CN220173589U - Heat radiation structure and wearing equipment - Google Patents

Abstract

The utility model relates to the technical field of intelligent wearing equipment, and discloses a heat dissipation structure and wearing equipment. The heat dissipation structure comprises a heat dissipation assembly, the heat dissipation assembly can be installed on one side of the shell, one part of the heat dissipation assembly is located on the outer surface of the shell, and the other part of the heat dissipation assembly penetrates through one side of the shell to be close to the heat source. The heat dissipation assembly can be used for conducting heat in the wearable device to the outer surface of the shell, so that air heat transfer is enhanced, and the heat dissipation efficiency of the heat dissipation assembly is improved. In addition, the heat dissipation assembly is positioned on the outer surface of the shell, the area of the heat dissipation assembly is not limited by the cavity of the shell, and the heat dissipation area can be enlarged, so that the shell of the wearable device and a heat source can be efficiently dissipated. The outer surface of the shell is achieved by the heat dissipation assembly, occupation of the heat dissipation structure to the inner space of the wearing equipment can be reduced, and miniaturization and light weight design of the wearing equipment are facilitated.

Description

Heat radiation structure and wearing equipment

Technical Field

The utility model relates to the technical field of intelligent wearing equipment, in particular to a heat dissipation structure and wearing equipment.

Background

Along with the smaller and smaller size of wearing equipment (such as AR glasses), the weight is lighter and the functions are more and more abundant, and the main shell structural material is a nonmetallic material with poor heat dissipation performance, so that the heat dissipation performance of the wearing equipment is influenced. In order to improve the heat dissipation efficiency, heat dissipation designs are currently performed inside the wearable device, such as a heat dissipation plate, a soaking plate, a graphite film, a heat conduction pipe and the like, but the designs increase weight and volume, which are not suitable for the current small and light demands of consumers on the wearable device. In addition, the heat dissipation design of the wearable equipment company is often more focused on the heat dissipation of the product shell and neglects the design of the junction temperature of the chip, so that the problem that the performance of the equipment is reduced and even the equipment is halted due to the overlarge junction temperature of the chip is often caused, and the customer experience is affected.

Therefore, a heat dissipation structure and a wearable device are needed to solve the above problems.

Disclosure of Invention

An object of the present utility model is to provide a heat radiation structure capable of improving heat radiation efficiency and ensuring normal use performance of a heat source device.

The technical scheme adopted by the utility model is as follows:

the utility model provides a heat radiation structure, is applicable to wearing equipment, wearing equipment has the casing, the casing has the cavity, set up the heat source in the cavity, heat radiation structure includes radiating component, radiating component can install in one side of casing, just radiating component's part is located the surface of casing, radiating component's another part passes one side of casing is close to the heat source.

Optionally, the heat dissipation assembly at least comprises a first heat dissipation part, a second heat dissipation part and a third heat dissipation part which are sequentially arranged, the first heat dissipation part is located on the outer surface of the shell, the third heat dissipation part is located on the inner wall surface of the cavity and is close to the heat source, and the second heat dissipation part is clamped between the first heat dissipation part and the third heat dissipation part.

Optionally, along the arrangement direction of the first heat dissipation element, the second heat dissipation element and the third heat dissipation element, the projection area of the second heat dissipation element is minimum.

Optionally, the first heat sink is flush with an outer surface of the housing; or alternatively, the first and second heat exchangers may be,

the first heat dissipation piece protrudes out of the outer surface of the shell.

Optionally, the inner wall surface of the cavity is provided with a concave accommodating cavity, and the third heat dissipation piece is positioned in the accommodating cavity.

Optionally, the heat dissipation structure further includes a thermal interface member, the thermal interface member is located between the heat dissipation component and the heat source, and the heat dissipation component is abutted to the heat source through the thermal interface member.

Optionally, the material of the thermal interface member is any one of heat dissipation glue, heat dissipation film and liquid metal.

Optionally, the materials of the first heat dissipation element, the second heat dissipation element and the third heat dissipation element are any one of metal, carbon-based material and composite material.

Another object of the present utility model is to provide a wearable device, which has a heat dissipation structure with high heat dissipation efficiency, so as to improve the product performance.

