CN211508893U - Power supply - Google Patents
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- CN211508893U CN211508893U CN202020471809.3U CN202020471809U CN211508893U CN 211508893 U CN211508893 U CN 211508893U CN 202020471809 U CN202020471809 U CN 202020471809U CN 211508893 U CN211508893 U CN 211508893U
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Abstract
The utility model provides a power supply relates to power technical field. The power supply comprises an inductance module, a power conversion module and a filtering module; the inductance module is a cylinder structure with a preset height and comprises an inductance, a radiator and an inductance output end, the inductance output end is arranged on one side, close to the power conversion module, of the cylinder structure, and the inductance module is electrically connected with the power conversion module through the inductance output end; the power conversion module comprises a first circuit board, a power conversion circuit is arranged in the first circuit board, a power conversion input end of the power conversion circuit is electrically connected with an inductor output end, and the length of a designated side edge of the power conversion module is the same as that of the bottom edge of the inductor module connected with the designated side edge; the filtering module comprises a second circuit board, the second circuit board is vertically connected with the surface of the first circuit board relatively, and the second circuit board is the same as the first circuit board in size. The power supply provided by the application improves the space utilization rate of each module and reduces the size of the power supply.
Description
Technical Field
The utility model relates to a power technical field particularly, relates to a power.
Background
With the development of miniaturization and portability of power electronic equipment, people have increased the requirement for the power supply volume in the electronic equipment, and the research on high-efficiency and high-power-density power supplies is more and more urgent. In the field of the current new energy electric automobile, the high-power small-size light-weight high-power density is the development direction of the industry of high-power vehicle-mounted power supply products due to the limitation of the space size and the weight of the whole automobile. At present, the size of a high-power switching power supply is large, the power density cannot meet the requirements of miniaturization and high efficiency, and the problem of low power density exists.
SUMMERY OF THE UTILITY MODEL
Embodiments of the present application provide a power supply to solve the problem of low power density of the conventional power supply.
The technical scheme of the embodiment of the application is as follows:
embodiments of the present application provide a power supply comprising an inductance module, a power conversion module, and a filtering module;
the inductance module is a cylinder structure with a preset height and comprises an inductance, a radiator and an inductance output end, wherein the radiator is used for accommodating the inductance and radiating the inductance, the inductance output end is arranged on one side, close to the power conversion module, of the cylinder structure, the inductance module is electrically connected with the power conversion module through the inductance output end, and the inductance output end is electrically connected with the inductance;
the power conversion module comprises a first circuit board, a power conversion circuit is arranged in the first circuit board, a power conversion input end of the power conversion circuit is electrically connected with the inductor output end, a specified side edge of the power conversion module is fixedly connected with the bottom edge of the inductor module, and the length of the specified side edge is less than or equal to that of the bottom edge of the inductor module connected with the specified side edge;
the filtering module comprises a second circuit board, a filtering circuit is arranged in the second circuit board, the filtering circuit is connected with the power conversion circuit in parallel, the second circuit board is connected with the board surface of the first circuit board in a relatively perpendicular mode, and the size of the second circuit board is smaller than or equal to that of the first circuit board.
In the above implementation process, the second circuit board is connected with the surface of the first circuit board vertically, so that the residual space is effectively utilized, the size of the second circuit board is smaller than or equal to that of the first circuit board, so that the size of the power supply can be reduced, and the power supply power of a unit volume, namely the power density of the power supply, can be improved under the same power supply power of the power supply.
Optionally, in the power supply provided by the embodiment of the present application, a stacking height of the power conversion module and the filtering module is lower than the preset height.
In the implementation process, the stacking height of the power conversion module and the filtering module is lower than the preset height, so that the sum of the volumes of the power conversion module and the filtering module can be reduced, and the space utilization rate is improved.
Optionally, in the power supply provided by the embodiment of the present application, the inductor module further includes a third circuit board, an input end of the inductor is an input positive electrode of the power supply, the inductor is disposed in the third circuit board in a flip-chip manner, and the third circuit board is disposed in the heat sink.
