CN219893675U - Heat abstractor, control module and energy storage power supply - Google Patents

Abstract

The utility model provides a heat dissipation device for dissipating heat of an electric control module. The heat dissipating device comprises a heat dissipating plate, a supporting column, a containing box, a heat conducting fin and a pressing sheet. The support plate fixes the circuit board. The support column both ends connect heating panel and backup pad. The containing box is arranged on the heat dissipation plate. The housing case includes a sidewall surrounding a cavity formed for accommodating the first heat generating element. The heat conducting fin is arranged on one surface of the side wall, which is away from the cavity. One end of the pressing sheet is arranged on the heat dissipation plate, and the other end of the pressing sheet presses the second heating element against the heat conduction sheet. The heat radiating device enables the first heating element to conduct heat to the heat radiating plate through the accommodating box, and enables the second heating element to conduct heat to the heat conducting fin outside the accommodating box through the pressing sheet, so that the heat radiating area inside and outside the accommodating box is fully utilized, the heat radiating efficiency is guaranteed, and the space is saved. The utility model also provides a control module comprising the heat radiating device and an energy storage power supply.

Description

Heat abstractor, control module and energy storage power supply

Technical Field

The utility model relates to the technical field of energy storage, in particular to a heat dissipation device, a control module and an energy storage power supply.

Background

At present, the device of energy storage power supply class is interior to have generally to be used for managing electrical components such as B M S system and vary voltage module of electric core, and some electrical components calorific capacity is great, assembles behind the circuit board, needs to assemble the circuit board on the fin, realizes the heat dissipation, however the fin often only can realize the electric components and assemble in the one side of circuit board and dispel the heat, and the radiating effect is limited, if need promote the radiating effect, generally needs to add the fan, so can lead to the problem such as cost to climb, increase in volume and equipment noise increase again.

Disclosure of Invention

In view of the above, it is necessary to provide a heat dissipating device, a control module and an energy storage power source, which are capable of improving the heat dissipating effect and avoiding the problems of increasing the cost, the volume and the noise.

The embodiment of the utility model provides a heat dissipation device which is applied to heat dissipation of an electric control module. The heat dissipating device comprises a heat dissipating plate, a supporting column, a containing box, a heat conducting fin and a pressing sheet. The supporting plate and the radiating plate are arranged at opposite intervals and used for fixing the circuit board. The two ends of the support columns are respectively connected with the heat dissipation plate and the support plate. The holding box is located the heating panel towards the one side of backup pad, and the holding box includes the lateral wall, and the lateral wall surrounds the cavity that forms and is used for holding first heating element. The heat conducting fin is arranged on one surface of the side wall, which is away from the cavity. The preforming has elasticity, and the one end of preforming is located the one side of heating panel towards the backup pad, and the other end of preforming is constructed to support the second heating element and presses in the one side that the heat conducting strip deviates from the lateral wall.

According to the heat dissipation device disclosed by the utility model, the first heating element can conduct heat to the heat dissipation plate through the accommodating box, and the second heating element can conduct heat to the heat conduction sheet outside the accommodating box through the pressing sheet, so that the heat dissipation area inside and outside the accommodating box is fully utilized, the space is saved, the problems of cost increase, volume increase and the like are further avoided, in addition, the heat conduction glue can be arranged in the accommodating box to cover the first heating element, and the vibration resistance of the first heating element and the circuit board can be improved while the better heat dissipation performance is realized.

In some embodiments, the heat dissipation plate, the accommodating box and the plurality of support columns are integrated into one piece together to improve the installation efficiency and the heat dissipation efficiency.

In some embodiments, the heat dissipation plate and the support plate are both metal plate structures to improve structural strength and heat dissipation efficiency.

In some embodiments, the heat dissipating device further includes a fin, where the fin is disposed on a side of the heat dissipating plate facing away from the support plate, or on a side of the support plate facing away from the heat dissipating plate, so as to improve heat dissipating efficiency.

In some embodiments, the housing box has a plurality of cavities disposed in spaced relation, each cavity housing a portion of the first heating element.