The technical scheme adopted by the utility model is as follows:

the utility model provides a wearing equipment, includes casing, heat source and foretell heat radiation structure, the casing has the cavity, the heat source is located in the cavity, heat radiation structure install in on the casing, and be located the user wear wearing equipment keep away from the one side of user, heat radiation structure's part is located the surface of casing, heat radiation structure's another part passes one side of casing is close to the heat source.

Optionally, the wearable device is an intelligent glasses, the legs of the intelligent glasses are provided with the cavities, and chips are arranged in the cavities and are the heat sources of the intelligent glasses;

the heat dissipation structure is arranged on at least one of the glasses legs, a first heat dissipation part of the heat dissipation structure is positioned on the outer surface of the glasses leg, and a third heat dissipation part of the heat dissipation structure penetrates through one side of the glasses leg to be close to the chip.

The beneficial effects of the utility model are as follows:

the heat dissipation structure provided by the utility model is suitable for the wearable device, the wearable device is provided with the shell, the shell is provided with the cavity, the heat source is arranged in the cavity, the heat dissipation structure comprises the heat dissipation component, the heat dissipation component can be arranged on one side of the shell, one part of the heat dissipation component is positioned on the outer surface of the shell, and the other part of the heat dissipation component passes through one side of the shell and is close to the heat source. Therefore, the heat in the wearable equipment is conducted to the outer surface of the shell by the heat dissipation component, so that the air heat transfer is enhanced, and the heat dissipation efficiency of the heat dissipation component is improved. And the heat dissipation assembly is positioned on the outer surface of the shell, the area of the heat dissipation assembly is not limited by the cavity of the shell, and the heat dissipation area can be enlarged, so that the shell of the wearable device and a heat source can be efficiently dissipated. In addition, accomplish the surface of casing with radiating component, also reducible wearing equipment is inside to radiate the structural design, reduces the occupation to wearing equipment inner space, is favorable to wearing equipment holistic miniaturization and lightweight design.

The wearing equipment comprises the shell, the heat source and the heat dissipation structure, wherein the shell is provided with the cavity, the heat source is positioned in the cavity, the heat dissipation structure can be arranged on the shell and is positioned at one side far away from a user when the user wears the wearing equipment, one part of the heat dissipation structure is positioned on the outer surface of the shell, and the other part of the heat dissipation structure passes through one side of the shell and is close to the heat source. Therefore, the heat in the wearable equipment is conducted to the outer surface of the shell by the heat radiating component, so that the air heat transfer is enhanced, and the heat radiating efficiency of the heat radiating component is improved.

Drawings

Fig. 1 is an assembly diagram of a heat dissipation structure on a wearable device according to an embodiment of the present utility model;

fig. 2 is an assembly diagram of another heat dissipation structure provided by an embodiment of the present utility model on a wearable device;

fig. 3 is a schematic structural diagram of an intelligent glasses according to an embodiment of the present utility model.

In the figure:

1. a heat dissipation assembly; 11. a first heat sink; 12. a second heat sink; 13. a third heat sink; 2. a thermal interface member;

10. a housing; 101. a cavity; 102. an outer surface; 103. an inner wall surface; 20. a heat source;

100. an intelligent glasses; 1001. a frame; 1002. a temple; 1003. and a main board.

Detailed Description

In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the utility model more clear, the technical scheme of the utility model is further described below by a specific embodiment in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present utility model are shown.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.

This embodiment provides a heat radiation structure, this heat radiation structure can be used to wearing equipment, wearing equipment has casing 10, and casing 10 has cavity 101, and is provided with heat source 20 in the cavity 101, wearing equipment because of belonging to intelligent device, and the chip that it has all can produce heat in the use promptly is heat source 20, if the heat dissipation is untimely, and lead to the chip junction temperature too big, the problem that performance decline even crashes will appear in wearing equipment, influences customer experience.

