CN213280198U - Multilayer PCB substrate with high heat conduction and high heat dissipation - Google Patents

Abstract

A multilayer PCB substrate with high heat conductivity and high heat dissipation comprises two or more than two layers of copper-clad plates which are arranged up and down, wherein an insulating plate layer is arranged between every two adjacent copper-clad plates; the utility model discloses a high heat conduction and high radiating multilayer PCB substrate can be rapidly with heat conduction to the other one side and the heat dissipation of multilayer PCB substrate through the heat conduction stick, and the radiating head increases heat radiating area, has improved the radiating efficiency, has good local radiating effect.

Description

Multilayer PCB substrate with high heat conduction and high heat dissipation

Technical Field

The utility model belongs to the technical field of the PCB, concretely relates to high heat conduction and high radiating multilayer PCB substrate.

Background

The circuit board of the electronic equipment can generate heat during working, so that the internal temperature of the equipment can rise rapidly, if the heat is not dissipated in time, the equipment can be heated continuously, and the service life and the reliability of the electronic element can be reduced due to overheating. Therefore, it is important to perform a heat dissipation process on a Printed Circuit Board (PCB).

The direct reason for causing the temperature rise of the PCB is that due to the existence of circuit power consumption devices, power consumption exists in all electronic devices to different degrees, the heating intensity changes along with the power consumption, and the temperature rise phenomenon in the PCB comprises local temperature rise or large-area temperature rise, and short-time temperature rise or long-time temperature rise.

The heat dissipation problem of the PCB is solved, and the heat dissipation of the PCB is mainly realized by optimizing the heat dissipation of components, reducing the power consumption of the components, optimizing the layout of a circuit and the components, adopting a radiator, strengthening the air cooling or water cooling and the like.

Because the PCB board widely used at present is a copper-clad/epoxy glass cloth substrate or phenolic resin glass cloth substrate and a paper-based copper-clad substrate, the substrates have excellent electrical performance and processability, but have poor heat dissipation performance, and for high-heating elements, the resin of the PCB board is difficult to conduct heat to form effective heat dissipation, and the electronic elements can dissipate heat to the surrounding environment in a heat conduction and heat radiation mode. Because of the use of a large number of small electronic elements, the surface heat dissipation area of the electronic elements is deficient, and more auxiliary heat dissipation means are needed for heat dissipation; if can improve the heat-sinking capability with the PCB self of the electronic component direct contact that generates heat, conduct the heat or distribute away through the PCB substrate, can reduce the input cost of PCB in the heat dissipation, let people have bigger degree of freedom when designing PCB.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a can improve radiating efficiency's multilayer PCB substrate.

In order to solve the technical problem, the utility model discloses a high heat conduction and high radiating multilayer PCB substrate, including the double-deck or the copper foil clad plate more than the double-deck of arranging from top to bottom, be equipped with insulating sheet layer between the adjacent copper foil clad plate, processing has a plurality of through-holes on the multilayer PCB substrate, and the through-hole interpolation has the heat conduction stick, and the heat conduction stick upper end has the radiating head that exposes multilayer copper foil clad plate upper surface, and the gap intussuseption between heat conduction stick and through-hole is filled with heat conduction silica gel.

Preferably, the heat dissipation head comprises a plurality of annular heat dissipation fins arranged up and down.

Preferably, the heat dissipation head comprises a plurality of top annular heat dissipation fins which are concentrically arranged.

Preferably, the heat conducting rod is in a column shape with uniform upper and lower parts.

Further, the heat conducting rod is a cylinder or a polygonal column.

Preferably, the lower end of the heat conducting rod is flush with or protrudes out of the lower surface of the multilayer PCB substrate.

Preferably, the heat conducting rod material is a high heat conducting material.

Preferably, the through hole is formed at a position on the multilayer PCB substrate where heat is easily generated or generated.

Preferably, the copper-clad plate is a single-sided or double-sided copper-clad plate.

The utility model discloses a high heat conduction and high radiating multilayer PCB substrate have following advantage at least:

the utility model discloses a high heat conduction and high radiating multilayer PCB substrate can be rapidly with heat conduction to the other one side and the heat dissipation of multilayer PCB substrate through the heat conduction stick, and the radiating head increases heat radiating area, has improved the radiating efficiency, has good local radiating effect.

Drawings

Fig. 1 is a schematic structural view of a multilayer PCB substrate with high thermal conductivity and high heat dissipation.

Fig. 2 is a schematic perspective view of the heat conducting rod in fig. 1.

Fig. 3 is a schematic perspective view of a second heat conduction rod.

The reference numbers in the figures are: 1-multilayer PCB substrate, 2-through hole, 3-heat conducting rod, 4-radiating head, 5-ring radiating fin arranged up and down, 6-ring radiating fin arranged concentrically.

Detailed Description

The present invention is further described in detail below with reference to examples so that those skilled in the art can implement the invention with reference to the description.

