CN219470241U - High film thickness electroplating anode conductive structure for continuously plating nickel layer of IC lead frame in reel-to-reel manner - Google Patents

Abstract

The application relates to the technical field of vehicle-gauge automobile chips, in particular to a roll-to-roll continuous plating Integrated Circuit (IC) lead frame nickel layer high film thickness electroplating anode conductive structure, which comprises a sub-groove, wherein the sub-groove is used for being installed in a mother groove, an opening of the sub-groove faces upwards, a lower anode basket is installed at the bottom of the sub-groove, and an upper anode basket is installed at the opening of the sub-groove. And the side wall of the sub-groove is provided with a conductive connecting strip, the upper anode basket and the lower anode basket are respectively connected with the conductive connecting strip, and the conductive connecting strip is used for being electrically connected with the power supply anode. An electroplating sheet is arranged in the subslot in a penetrating way along the horizontal direction and is positioned between the upper anode basket and the lower anode basket. In the electroplating process, the upper anode basket and the lower anode basket are electrified by the conductive connecting strips, so that current flows to the upper plane and the lower plane of the electroplating sheet, the conductive area of the electroplating sheet is increased, and the conductive resistance for electroplating a product with high film thickness is reduced. The method has the effect of improving the quality of the high-film-thickness product.

Description

High film thickness electroplating anode conductive structure for continuously plating nickel layer of IC lead frame in reel-to-reel manner

Technical Field

The application relates to the technical field of manufacturing of vehicle-gauge automobile chips, in particular to a high-film-thickness electroplating anode conductive structure for continuously plating a nickel layer of an IC lead frame from roll to roll.

Background

Electroplating refers to a surface processing method for forming a plating layer by taking a plated base metal as a cathode in a salt solution containing the metal to be plated and depositing cations to be plated in the plating solution on the surface of the base metal through electrolysis. The surface hardness and corrosion resistance of the IC lead frame can be improved, the glossiness and decoration of the IC lead frame can be enhanced, and the electric conductivity of the IC lead frame can be improved by plating the nickel layer on the IC lead frame.

Referring to fig. 1, the current conventional anode conductive structure includes a sub-tank 1, a conductive connection member 101, a titanium basket 102, and a plating member 103. The secondary tank 1 is arranged in the mother tank, the mother tank is filled with electrolytic liquid medicine, and the secondary tank 1 is communicated with the mother tank. During the electroplating process, a nickel cake is added to the titanium basket 102, and then the conductive connecting piece 101 is electrified, so that nickel is plated on the surface of the electroplated piece 103.

Referring to fig. 2, since the current path is from the positive electrode to the negative electrode (in which the conductive connection member 101 communicating with the titanium basket 102 is the positive electrode and the plating member 103 is the negative electrode), the current path is straight, and thus the current of the conventional plating anode conductive structure is led from both sides of the sub-tank 1 to the sides of the plating member 103.

At present, the thickness of the nickel layer required by the automobile chip product of the automobile specification is required to reach 150 mu, and the set value required by the current is required to reach 200-250A. When the high-film-thickness product with the film thickness of 150 mu is electroplated in the conductive mode, the production line speed can only be 1M-1.5M, and the conductive area and the resistance of the anode conductive mode are small due to the high film thickness, so that the current required by electroplating can not reach the current value required by steady flow after the voltage rises to the rated value. If the voltage is increased, after the voltage exceeds the setting range of the standard operation program, fatal anomalies such as scorching, peeling and the like can occur to the product; if the voltage is maintained, uniformity of the product film thickness and a set value of the film thickness cannot be achieved.

Disclosure of Invention

In order to increase the conductive area, reduce the conductive resistance to high film thickness product electroplating and improve the quality of high film thickness product, the application provides a roll-to-roll continuous plating IC lead frame nickel layer high film thickness electroplating anode conductive structure.

The application provides a roll-to-roll continuous plating IC lead frame nickel layer high film thickness electroplating anode conductive structure which adopts the following technical scheme:

a roll-to-roll continuous plating of nickel layers of an IC leadframe to high film thickness electroplated anode conductive structure comprising:

the secondary groove is used for being placed in the mother groove, and a through hole for the electroplating sheet extending along the horizontal direction to pass through is formed in the secondary groove;

the lower anode basket is arranged at the bottom of the sub-groove and is used for containing nickel cakes;

the upper anode basket is arranged at the opening of the sub-groove, the bottom of the upper anode basket is positioned in the sub-groove, and the upper anode basket is used for containing nickel cakes;

the conductive connecting strip is arranged on one side of the subslot, the lower anode basket and the upper anode basket are electrically connected to the conductive connecting strip, and the conductive connecting strip is used for being electrically connected with the power supply anode.

