CN220755317U - Dual-semiconductor core heat dissipation control module for mobile phone air-cooled radiator - Google Patents
Dual-semiconductor core heat dissipation control module for mobile phone air-cooled radiator Download PDFInfo
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- CN220755317U CN220755317U CN202322167423.XU CN202322167423U CN220755317U CN 220755317 U CN220755317 U CN 220755317U CN 202322167423 U CN202322167423 U CN 202322167423U CN 220755317 U CN220755317 U CN 220755317U
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- semiconductor
- circuit board
- semiconductor refrigerating
- heat dissipation
- pcb circuit
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 76
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 238000005057 refrigeration Methods 0.000 claims abstract description 22
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000741 silica gel Substances 0.000 claims abstract description 17
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 17
- 229910021392 nanocarbon Inorganic materials 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000499 gel Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 4
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 2
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000033999 Device damage Diseases 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of electronic equipment heat dissipation, and discloses a double-semiconductor core heat dissipation control module for a mobile phone air-cooled radiator, which is characterized in that: including integrated temperature sensor, intelligent master control PCB circuit board, semiconductor refrigeration piece, high conductivity nano carbon copper and high heat conduction silica gel, intelligent master control PCB circuit board with integrated temperature sensor connects, intelligent master control PCB circuit board with the semiconductor refrigeration piece is connected, integrated temperature sensor respectively with the hot face and the cold face of semiconductor refrigeration piece are connected, high conductivity nano carbon copper sets up the hot face one side of semiconductor refrigeration piece, high heat conduction silica gel sets up the cold face one side of semiconductor refrigeration piece. The utility model can automatically detect the temperature of the electronic equipment, intelligently adjust the temperature, quickly and effectively control the temperature of the electronic equipment, and has the effects of high heat dissipation efficiency and improvement of equipment performance and reliability.
Description
Technical Field
The utility model relates to the technical field of electronic equipment heat dissipation, in particular to a double-semiconductor core heat dissipation control module for a mobile phone air-cooled radiator.
Background
With the continuous development of electronic technology, electronic devices become smaller and lighter, and have more powerful functions. However, with the continuous increase of the operating frequency and the operating temperature of the electronic device, the problem of heat dissipation becomes a key issue for restricting the further development of the electronic device. In high temperature environments, the performance of electronic devices can be severely impacted and even potentially cause device damage. Therefore, effective heat dissipation technology is a key to the development of electronic devices.
In the existing electronic equipment heat dissipation technology, there are mainly several modes such as heat dissipation fins, fans, heat pipes, liquid cooling heat dissipation and the like. The heat sink reduces the temperature of the device by increasing the heat dissipation area, but the increase of the heat dissipation area increases the volume of the device, which is not in line with the trend of miniaturization of the electronic device. The fan takes away heat in the device by forced air flow, but the use of the fan generates noise, and the heat dissipation effect of the fan is not ideal when the device is in a stationary state. The heat pipe rapidly conducts out the heat in the equipment through the heat conduction principle, but the heat conduction capacity of the heat pipe is limited, so that the heat dissipation requirement of the high-power and high-heat-generation electronic equipment cannot be met. Liquid cooling heat dissipation takes heat away from the equipment through liquid circulation, but the liquid cooling heat dissipation requires a complex management system and high maintenance cost, and is not suitable for portable electronic equipment.
In addition, the existing heat dissipation technology has the problems of low heat dissipation efficiency, uneven heat dissipation, large occupied space of a heat dissipation device and the like, and the development of electronic equipment is limited. Therefore, developing a new, efficient, uniform, and miniaturized heat dissipation technology is an urgent need for the current heat dissipation technology of electronic devices.
Disclosure of Invention
The utility model aims to provide a double-semiconductor core heat dissipation control module for an air-cooled radiator of a mobile phone, which can automatically detect the temperature of electronic equipment, intelligently adjust the temperature, quickly and effectively control the temperature of the electronic equipment and has the effects of high heat dissipation efficiency and improvement of equipment performance and reliability.
