CN112672605B - Air cooling plate based on TEC refrigeration - Google Patents
Air cooling plate based on TEC refrigeration Download PDFInfo
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- CN112672605B CN112672605B CN202011536238.8A CN202011536238A CN112672605B CN 112672605 B CN112672605 B CN 112672605B CN 202011536238 A CN202011536238 A CN 202011536238A CN 112672605 B CN112672605 B CN 112672605B
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Abstract
The invention discloses an air cooling plate based on TEC refrigeration. The cold end of the TEC refrigerating sheet is in surface contact with the heating element to cool the same, the hot end of the TEC refrigerating sheet is in contact with the radiating fins to conduct heat to a high-temperature environment, and in order to enhance the radiating effect of the hot end, a heating pipe is additionally arranged between the hot end of the refrigerating sheet and the radiating fins of the cold plate to enhance the heat conduction between the hot end of the TEC refrigerating sheet and the radiating fins of the cold plate. Meanwhile, in order to prevent heat flow short circuit between the cold end and the hot end, a heat insulation gasket is added between the air cooling plate substrate and the radiating fins, and a heat insulation pressing block is added between the pressing block and the radiating fins.
Description
Technical Field
The invention belongs to a thermal design technology suitable for electronic equipment, and particularly relates to an air cooling plate based on TEC refrigeration.
Background
Forced air cooling is widely applied to cooling of various electronic equipment, and an air cooling plate is used as a heat dissipation heat sink commonly used for the electronic equipment and has the functions of mounting a carrier for the electronic equipment and dissipating heat through air cooling. Conventional air-cooled cold plates, however, have limitations that do not reduce the temperature of the electronic device below ambient temperature. At present, more and more electronic equipment, especially military electronic equipment, have more and more working requirements in a high-temperature environment, and some devices in the electronic equipment with high heat consumption and high heat flux density cannot meet the heat dissipation requirements by adopting a conventional air cooling cold plate. And the adoption of the compressor refrigeration mode needs to additionally increase a large amount of equipment, so that the whole machine has large size and heavy weight and can not meet the miniaturization requirement of electronic equipment.
The TEC refrigeration is also called thermoelectric refrigeration, and the refrigeration mode has simple structure, high integration level and flexible arrangement; the system has no moving parts, high reliability and low noise; the whole machine is quick to start, flexible to control, capable of refrigerating in the forward direction and heating in the reverse direction, and capable of meeting the high-low temperature use requirements of electronic equipment. Therefore, the thermoelectric refrigeration is applied to the air cooling cold plate, so that the heat dissipation requirement of the electronic equipment in a high-temperature environment can be met, particularly, some components with high heat consumption and high heat flux density can be met, and the miniaturization design requirement of the electronic equipment can be met.
Disclosure of Invention
The invention aims to provide an air cooling plate based on TEC refrigeration, which can meet the heat dissipation requirement of an electronic device in a high-temperature environment and can also meet the miniaturization design by combining the characteristic of TEC refrigeration and aiming at the heat dissipation requirement of the electronic device with high heat consumption and high heat flow density in the high-temperature environment.
The technical solution for realizing the purpose of the invention is as follows: a cold air plate based on TEC refrigeration is provided, wherein a phase change temperature equalizing layer and a plurality of TEC refrigeration components are arranged between a heat dissipation fin and a cold air plate substrate to dissipate heat of a mounted heating element, and the cold air plate substrate is used for providing a mounting and fixing space for the heating element and the TEC refrigeration components; the TEC refrigeration component is embedded in the bottom surface of the radiating fin.
The TEC refrigeration assembly comprises a pressing block, a heat insulation pressing block and a TEC refrigeration piece, the TEC refrigeration piece is fixed on the bottom surface of the radiating fin through the pressing block, the hot end of the TEC refrigeration piece is ensured to be attached to the radiating fin, an annular heat insulation pressing block is arranged between the bottom surface of the radiating fin and the pressing block and used for preventing heat flow between the radiating fin and the pressing block from being short-circuited, and the heating element is located below the pressing block.
The phase-change temperature-equalizing layer adopts a heat pipe, and the heat pipe is embedded into the radiating fin, is close to the bottom surface of the radiating fin and is positioned above the hot end of the TEC refrigerating sheet.
Furthermore, the heat pipe is embedded into the radiating fin in a mode of bonding, reflow soldering or compression bonding of heat conducting glue, so that heat transfer between the hot end of the TEC refrigerating sheet and the radiating fin is enhanced, and the radiating effect of the hot end of the TEC refrigerating sheet is enhanced.
