CN219780747U - Automobile central domain controller and automobile thereof - Google Patents

Abstract

The utility model relates to the technical field of automatic driving chips of new energy automobiles, in particular to an automobile central domain controller, which comprises: a first housing, a second housing, and a substrate; the substrate is provided with a chip, the first shell is provided with a first heat dissipation structure, and the second shell is provided with a second heat dissipation structure; the first heat radiation structure is attached to the surface of the chip, the second heat radiation structure is attached to the substrate, heat radiation is carried out on two sides of the chip, heat exchange capacity of the chip is enhanced, the temperature of the chip can be kept in a reasonable range under the condition of high-power operation, in addition, the automobile central domain controller is further provided with a shielding structure for preventing electromagnetic interference, and normal operation of the automobile central domain controller is guaranteed.

Description

Automobile central domain controller and automobile thereof

Technical Field

The utility model relates to the technical field of automatic driving chips of new energy automobiles, in particular to an automobile central domain controller and an automobile thereof.

Background

With the development of new energy automobile autopilot systems and the increasing complexity of vehicle electrical systems, the demand of autopilot, whole automobile and various component controllers for chips capable of providing higher operation amount, faster operation speed and processing complex codes is gradually increasing. The domain controller integrating the whole vehicle level software function in the specific functional domain, providing faster operation speed, higher operation amount and being capable of processing more complex codes is gradually rising, wherein the central domain controller is more important in the whole vehicle electronic and electric architecture.

The complex function needs to be realized by a chip with higher calculation power, and simultaneously, higher heat dissipation requirement can be brought, and the traditional heat dissipation mode of relying on the outer surface of the metal sheet shell for heat dissipation has poor heat dissipation effect, so that the internal temperature of the domain controller is too high, the CPU performance is reduced, and the function is damaged, even the whole domain controller stops working. Therefore, the existing domain controller generally adopts a water cooling system, but the traditional water cooling system has high production cost, is complex to assemble and disassemble and is easy to leak liquid to cause scrapping.

Disclosure of Invention

Based on this, it is necessary to provide a central domain controller of an automobile that satisfies both heat dissipation requirements.

In order to solve the technical problems, the utility model provides the following technical scheme:

an automotive central domain controller, the automotive central domain controller comprising:

a first housing;

the second shell covers the first shell and forms a mounting cavity with the first shell in a surrounding mode;

a substrate mounted within the mounting cavity and having a first surface facing the first housing and a second surface facing the second housing, wherein the first surface and the second surface are disposed opposite;

a chip mounted on the first surface;

the first heat dissipation structure is arranged on the first shell, and part of the first heat dissipation structure stretches into the mounting cavity, corresponds to the position of the chip and is attached to the surface of the chip;

the second heat dissipation structure is arranged on the second shell, and part of the second heat dissipation structure stretches into the mounting cavity, corresponds to the position of the chip and is attached to the second surface.

It can be understood that the first heat dissipation structure and the second heat dissipation structure are respectively arranged on the two sides of the first shell and the second shell, and the two sides of the chip are subjected to heat dissipation, so that the heat exchange capacity of the chip is enhanced. The first heat dissipation structure part extends into the mounting cavity, is attached to the chip and directly absorbs heat emitted by the chip, and dissipates heat through a part, in contact with the outside, of the first heat dissipation structure; the second heat radiation structure also has part to stretch into the installation intracavity, the part with the position of chip corresponds and with the laminating of second surface, the part passes through the base plate indirect absorption the heat that the chip sent, the part of rethread second heat radiation structure in with external contact dispels the heat, so, has strengthened the heat transfer ability of chip for the chip also can keep chip temperature at reasonable interval under the circumstances of high-power operation.

In an embodiment, the second heat dissipation structure includes a second heat dissipation fin and a second heat conduction platform, the second heat dissipation fin is installed on the outer surface of the second housing, and the second heat conduction platform is disposed on the inner surface of the second housing, protrudes from the inner surface, and is attached to the second surface.

It can be appreciated that the surface of the second heat conduction platform is a plane, so that the second surface of the substrate can be better attached, and the arrangement is beneficial to enhancing the heat conduction between the substrate and the second shell; the second radiating fin comprises a plurality of fins which are uniformly distributed, so that the heat exchange area between the second shell and the outside can be increased, and the heat dissipation capacity of the chip can be enhanced.

In an embodiment, a second heat conducting layer is disposed on an end face of the second heat conducting platform facing the second surface, and the second heat conducting layer is attached to the second surface.