The technical aim of the utility model is realized by the following technical scheme: the double-semiconductor core heat dissipation control module for the mobile phone air-cooled radiator comprises an integrated temperature sensor, an intelligent main control PCB (printed circuit board), a semiconductor refrigerating sheet, high-conductivity nano carbon copper and high-conductivity silica gel, wherein the intelligent main control PCB is connected with the integrated temperature sensor, the intelligent main control PCB is connected with the semiconductor refrigerating sheet, the integrated temperature sensor is respectively connected with a hot surface and a cold surface of the semiconductor refrigerating sheet, the high-conductivity nano carbon copper is arranged on one side of the hot surface of the semiconductor refrigerating sheet, and the high-conductivity silica gel is arranged on one side of the cold surface of the semiconductor refrigerating sheet;
the integrated temperature sensor is used for detecting the temperatures of the hot face and the cold face of the semiconductor refrigeration piece and transmitting data to the intelligent main control PCB circuit board;
the intelligent main control PCB circuit board intelligently adjusts the temperature according to the data from the integrated temperature sensor and controls the refrigerating gear by controlling the current output to the semiconductor refrigerating sheet;
the semiconductor refrigerating sheet realizes refrigeration according to the current output from the intelligent main control PCB circuit board;
the high-conductivity nano carbon copper is used for connecting the hot surface of the semiconductor refrigerating sheet and the fins so as to conduct heat to the fins;
the high-heat-conductivity silica gel is used for connecting the cold face of the semiconductor refrigeration piece and the heating area of the electronic equipment, so that the heating area of the electronic equipment is refrigerated.
The utility model is further provided with: the semiconductor refrigerating sheets are arranged in parallel.
By adopting the technical scheme, the semiconductor refrigerating sheets are arranged into two sheets, which is beneficial to improving the heat dissipation efficiency.
The utility model is further provided with: the thickness of the high-conductivity nano carbon copper is 0.3mm.
The utility model is further provided with: the thickness of the high heat conduction silica gel is 0.5mm.
The utility model is further provided with: the intelligent main control PCB circuit board is further provided with a type-c power supply interface, and the type-c power supply interface is connected with a direct current power supply.
Through adopting above-mentioned technical scheme, can provide stable DC power supply for whole module through type-c power supply interface, guarantee control module's steady operation
The utility model is further provided with: the semiconductor refrigerating sheet is made of bismuth telluride.
The beneficial effects of the utility model are as follows:
1. the utility model combines the semiconductor refrigerating sheet with the intelligent main control PCB circuit board to realize intelligent temperature control and heat dissipation. The temperature sensor is integrated in the module, so that the temperature of a cold surface and a hot surface can be detected, and data can be transmitted to the main control circuit board; the intelligent main control PCB circuit board intelligently adjusts the temperature according to the temperature data and controls the refrigeration gear; the type-c power supply interface is used for connecting and supplying power, the semiconductor refrigerating sheet is provided with two semiconductor refrigerating sheets, heat dissipation efficiency can be improved, high-conductivity carbon-copper nano-powder is connected with the heat surface of the semiconductor refrigerating sheet to conduct heat to the fins, and high-conductivity silica gel is connected with the cold surface of the semiconductor refrigerating sheet to refrigerate a heating area of electronic equipment. The intelligent temperature control heat dissipation module can rapidly and effectively control the temperature of the electronic equipment, and improve the performance and reliability of the equipment.
2. According to the utility model, the semiconductor refrigerating sheet is used for radiating the heat of the electronic equipment, and high-precision temperature control can be realized through controlling the input current.
3. The high-conductivity nano carbon copper and the high-conductivity silica gel are designed in the utility model, so that the semiconductor refrigeration piece can be well contacted with the radiating fins and the heating area of the electronic equipment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of the structure of the present utility model.
Fig. 2 is a schematic diagram of the operation of the semiconductor refrigeration sheet of the present utility model.