The embodiment of the utility model also provides a control module, which comprises an electric control module and the heat dissipation device in any embodiment, wherein the electric control module comprises a circuit board, a first heating element and a second heating element, wherein the first heating element and the second heating element are arranged on the circuit board, the circuit board is arranged on one surface of the supporting plate facing the heat dissipation plate, the first heating element is partially or completely positioned in the cavity, the second heating element is positioned between the pressing sheet and the heat conduction sheet, and the pressing sheet presses the second heating element to be attached to the heat conduction sheet.

The control module achieves the purposes of improving the radiating effect, avoiding increasing the cost, the volume and the noise and improving the vibration resistance through the radiating device.

In some embodiments, the electronic control module further includes a heat sink, and the heat sink is located in the cavity to improve heat dissipation efficiency of the circuit board.

The embodiment of the utility model also provides an energy storage power supply, which comprises a shell, a battery cell assembly and the control module in any embodiment, wherein the battery cell assembly and the control module are positioned in the shell, and the electric control module is electrically connected with the battery cell assembly.

The energy storage power supply of the utility model realizes the purposes of improving the heat dissipation effect, avoiding increasing the cost, the volume and the noise and improving the vibration resistance through the heat dissipation device in the control module.

In some embodiments, the cell assembly is connected to a side of the support plate facing away from the heat sink, the housing includes an end plate connected to the heat sink, the end plate having an opening, the energy storage power supply further includes a heat sink disposed in an area of the heat sink where the opening is exposed, the heat sink being located outside the housing.

In some embodiments, the energy storage power supply further comprises at least two sealing rings, wherein the sealing rings are located between the heat dissipation plate and the end plate, and the plurality of sealing rings are arranged in a sleeved mode.

Drawings

Fig. 1 is a perspective view of an energy storage power supply according to an embodiment of the utility model.

Fig. 2 is an exploded view of the stored energy power supply of fig. 1.

Fig. 3 is a perspective view of a control module according to an embodiment of the utility model.

FIG. 4 is an exploded view of a control module according to an embodiment of the utility model.

Fig. 5 is a cross-sectional view of the control module of fig. 3 taken along line V-V.

Fig. 6 is a cross-sectional view of the control module of fig. 3 taken along VI-VI.

Description of the main reference signs

100. A heat sink; 200. An electric control module; 300. A control module;

400. an energy storage power supply; 210. A circuit board; 220. A first heating element;

230. a second heating element; 240. An inductance; 10. A heat dissipation plate;

20. a support plate; 30. A support column; 40. A housing case;

41. a sidewall; 411. A cavity; 50. A heat conductive sheet;

60. tabletting; 70. A fin; 410. A housing;

411. an end plate; 4111. An opening; 420. A cell assembly;

430. a heat sink; 440. A seal ring; 61. A connection part;

62. an elastic part; 231. A component unit; 11. A boss;

21. a groove; 22. A gap.

Detailed Description

The following description of the embodiments of the present utility model refers to the accompanying drawings, which illustrate some, but not all embodiments of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.

At present, the device of energy storage power class is interior to have generally to be used for managing electrical components such as BMS system and transformation module of electric core, and some electrical components calorific capacity is great, and after assembling in the circuit board, need assemble the circuit board on the fin, realizes the heat dissipation, however the fin often only can realize the electric components and assemble the one side in the circuit board and dispel the heat, and the radiating effect is limited, if need promote the radiating effect, generally need add the fan, so can lead to the problem such as cost to climb, volume increase and equipment noise increase again.

