CN215871952U - Motor driver module and PCB (printed circuit board) thereof - Google Patents
Motor driver module and PCB (printed circuit board) thereof Download PDFInfo
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- CN215871952U CN215871952U CN202120844421.8U CN202120844421U CN215871952U CN 215871952 U CN215871952 U CN 215871952U CN 202120844421 U CN202120844421 U CN 202120844421U CN 215871952 U CN215871952 U CN 215871952U
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Abstract
The utility model discloses a motor driver module and a PCB (printed circuit board) thereof, wherein the PCB of the motor driver module comprises a board body, and the board body comprises copper foil layers and a base layer which are arranged in a stacked mode; the copper foil layers and the base layers are arranged in a staggered mode; the number of layers of the base layer is 1 less than that of the copper foil layers, and a base layer is respectively clamped between any two adjacent copper foil layers; the copper foil layer is at least four layers; among all the copper foil layers, the copper foil layers with the preset number at the top layer and/or the bottom layer are high-power-consumption copper foil layers, and the rest copper foil layers are low-power-consumption copper foil layers. This PCB board adopts the design of multilayer copper foil layer to set up the copper foil layer of top layer and/or bottom department default quantity into big consumption copper foil layer, remaining copper foil layer sets up to little consumption copper foil layer, the big consumption copper foil layer heat dissipation of being convenient for, and satisfy the actual heat dissipation demand on little consumption copper foil layer, rationally distributed, improve the radiating effect of PCB board, improve the current-carrying capacity of PCB board, be convenient for improve the actual power output ability of motor driver module.
Description
Technical Field
The utility model relates to the technical field of motor control drivers of new energy electric vehicles, in particular to a PCB (printed circuit board) of a motor driver module and the motor driver module.
Background
New forms of energy electric automobile motor control driver, because of power device's encapsulation is different, lead to driver module structure completely different, wherein some new forms of energy electric automobile motor control driver directly use PCB (Printed Circuit Board) Board as female electrical connection who realizes power device of arranging of power. But is often limited by the heat dissipation capability of the PCB, and the actual power output capability of the motor driver module is poor.
Therefore, how to provide a PCB with strong heat dissipation capability to improve the current carrying capability of the PCB and further improve the actual power output capability of the motor driver module is a problem to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a PCB of a motor driver module, which adopts a multi-layer copper foil layer design, and sets a preset number of copper foil layers at the top layer and/or the bottom layer as high power consumption copper foil layers, and sets the remaining copper foil layers as low power consumption copper foil layers, so as to facilitate heat dissipation of the high power consumption copper foil layers and meet actual heat dissipation requirements of the low power consumption copper foil layers, and realize arrangement according to heat dissipation requirements of each copper foil layer, and the PCB is reasonable in layout, beneficial to improving current carrying capacity of the PCB, and convenient to improve actual power output capacity of the motor driver module. The utility model also provides a motor driver module which is applied to the PCB and has strong actual power output capability.
In order to achieve the purpose, the utility model provides the following technical scheme:
a PCB of a motor driver module comprises a board body, wherein the board body comprises copper foil layers and a base layer which are arranged in a stacked mode; the copper foil layers and the base layers are arranged in a staggered mode; the number of layers of the base layer is 1 less than that of the copper foil layers, and one base layer is sandwiched between any two adjacent copper foil layers; the copper foil layer is at least four layers;
among all the copper foil layers, the copper foil layers with the preset number at the top layer and/or the bottom layer are high-power-consumption copper foil layers, and the rest copper foil layers are low-power-consumption copper foil layers.
Preferably, in the PCB, among the high power consumption copper foil layers, the copper foil layer located on the outermost side of the board body is an integrated copper foil layer.
Preferably, in the PCB, among all the copper foil layers, only a preset number of copper foil layers located at the bottom layer are high power consumption copper foil layers.
Preferably, in the PCB, components of the PCB are disposed on one side of the board body and close to the copper foil layer at the bottom.
Preferably, in the PCB, the power semiconductor IGBT and the dc bus capacitor in the component are fixed to the board body by soldering, respectively.
Preferably, in the PCB, the copper foil layer includes a signal copper foil layer, an alternating current output layer, a bus bar positive copper foil layer, and a bus bar negative copper foil layer sequentially arranged from top to bottom.
Preferably, in the PCB, the copper foil layer is four layers.
Preferably, in the PCB, the copper foil layer on the bottom layer of the board body is connected to the chassis of the motor driver module through a heat conducting insulating pad.