Through adopting above-mentioned technical scheme, utilize the conductive connection strip to carry out the circular telegram with lower positive pole basket and last positive pole basket to when making the electroplating piece carry out nickel plating in the sub tank, the upper and lower two sides of follow electroplating piece of electric current lead to the electroplating piece, make electrically conductive effective area increase, effectually reduced the resistance, played fine resistance reduction voltage's effect to the stability of the high electric current that high film thickness electroplating product required, thereby improved the quality of high film thickness product.

Optionally, at least one side of the lower anode basket extends upwards to form a side anode basket, and the side anode basket is fixedly connected with a conductive fixing piece, and the conductive fixing piece is used for being electrically connected with the conductive connecting strip.

Through adopting above-mentioned technical scheme, the setting of side positive pole basket makes electroplate the piece side direction also have the electric current to pass through, further increase electrically conductive effective area to side positive pole basket also is used for splendid attire nickel cake, and the setting of side positive pole basket has increased the quantity of storing the nickel cake simultaneously, and is convenient for add the nickel cake through side positive pole basket.

Optionally, the upper anode basket fixedly connected with stabilizer blade, the stabilizer blade is the setting of buckling, the part butt that the stabilizer blade buckled is in on the lateral wall of side anode basket, the stabilizer blade with conductive connection strip electric connection.

Through adopting above-mentioned technical scheme, utilize stabilizer blade butt to realize the spacing to last positive pole basket on the lateral wall of side positive pole basket for go up the connection of positive pole basket more stable, still play electrically conductive effect simultaneously.

Optionally, the bottom of lower positive pole basket is convex setting, lower positive pole basket bottom convex opening orientation the inside of lower positive pole basket, the clearance mouth has been seted up on the lower positive pole basket, fixedly connected with lapping plate on the lateral wall of clearance mouth, the lap joint has the titanium otter board on the lapping plate.

Through adopting above-mentioned technical scheme, set up the bottom of lower positive pole basket into circular arc shape and be convenient for collect the residue impurity behind the nickel cake electrolysis, the rethread takes off the nickel cake residue in the lower positive pole basket with the titanium otter board and clear up.

Optionally, a fixing part is fixedly connected to the lower anode basket, and the fixing part is used for being fixedly connected with the sub-tank.

Through adopting above-mentioned technical scheme, the setting of mounting is convenient for connect with sub-groove to make the connection more stable.

Optionally, a supporting groove is formed in the sub groove, a supporting plate is lapped in the supporting groove, and the supporting plate is used for supporting the upper anode basket.

Through adopting above-mentioned technical scheme, the setting of backup pad supports last positive pole basket, has reduced the atress of going up positive pole basket junction for it is more stable when splendid attire nickel cake in the positive pole basket.

Optionally, fixedly connected with locating part on the upper anode basket, the locating part joint is in on the lateral wall of sub tank, the locating part is used for right go up anode basket is spacing.

Through adopting above-mentioned technical scheme, the setting of locating part is convenient for carry out spacingly when placing last positive pole basket in the backup pad to be convenient for go up and connect between positive pole basket and the lower positive pole basket.

Optionally, a drainage block is fixedly connected in the sub-groove, a drainage channel is formed in the drainage block, and the drainage channel is used for communicating the sub-groove with the main groove

By adopting the technical scheme, the arrangement of the drainage block and the drainage channel enables the Chinese medicine water in the secondary tank and the primary tank to circulate fully.

Optionally, the both sides fixedly connected with water injection piece of sub tank, seted up the water injection passageway in the water injection piece, the water inlet of water injection passageway is located the bottom of water injection piece, the water injection passageway with drainage channel intercommunication.

By adopting the technical scheme, the traditional Chinese medicine water in the mother tank is lower than that in the son tank, and the liquid medicine can be introduced into the son tank.

Optionally, a water baffle is slidably connected to the sub-groove, and the water baffle is located above the electroplating piece.