Furthermore, the pressing block has the function of fixing the TEC refrigerating sheet and the function of transferring the heat of the heating element to the cold end of the TEC refrigerating sheet; in order to reduce the thermal resistance, a heat conducting gasket is arranged between the pressing block and the heating element.
Further, the material of the compact is selected to have high thermal conductivity.
Further, the heat insulation pressing block is made of a low-heat-conductivity material.
Furthermore, the phase-change temperature-uniforming layer adopts a VC cavity, namely radiating fins are directly processed on the shell of the phase-change temperature-uniforming layer, so that the heat transfer effect between the hot end of the TEC refrigerating fin and the radiating fins is further enhanced.
Furthermore, a heat insulation pad is arranged between the radiating fins and the base plate of the air cooling plate, so that short circuit of heat flow between the radiating fins and the base plate of the air cooling plate is prevented.
Compared with the prior art, the invention has the remarkable advantages that:
(1) And the TEC is adopted for refrigeration, so that the heat dissipation requirement of the electronic equipment in a high-temperature environment is met.
(2) The heat dissipation effect of the hot end of the refrigerating sheet is enhanced by utilizing phase change heat transfer.
(3) The pressing block, the air cooling plate substrate and the radiating fins are isolated by the heat insulating sheets, and short circuit of heat flow is prevented.
Drawings
Fig. 1 is a first layout diagram of an air cooling plate based on TEC refrigeration according to the present invention.
Fig. 2 is a partially enlarged view of fig. 1.
Fig. 3 is a layout diagram of an air cooling plate based on TEC refrigeration according to a second embodiment of the present invention.
Fig. 4 is a partially enlarged view of fig. 2.
Detailed Description
The present invention is described in further detail below with reference to the attached drawing figures.
Example 1: with reference to fig. 1 and 2, the air cooling plate based on TEC refrigeration of the present invention includes a heat dissipation fin 1, an air cooling plate substrate 2, a heating element 3, a pressing block 4, a heat insulation pressing block 5, a heat pipe 6 (or a VC cavity phase change temperature equalizing layer 10), a TEC refrigeration sheet 7, a heat insulation pad 8, and a heat conduction pad 9. The TEC refrigeration plate 7 is embedded in the air cooling plate radiating fin 1 and is fixed with the air cooling plate radiating fin 1 through the pressing block 4. The cold end of the TEC refrigeration piece 7 is in contact with the surface of the heating element 3 to cool the same, and the hot end of the TEC refrigeration piece is in contact with the radiating fin 1 to conduct heat to a high-temperature environment. In order to enhance the heat dissipation effect of the hot end, a heat pipe 6 is additionally arranged between the hot end of the TEC refrigeration piece 7 and the cold plate heat dissipation fin 1 to form a phase change temperature equalizing layer, so that the heat transfer between the hot end of the TEC refrigeration piece 7 and the cold plate heat dissipation fin 1 is enhanced. Meanwhile, in order to prevent a short circuit of heat flow between the cold end and the hot end, a heat insulation pad 8 is additionally arranged between the air cooling plate substrate 2 and the radiating fin 1, and a heat insulation pressing block 4 is additionally arranged between the pressing block 4 and the radiating fin 1. This air-cooling board possesses simple structure, and the integrated level is high, arranges in a flexible way, can satisfy electronic components's heat dissipation demand under the prerequisite of complete machine structure miniaturized design, especially can effectively control components and parts operating temperature under the high temperature environment. Meanwhile, a phase-change temperature-equalizing layer is added between the hot end of the refrigerating fin and the radiating fin by combining a phase-change heat transfer technology, so that the heat transfer effect between the hot end of the refrigerating fin and the radiating fin is enhanced, the heat of the hot end of the refrigerating fin can be prevented from being excessively concentrated, the problem of uneven heat dissipation is solved, and the heat dissipation effect of the whole machine is improved.
Example 2: with reference to fig. 3 and 4, on the basis of embodiment 1, the structural form of the heat pipe 6 embedded in the air-cooled heat dissipation fin 1 is changed into a heat dissipation fin processed on the top of the heat spreader plate of the VC cavity, so that the heat transfer between the hot end of the TEC refrigeration sheet 7 and the heat dissipation fin 1 is enhanced, and the heat dissipation effect of the hot end of the TEC refrigeration sheet is enhanced. The air cooling plate is simple in structure, high in integration level and flexible in arrangement, the heat dissipation requirement of electronic components can be met on the premise of miniaturization design of the whole structure, and the working temperature of the components can be effectively controlled under the high-temperature environment. Meanwhile, a phase-change temperature-equalizing layer is added between the hot end of the refrigerating plate 7 and the radiating fins 1 by combining a phase-change heat transfer technology, so that the heat transfer effect between the hot end of the TEC refrigerating plate 7 and the radiating fins 1 is enhanced, the heat of the hot end of the TEC refrigerating plate 7 can be prevented from being excessively concentrated, the problem of uneven heat dissipation is solved, and the heat dissipation effect of the whole machine is improved.