In the figure, 1, an integrated temperature sensor; 2. an intelligent main control PCB circuit board; 3. a semiconductor refrigeration sheet; 4. high-conductivity nano carbon copper; 5. high heat conduction silica gel; 6. type-c power interface.
Detailed Description
The technical scheme of the present utility model will be clearly and completely described in connection with specific embodiments. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.
Examples: referring to fig. 1 and 2, a dual-semiconductor core heat dissipation control module for an air-cooled radiator of a mobile phone comprises an integrated temperature sensor 1, an intelligent main control PCB circuit board 2, a semiconductor refrigerating sheet 3, high-conductivity nano carbon copper 4 and high-heat-conductivity silica gel 5, wherein the intelligent main control PCB circuit board 2 is connected with the integrated temperature sensor 1, the intelligent main control PCB circuit board 2 is connected with the semiconductor refrigerating sheet 3, the integrated temperature sensor 1 is respectively connected with a hot surface and a cold surface of the semiconductor refrigerating sheet 3, the high-conductivity nano carbon copper 4 is arranged on the hot surface side of the semiconductor refrigerating sheet 3, and the high-heat-conductivity silica gel 5 is arranged on the cold surface side of the semiconductor refrigerating sheet 3;
the integrated temperature sensor 1 is used for detecting the temperatures of the hot face and the cold face of the semiconductor refrigerating sheet 3 and transmitting data to the intelligent main control PCB circuit board 2;
the intelligent main control PCB circuit board 2 intelligently adjusts the temperature according to the data from the integrated temperature sensor 1 and controls the refrigeration gear by controlling the current output to the semiconductor refrigeration piece 3;
the semiconductor refrigerating sheet 3 realizes refrigeration according to the current output from the intelligent main control PCB circuit board 2;
the high-conductivity nano carbon copper 4 is used for connecting the hot surface of the semiconductor refrigeration piece 3 with the fins so as to conduct heat to the fins;
and the high-heat-conductivity silica gel 5 is used for connecting the cold surface of the semiconductor refrigerating sheet 3 and the heating area of the electronic equipment so as to refrigerate the heating area of the electronic equipment.
In a specific implementation, temperature data detected by an integrated temperature sensor 1 is received through control of an intelligent main control PCB (printed circuit board) 2, and the magnitude of current output to a semiconductor refrigerating sheet 3 is controlled according to the temperature data, so that the refrigerating gear of the semiconductor refrigerating sheet 3 is controlled, the heat surface of the semiconductor refrigerating sheet 3 is connected with heat conduction to the fins through high-conductivity nano carbon copper 4, and the cold surface of the semiconductor refrigerating sheet 3 is connected with cold surface of the high-conductivity silica gel 5 to refrigerate a heating area of electronic equipment.
Further, the semiconductor refrigerating sheets 3 are provided with two sheets, and the two semiconductor refrigerating sheets 3 are arranged in parallel.
It should be noted that the semiconductor refrigerating sheets 3 are arranged in parallel, so that the power can be increased, and the refrigerating efficiency can be improved; and simultaneously, the two semiconductor refrigerating sheets 3 can improve the heat dissipation efficiency.
Further, the thickness of the high-conductivity nano-carbon copper 4 is 0.3mm.
Further, the thickness of the high thermal conductivity silica gel 5 is 0.5mm.
Further, the intelligent main control PCB 2 is further provided with a type-c power supply interface 6, and the type-c power supply interface 6 is connected with a direct current power supply.
In a specific implementation, the direct current power supply supplies power to the whole module through the type-c power supply interface 6, and can provide stable direct current power supply for the intelligent main control PCB 2 and the semiconductor refrigerating sheet 3.
Further, the material of the semiconductor refrigeration sheet 3 is bismuth telluride.