As shown in fig. 1 and 2, the heat dissipation structure provided in this embodiment includes a heat dissipation assembly 1, where the heat dissipation assembly 1 can be mounted on a housing 10, and the mounting position is preferably at a side far away from a user, so that the heat dissipation structure is far away from the user, and accidental injury is avoided. A portion of the heat sink assembly 1 is located on the outer surface 102 of the housing 10, while another portion of the heat sink assembly 1 passes through one side of the housing 10 proximate the heat source 20. Therefore, the heat dissipation component 1 can be utilized to conduct heat in the wearing equipment to the outer surface 102 of the shell 10, so that air heat transfer is enhanced, namely, the heat dissipation efficiency of the heat dissipation component 1 is improved, the area of the part of the heat dissipation component 1, which is positioned on the outer surface 102 of the shell 10, is not limited by the cavity 101 of the shell 10, and the heat dissipation area can be enlarged, so that efficient heat dissipation of the shell 10 and the heat source 20 of the wearing equipment can be realized. In addition, the heat dissipation assembly 1 is made on the outer surface 102 of the shell 10, so that the heat dissipation structure design inside the wearing equipment can be reduced, the occupation of the internal space of the wearing equipment is reduced, and the overall miniaturization and light weight design of the wearing equipment are facilitated.

Alternatively, the heat dissipation assembly 1 includes at least a first heat dissipation element 11, a second heat dissipation element 12, and a third heat dissipation element 13 sequentially arranged, where the first heat dissipation element 11 is located on the outer surface 102 of the housing 10, the third heat dissipation element 13 is located on the inner wall surface 103 of the cavity 101 and is close to the heat source 20, and the second heat dissipation element 12 is sandwiched between the first heat dissipation element 11 and the third heat dissipation element 13. The third heat dissipation element 13 can collect and diffuse heat of the heat source 20 in the cavity 101, and is also used for sealing the housing 10, so as to ensure sealing performance of the housing 10. The second heat dissipation element 12 serves as a bridge for diffusing the heat of the internal heat source 20 into the external air, and is communicated with the inner cavity of the housing 10 and the outside, namely, the heat on the third heat dissipation element 13 can be transferred to the first heat dissipation element 11 by utilizing the abutting joint of the second heat dissipation element 12 with the first heat dissipation element 11 and the third heat dissipation element 13, so as to realize heat exchange between the first heat dissipation element 11 and the air. The first heat sink 11 is used for spreading heat over a large area, and is also used for sealing and designing the housing 10.

In addition, in the specific implementation, the first heat dissipation element 11, the second heat dissipation element 12 and the third heat dissipation element 13 may have a solid structure, or may have a hollow structure, that is, only the outer shells of the first heat dissipation element 11, the second heat dissipation element 12 and the third heat dissipation element 13 are limited to abut against each other, and the internal structure is not limited.

Further, along the arrangement direction of the first heat dissipation element 11, the second heat dissipation element 12 and the third heat dissipation element 13, the projection area of the second heat dissipation element 12 is minimum. In particular, the first heat dissipation element 11, the second heat dissipation element 12, and the third heat dissipation element 13 are all plate members, and each plate member has two large surfaces along its thickness direction (i.e., the arrangement direction of the first heat dissipation element 11, the second heat dissipation element 12, and the third heat dissipation element 13 in this embodiment) and side surfaces located in the circumferential direction. When the heat dissipating assembly 1 is mounted on the housing 10, the gap between the side surface of the second heat dissipating member 12 and the housing 10 is staggered with the gap between the side surface of the first heat dissipating member 11 and the housing 10; and/or the gaps between the side surfaces of the second heat sink 12 and the case 10 are staggered with the gaps between the side surfaces of the third heat sink 13 and the case 10. Through the staggered arrangement of the gaps, dust, water vapor and the like in the external environment can be prevented from entering the cavity 101 of the shell 10, and the influence on the tightness of the shell 10 due to the arrangement of the heat dissipation assembly 1 can be avoided.

Alternatively, the difference between the projected areas of the first heat dissipation element 11 and the third heat dissipation element 13 in the above arrangement direction is not limited, but in a specific implementation, since the first heat dissipation element 11 is located on the outer surface 102 of the housing 10 and the third heat dissipation element 13 is located in the cavity 101, the projected area of the first heat dissipation element 11 is generally larger than that of the third heat dissipation element 13, so as to improve the heat dissipation efficiency.