In the implementation process, the radiator can radiate heat for the inductance module, so that the power supply is prevented from being damaged due to overhigh temperature of the inductance module, and the service life and the safety of the power supply are improved.
Optionally, the power conversion circuit in the power supply provided by the embodiment of the present application includes a power tube circuit and a diode circuit, a first end of the power conversion circuit is connected to a positive electrode of the diode circuit, a second end of the power tube circuit is connected to the inductor, and a third end of the power tube circuit is connected to a negative electrode of the diode circuit and grounded.
In the implementation process, the input current in the power conversion circuit is continuous, so that the electromagnetic interference on the power supply can be reduced, and the stability of the power supply is improved.
Optionally, in the power supply provided by the embodiment of the present application, the power transistor circuit includes at least two power transistors connected in parallel, the diode circuit includes at least two diodes connected in parallel, the at least two power transistors and the at least two diodes are disposed on the first circuit board, the first end of the power conversion circuit is a connection point of drains of the at least two power transistors, the first end of the power conversion circuit is a connection point of gates of the at least two power transistors, and the first end of the power conversion circuit is a connection point of sources of the at least two power transistors.
In the implementation process, each power tube and each diode connected in parallel share the total current in the power conversion circuit, so that the breakdown phenomenon of the power tubes and the diodes is avoided, and the stability of the power conversion circuit is improved.
Optionally, the heat sink in the power supply provided by the embodiment of the application is a groove-shaped heat sink, and the groove-shaped heat sink dissipates heat in a heat conduction pouring sealant mode.
In the implementation process, the radiator is a groove-shaped radiator, so that the radiating area can be increased, and the radiating efficiency of the power supply is improved.
Optionally, the inductance output end in the power supply provided by the embodiment of the present application is a Z-shaped metal strip.
In the implementation process, the inductance module and the power conversion module are connected through the Z-shaped metal strip, so that the connection stability is improved, and stable inductance output is performed.
Optionally, in the power that this application's embodiment provided inductance module still includes the water-cooling board, the water-cooling board with the radiator is connected, the water-cooling board is located the radiator below.
In the implementation process, the water cooling plate is used for heat dissipation, and the heat dissipation capacity of the power supply is improved on the basis of the heat radiator.
Optionally, in the power supply provided by the embodiment of the present application, the power conversion module further includes a first patch stud, a second patch stud, a third patch stud, and a fourth patch stud, where the first patch stud is used for fixed connection with the inductor output end, the second patch stud is used for fixed connection with the filtering module, the third patch stud is the output cathode of the power supply, and the fourth patch stud is the output anode of the power supply.
In the implementation process, all the studs are used for fixing the power conversion module, so that the connection stability of the power supply is improved, meanwhile, electric energy transmission is carried out through the studs, other power supply flat cable arrangements are not needed, and the space utilization rate is improved.
Optionally, the filtering module in the power supply provided by the embodiment of the present application further includes a metal bar electrically connected to the filtering circuit, and the metal bar is an input cathode of the power supply.
In the implementation process, the metal bar improves the electrical property of the power supply, and meanwhile, the metal plate is connected to the power conversion module in a stud mode, so that the metal plate has higher stability and improves the anti-seismic grade of the power supply.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
As shown in the drawings, the above and other objects, features and advantages of the present invention will be more clearly understood from the drawings, in which like reference numerals refer to like parts throughout, which are not drawn with an equal scale according to actual dimensions, and which are emphasized in illustrating the gist of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the embodiments of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Fig. 1 is a schematic structural diagram of a power supply according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a power conversion circuit according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a power conversion module according to an embodiment of the present disclosure.
Icon: 10-a power supply; 101-an inductance module; 1011-inductance; 1012-radiator; 1013-an inductor output; 1014-a third circuit board; 1015-water cooling plate; 102-a power conversion module; 1021-a first circuit board; 1022-a power conversion circuit; 1023-a first patch stud; 1024 — a second patch stud; 1025-third patch stud; 1026-fourth patch stud; 10221-power tube circuit; 10222-diode circuit; 1022A — first drive sub-circuit; 1022B — second drive sub-circuit; 1022C — third drive sub-circuit; 10223-a filter sub-circuit; 103-a filtering module; 1031-a second circuit board; 1032-a filter circuit; 1033-metal row; 1034-filter capacitance.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a power supply according to an embodiment of the present disclosure.
