CN214253139U - Auxiliary heat dissipation device for electronic equipment - Google Patents

Abstract

The utility model discloses an auxiliary heat dissipation device for electronic equipment belongs to the heat dissipation device field. It includes refrigeration module, heat radiation module and single chip microcomputer control circuit, and refrigeration module mainly includes heat conduction silica gel membrane, semiconductor refrigeration piece, leads cold board, thermal insulation material, and its refrigeration module's semiconductor refrigeration piece can carry out active refrigeration heat dissipation, can promote the radiating efficiency on fixed area, the utility model discloses can provide extra heat dissipation for high performance's small-size electronic equipment. The utility model discloses an active refrigeration heat dissipation of refrigeration module cold plate is higher than traditional air-cooled radiating efficiency, and it is littleer than the volume that water-cooled heat dissipation occupies simultaneously, uses more in a flexible way.

Description

Auxiliary heat dissipation device for electronic equipment

Technical Field

The utility model belongs to electronic equipment heat dissipation field, specifically speaking relates to an auxiliary heat abstractor of electronic equipment.

Background

At present, when a conventional smart phone and a part of high-performance small electronic equipment work at high performance or full load, a processor generates a large amount of heat in a long-time overload running process, and the temperature rises sharply. However, most electronic devices cannot effectively dissipate heat, and a frequency reduction operation of a processor often causes that the mobile phone and the electronic devices are jammed or even halted, so that an external auxiliary heat dissipation device needs to be additionally arranged on the high-performance small electronic devices. The commercially available external auxiliary radiator mainly adopts fan heat radiation, water cooling heat radiation, back-clamping type semiconductor refrigeration heat radiation and other modes.

The heat dissipation is assisted by a fan and a water cooling mode, and the heat of the mobile phone is transferred to another place through air or circulating water, so that the heat dissipation effect is achieved. However, the temperature difference between the outside air or the circulating water and the heating part of the mobile phone is small, so that the auxiliary heat dissipation effect of the mobile phone is poor. The back-clamping semiconductor refrigeration auxiliary heat radiation utilizes the semiconductor refrigeration piece to refrigerate and generate larger temperature difference to actively radiate the heat generating part of the mobile phone. But the refrigeration power is smaller, the contact area between the semiconductor refrigeration end and the mobile phone is smaller, and the contact area between the radiating fins and the air is smaller, so the radiating effect is still not obvious. In addition, compared with other heat dissipation methods, the water-cooled heat dissipation has the disadvantages that the volume of the heat sink is too large, the use is complicated, and the heat sink is not suitable for heat dissipation of mobile phones and small-sized equipment; the air-cooled heat dissipation and the back splint type semiconductor heat dissipation both use a fan with high rotating speed to take away heat, so that the noise is high, and the use experience of a user is influenced. The heat dissipation effects of the three radiators are all poor, and the continuous operation of the mobile phone under high load cannot be guaranteed.

For example, the disclosure of the invention is 7 and 10 in 2013, and the application number is 2013102869445, the invention provides a radiator for the back of a mobile phone, the working principle of the radiator mainly depends on natural heat transfer, and then the radiator radiates heat through a fan, and the principle of the radiating mode requires that the temperature difference between room temperature and equipment needing radiating is large, so that the radiating effect is not ideal in regions with warmer room temperature or seasons.

Therefore, it is necessary to develop an auxiliary heat dissipation device for electronic equipment, which effectively increases heat dissipation power and heat dissipation effect, so that the electronic equipment can continuously operate in a high performance mode, reduces the temperature of the processor and the battery, and prolongs the service life of the equipment.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned problem that prior art exists, the utility model aims to provide an occupation space is little, and the radiating effect receives environmental impact little, can stabilize an auxiliary heat abstractor of work for a long time.

In order to solve the above problems, the utility model adopts the following technical proposal.