It will be understood that terms such as "having," "including," and "comprising," when used herein, do not preclude the presence or addition of one or more other elements or groups thereof.

As shown in fig. 1-2, a multilayer PCB substrate 1 with high thermal conductivity and high heat dissipation comprises two or more than two copper foil-clad plates arranged from top to bottom, wherein an insulating plate layer is arranged between adjacent copper foil-clad plates, a plurality of through holes 2 are processed on the multilayer PCB substrate, a thermal conductive rod 3 is inserted into each through hole, a heat dissipation head 4 exposing the upper surface of each copper foil-clad plate is arranged at the upper end of each thermal conductive rod, and a gap between each thermal conductive rod and each through hole is filled with thermal conductive silica gel. The through-hole can sink copper, also can not sink copper (need not to sink copper), and punch and install the heat conduction stick in the preparation later stage of multilayer PCB substrate, the heat conduction stick keep away from modes such as radiating head one end accessible direct contact, heat-conducting glue or gasket and the big electronic component contact of calorific capacity, increase heat transfer area improves heat conduction efficiency, in addition, fix the heat conduction stick in the through-hole through heat-conducting silica gel, can satisfy the fixed requirement under the general condition, and technology is simple relatively, and is with low costs.

The heat dissipation head comprises a plurality of annular heat dissipation fins 5 which are arranged up and down. The heat conducting rod conducts partial heat generated by the electronic element to the heat dissipation head on the other side of the multilayer PCB substrate, so that local heat dissipation of the multilayer PCB substrate is enhanced, and local overheating is prevented.

The heat conducting rod is a cylinder with uniform upper and lower parts.

The lower end of the heat conducting rod is flush with or protrudes out of the lower surface of the multilayer PCB substrate. Because the heat conducting silica gel is adopted to fix the heat conducting rod in the through hole, the position relation between the lower end of the heat conducting rod and the multilayer PCB substrate is relatively flexibly arranged, and the heat conducting rod has better adaptability.

The heat conducting rod is made of copper or copper alloy.

The through hole is arranged at a position on the multilayer PCB substrate where heat is easy to generate or the heat productivity is large. Can be rapidly with heat conduction to the other side of multilayer PCB substrate and heat dissipation through the heat conduction stick to solve the poor problem of PCB substrate heat conductivity to a certain extent, the local heat dissipation problem in the pertinence solution PCB substrate use.

The copper-clad plate is a single-sided or double-sided copper-clad plate.

Example 2

As shown in fig. 3, similarly to embodiment 1, the difference is that the heat radiation head includes a plurality of concentrically arranged ring-shaped heat radiation fins 6 provided on the top. The arrangement mode of the annular radiating fins can better prevent the radiating head from deforming under the external pressure in the mounting and using processes, and the requirement on the height of the radiating head exposed out of the multi-layer PCB substrate is lower.

While the embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in all kinds of fields suitable for the invention, and further modifications may be readily made by those skilled in the art, and the invention is therefore not limited to the specific details and embodiments shown and described herein, without departing from the general concept defined by the claims and their equivalents.

Claims (9)

1. The utility model provides a high heat conduction and high radiating multilayer PCB substrate, includes the double-deck or the copper clad laminate more than the double-deck of arranging from top to bottom, is equipped with insulation board layer between the adjacent copper clad laminate, its characterized in that, processing has a plurality of through-holes on the multilayer PCB substrate, and the through-hole interpolation has the heat conduction stick, and the heat conduction stick upper end has the radiating head that exposes multilayer copper clad laminate upper surface, and the gap intussuseption between heat conduction stick and through-hole is filled with heat conduction silica gel.

2. The high thermal conductivity and high heat dissipation multilayer PCB substrate of claim 1, wherein the heat dissipation head comprises a plurality of annular heat dissipation fins arranged above and below.

3. The high thermal conductivity and high thermal dissipation multilayer PCB substrate of claim 1, wherein the thermal head comprises a top plurality of concentrically arranged annular fins.

4. The high thermal conductivity and high heat dissipation multilayer PCB substrate of claim 2 or 3, wherein the thermal conductive bar is a column shape with uniform upper and lower parts.

5. The high thermal conductivity and high heat dissipation multilayer PCB substrate of claim 4, wherein the thermal conductive rods are cylindrical or polygonal.

6. The multilayer PCB substrate with high thermal conductivity and high heat dissipation of claim 4, wherein the lower end of the heat conducting rod is flush with or protrudes from the lower surface of the multilayer PCB substrate.

7. The high thermal conductivity and high heat dissipation multilayer PCB substrate of claim 1, wherein the thermal conductive rods are high thermal conductivity material.

8. The high thermal conductivity and high heat dissipation multilayer PCB substrate of claim 1, wherein the through holes are disposed at positions on the multilayer PCB substrate where heat is easily generated or is generated.

9. The high thermal conductivity and high heat dissipation multilayer PCB substrate of claim 1, wherein the copper clad laminate is a single or double sided copper clad laminate.

Images