Through adopting above-mentioned technical scheme, the setting of breakwater is convenient for adapt to the different thickness of electroplating piece, can control the liquid medicine water level in the subslot simultaneously for the bottom and the electroplating piece of going up the positive pole basket fully soak in the liquid medicine.

In summary, the present application includes at least one of the following beneficial technical effects:

1. through the matching of the subslot, the electroplating piece, the lower anode basket, the upper anode basket and the conductive connecting strips, the upper side and the lower side of the electroplating piece are subjected to current passing, so that the conductive area is increased, the conductive resistance of electroplating a high-film-thickness product is reduced, and the effect of improving the quality of the high-film-thickness product is achieved;

2. through the matching of the subslot, the electroplating piece, the lower anode basket, the upper anode basket and the side anode basket, the electroplating piece is enabled to conduct current to pass in four directions, the conductive area is further increased, the conductive resistance of electroplating of a high-film-thickness product is reduced, and the quality of the high-film-thickness product is improved;

3. the bottom of the lower anode basket is arranged into an arc shape, and the cleaning opening is formed in the lower anode basket, so that the nickel cake residues after electrolysis in the lower anode basket are cleaned conveniently.

Drawings

Fig. 1 is a schematic structure diagram of a conductive structure of an electroplating anode in the background art.

Fig. 2 is a cross-sectional view and a current flow diagram of a plated anode conductive structure in the background art.

Fig. 3 is a schematic structural diagram of a roll-to-roll continuous plating of a nickel layer of an IC leadframe with high film thickness electroplating anode conductive structure in an embodiment of the present application.

Fig. 4 is a top view of a roll-to-roll continuous nickel layer plated anode conductive structure for an IC leadframe in an embodiment of the present application.

Fig. 5 is a cross-sectional view A-A of fig. 4.

Fig. 6 is a sectional view of B-B in fig. 4.

Fig. 7 is an exploded view of a roll-to-roll continuous plating of a nickel layer of an IC leadframe and high film thickness plating anode conductive structure in an embodiment of the present application.

Reference numerals illustrate:

1. a subslot; 101. a conductive connection; 102. titanium basket; 103. an electroplated part; 11. a via hole; 12. a water injection block; 13. a water injection channel; 14. a water inlet; 15. a drainage block; 16. a drainage channel; 17. a water baffle; 18. a support groove; 2. a lower anode basket; 21. cleaning the mouth; 22. a lapping plate; 23. titanium mesh plates; 24. a fixing member; 3. an upper anode basket; 31. a support leg; 32. a limiting piece; 33. a limiting piece; 4. a conductive connection bar; 5. electroplating sheets; 6. a support plate; 7. a side anode basket; 71. and a conductive fixing member.

Detailed Description

The present application is described in further detail below in conjunction with figures 3-7.

The embodiment of the application discloses a roll-to-roll continuous plating anode conductive structure with a high film thickness for a nickel layer of an IC lead frame.

Referring to fig. 3, 4 and 5, the high film thickness electroplating anode conductive structure of the coil-to-coil continuous plating IC lead frame nickel layer comprises a sub-slot 1, wherein the sub-slot 1 is used for being installed in a mother slot, an opening of the sub-slot 1 faces upwards, a lower anode basket 2 is installed at the bottom of the sub-slot 1, and an upper anode basket 3 is installed at the opening of the sub-slot 1.

The side wall of the sub-tank 1 is provided with a conductive connecting strip 4, the upper anode basket 3 and the lower anode basket 2 are respectively connected to the conductive connecting strip 4, and the conductive connecting strip 4 is used for being electrically connected with a power anode. The subslot 1 is provided with a via hole 11 for the electroplating piece 5 to pass through in the horizontal direction, and the electroplating piece 5 is positioned between the upper anode basket 3 and the lower anode basket 2.

In the electroplating process, the upper anode basket 3 and the lower anode basket 2 are electrified by the conductive connecting strip 4, so that current flows to the upper plane and the lower plane of the electroplating sheet 5, the conductive area of the electroplating sheet 5 is increased, the conductive resistance to electroplating of the electroplating sheet 5 is reduced, the holding voltage can reach the current value required by steady flow, the fatal abnormal phenomena of burning, peeling and the like of the electroplating sheet 5 caused by increasing the voltage are avoided as much as possible, and the quality of a high-film-thickness product is improved.