The material of the compact 4 is selected from materials having high thermal conductivity, such as copper, 6063 aluminum alloy, and the like.
The thermal insulation compact 5 uses a material with low thermal conductivity such as polytetrafluoroethylene, epoxy resin, or the like.
Claims (5)
1. The utility model provides a forced air cooling board based on TEC is cryogenic which characterized in that: a phase-change temperature-equalizing layer (10) and a plurality of TEC refrigerating components are arranged between the radiating fins (1) and the air cooling plate substrate (2), and the air cooling plate substrate (2) is used for providing a mounting and fixing space for the heating element (3) and the TEC refrigerating components; the TEC refrigeration component is embedded in the bottom surface of the radiating fin (1);
the TEC refrigeration component comprises a pressing block (4), a heat insulation pressing block (5) and a TEC refrigeration piece (7), the TEC refrigeration piece (7) is fixed on the bottom surface of the radiating fin (1) through the pressing block (4), the hot end of the TEC refrigeration piece (7) is ensured to be attached to the radiating fin (1), the annular heat insulation pressing block (5) is arranged between the bottom surface of the radiating fin (1) and the pressing block (4) and used for preventing heat flow short circuit between the radiating fin (1) and the pressing block (4), and the heating element (3) is located below the pressing block (4);
the phase-change temperature-equalizing layer (10) adopts a heat pipe (6), the heat pipe (6) is embedded into the radiating fin (1), is close to the bottom surface of the radiating fin (1), and is positioned above the hot end of the TEC refrigerating sheet (7);
the heat pipe (6) is embedded into the radiating fin (1) in a mode of bonding, reflow soldering or compression bonding of heat conducting glue, so that heat transfer between the hot end of the TEC refrigerating sheet (7) and the radiating fin (1) is enhanced, and the heat radiating effect of the hot end of the TEC refrigerating sheet (7) is enhanced;
the pressing block (4) has the function of fixing the TEC refrigerating sheet and also has the function of transferring the heat of the heating element (3) to the cold end of the TEC refrigerating sheet (7); in order to reduce the thermal resistance, a heat conducting gasket (9) is arranged between the pressing block (4) and the heating element (3).
2. The TEC refrigeration based air cooling plate according to claim 1, wherein: the material of the compact (4) is selected to have high thermal conductivity.
3. The TEC refrigeration based air cooling plate according to claim 1, wherein: the heat insulation pressing block (5) is made of a material with low heat conductivity.
4. The TEC refrigeration based air cooling plate according to claim 1, wherein: the phase-change temperature-uniforming layer (10) adopts a VC cavity, namely the heat radiating fins (1) are directly processed on the shell of the phase-change temperature-uniforming layer (10), so that the heat transfer effect between the hot end of the TEC refrigerating fin (7) and the heat radiating fins (1) is further enhanced.
5. The TEC refrigeration based air cooling plate according to claim 1, wherein: a heat insulation pad (8) is arranged between the radiating fins (1) and the air cooling plate substrate (2) to prevent short circuit of heat flow between the radiating fins (1) and the air cooling plate substrate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011536238.8A CN112672605B (en) | 2020-12-22 | 2020-12-22 | Air cooling plate based on TEC refrigeration |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011536238.8A CN112672605B (en) | 2020-12-22 | 2020-12-22 | Air cooling plate based on TEC refrigeration |
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| CN112672605A CN112672605A (en) | 2021-04-16 |
| CN112672605B true CN112672605B (en) | 2023-03-31 |
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| CN202011536238.8A Active CN112672605B (en) | 2020-12-22 | 2020-12-22 | Air cooling plate based on TEC refrigeration |
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| CN115443026A (en) * | 2021-06-02 | 2022-12-06 | 北京智行者科技股份有限公司 | Temperature regulation structure, controller and moving tool |
| CN113923938B (en) * | 2021-09-06 | 2023-03-24 | 联想(北京)有限公司 | Electronic device |
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| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN207965695U (en) * | 2018-04-08 | 2018-10-12 | 北京华宇德信光电技术有限公司 | A kind of accurate temperature control device under hot environment |
| CN110837284A (en) * | 2019-10-25 | 2020-02-25 | 华为技术有限公司 | Thermoelectric module, hard disk device and electronic equipment |
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