The working principle of the utility model is as follows:
the type-c power supply interface 6 is connected with a direct current power supply to supply power to the whole module, the integrated temperature sensor 1 detects the temperature of the hot face and the cold face of the semiconductor refrigerating sheet 3 and transmits temperature data to the intelligent main control PCB circuit board 2, the intelligent main control PCB circuit board 2 controls and outputs the current to the semiconductor refrigerating sheet 3 according to the temperature data, temperature adjustment is achieved, the refrigerating gear is adjusted, the high-conductivity carbon copper 4 is connected with the hot face of the semiconductor refrigerating sheet 3 to conduct heat to the fins, the high-conductivity silica gel 5 is connected with the cold face of the semiconductor refrigerating sheet 3 to conduct refrigeration to the heating area of electronic equipment.
Claims (6)
1. A two semiconductor core heat dissipation control modules for cell-phone forced air cooling radiator, its characterized in that: the intelligent main control PCB circuit board (2) is connected with the integrated temperature sensor (1), the intelligent main control PCB circuit board (2) is connected with the semiconductor refrigerating sheet (3), the integrated temperature sensor (1) is respectively connected with a hot surface and a cold surface of the semiconductor refrigerating sheet (3), the high-conductivity carbon copper (4) is arranged on one side of the hot surface of the semiconductor refrigerating sheet (3), and the high-conductivity silicon gel (5) is arranged on one side of the cold surface of the semiconductor refrigerating sheet (3);
the integrated temperature sensor (1) is used for detecting the temperatures of a hot surface and a cold surface of the semiconductor refrigeration piece (3) and transmitting data to the intelligent main control PCB (2);
the intelligent main control PCB circuit board (2) intelligently adjusts the temperature according to the data from the integrated temperature sensor (1) and controls the refrigerating gear by controlling the current output to the semiconductor refrigerating sheet (3);
the semiconductor refrigerating sheet (3) realizes refrigeration according to the current output from the intelligent main control PCB circuit board (2);
the high-conductivity nano carbon copper (4) is used for connecting the hot surface of the semiconductor refrigerating sheet (3) with the fins so as to conduct heat to the fins;
the high-heat-conductivity silica gel (5) is used for connecting the cold face of the semiconductor refrigeration piece (3) and the heating area of the electronic equipment, so that the heating area of the electronic equipment is refrigerated.
2. The dual semiconductor die attach control module for a mobile phone air-cooled radiator of claim 1, wherein: the semiconductor refrigerating sheets (3) are provided with two pieces, and the two semiconductor refrigerating sheets (3) are arranged in parallel.
3. The dual semiconductor die attach control module for a mobile phone air-cooled radiator of claim 1, wherein: the thickness of the high-conductivity nano carbon copper (4) is 0.3mm.
4. The dual semiconductor die attach control module for a mobile phone air-cooled radiator of claim 1, wherein: the thickness of the high heat conduction silica gel (5) is 0.5mm.
5. The dual semiconductor die attach control module for a mobile phone air-cooled radiator of claim 1, wherein: the intelligent main control PCB circuit board (2) is further provided with a type-c power supply interface (6), and the type-c power supply interface (6) is connected with a direct current power supply.
6. The dual semiconductor die attach control module for a mobile phone air-cooled radiator of claim 1, wherein: the semiconductor refrigeration sheet (3) is made of bismuth telluride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322167423.XU CN220755317U (en) | 2023-08-11 | 2023-08-11 | Dual-semiconductor core heat dissipation control module for mobile phone air-cooled radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322167423.XU CN220755317U (en) | 2023-08-11 | 2023-08-11 | Dual-semiconductor core heat dissipation control module for mobile phone air-cooled radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220755317U true CN220755317U (en) | 2024-04-09 |
Family
ID=90559911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322167423.XU Active CN220755317U (en) | 2023-08-11 | 2023-08-11 | Dual-semiconductor core heat dissipation control module for mobile phone air-cooled radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220755317U (en) |
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2023
- 2023-08-11 CN CN202322167423.XU patent/CN220755317U/en active Active
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