An auxiliary heat dissipation device for electronic equipment comprises a heat dissipation module, and is characterized in that the heat dissipation module is provided with a heat conduction block, and a refrigeration module is arranged between the heat conduction block and the electronic equipment;

the refrigeration module comprises a heat conduction membrane, a cold conduction plate, a temperature sensor and a refrigeration piece, the heat conduction membrane is arranged between the cold conduction plate and the electronic equipment, the refrigeration piece is arranged between the cold conduction plate and the heat conduction block of the heat dissipation module, and the temperature sensor is embedded in the cold conduction plate;

and the singlechip is respectively connected with the temperature sensor, the heat dissipation module and the refrigerating piece.

The heat conduction membrane be the silica gel heat conduction membrane, the heat conduction efficiency of silica gel is higher, is more suitable to the little electronic equipment of area.

Refrigeration piece is semiconductor refrigeration piece, and semiconductor refrigeration piece accessible PWM frequency modulation controls the refrigeration, as the utility model discloses a core for the heat dissipation of initiative

And a heat insulating material is arranged below the cold conduction plate and is positioned around the refrigerating sheet, so that the influence of the room temperature of the non-contact part on the cold conduction plate and the refrigerating sheet is reduced.

The single chip microcomputer circuit is provided with a buzzer, and an alarm is given when the temperature exceeds a specified temperature.

The single chip microcomputer circuit is provided with a liquid crystal display screen and can reflect the temperature of the electronic equipment in real time.

The single chip microcomputer circuit is connected to the refrigeration module and the heat dissipation module and supplies power to the two modules, and the refrigeration module and the heat dissipation module do not need an additional power supply.

The single chip microcomputer circuit is powered by the battery, so that the equipment can work at any time, and the portability is improved.

The single chip circuit is powered by the power supply, the equipment supports long-time continuous work, and a heat dissipation function can be stably provided for the electronic equipment.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses an active cooling, the efficiency of cooling is higher and the radiating efficiency that does not have traditional heat-radiating equipment receives the problem of room temperature influence.

(2) The utility model discloses a cryogenic power is regulated and control to the singlechip circuit accuracy, makes equipment under the high performance mode, is in suitable operating temperature within range all the time. Meanwhile, the battery damage of the equipment caused by too high refrigeration power and too low temperature can be prevented.

(3) The utility model discloses an external power supply, the subsidiary battery power supply of accessible single chip microcomputer circuit also can add the extension treasured that charges or directly insert the power supply on the power, and the power supply mode is nimble, satisfies the different demands of carrying the use and using for a long time fixedly.

(4) The utility model discloses a charactron or liquid crystal display show the real-time temperature of heat dissipation position to adopt bee calling organ to report to the police when the high temperature or cross lowly and indicate, effectively monitor the heat dissipation condition.

(5) The utility model discloses simple structure, reasonable in design easily makes.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of the refrigerating apparatus of the present invention;

FIG. 3 is a schematic structural view of the heat dissipation device of the present invention;

fig. 4 is a schematic circuit diagram of the present invention;

in the figure: 1. a temperature sensor; 2. a heat-conducting silicone membrane; 3. a thermal insulation material; 4. a connecting frame; 5. a fan; 6. a cold conducting plate; 7. heat dissipation fins; 8. a liquid crystal display screen; 9. a power interface; 10. a data interface; 11. a buzzer; 12. a semiconductor refrigeration sheet; 13. a heat conducting block; 14. a heat pipe; 15. abs feet.

Detailed Description

The present invention will be further described with reference to the following specific embodiments.

Example 1;

an auxiliary heat dissipation device for electronic equipment is composed of a refrigeration module, a heat dissipation module and a single chip microcomputer circuit part.

As shown in fig. 1 and 2, the refrigeration module is composed of a semiconductor refrigeration sheet 12, a cold conducting plate 6, a heat conducting silicone film 2, a heat insulating material 3, and the like, wherein heat conducting silicone grease is coated on the cold and hot contact ends of the semiconductor refrigeration sheet 12, so that the cold end of the semiconductor refrigeration sheet 12 is tightly attached to the cold conducting plate 6, and the hot end of the semiconductor refrigeration sheet is attached to a heat conducting block 13 of the heat dissipation device.

