CN221151843U

CN221151843U - Radiating device for reflecting electromagnetic wave

Info

Publication number: CN221151843U
Application number: CN202322735888.0U
Authority: CN
Inventors: 王海波; 蔡云枝
Original assignee: Taicang T&W Electronics Co Ltd
Current assignee: Taicang T&W Electronics Co Ltd
Priority date: 2023-10-12
Filing date: 2023-10-12
Publication date: 2024-06-14
Anticipated expiration: 2033-10-12

Abstract

The utility model relates to the field of electronic communication, in particular to a heat dissipation device for reflecting electromagnetic waves; the heat dissipation device includes: a heat dissipation plate mounted above the chip, a gap being provided between the heat dissipation plate and the chip; the heat conduction assembly is pressed in the gap, and a copper sheet is arranged in the heat conduction assembly; the utility model effectively suppresses the noise radiation of the chip, and can effectively reduce the noise of the chip coupled to the radiating fin through the reflection of the interlayer copper sheet on the radiation of the chip; the original heat dissipation structure is not destroyed, and the original heat dissipation structure can be used at the position where the shielding cover cannot be used due to certain reasons, so that the heat dissipation scheme is not required to be replaced; the main function of the shielding cover is to shield the noise of the chip without using the shielding cover, but the heat dissipation efficiency of the chip is greatly reduced, and the welding shielding cover cannot be used by using the scheme, so that the shielding effect is achieved.

Description

Radiating device for reflecting electromagnetic wave

Technical Field

The utility model relates to the field of electronic communication, in particular to a heat dissipation device for reflecting electromagnetic waves.

Background

The general radiating fin structure is to add heat conduction gasket or heat conduction silicone grease on PCBA chip, add aluminum alloy or other material's fin on heat conduction gasket or silicone grease, owing to increased heat conduction material and fin on the chip, form parasitic capacitance, coupling part chip radiation electromagnetic noise, and the rethread fin emits out, does not have the suppression effect to the radiation but can strengthen the radiation on the contrary, makes the product unable to pass the authentication test.

In some special conditions, if the shielding cover is not considered in design or the shielding cover cannot be added due to structural problems, the shielding cover cannot be used, so that the radiating fin of the chip is coupled with electromagnetic noise to be emitted.

Disclosure of utility model

The utility model provides a radiating device for reflecting electromagnetic waves to solve the problems of heat radiation and radiation of a PCB chip aiming at the technical problems in the prior art.

The technical scheme for solving the technical problems is as follows:

Provided is a heat dissipating device for reflecting electromagnetic waves, including a PCBA, and a chip mounted on the PCBA, the heat dissipating device comprising:

a heat dissipation plate mounted above the chip, a gap being provided between the heat dissipation plate and the chip; and

And the heat conduction assembly is pressed in the gap, and a copper sheet is arranged in the heat conduction assembly.

Further, the heat conduction assembly comprises a first heat conduction gasket attached to the heat dissipation plate and a second heat conduction gasket attached to the chip, and the copper sheet is clamped between the first heat conduction gasket and the second heat conduction gasket.

Further, the heat dissipation plate is mounted on the PCBA by a plurality of fixing screws.

Further, the upper end of the heat dissipation plate is provided with a plurality of comb-shaped heat dissipation fins.

The beneficial effects of the utility model are as follows:

1. The noise radiation of the chip is effectively restrained, and the noise of the chip coupled to the radiating fin can be effectively reduced through the reflection of the interlayer copper sheet on the radiation of the chip.

2. The original heat dissipation structure can not be destroyed, and the original heat dissipation structure can be used at the position where the shielding cover cannot be used due to some reasons, so that the heat dissipation scheme is not required to be replaced.

3. The main function of the shielding cover is to shield the noise of the chip without using the shielding cover, but the heat dissipation efficiency of the chip is greatly reduced, and the welding shielding cover cannot be used by using the scheme, so that the shielding effect is achieved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic reflection diagram of the present utility model;

FIG. 3 is a thermal conduction of the present utility model;

in the drawings, the list of parts represented by the reference numerals is as follows:

100. A heat dissipation plate; 200. a first thermally conductive pad; 300. copper sheets; 400. a second thermally conductive pad; 500. a chip; 600. a set screw; 700. PCBA.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. Examples of the embodiments are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model. Furthermore, it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "left," "right," "horizontal," "top," "bottom," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different structures of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize applications of other processes and/or usage scenarios for other materials.

The present utility model provides the following preferred embodiments:

example 1

Referring to fig. 1, the present embodiment describes a heat sink for reflecting electromagnetic waves, the heat sink being used for a PCBA 700, a chip 500 being mounted on the PCBA 700, the heat sink being mounted on the chip 500; the device is characterized by comprising the following components:

Heat dissipation plate 100: the heat dissipation plate 100 is located above the chip 500, and a certain gap is left between the heat dissipation plate and the chip 500. The main function of the heat dissipating plate 100 is to dissipate heat generated by the chip 500 to the environment, so as to ensure the chip 500 to work normally.