The power supply 10 includes: an inductance module 101, a power conversion module 102 and a filtering module 103; the inductor module 101 is a cylinder structure with a predetermined height, and includes an inductor 1011, a heat sink 1012 and an inductor output end 1013, the heat sink 1012 is used for accommodating the inductor 1011 and dissipating heat from the inductor 1011, the inductor output end 1013 is disposed on one side of the cylinder structure close to the power conversion module 102, the inductor module 101 is electrically connected to the power conversion module 102 through the inductor output end 1013, and the inductor output end 1013 is electrically connected to the inductor 1011.
The power conversion module 102 includes a first circuit board 1021, a power conversion circuit 1022 is disposed in the first circuit board 1021, a power conversion input terminal of the power conversion circuit 1022 is electrically connected to the inductor output terminal 1013, a designated side of the power conversion module 102 is fixedly connected to a bottom side of the inductor module, and a length of the designated side is less than or equal to a length of the bottom side of the inductor module 101 connected to the designated side. The heat sink 1012 may be fixedly connected to the first circuit board 1021 using studs, which may be distributed at the vertices of the posts.
The filter module 103 includes a second circuit board 1031, a filter circuit 1032 is disposed in the second circuit board 1031, the filter circuit 1032 is connected in parallel with the power conversion circuit 1022, the second circuit board 1031 is connected to the board surface of the first circuit board 1021 in a relatively vertical manner, and the size of the second circuit board 1031 is smaller than or equal to the size of the first circuit board 1021.
Optionally, the filtering module 103 further includes a metal bar 1033 electrically connected to the filtering circuit 1032, the metal bar 1033 is an input negative electrode of the power supply 10, and the metal bar 1033 is fixed to the filtering module 103 by a screw connection.
In one embodiment, the filter circuit 1032 includes a filter capacitor 1034 disposed side by side on the second circuit board 1031.
From the viewpoint of both economic cost and electrical performance, a Z-shaped metal strip made of copper may be used as the metal row 1033.
It can be understood that the arrangement of the inductance module 101, the power conversion module 102, and the filter module 103 can improve the space utilization rate of the power supply 10, and can reduce the volume of the power supply 10, the second circuit board 1031 is connected to the board surface of the first circuit board 1021 in a relatively perpendicular manner, so that the remaining space is effectively utilized, the size of the second circuit board 1031 is smaller than or equal to the size of the first circuit board 1021, so that the volume of the power supply 10 can be reduced, and under the same power supply power of the power supply 10, the power supply power per unit volume can be improved, that is, the power density of the power supply can be improved.
Optionally, the power conversion module 102 and the filtering module 103 are arranged in a stacked manner, and the stacking height is lower than the preset height, so that the sum of the volumes of the power conversion module 102 and the filtering module 103 can be reduced, and the space utilization rate can be improved.
The predetermined height may be flexibly adjusted according to the specific size requirements of the power supply 10.
Optionally, the inductor module 101 further comprises a third circuit board 1014, the inductor input terminal 1013 is an input positive terminal of a power supply, the inductor 1011 is arranged in the third circuit board 1014 in a flip-chip manner, and the third circuit board 1014 is arranged in the heat sink 1012.
It is understood that the inductor 1011 is disposed on the lower surface of the third circuit board 1014, so that the inductor 1011 is surrounded by the heat sink 1012, and heat dissipation of the inductor 1011 is facilitated.
Optionally, the power conversion circuit 1022 includes a power tube circuit 10221 and a diode circuit 10222, a first terminal of the power conversion circuit 1022 is connected to an anode of the diode circuit 10222, a second terminal of the power tube circuit 10221 is connected to the inductor 1011, and a third terminal of the power tube circuit 10221 is connected to a cathode of the diode circuit 10222 and grounded.