It will be appreciated that the provision of the second thermally conductive layer on the end face of the second thermally conductive stage may allow for a tighter attachment of the substrate to the second housing, which is advantageous for ensuring heat transfer from the substrate to the second housing.

In an embodiment, the first heat dissipation structure includes a first heat dissipation fin and a first heat conduction platform, the first heat dissipation fin is installed on the outer surface of the first housing, and the first heat conduction platform is disposed on the inner surface of the first housing and protrudes from the inner surface and is attached to the surface of the chip.

It can be understood that the surface of the first heat conduction platform is a plane, so that the surface of the chip can be better attached, and the arrangement is beneficial to enhancing the heat conduction between the chip and the first shell; the first radiating fin comprises a plurality of fins which are uniformly distributed, so that the heat exchange area between the first shell and the outside can be increased, and the heat dissipation capacity of the chip can be enhanced.

In an embodiment, a first heat conducting layer is disposed on an end face of the first heat conducting platform facing the first surface, and the first heat conducting layer is attached to the surface of the chip.

It can be appreciated that the first heat conducting layer is arranged on the end face of the first heat conducting table, so that the chip and the first shell are tightly attached, and the heat conduction from the chip to the first shell is guaranteed.

In an embodiment, the first heat dissipation structure further includes a third heat dissipation fin, the third heat dissipation fin is located in the mounting cavity and mounted on the first housing, and the first heat conduction platform is mounted on the third heat dissipation fin.

It can be appreciated that the third radiating fin is located the inside of first casing, has increased the inside heat transfer area of installation cavity, so set up, can accelerate the absorption of first casing to the heat in the installation cavity.

In an embodiment, the automobile central domain controller further comprises a shielding structure, wherein the shielding structure is located in the mounting cavity and surrounds the circumference of the substrate.

It can be understood that various electronic components such as chips and microcircuits are arranged on the substrate, and electromagnetic interference from the outside can be effectively prevented by arranging the shielding structure.

In an embodiment, the shielding structure includes a first shielding rib and a second shielding rib, where the first shielding rib is disposed on the first housing and can be enclosed in a circumferential direction of the substrate, the second shielding rib is disposed on the second housing and is covered on the first housing, and the second shielding rib can be enclosed in a circumferential direction of the substrate and is in sealing fit with the first shielding rib.

It will be appreciated that the substrate may be sealed inside the mounting cavity by the sealing engagement of the first and second shield ribs, which is advantageous in preventing electromagnetic interference from the outside.

In an embodiment, the first shielding rib and/or the second shielding rib are/is provided with conductive glue, and the conductive glue is electrically connected with the substrate.

It will be appreciated that when the automotive central domain controller is assembled, the conductive adhesive is present in the gap formed at the junction of the first shielding rib and the second shielding rib, and thus, the gap is sealed by the conductive adhesive, thereby being beneficial to preventing electromagnetic interference that can pass through the gap.

The utility model also provides a technical scheme as follows:

an automobile comprising the automobile central domain controller according to any one of the above technical solutions.

Compared with the prior art, the utility model has the advantages that the first heat dissipation structure and the second heat dissipation structure are respectively arranged on the upper surface and the lower surface of the chip, and the heat dissipation is carried out on the two surfaces of the chip, so that the heat exchange capacity of the chip is enhanced; the first heat dissipation structure comprises a first heat conduction platform, a first heat dissipation fin and a third heat dissipation fin, wherein the first heat conduction platform is attached to the chip and directly absorbs heat emitted by the chip, the third heat dissipation fin is arranged in the mounting cavity and can absorb heat generated in the mounting cavity, and the first heat dissipation fin is in direct contact with the outside and exchanges heat with the outside through the heat absorbed by the first shell; the second heat radiation structure comprises a second heat conduction table and a second heat radiation fin, wherein the second heat conduction table is attached to the second surface of the substrate and absorbs heat from the chip through the second surface, the second heat radiation fin is in direct contact with the outside and conducts heat exchange with the outside through the heat absorbed by the second shell, the heat exchange capacity of the chip is enhanced, and the temperature of the chip can be kept in a reasonable range under the condition of high-power operation.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present utility model, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present utility model, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic diagram of a central domain controller of an automobile according to the present utility model.

Fig. 2 is a top-down exploded view of the automotive central domain controller provided by the utility model.

Fig. 3 is a bottom exploded view of the central domain controller of the automobile provided by the utility model.