Referring to fig. 3 and 6, water injection blocks 12 are fixedly connected to two sides of the sub-tank 1 along the feeding direction of the electroplating sheet 5, water injection channels 13 for flowing liquid medicine are formed in the water injection blocks 12, and water inlets 14 of the water injection channels 13 are formed in the bottoms of the water injection blocks 12. The drainage block 15 is fixedly connected inside the sub-groove 1, a drainage channel 16 is formed in the drainage block 15, the water injection channel 13 is communicated with the drainage channel 16, and a drainage hole is formed in one side, facing the inside of the sub-groove 1, of the drainage block 15.

The liquid medicine in the mother tank flows into the sub tank 1 through the water inlet 14 of the water injection block 12 by utilizing the water pump, so that the liquid medicine in the mother tank and the liquid medicine in the sub tank 1 are fully circulated.

Referring to fig. 3, a notch communicated with the through hole 11 is formed in the sub-tank 1, a water baffle 17 is slidably connected to the notch of the sub-tank 1, and the water baffle 17 slides vertically, so that the electroplating piece 5 with different thicknesses can be adapted, and meanwhile, the water level in the sub-tank 1 can be controlled, so that the electroplating piece 5 and the bottom of the upper anode basket 3 are immersed in liquid medicine.

In order to reduce the possibility of damage to the plating sheet 5 due to friction between the water baffle 17 and the plating sheet 5, a gap exists between the water baffle 17 and the plating sheet 5, and the water baffle 17 can be fixed by friction with the subslot 1, so that the water baffle 17 is fixed above the plating sheet 5.

The water baffle 17 reduces the aperture size of the liquid medicine flowing out of the sub tank 1, so that the speed of leading the liquid medicine in the main tank into the sub tank 1 through the water injection block 12 is higher than the speed of flowing out of the liquid medicine in the sub tank 1, and the liquid level of the liquid medicine in the sub tank 1 is higher than that of the liquid medicine in the main tank, thereby ensuring that the liquid medicine in the sub tank 1 always submerges the bottom of the electroplating sheet 5 and the upper anode basket 3.

The supporting groove 18 is formed in the drainage block 15 in the sub groove 1, the supporting grooves 18 are lapped with the supporting plates 6, the two supporting plates 6 are arranged in parallel, and the length direction of the supporting plates 6 is perpendicular to the feeding direction of the electroplating sheet 5.

Referring to fig. 5, in an alternative embodiment, both sides of the lower anode basket 2 are upwardly extended with side anode baskets 7, respectively, and the two side anode baskets 7 communicate with the lower anode basket 2, and the sub-tank 1 is surrounded by the two side anode baskets 7 and the lower anode basket 2. The side anode basket 7 is communicated with the lower anode basket 2, so that nickel cakes are convenient to add, the storage quantity of the nickel cakes is larger, and the number of times of adding the nickel cakes is reduced. In other embodiments, the lower anode basket 2 may not have a side anode basket 7 or only have a side anode basket 7 on one side

Referring to fig. 3, conductive fixing pieces 71 are fixedly connected to both sides of the side anode basket 7, the conductive fixing pieces 71 are lapped on the conductive connecting strips 4 and fixedly connected with the conductive connecting strips 4, the conductive connecting strips 4 are lapped on the water injection block 12, and the side anode basket 7 and the lower anode basket 2 are synchronously electrified by electrifying the conductive connecting strips 4.

Referring to fig. 5, the bottom of the lower anode basket 2 is arc-shaped, and the opening of the lower anode basket 2 is arc-shaped toward the inside of the lower anode basket 2, so that the nickel cake residues after the electrolysis of the lower anode basket 2 and the side anode basket 7 fall into the arc bottom of the lower anode basket 2.

The middle part of the lower anode basket 2 is provided with a cleaning opening 21, the side wall of the cleaning opening 21 is fixedly connected with a lapping plate 22, the lapping plate 22 is lapped with a titanium screen plate 23, and nickel cake residues deposited at the bottom of the lower anode basket 2 are cleaned by detaching the titanium screen plate 23.

