CN217603895U

CN217603895U - LED lighting module device of high heat conductivity

Info

Publication number: CN217603895U
Application number: CN202221964359.7U
Authority: CN
Inventors: 刘龙峰; 刘清泉; 刘宇峰; 陈小梅
Original assignee: Zhangzhou Gewei Electronics Co ltd
Current assignee: Zhangzhou Gewei Electronics Co ltd
Priority date: 2022-07-28
Filing date: 2022-07-28
Publication date: 2022-10-18
Anticipated expiration: 2032-07-28

Abstract

The utility model discloses a LED lighting module device of high heat conductivity, include: the LED lamp comprises a copper radiating fin, an LED module and an LED lampshade, wherein one side of the copper radiating fin is fixedly connected with the LED module, and the LED lampshade is fixedly arranged on one surface of the LED module; copper heating panel, two the top and the bottom at the LED module are installed respectively to the copper heating panel, at the in-process that uses, paste the back to the LED module through the heat dissipation and compare the cascade liquid cooling heat dissipation of aluminum sheet more efficient, carry out more efficient heat-conduction than the aluminum sheet through the graphite alkene layer of copper heating panel one side, carry out heat-conduction through the copper fin to the back of LED module, absorb the heat of adsorption on copper pole and the copper bar through bar copper aluminium alloy strip, enlarge heat radiating area on the copper heating panel through the square hole, enlarge heat radiating area on the copper fin through the louvre, enlarge heat radiating area on the L shape copper aluminium alloy pole through the round hole, enlarge the heat radiating area of copper bar through first through-hole and second through-hole.

Description

LED lighting module device of high heat conductivity

Technical Field

The utility model relates to a LED lighting module device technical field, in particular to LED lighting module device of high heat conductivity.

Background

At present, a basic light-emitting component of an LED lamp, namely an LED module, is generally mounted on a copper-clad aluminum substrate by adopting a surface-mounted LED lamp bead, and the surface-mounted LED lamp bead is contacted with a metal radiator by taking heat-conducting silicone grease as a heat-conducting medium, so that heat generated when the LED lamp bead is ignited is conducted to the radiator and is radiated to the external environment by the radiator. The traditional LED module device mainly comprises a high-power LED, a transparent device, a PCB (printed circuit board), a heat dissipation aluminum substrate and a base, wherein the high-power LED is welded on the PCB to form the LED circuit board, then the LED circuit board is fixed on the heat dissipation aluminum substrate, and the heat dissipation aluminum substrate is arranged on the base

The conventional LED lighting module device usually adopts a sheet-type heat dissipation device, two sides of a plurality of aluminum sheets are used for heat dissipation, the heat dissipation structure is too single, the heat dissipation effect is limited, a plurality of different heat dissipation modes are lacked for heat dissipation, and the LED module cannot be efficiently conducted; therefore, the application provides a high thermal conductivity LED lighting module device.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcomings existing in the prior art and providing a high-thermal-conductivity LED lighting module device.

In order to achieve the above object, the utility model discloses a main technical scheme include: a high thermal conductivity LED lighting module device, comprising: the LED lamp comprises a copper radiating fin, an LED module and an LED lampshade, wherein one side of the copper radiating fin is fixedly connected with the LED module, and the LED lampshade is fixedly arranged on one surface of the LED module;

the two copper heat dissipation plates are respectively arranged at the top and the bottom of the LED module, and one surface of each copper heat dissipation plate is fixedly connected with one surface of the LED lampshade;

the heat dissipation paste is fixedly arranged on one surface of the LED module;

the L-shaped copper-aluminum alloy rod is fixedly connected with the copper radiating plate and the copper radiating fins through the L-shaped copper-aluminum alloy rod.

As a preferred technical scheme, two sides of the heat dissipation paste are respectively abutted against the side faces of two adjacent copper heat dissipation fins, and the heat dissipation paste is a cascade liquid cooling heat dissipation paste.

According to a preferable technical scheme, one surface, far away from the LED lamp shade, of the copper heat dissipation plate is provided with a graphene layer.

As the preferred technical scheme, the copper heat dissipation plate is provided with heat dissipation holes, the copper heat dissipation plate is provided with square holes, and the L-shaped copper aluminum alloy rod is provided with round holes.

As a preferred technical scheme, the two L-shaped copper-aluminum alloy rods are fixedly connected through copper rods.

According to the preferable technical scheme, the copper radiating fins are fixedly connected through a copper bar, a first through hole is formed in the copper bar, a second through hole is formed in the copper bar, and the first through hole is communicated with the second through hole.

As a preferred technical scheme, the copper rod and the copper bar are fixedly connected through a strip-shaped copper aluminum alloy bar.

As a preferred technical scheme, a heat-conducting silicone grease layer is coated on the outer side of the strip-shaped copper-aluminum alloy strip.