In view of the above, it is necessary to provide a heat dissipating device, which is capable of improving the heat dissipating effect and avoiding the problems of increasing the cost, the volume and the noise. The heat dissipation device is applied to heat dissipation of the electric control module. The electric control module comprises a circuit board, a first heating element and a second heating element which are arranged on the circuit board, and the heat radiating device comprises a heat radiating plate, a supporting column, a containing box, a heat conducting fin and a pressing sheet. The supporting plate and the radiating plate are arranged at opposite intervals and used for fixing the circuit board. The two ends of the support columns are respectively connected with the heat dissipation plate and the support plate. The holding box is located the heating panel towards the one side of backup pad, and the holding box includes the lateral wall, and the lateral wall surrounds the cavity that forms and is used for holding first heating element. The heat conducting fin is arranged on one surface of the side wall, which is away from the cavity. The preforming has elasticity, and the one end of preforming is located the one side of heating panel towards the backup pad, and the other end of preforming is constructed to support the second heating element and presses in the one side that the heat conducting strip deviates from the lateral wall.

According to the heat dissipation device disclosed by the utility model, the first heating element can conduct heat to the heat dissipation plate through the accommodating box, and the second heating element can conduct heat to the heat conduction sheet outside the accommodating box through the pressing sheet, so that the heat dissipation area inside and outside the accommodating box is fully utilized, the space is saved, the problems of cost increase, volume increase and the like are further avoided, in addition, the heat conduction glue can be arranged in the accommodating box to cover the first heating element, and the vibration resistance of the first heating element and the circuit board can be improved while better heat dissipation is realized.

The utility model also provides a control module which is formed by combining and installing the heat radiating device and the electric control module, wherein part or all of the first heating element is positioned in the heat conducting glue in the cavity, and the pressing sheet presses the second heating element to be attached to the heat conducting sheet, so that the overall heat radiating effect of the control module is improved, the volume and noise are reduced, and the vibration resistance is improved.

The utility model further provides an energy storage power supply, which comprises a shell, a battery cell assembly and the control module, wherein the battery cell assembly and the control module are positioned in the shell, the shell is used for protecting the battery cell assembly and the control module, and the electric control module is electrically connected with the battery cell assembly and is used for controlling the charge and discharge of the battery cell assembly. The energy storage power supply improves the overall heat dissipation effect of the energy storage power supply through the structural cooperation between the heat dissipation device in the control module and the electric control module, reduces the volume and noise and improves the vibration resistance.

Some embodiments of the present utility model are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without collision.

Referring to fig. 1 and 2, an embodiment of the present utility model further provides an energy storage power supply 400, which includes a housing 410, a battery module 420, and a control module 300. The battery cell assembly 420 and the control module 300 are located inside the housing 410, and the housing 410 is used for protecting and fixing the battery cell assembly 420 and the control module 300. The electric control module 200 is electrically connected to the battery cell assembly 420, and the electric control module 200 is used for controlling charging and discharging of the battery cell assembly 420.

Referring to fig. 3 to 6, the control module 300 includes a heat sink 100 and an electronic control module 200 that can be mounted together. The heat dissipation device 100 is used for dissipating heat of the electronic control module 200. The electronic control module 200 includes a circuit board 210, a first heating element 220, and a second heating element 230. The first heating element 220 and the second heating element 230 are disposed on the same surface of the circuit board 210. The heat dissipating device 100 is capable of dissipating heat from the circuit board 210, the first heat generating element 220, and the second heat generating element 230 simultaneously.

The heat sink 100 includes a heat sink plate 10 and a support plate 20. The heat dissipation plate 10 is opposite to the support plate 20 and spaced apart from the support plate. The electronic control module 200 is located between the heat dissipation plate 10 and the support plate 20. One surface of the circuit board 210, which faces away from the first heating element 220 and the second heating element 230, is mounted on one surface of the support plate 20, which faces the heat dissipation plate 10, so that the first heating element 220 and the second heating element 230 are arranged towards the heat dissipation plate 10, and the heat dissipation of the first heating element 220 and the second heating element 230 by the heat dissipation plate 10 is facilitated.

The support plate 20 is used for fixing the circuit board 210, and meanwhile, the connection between the circuit board 210 and the support plate 20 can enable heat of the circuit board 210 to be conducted to the support plate 20, so that the support plate 20 plays a role in assisting heat dissipation of the circuit board 210. By way of exemplary example, the heat dissipation plate 10 and the support plate 20 are made of metal, such as aluminum plate, steel plate or copper plate, so that the heat dissipation efficiency is improved and the strength is also improved.