It can be understood that the power conversion refers to that a low-voltage and low-current circuit controls a high-voltage and high-current load circuit, that is, a low-power signal circuit controls a high-power load, which is equivalent to amplifying a low power to a high power to complete the power conversion. The input current in the power conversion circuit 1022 is continuous, and electromagnetic interference with the power supply 10 can be reduced, thereby improving the stability of the power supply 10.
Optionally, the heat sink 1012 is a slot-type heat sink, which dissipates heat in the form of a heat-conducting potting adhesive.
It can be understood that the heat-conducting potting adhesive may be heat-conducting silicone grease commonly known as a heat-dissipating paste, the heat-conducting silicone grease uses silicone as a main raw material, and a heat-conducting silicone grease-like compound made of a material with excellent heat resistance and heat-conducting property is added, so that the stability of the electrical property of the power conversion circuit 1022 can be ensured. The heat-conducting silicone grease is a high-heat-conducting insulating silicone material, and can be kept in a grease state for a long time at the temperature of-50 ℃ to +230 ℃. The insulating material has excellent electrical insulation, excellent heat conductivity, low freeness (tending to zero), high and low temperature resistance, water resistance, ozone resistance and weather aging resistance.
Optionally, the inductor output 1013 is a Z-shaped metal strip. For economic cost and electrical performance considerations, a copper Z-shaped metal strip may be used as the inductor output 1013.
Optionally, the inductor module 101 further includes a water cooling plate 1015, the water cooling plate 1015 is connected to the heat sink 1012, and the water cooling plate 1015 is located below the heat sink 1012.
It can be understood that the water-cooling plate 1015 is processed into a flow channel in the metal plate through liquid cooling and heat exchange, the electronic component is mounted on the surface of the plate (the heat-conducting medium is coated in the middle), and the cooling liquid enters from the inlet of the plate and comes out from the outlet of the plate to take away the heat emitted by the component. The water-cooled plate 1015 can enhance the heat dissipation capability of the power supply 10 on the basis of the heat sink 1012.
Referring to fig. 2, fig. 2 is a schematic diagram of a power conversion circuit according to an embodiment of the present application. Optionally, the power transistor circuit 10221 includes at least two power transistors connected in parallel, the diode circuit 10222 includes at least two diodes connected in parallel, the at least two power transistors and the at least two diodes are disposed on the first circuit board 1021, a first end of the power transistor circuit 10221 is a connection point of drains of the at least two power transistors, a second end of the power transistor circuit 10221 is a connection point of gates of the at least two power transistors, and a third end of the power transistor circuit 10221 is a connection point of sources of the at least two power transistors. In the embodiments provided in the present application, the power transistor circuit 10221 includes three power transistors connected in parallel, and the diode circuit 10222 includes six diodes connected in parallel.
Optionally, the power conversion circuit 1022 further includes a first driving sub-circuit 1022A, a second driving sub-circuit 1022B, a third driving sub-circuit 1022C, and a filter sub-circuit 10223, the first driving sub-circuit 1022A includes a first resistor R1, a second resistor R2, and a first capacitor C1, a first end of the first resistor R1 is connected to the gate of the first power transistor Q1, a first end of the second resistor R2 is connected to the gate of the first power transistor Q1, a first end of the first capacitor C1 is connected to the gate of the first power transistor Q1, and a second end of the first capacitor C1 and a second end of the second resistor R2 are both grounded.
In one embodiment, the second driving sub-circuit 1022B includes a third resistor R3, a fourth resistor R4, and a second capacitor C2, a first end of the third resistor R3 is connected to the gate of the second power transistor Q2, a first end of the fourth resistor R4 is connected to the gate of the second power transistor Q2, and a second end of the second capacitor C2 and a second end of the fourth resistor R4 are both grounded.
In one embodiment, the third driving sub-circuit 1022C includes a fifth resistor R5, a sixth resistor R6, and a third capacitor C3, a first end of the fifth resistor R5 is connected to the gate of the third power transistor Q3, a first end of the sixth resistor R6 is connected to the gate of the third power transistor Q3, a second end of the third capacitor C3 and a second end of the fourth resistor R4 are both grounded, and a second end of the first resistor R1 is connected to the second end of the third resistor R3 and the second end of the fifth resistor R5, respectively.