The utility model discloses possess following beneficial effect at least:

1. the utility model discloses in, paste through the heat dissipation and compare the more efficient cascade waterfall liquid cooling heat dissipation of aluminum sheet to the back of LED module, go on than the more efficient heat-conduction of aluminum sheet through the graphite alkene layer of copper heating panel one side, carry out heat-conduction to the back of LED module through the copper fin, absorb the heat of absorption on copper pole and the copper bar through bar copper aluminium alloy strip.

2. The utility model discloses in, enlarge the heat radiating area on the copper heating panel through the square hole, enlarge the heat radiating area on the copper fin through the louvre, enlarge the heat radiating area on the L shape copper aluminium alloy pole through the round hole, enlarge the heat radiating area of copper bar through first through-hole and second through-hole.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic view of a three-dimensional overall structure at a first view angle of the present invention;

fig. 2 is a schematic view of a three-dimensional overall structure of a second view angle of the present invention;

fig. 3 is a schematic view of a partial explosion structure at view angle three of the present invention;

fig. 4 is a schematic diagram of a partial explosion structure at the fourth viewing angle of the present invention.

The reference numbers indicate:

1. an LED lamp shade; 2. an LED module; 3. a copper heat sink; 4. a copper heat sink plate; 5. a square hole; 6. an L-shaped copper-aluminum alloy rod; 7. a circular hole; 8. heat dissipation holes; 9. a copper bar; 10. a first through hole; 11. a second through hole; 12. strip copper aluminum alloy strip; 13. a copper rod; 14. a heat dissipation patch.

Detailed Description

The embodiments of the present application will be described in detail with reference to the drawings and examples, so that how to implement the technical means for solving the technical problems and achieving the technical effects of the present application can be fully understood and implemented.

Referring to fig. 1 to 4, a first embodiment of the present invention provides a high thermal conductivity LED lighting module device, including: the LED lamp comprises a copper radiating fin 3, an LED module 2 is fixedly connected to one side of the copper radiating fin 3, and an LED lampshade 1 is fixedly mounted on one surface of the LED module 2; the two copper heat dissipation plates 4 are respectively arranged at the top and the bottom of the LED module 2, and one surface of each copper heat dissipation plate 4 is fixedly connected with one surface of the LED lampshade 1; the heat dissipation paste 14, the heat dissipation paste 14 is fixedly arranged on one surface of the LED module 2; the L-shaped copper-aluminum alloy rod 6, the copper heat dissipation plate 4 and the copper heat dissipation plate 3 are fixedly connected through the L-shaped copper-aluminum alloy rod 6.

Through adopting above-mentioned technical scheme, the heat conductivility that the heat dissipation pasted 14 is highest, the graphene layer subsidiary also has extremely strong heat conductivity on the copper cooling plate 4, can carry out efficient heat conduction to the back of LED lamp shade 1 and LED module 2 through these two parts, can carry out the conduction to the absorbent heat of copper cooling plate 4 through L shape copper aluminium alloy pole 6 and give off, can carry out the conduction to the heat that LED module 2 and heat dissipation pasted 14 through copper cooling plate 3 and give off, can carry out the conduction to the heat on the L shape copper aluminium alloy pole 6 through copper bar 13 and give off, carry out the conduction through the heat of copper bar 9 on the copper cooling plate 3 and give off, can give off the heat conduction on copper bar 13 and copper bar 9 through bar copper aluminium alloy 12.

Please refer to fig. 1 to 4, embodiment two of the present invention, both sides of the heat dissipation paste 14 are respectively abutted to the sides of two adjacent copper heat dissipation plates 3, the heat dissipation paste 14 is a cascade waterfall liquid cooling heat dissipation paste, one side of the copper heat dissipation plate 4 away from the LED lamp shade 1 has a graphene layer, a heat dissipation hole 8 has been opened on the copper heat dissipation plate 3, a square hole 5,L is opened on the copper heat dissipation plate 4, a round hole 7 has been opened on the copper-aluminum alloy rod 6, two L-shaped copper-aluminum alloy rods 6 are fixedly connected through a copper rod 13, a copper bar 9 is fixedly connected between the copper heat dissipation plates 3, a first through hole 10 has been opened on the copper bar 9, a second through hole 11 has been opened on the copper bar 9, the first through hole 10 is communicated with the second through hole 11, the copper rod 13 and the copper bar 9 are fixedly connected through a copper-aluminum alloy bar 12, a heat conductive silicone grease layer is smeared outside the copper-aluminum alloy bar 12.

By adopting the technical scheme, the heat dissipation area of the copper heat dissipation fins 3 is enlarged through the heat dissipation holes 8, the heat dissipation area of the L-shaped copper-aluminum alloy rod 6 is enlarged through the round hole 7, and the heat dissipation area of the copper bar 9 is enlarged through the first through hole 10 and the second through hole 11.