Reference numerals: 100. a vehicle central domain controller; 10. a first housing; 101. a mounting cavity; 20. a substrate; 21. a first surface; 211. a first heat conductive layer; 22. a second surface; 221. a second heat conductive layer; 23. a debug interface; 231. a rubber stopper; 30. a second housing; 40. a first heat dissipation structure; 41. a first heat sink; 42. a first heat conduction stage; 43. a third heat sink; 50. a second heat dissipation structure; 51. a second heat sink; 52. a second heat conduction stage; 60. a chip; 61. a chip holder; 70. a shielding structure; 71. a first shielding rib; 72. and a second shielding rib.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and the like are used in the description of the present utility model for the purpose of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through intermedial media. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of the present utility model have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in the description of the present utility model includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to 2, the present utility model provides an automotive center domain controller 100, the automotive center domain controller 100 including a first housing 10, a substrate 20, a second housing 30, a first heat dissipation structure 40, a second heat dissipation structure 50, and a chip 60; the second housing 30 covers the first housing 10 and forms a mounting cavity 101 with the first housing 10. The substrate 20 is mounted in the mounting cavity 101 and has a first surface 21 facing the first housing 10 and a second surface 22 facing the second housing 30, wherein the first surface 21 and the second surface 22 are disposed opposite to each other. The chip 60 is mounted on the first surface 21. The first heat dissipation structure 40 is mounted on the first housing 10, and a portion of the first heat dissipation structure 40 extends into the mounting cavity 101, corresponds to the position of the chip 60, and is attached to the surface of the chip 60. The second heat dissipation structure 50 is mounted on the second housing 30, and a portion of the second heat dissipation structure 50 extends into the mounting cavity 101, corresponds to the position of the chip 60, and is attached to the second surface 22.

It should be explained that, the present utility model respectively provides the first heat dissipation structure 40 and the second heat dissipation structure 50 on two sides of the first housing 10 and the second housing 30, and simultaneously dissipates heat on two sides of the chip 60, so as to enhance the heat exchange capability of the chip 60. Wherein, a part of the first heat dissipation structure 40 extends into the mounting cavity 101, a part of the first heat dissipation structure is attached to the chip 60 and directly absorbs heat emitted by the chip 60, and then the heat is dissipated through a part of the first heat dissipation structure 40 contacting with the outside; the second heat dissipation structure 50 also has a portion extending into the mounting cavity 101, a portion corresponding to the position of the chip 60 and being attached to the second surface 22, and a portion indirectly absorbing the heat emitted by the chip 60 through the substrate 20, and then dissipating the heat through the portion of the second heat dissipation structure 50 contacting with the outside, so that the heat exchange capability of the chip 60 is enhanced, and the temperature of the chip 60 can be kept in a reasonable range under the condition of high-power operation of the chip 60.

In one embodiment, the material of the first housing 10 is a material with good heat dissipation performance, such as an aluminum alloy, a copper alloy, and the like. In the present utility model, the material of the first housing 10 is selected from aluminum alloy, which not only has good heat dissipation performance but also has low cost. Also, the material of the second housing 30 is set to a material having a good heat dissipation property, such as an aluminum alloy, a copper alloy, or the like. In the present utility model, the material of the second housing 30 is selected from aluminum alloy, which not only has good heat dissipation performance but also has low cost. As shown in fig. 2 and 3, the substrate 20 is provided with a debug interface 23, and the debug interface 23 has a function of enabling software debugging. Here, the debug interface 23 is provided with a rubber stopper 231, and the rubber stopper 231 is used to prevent dust, water, etc. from entering the debug interface 23.

As shown in fig. 2 and 3, the second heat dissipation structure 50 includes a second heat dissipation plate 51 and a second heat conduction platform 52, the second heat dissipation plate 51 is mounted on the outer surface of the second housing 30, and the second heat conduction platform 52 is disposed on the inner surface of the second housing 30 and protrudes from the inner surface and is attached to the second surface 22. It will be appreciated that the surface of the second thermally conductive stage 52 is planar, and may better conform to the second surface 22 of the substrate 20, such arrangement being beneficial for enhancing thermal conduction between the substrate 20 and the second housing 30.

Further, the second heat sink 51 is composed of a plurality of fins which are uniformly distributed, wherein the number of the fins may be 10, 20, 30 or not, and the specific number depends on the structural requirement of the controller. By the arrangement, the heat exchange area between the second shell 30 and the outside can be increased, which is beneficial to enhancing the heat dissipation capacity of the chip 60. Meanwhile, two adjacent second heat radiating fins 51 are spaced apart from each other, thereby forming a heat radiating gap for facilitating the diffusion and flow of heat.