It is understood that the first driving sub-circuit 1022A is used for driving the first power transistor Q1 and suppressing current oscillation, the second driving sub-circuit 1022B is used for driving the second power transistor Q2 and suppressing current oscillation, and the third driving sub-circuit 1022C is used for driving the third power transistor Q3 and suppressing current oscillation.
In one embodiment, the filter sub-circuit 10223 includes a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, and a seventh capacitor C8, wherein a first end of the fourth capacitor C4, a first end of the fifth capacitor C5, a first end of the sixth capacitor C6, a first end of the seventh capacitor C7, and a first end of the seventh capacitor C8 are connected together and to a second end of the diode circuit 10222, and the second end of the diode circuit 10222 is a terminal formed by connecting cathodes of diodes in the diode circuit 10222. The second terminal of the fourth capacitor C4, the second terminal of the fifth capacitor C5, the second terminal of the sixth capacitor C6, the second terminal of the seventh capacitor C7, and the second terminal of the seventh capacitor C8 are connected together to ground. It can be understood that the filter sub-circuit 10223 is used for filtering the current in the power conversion circuit 1022, filtering the ripple of the power conversion circuit 1022, avoiding damage to the components of the power conversion circuit 1022, and increasing the service life of the power conversion circuit 1022.
Referring to fig. 3, fig. 3 is a schematic diagram of a power conversion module according to an embodiment of the present disclosure. Optionally, the power conversion module 102 further includes a first patch stud 1023, a second patch stud 1024, a third patch stud 1025, and a fourth patch stud 1026, where the first patch stud 1023 is used to fixedly connect to the inductor output 1013, the second patch stud 1024 is used to fixedly connect to the filtering module 103, the third patch stud 1025 is an output negative electrode of the power supply 10, and the fourth patch stud 1026 is an output positive electrode of the power supply 10.
In the embodiment of the present application provided in fig. 3, 4 first patch studs 1023 are disposed on the power conversion module 102, wherein 2 first patch studs 1023 are used to fix the Z-shaped inductor output 1013 at one end of the inductor module 101, the remaining 2 first patch studs 1023 are used to fix the Z-shaped inductor output 1013 at one end of the power conversion module 102, and the Z-shaped inductor output 1013 fixedly connects the inductor module 101 and the power conversion module 102 with different heights through the first patch studs 1023.
The power conversion module 102 is provided with 10 second patch studs 1024, which are distributed on two sides of the filter capacitor 1034 to fixedly connect the power conversion module 102 and the filter module 103.
When the first power tube Q1, the second power tube Q2 and the third power tube Q3 are turned off, the current passes through the input end of the inductor 1011, then passes through the inductor module 101 and the inductor output end 1013 and is connected to the power conversion module 102, and passes through the diode circuit 10222 and the second patch stud 1024 to reach the output positive electrode of the power supply 10, namely the fourth patch stud 1026, so that the energy releasing and boosting processes of the inductor 1011 are completed.
To sum up, the utility model provides a power relates to power technical field. The power supply comprises an inductance module, a power conversion module and a filtering module; the inductance module is a cylinder structure with a preset height and comprises an inductance, a radiator and an inductance output end, wherein the radiator is used for accommodating the inductance and radiating the inductance; the power conversion module comprises a first circuit board, a power conversion circuit is arranged in the first circuit board, a power conversion input end of the power conversion circuit is electrically connected with an inductor output end, a designated side edge of the power conversion module is fixedly connected with the bottom edge of the inductor module, and the length of the designated side edge is smaller than or equal to that of the bottom edge of the inductor module connected with the designated side edge; the filtering module comprises a second circuit board, a filtering circuit is arranged in the second circuit board, the filtering circuit is connected with the power conversion circuit in parallel, the second circuit board is vertically connected with the surface of the first circuit board relatively, and the size of the second circuit board is smaller than or equal to that of the first circuit board.