The utility model discloses a theory of operation is: the heat-conducting property of the heat dissipation sticker 14 is highest, the graphene layer attached on the copper heat dissipation plate 4 is also attached with extremely strong heat conductivity, can carry out efficient heat conduction to the back of the LED lampshade 1 and the LED module 2 through the two components, the heat absorbed by the copper heat dissipation plate 4 can be conducted and dissipated through the L-shaped copper-aluminum alloy rod 6, the heat on the LED module 2 and the heat dissipation sticker 14 can be conducted and dissipated through the copper heat dissipation plate 3, the heat on the L-shaped copper-aluminum alloy rod 6 can be conducted and dissipated through the copper rod 13, the heat on the copper heat dissipation plate 3 can be conducted and dissipated through the copper bar 9, the heat on the copper rod 13 and the copper bar 9 can be conducted and dissipated through the strip-shaped copper-aluminum alloy bar 12;

the heat dissipation area of the copper heat dissipation fins 3 is enlarged through the heat dissipation holes 8, the heat dissipation area of the L-shaped copper aluminum alloy rods 6 is enlarged through the round holes 7, and the heat dissipation area of the copper bars 9 is enlarged through the first through holes 10 and the second through holes 11;

paste 14 through the heat dissipation and compare the cascade liquid cooling heat dissipation of the more efficient of aluminum sheet to the back of LED module 2, carry out more efficient heat-conduction than the aluminum sheet through the graphite alkene layer of 4 one sides of copper cooling panel, carry out heat-conduction to the back of LED module 2 through copper fin 3, absorb adsorbed heat on copper pole 13 and the copper bar 9 through bar copper aluminium alloy strip 12, enlarge heat radiating area on the copper cooling panel 4 through square hole 5, enlarge heat radiating area on the copper fin 3 through louvre 8, enlarge heat radiating area on the L shape copper aluminium alloy pole 6 through round hole 7, enlarge heat radiating area of copper bar 9 through first through-hole 10 and second through-hole 11.

The different embodiments described above can be used in combination with each other.

The model of the LED module 2 is M23SMD.

While the foregoing description shows and describes several preferred embodiments of the invention, it is to be understood, as noted above, that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive or to exclude other embodiments and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.

Claims

1. The utility model provides a high heat conductivity's LED lighting module device which characterized in that includes:

the LED lamp comprises a copper radiating fin (3), wherein one side of the copper radiating fin (3) is fixedly connected with an LED module (2), and one surface of the LED module (2) is fixedly provided with an LED lampshade (1);

the two copper heat dissipation plates (4) are respectively arranged at the top and the bottom of the LED module (2), and one surface of each copper heat dissipation plate (4) is fixedly connected with one surface of the LED lampshade (1);

the heat dissipation sticker (14), wherein the heat dissipation sticker (14) is fixedly installed on one surface of the LED module (2);

l shape copper aluminium alloy pole (6), copper cooling plate (4) and copper fin (3) pass through L shape copper aluminium alloy pole (6) fixed connection.

2. The LED lighting module device with high thermal conductivity as claimed in claim 1, wherein: the two sides of the heat dissipation paste (14) are respectively abutted against the side faces of the two adjacent copper radiating fins (3), and the heat dissipation paste (14) is a cascade waterfall liquid cooling heat dissipation paste.

3. The LED lighting module device with high thermal conductivity as claimed in claim 1, wherein: one surface of the copper heat dissipation plate (4) far away from the LED lampshade (1) is provided with a graphene layer.

4. The LED lighting module device with high thermal conductivity as claimed in claim 3, wherein: the copper radiating fin (3) is provided with a radiating hole (8), the copper radiating plate (4) is provided with a square hole (5), and the L-shaped copper-aluminum alloy rod (6) is provided with a round hole (7).

5. The LED lighting module device with high thermal conductivity as claimed in claim 4, wherein: the two L-shaped copper-aluminum alloy rods (6) are fixedly connected through copper rods (13).

6. The LED lighting module device with high thermal conductivity as claimed in claim 4, wherein: the copper radiating fins (3) are fixedly connected through copper bars (9), first through holes (10) are formed in the copper bars (9), second through holes (11) are formed in the copper bars (9), and the first through holes (10) are communicated with the second through holes (11).

7. The LED lighting module device with high thermal conductivity as claimed in claim 5, wherein: the copper rod (13) and the copper bar (9) are fixedly connected through a strip copper aluminum alloy bar (12).

8. The LED lighting module device with high thermal conductivity according to claim 7, wherein: and a heat-conducting silicone grease layer is coated on the outer side of the strip-shaped copper-aluminum alloy strip (12).