The heat dissipating device 100 further includes a plurality of support columns 30, wherein two ends of the support columns 30 are respectively connected to the heat dissipating plate 10 and the support plate 20 to fix the relative positions between the heat dissipating plate 10 and the support plate 20. The heat dissipation plate 10 and the support plate 20 are arranged in parallel, the support columns 30 are perpendicular to the heat dissipation plate 10 and the support plate 20, and the plurality of support columns 30 are distributed between the heat dissipation plate 10 and the support plate 20 at intervals, so that the heat dissipation device 100 forms a hollow structure and exposes the electric control module 200, thereby avoiding closing the space between the heat dissipation plate 10 and the support plate 20, further improving the heat convection of the heat dissipation plate 10, the support plate 20, the electric control module 200 and the outside, and further improving the heat dissipation efficiency.

The heat dissipating device 100 further includes a housing box 40, where the housing box 40 is disposed on a surface of the heat dissipating plate 10 facing the support plate 20. The receiving box 40 includes a sidewall 41, the sidewall 41 surrounding a cavity 411, the cavity 411 for receiving the first heating element 220. The side wall 41 is used for protecting the first heating element 220, and meanwhile, heat of the first heating element 220 can be simultaneously transferred to the bottom of the side wall 41 and the bottom of the accommodating box 40, and then is conducted to the heat dissipation plate 10 from the bottom of the accommodating box 40 and the side wall 41, so that the heat dissipation plate 10 dissipates heat of the first heating element 220.

In some embodiments, the cavity 411 is filled with a heat-conducting glue, and the first heat-generating element 220 is partially or completely immersed in the heat-conducting glue, so that heat of the first heat-generating element 220 can be more fully conducted to the side wall 41 and the bottom of the accommodating box 40, thereby improving heat dissipation efficiency. In addition, the heat-conducting glue can also cover the first heating element 220, so as to improve the vibration resistance of the first heating element 220 and even the circuit board 210.

In some embodiments, the heat dissipation plate 10, the support column 30 and the accommodating box 40 are integrally formed, so as to reduce the number of parts and improve the installation efficiency, and the integrally formed structure can further enable the bottom of the accommodating box 40 to be fused with the heat dissipation plate 10, so as to improve the heat transfer efficiency. As an exemplary example, the heat radiating plate 10, the support column 30, and the receiving box 40 are formed by integral injection molding. In other embodiments, the heat dissipating plate 10, the support columns 30, and the accommodating case 40 may be formed by blank milling or the like.

In some embodiments, the side walls 41 are vertically disposed on the heat dissipation plate 10, and two adjacent side walls 41 are vertically connected, so as to improve the overall structural strength of the accommodating box 40. Further alternatively, a support column 30 is connected to the junction of two adjacent side walls 41 of a portion of the accommodating case 40, so that the support column 30 thereat can further enhance the overall structural strength of the accommodating case 40.

In other embodiments, the side wall 41 is connected with the heat dissipation plate 10 at an included angle, so that the cross-sectional area of the accommodating box 40 gradually increases towards the direction close to the heat dissipation plate 10, that is, the accommodating box 40 is approximately cone-shaped or trapezoid-shaped, compared with the structure that the side wall 41 is perpendicular to the heat dissipation plate 10, the space at the bottom of the accommodating box 40 can be increased due to the included angle between the side wall 41 and the heat dissipation plate 10, more heat conducting glue can be contained, the contact area between the heat conducting glue and the heat dissipation plate 10 is increased, the heat transfer efficiency is improved, and the vibration resistance performance is further improved.

The heat sink 100 further includes a heat conductive sheet 50 and a pressing sheet 60. The heat conductive sheet 50 is provided on the outer side surface of the side wall 41. The pressing piece 60 has elasticity. One end of the pressing piece 60 is detachably connected to one surface of the heat dissipation plate 10 facing the support plate 20, and the other end of the pressing piece 60 can elastically press the second heating element 230 against the heat conduction sheet 50, so that the second heating element 230 can stably contact the heat conduction sheet 50, heat of the second heating element 230 can be conducted to the heat conduction sheet 50, and then conducted to the side wall 41 and the heat dissipation plate 10 by the heat conduction sheet 50, and further the heat dissipation plate 10 dissipates heat of the second heating element 230.