In the implementation process, the arrangement mode of the inductance module, the power conversion module and the filtering module can improve the space utilization rate of the battery, reduce the size of the power supply, and improve the power density of the power supply in unit volume under the same power supply power of the power supply, namely improve the power density of the power supply.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
Claims (10)
1. A power supply, characterized in that the power supply comprises: the power conversion module comprises an inductance module, a power conversion module and a filtering module;
the inductance module is a cylinder structure with a preset height and comprises an inductance, a radiator and an inductance output end, wherein the radiator is used for accommodating the inductance and radiating the inductance, the inductance output end is arranged on one side, close to the power conversion module, of the cylinder structure, the inductance module is electrically connected with the power conversion module through the inductance output end, and the inductance output end is electrically connected with the inductance;
the power conversion module comprises a first circuit board, a power conversion circuit is arranged in the first circuit board, a power conversion input end of the power conversion circuit is electrically connected with the inductor output end, a specified side edge of the power conversion module is fixedly connected with the bottom edge of the inductor module, and the length of the specified side edge is less than or equal to that of the bottom edge of the inductor module connected with the specified side edge;
the filtering module comprises a second circuit board, a filtering circuit is arranged in the second circuit board, the filtering circuit is connected with the power conversion circuit in parallel, the second circuit board is connected with the board surface of the first circuit board in a relatively perpendicular mode, and the size of the second circuit board is smaller than or equal to that of the first circuit board.
2. The power supply of claim 1, wherein a stacking height of the power conversion module and the filtering module is lower than the preset height.
3. The power supply of claim 1, wherein the inductor module further comprises a third circuit board, wherein the input terminal of the inductor is the input positive terminal of the power supply, wherein the inductor reverse is disposed in the third circuit board, and wherein the third circuit board is disposed in the heat sink.
4. The power supply of claim 1, wherein the power conversion circuit comprises a power tube circuit and a diode circuit, a first terminal of the power tube circuit is connected to a positive electrode of the diode circuit, a second terminal of the power tube circuit is connected to the inductor, and a third terminal of the power tube circuit is connected to a negative electrode of the diode circuit and grounded.
5. The power supply of claim 4, wherein the power transistor circuit comprises at least two power transistors connected in parallel, the diode circuit comprises at least two diodes connected in parallel, the at least two power transistors and the at least two diodes are disposed on the first circuit board, the first end of the power conversion circuit is a connection point of drains of the at least two power transistors, the first end of the power conversion circuit is a connection point of gates of the at least two power transistors, and the first end of the power conversion circuit is a connection point of sources of the at least two power transistors.
6. The power supply of claim 1 or 3, wherein the heat sink is a channel heat sink that dissipates heat in the form of a thermally conductive potting adhesive.
7. The power supply of claim 1, wherein the inductor output is a Z-shaped metal strip.
8. The power supply of claim 1, wherein the inductance module further comprises a water-cooled plate connected to the heat sink, the water-cooled plate being located below the heat sink.
9. The power supply of claim 1, wherein the power conversion module further comprises a first patch stud, a second patch stud, a third patch stud, and a fourth patch stud, the first patch stud is used for fixedly connecting the inductor output terminal, the second patch stud is used for fixedly connecting the filtering module, the third patch stud is an output negative pole of the power supply, and the fourth patch stud is an output positive pole of the power supply.
10. The power supply of claim 1 or 9, wherein the filter module further comprises a metal bar electrically connected to the filter circuit, the metal bar being the negative input of the power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020471809.3U CN211508893U (en) | 2020-04-02 | 2020-04-02 | Power supply |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020471809.3U CN211508893U (en) | 2020-04-02 | 2020-04-02 | Power supply |
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| CN211508893U true CN211508893U (en) | 2020-09-15 |
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| CN202020471809.3U Active CN211508893U (en) | 2020-04-02 | 2020-04-02 | Power supply |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466511A (en) * | 2022-03-23 | 2022-05-10 | 中国电子科技集团公司第五十八研究所 | Multi-substrate power supply micro-module design method |
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2020
- 2020-04-02 CN CN202020471809.3U patent/CN211508893U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466511A (en) * | 2022-03-23 | 2022-05-10 | 中国电子科技集团公司第五十八研究所 | Multi-substrate power supply micro-module design method |
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