Alternatively, the first heat sink 11 is located on the outer surface 102 of the housing 10 in at least the following two configurations. Referring to fig. 1, the first heat sink 11 may be disposed flush with the outer surface 102 of the housing 10, i.e., the first heat sink 11 is embedded in the outer surface 102 of the housing 10. Or referring to fig. 2, the first heat dissipation element 11 may be disposed to protrude from the outer surface 102 of the housing 10, that is, the outer surface 102 of the housing 10 is a plane, and no groove is required to be disposed on the outer surface 102, so that the first heat dissipation element 11 is directly fixed on the plane, and the installation is simple.

Alternatively, the inner wall surface 103 of the cavity 101 has a concave receiving cavity, and the third heat sink 13 is located in the receiving cavity. That is, in the present embodiment, the third heat sink 13 is located on the inner wall surface 103 of the cavity 101, and the third heat sink 13 is flush with the inner wall surface 103 of the cavity 101.

Preferably, the materials of the first heat sink 11, the second heat sink 12 and the third heat sink 13 are any one of metal, carbon-based material and composite material. In the specific implementation, the first heat dissipation element 11, the second heat dissipation element 12 and the third heat dissipation element 13 may be made of the same material or different materials according to factors such as heat dissipation effect and cost reliability.

Further, the heat dissipation structure further includes a thermal interface member 2, the thermal interface member 2 is located between the heat dissipation assembly 1 and the heat source 20, and the heat dissipation assembly 1 is abutted to the heat source 20 through the thermal interface member 2. That is, as shown in fig. 1 and 2, the thermal interface member 2 is positioned in the cavity 101, and the internal heat source 20 and the heat dissipating assembly 1 are connected by the thermal interface member 2, so that heat can be directly diffused to the outer surface 102 of the housing 10, and heat dissipation is achieved by convection and heat conduction with air. In practice, one side of the thermal interface member 2 may be attached to the third heat sink 13, and the other side of the thermal interface member 2 may be covered by the heat source 20.

Preferably, the material of the thermal interface member 2 is any one of heat dissipation glue, heat dissipation film and liquid metal. The thermal interface member 2 can be better attached to the heat source 20 and the third heat sink 13 to improve the heat conduction efficiency.

The present embodiment further provides a wearable device, including the housing 10, the heat source 20, and the heat dissipation structure described above, where the housing 10 has a cavity 101, the heat source 20 is located in the cavity 101, and the heat dissipation structure may be mounted on the housing 10, specifically mounted on a side far away from a user when the user wears the wearable device, and a portion of the heat dissipation structure is located on an outer surface 102 of the housing 10, and another portion of the heat dissipation structure passes through a side of the housing 10 to be close to the heat source 20. Therefore, the heat dissipation component 1 can be utilized to conduct the heat in the wearing equipment to the outer surface 102 of the shell 10, so that the air heat transfer is enhanced, and the heat dissipation efficiency of the heat dissipation component 1 is improved.

Optionally, as shown in fig. 3, the wearable device is a pair of smart glasses 100, the pair of smart glasses 100 has two legs 1002, and the leg 1002 of the pair of smart glasses 100 has a cavity 101, and the heat dissipation structure is disposed on at least one side of the leg 1002 of the pair of smart glasses 100, and then the first heat dissipation element 11 of the heat dissipation structure is located on the outer surface 102 of the leg 1002, and the outer surface 102 of the leg 1002 is a surface of a side far away from the user when the user wears the pair of smart glasses 100.

Optionally, the chip of the smart glasses 100 is the heat source 20 of the smart glasses 100, the chip is disposed on the motherboard 1003, the motherboard 1003 and the chip are both disposed in the cavity 101, and the chip is disposed towards one side of the heat dissipation structure, so that the third heat dissipation element 13 of the heat dissipation structure can pass through one side of the glasses leg 1002 to be close to the chip.