And a heat conduction assembly: the heat conductive member is disposed in the gap between the heat dissipation plate 100 and the chip 500 to fill the gap, the heat conductive member internally includes the copper sheet 300, copper has good electrical conductivity, and thus a reflection effect is generated under the action of electromagnetic waves, when electromagnetic waves such as light waves, radio waves, etc. encounter the surface of the copper sheet 300, electrons are caused to move inside the copper sheet 300, and due to the existence of free electrons in the copper sheet 300, the electrons are vibrated by the action of an electric field to generate a reverse electric field, and the reverse electric field interacts with an incident electric field to cause a reflection phenomenon of the electromagnetic waves, which is just a phenomenon of using the reflected electromagnetic waves of copper, so that the electromagnetic waves of the chip 500 can be effectively reflected inside through the copper sheet 300 to realize a shielding function, and it is ensured that radiation of the device chip 500 is not directly coupled to the heat dissipation plate of the chip 500, as shown in fig. 2.

In addition, the copper sheet 300 functions to optimize heat conduction, and more effectively transfer heat generated from the chip 500 to the heat dissipation plate 100 to improve heat dissipation efficiency; copper has high heat conductivity, uniform heat conductivity, good oxidation resistance and plasticity, and in the design of a heat dissipation structure, copper is often used for manufacturing parts such as a heat sink, a heat dissipation pipe, a heat dissipation base and the like, so that the addition of the copper sheet 300 between the heat conduction pads can not damage heat dissipation of the chip 500, and normal operation of equipment can be ensured, as shown in fig. 3.

The design of the heat dissipating device of the present embodiment helps to solve the heat dissipation and electromagnetic compatibility problems at the same time, and optimizes the thermal and electrical properties through the use of the copper sheet 300, so as to ensure that the product has better performance in terms of electromagnetic radiation.

Example two

As shown in fig. 1, the detailed features of the heat conduction assembly are further described in this embodiment on the basis of the heat dissipation device described in the first embodiment, in this embodiment, the heat conduction assembly plays a key role in a gap between the heat dissipation plate 100 and the chip 500 to optimize heat conduction and electromagnetic compatibility, and the heat conduction assembly includes two parts:

The first heat conductive gasket 200 is attached to the heat dissipation plate 100, and functions to provide a heat conduction path, so that heat conducted by the copper sheet 300 is effectively transferred to the heat dissipation plate 100, and then is conducted to the air by the heat dissipation plate 100.

The second thermal pad 400 is attached to the chip 500 and directly contacts the chip 500, which helps to direct heat generated by the chip 500 into the thermally conductive assembly.

The copper sheet 300 is sandwiched between the first and second heat conductive gaskets 200 and 400, and thus, the clamping of the copper sheet 300 between the first and second heat conductive gaskets 200 and 400 ensures effective coordination between heat conduction and electromagnetic compatibility because the copper sheet 300 has excellent heat conduction properties, and can effectively transfer heat while also contributing to reduction of parasitic capacitance effects.

The design of the heat dissipating device in this embodiment further optimizes the heat conduction efficiency, and simultaneously helps to solve the electromagnetic noise radiation problem by applying the copper sheet 300, so as to ensure that the product is excellent in electromagnetic compatibility; this structure helps to reflect electromagnetic waves and reduces the possibility of electromagnetic interference while maintaining heat dissipation properties.

Example III

Referring to fig. 1, in order to ensure that heat dissipation plate 100 is firmly mounted on PCBA 700, a plurality of fixing screws 600 are used; these screws are used to firmly attach heat sink 100 to PCBA 700, ensuring that it does not loosen or move during use.

The reliable connection between heat sink 100 and PCBA 700 in this embodiment is achieved by a plurality of set screws 600, which helps to ensure that the heat sink maintains its position and performance over long periods of use, thereby efficiently dissipating heat and reflecting electromagnetic waves, while maintaining electromagnetic compatibility of the product.

Example IV

Referring to fig. 1, a plurality of comb-shaped heat sinks are provided at the upper end of the heat dissipation plate 100, and are designed to increase the heat dissipation surface area and provide more heat conduction paths to more effectively dissipate heat, and the projected shapes of the comb-shaped heat sinks are similar to the teeth of a comb, which can uniformly disperse heat and promote heat transfer, and can more effectively dissipate heat, thereby ensuring stable operation of the chip 500 under high temperature conditions.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the utility model.

Claims

1. A heat sink for reflecting electromagnetic waves, comprising a PCBA (700), and a chip (500) mounted on the PCBA (700), the heat sink comprising:

A heat dissipation plate (100) mounted above the chip (500), a gap being provided between the heat dissipation plate (100) and the chip (500); and

And the heat conduction assembly is pressed in the gap, and a copper sheet (300) is arranged in the heat conduction assembly.

2. The heat dissipating device for reflecting electromagnetic waves according to claim 1, wherein the heat conducting component comprises a first heat conducting pad (200) attached to the heat dissipating plate (100) and a second heat conducting pad (400) attached to the chip (500), and the copper sheet (300) is sandwiched between the first heat conducting pad (200) and the second heat conducting pad (400).

3. The heat sink for reflecting electromagnetic waves as recited in claim 1, wherein the heat sink (100) is mounted on the PCBA (700) by a plurality of fixing screws (600).

4. The heat dissipating device for reflecting electromagnetic waves according to claim 1, wherein a plurality of comb-shaped heat dissipating fins are provided at an upper end of the heat dissipating plate (100).