As shown in fig. 2, one surface of the cold guide plate contacting the electronic device is adhered with a layer of heat conductive silicone film 2, the electronic device is adhered with the heat conductive silicone film 2, and the heat conductive silicone film 2 can effectively and quickly transfer the heat of the electronic device to the cold guide plate 6. On the cold guide plate 6, all parts which are not in contact with the mobile phone are filled with heat insulation materials 3, so that the influence of the external temperature on the semiconductor refrigeration sheet 12 is reduced.

As shown in fig. 3, the heat dissipation portion is a relatively common tower-type heat sink structure, the heat sink mainly includes a heat conduction block 13, a heat pipe 14, heat dissipation fins 7, a fan 5 and ABS feet 15, the heat conduction block 13 receives heat transferred from the semiconductor refrigeration fins 12, the heat conduction block 13 transfers the heat to the heat dissipation fins 7 through the heat pipe 14, gaps are formed between the heat dissipation fins 7, the area of air circulation is larger, the fan 5 arranged on the side surface accelerates air circulation, and reduces the temperature of the heat dissipation fins 7.

As shown in fig. 1 and 4, the circuit part of the single chip is installed in a waterproof box, the power lines of the semiconductor refrigerating sheet 12, the temperature sensor 1 and the fan 5 are connected to the data interface 10 of the waterproof box, on one hand, the power supply of the circuit can be supplied by a battery, under the condition that long-time heat dissipation is needed, civil alternating current can be converted into low-voltage direct current through a power adapter, and the low-voltage direct current is connected with an internal circuit through the power interface 9 of the waterproof box.

The single chip microcomputer circuit collects the real-time temperature of the cold guide plate 6 through the temperature sensor 1 embedded in the cold guide plate 6, controls the semiconductor refrigerating sheet 12 in a PWM mode, and adjusts the refrigerating power of the semiconductor refrigerating sheet 12. The temperature, the working mode and the like of the mobile phone are displayed in real time through the liquid crystal display screen 8, and the buzzer 11 is arranged to give an alarm when the temperature exceeds a set threshold value.

When the temperature is higher than the set threshold value, the single chip microcomputer circuit controls the semiconductor refrigerating sheet 12 to refrigerate and turns on the fan 5. And when the temperature is lower than a set threshold value, the semiconductor refrigerating sheet 12 and the fan 5 are turned off.

This example is only one embodiment of the present invention, and does not limit the final practical use of the present invention.

Claims (8)

1. The utility model provides an auxiliary heat dissipation device of electronic equipment, includes heat dissipation module, its characterized in that still includes:

the cooling module is provided with a heat conduction block and is arranged between the heat conduction block and the electronic equipment; the refrigeration module comprises a heat conduction membrane, a cold conduction plate, a temperature sensor and a refrigeration piece, wherein the heat conduction membrane is arranged between the cold conduction plate and the electronic equipment, the refrigeration piece is arranged between the cold conduction plate and a heat conduction block of the heat dissipation module, and the temperature sensor is embedded in the cold conduction plate;

and the singlechip is respectively connected with the temperature sensor, the heat dissipation module and the refrigerating piece.

2. The auxiliary heat sink for electronic devices as claimed in claim 1, wherein the thermal conductive film is a silicone thermal conductive film.

3. The auxiliary heat sink for electronic devices of claim 1, wherein the cooling fins are semiconductor cooling fins.

4. The auxiliary heat sink for electronic devices as claimed in claim 1, wherein an insulating material is disposed under the cold conducting plate, and the insulating material is disposed around the cooling plate.

5. The auxiliary heat sink for electronic device as claimed in claim 1, wherein the single chip circuit is provided with a buzzer.

6. The auxiliary heat sink for electronic devices as claimed in claim 1, wherein the single chip circuit is provided with a liquid crystal display.

7. The auxiliary heat sink for electronic equipment as claimed in claim 1, wherein the single chip circuit supplies power to the cooling module and the heat dissipating module.

8. The auxiliary heat sink for electronic devices as claimed in claim 1, wherein the single chip circuit is powered by a battery or a power source.

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