In some embodiments, the pressing sheet 60 is a metal spring sheet, so that the heat of the second heating element 230 can be further conducted to the pressing sheet 60, and then conducted to the heat dissipation plate 10 by the pressing sheet 60, so as to further dissipate the heat of the second heating element 230.

In some embodiments, the heat conducting sheet 50 is a material capable of conducting heat and insulating, such as an alumina ceramic sheet.

In some embodiments, the first heating element 220 is a component with an operating temperature lower than the melting point of the heat-conducting glue, such as a capacitor, an inductor, or a transformer coil, and may be immersed in the heat-conducting glue. The second heating element 230 is a component such as a MOS transistor having an operation temperature close to the melting point of the heat conductive paste, and therefore cannot be immersed in the heat conductive paste.

In some embodiments, as shown in fig. 4 to 6, the first heating element 220 includes a plurality of columnar inductors 240, and the inductors 240 have a larger volume and generate more heat than other components in the first heating element 220, optionally, the heat dissipation plate 10 is provided with two separate accommodating boxes 40, each of the two accommodating boxes 40 has a cavity 411, the inductors 240 and other components in the first heating element 220 are respectively located in the two cavities 411 to conduct heat independently, so as to avoid heat conduction between the inductors 240 and other components in the first heating element 220, and further ensure heat dissipation efficiency. In other embodiments, the number of the accommodating boxes 40 may be plural according to the volume, the position distribution and the heat productivity of each component in the first heat generating element 220 on the circuit board 210, the shape of each accommodating box 40 may be various structures, and the sidewall 41 of each accommodating box 40 determines whether to arrange the heat conducting fin 50 according to the position distribution of the second heat generating element 230.

In some embodiments, the electronic control module 200 further includes a heat sink (not shown) disposed on the circuit board 210 and configured to dissipate heat from the circuit board 240. A heat sink may be located within the cavity 411 and immersed in the thermally conductive paste. Optionally, the heat sink is located in an independent accommodating box 40 to conduct heat independently, so as to avoid heat conduction between the heat sink and other components in the first heat generating element 220, thereby ensuring heat dissipation efficiency.

In some embodiments, the heat sink 100 further includes fins 70. The fins 70 are disposed on a surface of the heat dissipation plate 10 away from the support plate 20, or on a surface of the support plate 10 away from the heat dissipation plate 20, so as to further improve heat dissipation efficiency of the heat dissipation plate 10 and the support plate 10.

It is understood that the pressing sheet 60 may be disposed on the support plate 20, or connected to both the heat dissipation plate 10 and the support plate 20, so long as the pressing sheet can act to press the second heat generating element 230. However, in some embodiments, in order to minimize the volume of the heat dissipating device 100, the areas of the heat dissipating plate 10 and the support plate 20 are approximately the same as the area of the circuit board 210, and based on this, since the circuit board 210 is mounted on the support plate 20, no additional area is required for mounting the support plate 20 to mount the pressing piece 60, only the pressing piece 60 can be mounted on the heat dissipating plate 10, and at this time, most of the heat of the first heat generating element 220 and the second heat generating element 230 is transferred to the heat dissipating plate 10 through the side wall 41, the pressing piece 60, the heat conducting sheet 50 and the heat conducting glue, so that the fins 70 are preferentially disposed on the heat dissipating plate 10 to dissipate the heat of the heat dissipating plate 10, so that the heat of the first heat generating element 220 and the second heat generating element 230 is continuously transferred to the heat dissipating plate 10, not to the circuit board 210, thereby guaranteeing the temperature of the circuit board 210, and avoiding the excessive temperature of the circuit board 210.