Preferably, in the PCB, the copper foil layer at the bottom layer of the board body is connected to the heat dissipation water channel of the chassis through a heat conduction insulating pad.
A motor driver module comprises a PCB, wherein the PCB is any one of the above technical schemes.
The utility model provides a PCB (printed circuit board) of a motor driver module, which comprises a board body, wherein the board body comprises copper foil layers and a base layer which are arranged in a stacked mode; the copper foil layers and the base layers are arranged in a staggered mode; the number of layers of the base layer is 1 less than that of the copper foil layers, and a base layer is respectively clamped between any two adjacent copper foil layers; the copper foil layer is at least four layers; among all the copper foil layers, the copper foil layers with the preset number at the top layer and/or the bottom layer are high-power-consumption copper foil layers, and the rest copper foil layers are low-power-consumption copper foil layers.
The PCB board of the motor driver module that this embodiment provided adopts the design of multilayer copper foil layer, and set up the copper foil layer of top layer and/or bottom department default quantity into big consumption copper foil layer, surplus copper foil layer sets up to little consumption copper foil layer, the heat dissipation of big consumption copper foil layer both being convenient for, satisfy the actual heat dissipation demand on little consumption copper foil layer again, the realization is arranged according to the heat dissipation demand on each copper foil layer, and is rationally distributed, improve the radiating effect of PCB board, it is favorable to improving the current-carrying capacity of PCB board, be convenient for improve the actual power output capacity of motor driver module.
The utility model also provides a motor driver module which is applied to the PCB and has strong actual power output capability.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is an exploded view of a board body in a PCB provided in an embodiment of the present invention;
fig. 2 is an assembly view of a PCB board and a chassis according to an embodiment of the present invention;
fig. 3 is an assembled perspective view of a PCB board and a chassis according to an embodiment of the present invention;
fig. 4 is an electrical schematic diagram of a motor driver module according to an embodiment of the present invention;
wherein, in fig. 1-3:
a plate body 100; a copper foil layer 101; a signal copper foil layer 111, an alternating current output layer 112, a busbar anode copper foil layer 113 and a busbar cathode copper foil layer 114; a base layer 102; bus capacitor pads 1001; power semiconductor IGBT solder joints 1002; a power semiconductor IGBT 201; a thermally conductive insulating pad 300; a heat-dissipating cold plate 401; a heat sink water channel 402.
Detailed Description
The embodiment of the utility model discloses a PCB (printed circuit board) of a motor driver module, which adopts a multi-layer copper foil layer design, and the preset number of copper foil layers at the top layer and/or the bottom layer are set as high-power-consumption copper foil layers, and the rest of copper foil layers are set as low-power-consumption copper foil layers, so that heat dissipation of the high-power-consumption copper foil layers is facilitated, the actual heat dissipation requirements of the low-power-consumption copper foil layers are met, the heat dissipation requirements of all the copper foil layers are distributed, the layout is reasonable, the current carrying capacity of the PCB is improved, and the actual power output capacity of the motor driver module is improved conveniently. The embodiment of the utility model also discloses a motor driver module which is strong in actual power output capability by applying the PCB.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, an embodiment of the present invention provides a PCB of a motor driver module, including a board body 100, the board body 100 including a copper foil layer 101 and a base layer 102, which are stacked; the copper foil layers 101 and the base layers 102 are arranged in a staggered manner; the number of layers of the base layer 102 is less than that of the copper foil layers 101 by 1, and one base layer 102 is sandwiched between any two adjacent copper foil layers 101; the copper foil layer 101 has at least four layers; among all the copper foil layers 101, a preset number of copper foil layers 101 located at the top and/or the bottom are high-power-consumption copper foil layers, and the remaining copper foil layers are low-power-consumption copper foil layers.
The "high power consumption copper foil layer" and the "low power consumption copper foil layer" mean that the former has higher power consumption than the latter when compared with each other. When the copper foil layers 101 located at the top and located at the preset number of the top are large power consumption copper foil layers, the preset number of the large power consumption copper foil layers at the top and the preset number of the large power consumption copper foil layers at the bottom can be set to be the same or different, and the embodiment does not limit the scope.