In an embodiment, a second heat conducting layer 221 is disposed on an end surface of the second heat conducting stage 52 facing the second surface 22, and the second heat conducting layer 221 is adhered to the second surface 22. It will be appreciated that the provision of the second heat conductive layer 221 on the end surface of the second heat conductive stage 52 may enable the substrate 20 and the second housing 30 to be more tightly adhered, which is advantageous for ensuring heat conduction from the substrate 20 to the second housing 30. The second heat conductive layer 221 may be provided as a heat conductive pad, a heat conductive silicone grease layer, or the like having a heat conductive effect, so as to facilitate the heat conduction at the chip 60. Preferably, the material of the second heat conduction stage 52 has a good heat conduction property. For example, it may be any one of a thermally conductive gel, a thermally conductive silicone grease, a thermally conductive paste, and the like.

As shown in fig. 2 and 3, the first heat dissipation structure 40 includes a first heat dissipation fin 41 and a first heat conduction platform 42, the first heat dissipation fin 41 is mounted on the outer surface of the first housing 10, and the first heat conduction platform 42 is disposed on the inner surface of the first housing 10 and protrudes from the inner surface, and is attached to the surface of the chip 60; meanwhile, the first heat conduction stage 42 is connected to the first heat sink 41. It can be appreciated that the first heat conducting platform 42 is attached to the surface of the chip 60, so that the heat conduction between the chip 60 and the first housing 10 is enhanced, and the heat dissipation effect of the chip 60 is improved.

Further, the first heat sink 41 is composed of a plurality of fins uniformly distributed, wherein the number of fins may be 10, 20, 30, or not, depending on the specific controller structure. By the arrangement, the heat exchange area between the first shell 10 and the outside can be increased, which is beneficial to enhancing the heat dissipation capacity of the chip 60. Meanwhile, two adjacent first heat radiating fins 41 are spaced apart from each other, thereby forming a heat radiating gap for facilitating the diffusion and flow of heat.

In an embodiment, a first heat conducting layer 211 is disposed on an end surface of the first heat conducting platform 42 facing the first surface 21, and the first heat conducting layer 211 is adhered to the surface of the chip 60. It will be appreciated that the provision of the first heat conductive layer 211 on the end face of the first heat conductive stage 42 may allow for a tighter attachment of the chip 60 to the first housing 10, which may be advantageous in ensuring heat transfer from the chip 60 to the first housing 10. The first heat conductive layer 211 may be provided as a heat conductive pad, a heat conductive silicone grease layer, or the like having a heat conductive effect, so as to facilitate the heat conduction out at the chip 60.

Preferably, the material of the first heat conducting stage 42 needs to have good heat conducting performance, and may be any one of heat conducting gel, heat conducting silicone grease, heat conducting mud, and the like.

Further, the first heat dissipation structure 40 further includes a third heat dissipation plate 43, the third heat dissipation plate 43 is located in the mounting cavity 101 and mounted on the first housing 10, and the first heat conduction stage 42 is mounted on the third heat dissipation plate 43. It will be appreciated that the third heat sink 43 is located inside the first housing 10, which increases the heat exchange area inside the mounting cavity 101, so that the heat absorption of the first housing 10 into the mounting cavity 101 can be accelerated. At the same time, the third heat sink 43 connects the first heat conduction stage 42 with the outer shell of the first housing 10, so that the entire structure becomes more stable, functioning as a reinforcing rib. Specifically, the first heat sink 41 extends along the width direction of the first housing 10, and the third heat sink 43 extends along the width and length directions of the first housing 10 from the periphery of the first heat conduction stage 42.

As shown in fig. 2 and 3, the automotive center field controller 100 further includes a shielding structure 70, the shielding structure 70 is located in the mounting cavity 101 and is circumferentially arranged around the substrate 20, and the shielding structure 70 includes a first shielding rib 71 and a second shielding rib 72; the first shielding rib 71 is disposed on the first housing 10 and can be disposed around the substrate 20, the second shielding rib 72 is disposed on the second housing 30 and is disposed on the first housing 10 by covering the second housing 30, and the second shielding rib 72 can be disposed around the substrate 20 and is in sealing engagement with the first shielding rib 71. It will be appreciated that the substrate 20 may be sealed inside the mounting cavity 101 by the sealing engagement of the first and second shield ribs 71, 72, which is advantageous in preventing electromagnetic interference from the outside.

It should be noted that, the materials of the first shielding rib 71 and the second shielding rib 72 are metals, and free moving electrons exist in the metal materials, and when the automobile central domain controller 100 is interfered by an electromagnetic field, the free moving electrons of the metal materials generate an electric field to counteract the interference, thereby realizing electromagnetic shielding.