In some embodiments, as shown in fig. 4 and 6, the pressing piece 60 includes a connection portion 61 and an elastic portion 62, the connection portion 61 is used for connecting the heat dissipation plate 10, the elastic portion 62 has one or more, a plurality of elastic portions 62 are arranged at intervals on the connection portion 61, and one end of each elastic portion 62 is connected to the connection portion 61, and the other end is used for pressing the second heating element 230.

In some embodiments, the second heating element 230 has a plurality of components with different sizes, where the components with the same size are arranged at intervals to form a set of component units 231, the pressing sheet 60 has a plurality of pressing sheets 60, each pressing sheet 60 corresponds to pressing against a set of component units 231, and each elastic portion 62 in the pressing sheet 60 corresponds to pressing against one component in the component units 231. The size and dimensions of the pressing sheet 60 are changed accordingly for the component units 231 of different specifications, for example, the width of the elastic portion 62 is wider for the component units 231 of larger volume to be able to apply larger pressure to ensure the attachment of the component to the heat conductive sheet 50, and conversely, the width of the elastic portion 62 is also smaller for the component units 231 of larger volume to avoid damage to the component due to the application of excessive pressure. In addition, each component unit 231 is correspondingly attached to one heat conducting fin 50, that is, each heat conducting fin 50 radiates heat to only one component unit 231, so that each component unit 231 can radiate heat independently, heat transfer between the component units 231 is avoided, and further the heat radiation effect is guaranteed.

In some embodiments, as shown in fig. 4 and 6, the heat dissipation plate 10 is provided with a boss 11, the boss 11 is used for connecting the connection portion 61 of the pressing sheet 60, and the thickness of the heat dissipation plate 10 at the boss 11 is greater than the thickness of the heat dissipation plate 10 itself, so that the connection portion 61 is connected to the boss 11 by a screw, and at the same time, the connection strength between the pressing sheet 60 and the heat dissipation plate 10 is improved.

In some embodiments, as shown in fig. 4 and 5, the supporting plate 20 is provided with a plurality of grooves 21, the grooves 21 are located at the connection positions of the supporting plate 20 and the supporting columns 30, and the circuit board 210 is connected to the bottom surface of the grooves 21, so that a gap 22 is formed between the circuit board 210 and the supporting plate 20, the gap 22 can play a role of buffering and damping, and when the supporting plate 20 is impacted, the gap 22 can prevent the impact from being directly transmitted to the circuit board 210, thereby protecting the circuit board 210. In addition, when the support plate 20 is connected to the support column 30 by screws, the grooves 21 can accommodate the screws so that the side of the support plate 20 facing away from the heat dissipation plate 10 is smoother, so that the support plate can be mounted to other components.

In summary, the heat dissipating device 100 can make the first heat generating element 220 that can be immersed in the heat conducting glue and the second heat generating element 230 that cannot be immersed in the heat conducting glue conduct heat to the heat dissipating plate 10 through the inner and outer surfaces of the side wall 41, so that the heat is transferred by fully utilizing the inner and outer heat dissipating areas of the side wall 41, and the first heat generating element 220 can also directly transfer heat to the heat dissipating plate 10 through the heat conducting glue in the cavity 411, the second heat generating element 230 can also transfer heat to the heat dissipating plate 10 through the pressing sheet 60, the heat dissipating plate 10 can dissipate heat through the fins 70, the circuit board 210 can also dissipate heat through the supporting plate 20, the whole heat dissipating device 100 can also dissipate heat through the hollow structure formed by the supporting columns 30.

Referring to fig. 1 and 2, in some embodiments, the battery module 420 is connected to a side of the support plate 20 facing away from the heat dissipation plate 10. The case 410 includes an end plate 411, and a side of the heat dissipating plate 10 facing away from the support plate 20 is connected to the end plate 411, thereby connecting the heat dissipating device 100 to the case 410. The end plate 411 has an opening 4111. The energy storage power supply 400 further includes a heat sink 430, where the heat sink 430 is connected to a region of the heat dissipation plate 10 where the opening 4111 is exposed, that is, the heat sink 430 plays a role of a fin 70, and the heat sink 430 extends out of the opening 4111 and is located outside the housing 410, so as to efficiently dissipate heat of the heat dissipation plate 10, so that heat of the first heat generating element 220 and the second heat generating element 230 can be continuously transferred to the heat dissipation plate 10, and then be dissipated to the outside by the heat sink 430, thereby avoiding heat transfer to the circuit board 210, and guaranteeing the temperature of the circuit board 210.