The PCB board of the motor driver module that this embodiment provided adopts multilayer copper foil layer 101 design, and set up the copper foil layer 101 of top layer and/or bottom department default quantity into big consumption copper foil layer, surplus copper foil layer 101 sets up to little consumption copper foil layer, the heat dissipation of big consumption copper foil layer both being convenient for, satisfy the actual heat dissipation demand of little consumption copper foil layer again, the realization is arranged according to the heat dissipation demand of each copper foil layer 101, and is rationally distributed, improve the radiating effect of PCB board, it is favorable to improving the current-carrying capacity of PCB board, be convenient for improve the actual power output capacity of motor driver module.
Among the high-power-consumption copper foil layers, the copper foil layer 101 located on the outermost side of the board body 100 is an integrated copper foil layer, and the integrated copper foil layer is large in area and beneficial to improvement of a heat dissipation effect.
Specifically, in the PCB provided in the above embodiment, among all the copper foil layers 101, the copper foil layers 101 only located at the bottom layer in the preset number are high power consumption copper foil layers, and specifically include the bus-bar positive copper foil layer 113 and the bus-bar negative copper foil layer 114, so that the plate body is pressed close to the bottom layer, and dissipates heat, such as a heat sink or a chassis, of the components in the motor driver module, and the heat dissipation effect is enhanced.
The components of the PCB are disposed on one side of the board body 100, specifically, on one side close to the bottom copper foil layer 101, so that the components such as the heat sink or the chassis can simultaneously dissipate heat of the board body 100 and the components.
Of course, in the motor driver module in which the heat dissipation devices such as the heat sink are respectively disposed above and below the PCB, the copper foil layer 101 of the plate body 100 may be further configured as: the copper foil layers 101 located at the top layer and the copper foil layers 101 located at the bottom layer are large-power-consumption copper foil layers respectively, which is not limited in this embodiment.
Specifically, in the above-mentioned PCB, the power device (e.g. power semiconductor IGBT201) and the dc bus capacitor in the component are fixed to the board body 100 by soldering, and the board body 100 is provided with a power semiconductor IGBT soldering point 1002 and a bus capacitor soldering point 1001, as shown in fig. 4.
The copper foil layer 101 in the plate body 100 comprises a signal copper foil layer 111, an alternating current output layer 112, a busbar positive copper foil layer 113 and a busbar negative copper foil layer 114 which are sequentially arranged from top to bottom; the copper foil layer 101 is four layers, that is, the signal copper foil layer 111, the ac output layer 112, the bus bar positive copper foil layer 113, and the bus bar negative copper foil layer 114 are respectively one layer, or the copper foil layer 101 is 5 layers, 6 layers, 7 layers, 8 layers, etc., and one, two, three, or four of the signal copper foil layer 111, the ac output layer 112, the bus bar positive copper foil layer 113, and the bus bar negative copper foil layer 114 are respectively multiple layers, which is not limited in this embodiment.
In order to meet the heat dissipation requirement of the high-power copper foil layer, in the PCB provided in the above embodiment, the copper foil layer 101 at the bottom layer in the board body 100 is connected to the chassis of the motor driver module through the thermal conductive insulating pad 300.
Preferably, the copper foil layer 101 at the bottom layer in the plate body 100 is connected to the heat dissipation water channel 402 of the chassis through the heat conduction insulating pad 300. The heat sink channel 402 is enclosed by the heat sink cold plate 401 and the chassis, and the thermally conductive insulating pad 300 is connected to the heat sink cold plate 401, as shown in fig. 3.
The PCB provided by the embodiment of the utility model adopts the following technical scheme for cooperation, so that the heat dissipation plate capacity of the PCB is highest:
in the present embodiment, four layers of PCB boards are used as current carriers of the motor driver module, and the functions of each copper foil layer 101 of the board body 100 are divided in detail, so that the copper foil layer with high power consumption is arranged inside the board body 100 at the outside and with low loss:
the top layer is a signal copper foil layer 111, and the transmitted signals include but are not limited to driving signals, temperature sampling signals, current sampling signals, driving power signals, direct-current bus voltage sampling signals and the like; the second layer is an AC output layer 112; the third layer and the fourth layer are a busbar positive copper foil layer 113 and a busbar negative copper foil layer 114 respectively, which are large-loss copper foil layers, and the single-phase loss in the alternating current output layer 112 is only one third of that of the busbar positive and negative;
secondly, the copper foil layer (namely the busbar negative copper foil layer 114) at the bottom layer is connected with a chassis (preferably the heat dissipation water channel 402 of the chassis) through a heat conduction insulating pad 300, so that the plate body 100 can be ensured to dissipate heat through the chassis, the influence of the environmental temperature on the PCB is reduced, and the heat dissipation efficiency of the PCB is improved;
as shown in fig. 3, a heat conducting insulating pad 300 is pressed on the copper foil layer at the bottom layer, and is connected with a heat dissipation cold plate 401 forming a heat dissipation water channel 402 through the heat conducting pad 300;
the copper foil layer at the bottom (namely the bus bar negative electrode copper foil layer 114) adopts an integrated copper foil, so that the heat conduction efficiency is improved, and the downward heat dissipation of the PCB is facilitated;
power devices and direct-current bus capacitors in the PCB are directly connected with the board body 100 in a soldering mode respectively, so that the production process is simplified, and the production efficiency is improved;
the power device and the bus capacitor are directly connected with the board body 100 in a soldering mode, specifically, the bonding pad is manufactured on the board body 100 in the manufacturing process of the board body 100, and in the production process, the power device and the bus capacitor are respectively welded on the board body only through wave soldering or selective soldering.