Further, a conductive paste (not shown) is disposed on the first shielding rib 71 and/or the second shielding rib 72, and the conductive paste is electrically connected to the substrate 20. It will be appreciated that, when the automotive central domain controller 100 is assembled, the conductive adhesive exists in the gap formed at the junction of the first shielding rib 71 and the second shielding rib 72, so that electromagnetic interference that can pass through the gap is prevented; in addition, the conductive paste is electrically connected with the substrate 20, so that electromagnetic influence of the substrate on the chip 60 can be reduced, and in particular, the conductive paste is connected with the exposed copper on the substrate 20, so that the electrical connection with the substrate 20 is realized. Alternatively, the first shielding rib 71 and/or the second shielding rib 72 are provided with grooves (not shown), and rubber rings are placed in the grooves, so that electromagnetic shielding can be realized.

In one embodiment, a chip holder 61 is disposed between the second surface 22 and the second housing 30, and the chip holder 61 is used to fix the chip 60. It should be explained that, when the automobile works, continuous vibration is generated, so that a force is applied to the pins of the chip 60, which may separate the chip 60 from the substrate 20, affect the working life of the chip 60, and the chip support 61 is provided to effectively ensure the working stability of the chip 60.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of the utility model should be determined from the following claims.

Claims (10)

1. An automotive central domain controller, the automotive central domain controller comprising:

a first housing (10);

a second housing (30) covering the first housing (10) and forming a mounting cavity (101) with the first housing (10);

a substrate (20) mounted within the mounting cavity (101) and having a first surface (21) facing the first housing (10) and a second surface (22) facing the second housing (30), wherein the first surface (21) and the second surface (22) are disposed opposite;

-a chip (60) mounted on said first surface (21);

the first heat dissipation structure (40) is mounted on the first shell (10), and part of the first heat dissipation structure (40) stretches into the mounting cavity (101), corresponds to the position of the chip (60) and is attached to the surface of the chip (60);

the second heat dissipation structure (50) is mounted on the second shell (30), and part of the second heat dissipation structure (50) stretches into the mounting cavity (101), corresponds to the position of the chip (60) and is attached to the second surface (22).

2. The automotive center area controller according to claim 1, wherein the second heat dissipation structure (50) includes a second heat dissipation fin (51) and a second heat conduction stage (52), the second heat dissipation fin (51) is mounted on the outer surface of the second housing (30), and the second heat conduction stage (52) is provided on the inner surface of the second housing (30) and protrudes from the inner surface and is attached to the second surface (22).

3. The automotive central domain controller according to claim 2, characterized in that a second heat conducting layer (221) is provided on an end surface of the second heat conducting stage (52) facing the second surface (22), the second heat conducting layer (221) being attached to the second surface (22).

4. The automotive center area controller according to claim 1, wherein the first heat dissipation structure (40) includes a first heat dissipation fin (41) and a first heat conduction stage (42), the first heat dissipation fin (41) is mounted on the outer surface of the first housing (10), and the first heat conduction stage (42) is provided on the inner surface of the first housing (10) and protrudes from the inner surface and is attached to the surface of the chip (60).

5. The automobile central domain controller according to claim 4, wherein a first heat conducting layer (211) is provided on an end surface of the first heat conducting stage (42) facing the first surface (21), and the first heat conducting layer (211) is attached to the surface of the chip (60).

6. The automotive center area controller according to claim 4, characterized in that the first heat radiation structure (40) further includes a third heat radiation fin (43), the third heat radiation fin (43) is mounted on the first housing (10) in the mounting cavity (101), and the first heat conduction stage (42) is mounted on the third heat radiation fin (43).

7. The automotive center area controller according to claim 1, further comprising a shielding structure (70), wherein the shielding structure (70) is located within the mounting cavity (101) and surrounds the circumference of the base plate (20).

8. The automotive central domain controller according to claim 7, characterized in that the shielding structure (70) comprises a first shielding rib (71) and a second shielding rib (72);

the first shielding rib (71) is arranged on the first shell (10) and can be arranged around the substrate (20), the second shielding rib (72) is arranged on the second shell (30), the second shell (30) is covered on the first shell (10), and the second shielding rib (72) can be arranged around the substrate (20) and is in sealing fit with the first shielding rib (71).

9. The automotive center area controller according to claim 8, characterized in that the first shielding rib (71) and/or the second shielding rib (72) are provided with a conductive paste, which is electrically connected with the substrate.

10. An automobile comprising an automobile central domain controller according to any one of claims 1-9.