In some embodiments, the energy storage power supply 400 further includes at least two sealing rings 440, the sealing rings 440 are located between the heat dissipation plate 10 and the end plate 411, and the sealing rings 440 are disposed around each other to seal the opening 4111 from water or dust.

In addition, those skilled in the art will recognize that the foregoing embodiments are merely illustrative of the present utility model and are not intended to be limiting, as appropriate modifications and variations of the foregoing embodiments are within the scope of the disclosure of the utility model.

Claims (10)

1. The utility model provides a heat abstractor is applied to and dispels the heat to automatically controlled module, automatically controlled module include the circuit board, set up in first heating element and the second heating element of circuit board, its characterized in that includes:

a heat dissipation plate;

the support plate is arranged at intervals opposite to the heat dissipation plate and used for fixing the circuit board;

the two ends of the support columns are respectively connected with the heat dissipation plate and the support plate;

the accommodating box is arranged on one surface of the radiating plate, which faces the supporting plate, and comprises a side wall, wherein the side wall surrounds a cavity for accommodating the first heating element;

the heat conducting sheet is arranged on one surface of the side wall, which is away from the cavity; and

and one end of the pressing piece is arranged on one surface of the heat dissipation plate facing the support plate, and the other end of the pressing piece is configured to press the second heating element against one surface of the heat conduction piece facing away from the side wall.

2. The heat sink as recited in claim 1, wherein: the heat dissipation plate, the accommodating box and the support columns are of an integrated structure.

3. The heat sink as recited in claim 1, wherein: the heat dissipation plate and the support plate are both of metal plate structures.

4. The heat sink as recited in claim 1, wherein: the heat dissipation device further comprises fins, and the fins are arranged on one surface of the heat dissipation plate, which is away from the support plate, or on one surface of the support plate, which is away from the heat dissipation plate.

5. The heat sink as recited in claim 1, wherein: the accommodating boxes are provided with a plurality of cavities, the cavities of the accommodating boxes are arranged at intervals, and each cavity accommodates the first heating element of the part.

6. A control module, characterized in that: the heat dissipation device comprises an electric control module and any one of claims 1 to 5, wherein the electric control module comprises a circuit board, a first heating element and a second heating element, the first heating element and the second heating element are arranged on the circuit board, the circuit board is arranged on one surface of the supporting plate, which faces the heat dissipation plate, the first heating element is partially or completely positioned in the cavity, the second heating element is positioned between the pressing sheet and the heat conduction sheet, and the pressing sheet presses the second heating element to be attached to the heat conduction sheet.

7. The control module of claim 6, wherein: the electric control module further comprises a radiator, and the radiator is located in the cavity.

8. An energy storage power supply, characterized in that: the battery module comprises a shell, a battery cell assembly and the control module as claimed in any one of claims 6 to 7, wherein the battery cell assembly and the control module are positioned in the shell, and the electric control module is electrically connected with the battery cell assembly.

9. The energy storage power supply of claim 8, wherein: the battery cell assembly is connected to one side, away from the cooling plate, of the supporting plate, the shell comprises an end plate, the end plate is connected with the cooling plate, the end plate is provided with an opening, the energy storage power supply further comprises cooling fins, the cooling fins are arranged on the cooling plate, the cooling fins are exposed out of the opening area, and the cooling fins are located outside the shell.

10. The energy storage power supply of claim 9, wherein: the energy storage power supply further comprises at least two sealing rings, wherein the sealing rings are positioned between the heat dissipation plate and the end plate, and a plurality of sealing rings are sleeved with one another.