Above-mentioned basic unit 102 can set up to FR4 panel, and each copper foil layer 101 reasonable layout of cooperation prevents to be in inside copper foil layer 101 high temperature, avoids the PCB board ageing in advance, realizes safe handling in the full life cycle of PCB board.
In addition, the PCB provided by the embodiment has good heat dissipation capacity, the current carrying capacity of copper foil in the PCB is improved in a mode of avoiding increasing the copper-clad thickness of the PCB or increasing a copper block above the copper-clad of the PCB, and the like, so that the cost is prevented from being increased and the manufacturing difficulty is improved.
The embodiment of the utility model also provides a motor driver module, which comprises a PCB, wherein the PCB is the PCB provided by the embodiment.
The motor driver module provided by the embodiment uses the PCB provided by the above embodiment, and the actual power output capability is strong. Of course, the motor driver module provided in this embodiment also has other effects related to the PCB provided in the above embodiments, and will not be described herein again.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The PCB of the motor driver module is characterized by comprising a board body, wherein the board body comprises copper foil layers and a base layer which are arranged in a stacked mode; the copper foil layers and the base layers are arranged in a staggered mode; the number of layers of the base layer is 1 less than that of the copper foil layers, and one base layer is sandwiched between any two adjacent copper foil layers; the copper foil layer is at least four layers;
among all the copper foil layers, the copper foil layers with the preset number at the top layer and/or the bottom layer are high-power-consumption copper foil layers, and the rest copper foil layers are low-power-consumption copper foil layers.
2. The PCB board of claim 1, wherein, among the high power consumption copper foil layers, the copper foil layer positioned at the outermost side of the board body is an integrated copper foil layer.
3. The PCB board of claim 1, wherein, of all the copper foil layers, only a preset number of copper foil layers at the bottom layer are high power consumption copper foil layers.
4. The PCB board of claim 3, wherein the components of the PCB board are arranged on one side of the board body and close to the copper foil layer on the bottom.
5. The PCB of claim 1 or 4, wherein in the components of the PCB, the power semiconductor IGBT and the direct current bus capacitor are respectively fixed on the board body by soldering.
6. The PCB board of claim 3, wherein the copper foil layer comprises a signal copper foil layer, an alternating current output layer, a bus bar positive copper foil layer and a bus bar negative copper foil layer which are sequentially arranged from top to bottom.
7. The PCB board of claim 6, wherein the copper foil layer is four layers.
8. The PCB board of claim 3, wherein the copper foil layer at the lowest layer in the board body is connected with the chassis of the motor driver module through a heat conducting insulating pad.
9. The PCB board of claim 8, wherein the copper foil layer at the bottom layer of the board body is connected to the heat dissipation water channel of the case through a heat conduction insulating pad.
10. A motor driver module comprising a PCB, wherein the PCB is the PCB of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120844421.8U CN215871952U (en) | 2021-04-21 | 2021-04-21 | Motor driver module and PCB (printed circuit board) thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120844421.8U CN215871952U (en) | 2021-04-21 | 2021-04-21 | Motor driver module and PCB (printed circuit board) thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215871952U true CN215871952U (en) | 2022-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120844421.8U Active CN215871952U (en) | 2021-04-21 | 2021-04-21 | Motor driver module and PCB (printed circuit board) thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215871952U (en) |
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2021
- 2021-04-21 CN CN202120844421.8U patent/CN215871952U/en active Active
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