Alternatively, the first heat dissipation member 11 may cover the entire temple 1002 at most to secure high heat dissipation efficiency by the heat dissipation structure provided on the temple 1002. In other embodiments, if the heat source 20 is located at the frame 1001 of the smart glasses 100, that is, the frame 1001 is of a hollow structure and has a cavity capable of accommodating the heat source 20 and a part of the heat dissipation structure, the heat dissipation structure may be disposed on the frame 1001. Specifically, the first heat dissipation element 11 of the heat dissipation structure is located at a side of the frame 1001 away from the user, and the third heat dissipation element 13 of the heat dissipation structure extends into the cavity of the frame 1001 to be close to the heat source 20, so that efficient heat dissipation of the smart glasses 100 can be achieved.

The above embodiments merely illustrate the basic principle and features of the present utility model, and the present utility model is not limited to the above embodiments, but may be varied and altered without departing from the spirit and scope of the present utility model. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (10)

1. The utility model provides a heat radiation structure, is applicable to wearing equipment, wearing equipment has casing (10), casing (10) have cavity (101), set up heat source (20) in cavity (101), a serial communication port, heat radiation structure includes radiator unit (1), radiator unit (1) can install in one side of casing (10), just a part of radiator unit (1) is located surface (102) of casing (10), another part of radiator unit (1) passes one side of casing (10) is close to heat source (20).

2. The heat dissipation structure according to claim 1, wherein the heat dissipation assembly (1) comprises at least a first heat dissipation element (11), a second heat dissipation element (12) and a third heat dissipation element (13) which are sequentially arranged, the first heat dissipation element (11) is located on an outer surface (102) of the housing (10), the third heat dissipation element (13) is located on an inner wall surface (103) of the cavity (101) and is close to the heat source (20), and the second heat dissipation element (12) is sandwiched between the first heat dissipation element (11) and the third heat dissipation element (13).

3. The heat dissipation structure according to claim 2, wherein a projected area of the second heat dissipation element (12) is smallest along an arrangement direction of the first heat dissipation element (11), the second heat dissipation element (12), and the third heat dissipation element (13).

4. The heat dissipating structure according to claim 2, wherein the first heat dissipating member (11) is flush with an outer surface (102) of the housing (10); or alternatively, the first and second heat exchangers may be,

the first heat dissipation element (11) protrudes from the outer surface (102) of the housing (10).

5. The heat dissipation structure as defined in claim 2, wherein the inner wall surface (103) of the cavity (101) has a concave accommodating cavity, and the third heat dissipation element (13) is located in the accommodating cavity.

6. The heat dissipating structure of claim 1, further comprising a thermal interface member (2), wherein the thermal interface member (2) is located between the heat dissipating assembly (1) and the heat source (20), and wherein the heat dissipating assembly (1) is in abutment with the heat source (20) through the thermal interface member (2).

7. The heat dissipation structure as defined in claim 6, wherein the material of the thermal interface member (2) is any one of a heat dissipation glue, a heat dissipation film, and a liquid metal.

8. The heat dissipation structure according to claim 2, wherein the material of the first heat dissipation element (11), the second heat dissipation element (12), and the third heat dissipation element (13) is any one of a metal, a carbon-based material, and a composite material.

9. A wearing device, characterized by comprising a housing (10), a heat source (20) and a heat dissipating structure according to any of claims 1-8, the housing (10) having a cavity (101), the heat source (20) being located in the cavity (101), the heat dissipating structure being mounted on the housing (10) and being located on a side of the wearing device being worn away from the user by the user, a part of the heat dissipating structure being located on an outer surface (102) of the housing (10), another part of the heat dissipating structure passing through a side of the housing (10) being close to the heat source (20).

10. The wearable device according to claim 9, characterized in that the wearable device is a smart glasses (100), a glasses leg (1002) of the smart glasses (100) has the cavity (101), a chip is arranged in the cavity (101), and the chip is the heat source (20) of the smart glasses (100);

the heat dissipation structure is arranged on at least one glasses leg (1002), a first heat dissipation piece (11) of the heat dissipation structure is located on the outer surface (102) of the glasses leg (1002), and a third heat dissipation piece (13) of the heat dissipation structure penetrates through one side of the glasses leg (1002) to be close to the chip.