Referring to fig. 3 and 7, fixing pieces 24 are fixedly connected to two sides of the lower anode basket 2 along the length direction of the electroplating sheet 5, the fixing pieces 24 are used for fixedly connecting the lower anode basket 2 with the sub-tank 1, in this embodiment, the fixing pieces 24 are fixing strips, the fixing strips are arranged in an L-shaped manner on the cross section perpendicular to the extending direction of the fixing strips, and the lower anode basket 2 and the sub-tank 1 are welded through the fixing strips, so that the fixing among the sub-tank 1, the lower anode basket 2 and the side anode basket 7 is realized. Of course, the fixing member 24 may be provided as a plurality of separate fixing blocks in other embodiments.

Four supporting legs 31 are fixedly connected to the upper anode basket 3, and the four supporting legs 31 are correspondingly lapped on the four conductive fixing pieces 71 one by one, so that the upper anode basket 3 is electrically connected with the conductive connecting strips 4; so that the upper anode basket 3, the two side anode baskets 7 and the lower anode basket 2 are simultaneously energized by energizing the conductive connection bars 4.

Each leg 31 is fixedly connected to a corresponding conductive fixing member 71 to enhance the stability of the upper anode basket 3 fixed to the sub-tank 1. In this embodiment, the conductive fixing members 71 on both sides of each side anode basket 7 are fixedly connected with the legs 31, and the bent portions of the legs 31 are abutted against the side walls of the side anode basket 7, so that the upper anode basket 3 can be restrained in the length direction of the plating sheet 5. Of course, the support legs 31 may be spaced from the side anode basket 7.

Fixedly connected with locating part 32 on the stabilizer blade 31, the locating part 32 includes two spacing pieces 33 along vertical setting, and two spacing pieces 33 carry out the centre gripping with the lateral wall of sub tank 1 for when fixing the stabilizer blade 31 of going up positive pole basket 3, the spacing piece 33 can fix a position the position of going up positive pole basket 3 fast, thereby is convenient for fix four stabilizer blades 31 of going up positive pole basket 3.

In another alternative embodiment, the support legs 31 may not be provided with a limiting member 32, and two support legs 31 located at two sides of the anode basket 7 at the same side are propped against the same side of the sub-tank 1, and two opposite side surfaces of the sub-tank 1 are propped against the support legs 31, so that the upper anode basket 3 can be limited in the width direction of the electroplating sheet 5.

The implementation principle of the high-film-thickness electroplating anode conductive structure for continuously plating the nickel layer of the lead frame of the IC in a roll-to-roll manner is as follows: the plating sheet 5 is inserted into the sub-tank 1, then a nickel cake is added into the upper anode and the side anode basket 7, and then a liquid medicine is injected into the water inlet 14, so that the liquid medicine completely submerges the plating sheet 5 and submerges the bottom of the upper anode basket 3.

Then, the conductive connecting strip 4 is connected with anode electricity, the electroplating sheet 5 is connected with cathode electricity, and current passes through each surface of the electroplating sheet 5, so that the current direction of each surface of the electroplating sheet 5 can be perpendicular to the electroplating sheet 5, the conductive area of the electroplating sheet 5 is increased, the conductive resistance of electroplating a high-film-thickness product is reduced, the possibility of burning the electroplating sheet 5 by current is reduced, and the quality of the high-film-thickness product is improved.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims (10)

1. A roll-to-roll continuous plating IC lead frame nickel layer high film thickness electroplating anode conductive structure, comprising:

the secondary groove (1), the secondary groove (1) is used for being placed in the mother groove, and a through hole (11) for the electroplating sheet (5) extending along the horizontal direction to pass through is formed in the secondary groove (1);

the lower anode basket (2) is arranged at the bottom of the sub-groove (1), and the lower anode basket (2) is used for containing nickel cakes;

the upper anode basket (3) is arranged at the opening of the sub-tank (1), the bottom of the upper anode basket (3) is positioned in the sub-tank (1), and the upper anode basket (3) is used for containing nickel cakes;

the conductive connecting strip (4) is arranged on one side of the subslot (1), the lower anode basket (2) and the upper anode basket (3) are electrically connected to the conductive connecting strip (4), and the conductive connecting strip (4) is used for being electrically connected with a power anode.

2. The roll-to-roll continuous plating IC leadframe nickel layer high film thickness electroplating anode conductive structure of claim 1, wherein: at least one side of the lower anode basket (2) upwards extends to form a side anode basket (7), a conductive fixing piece (71) is fixedly connected to the side anode basket (7), and the conductive fixing piece (71) is used for being electrically connected with the conductive connecting strip (4).

3. The roll-to-roll continuous plating IC leadframe nickel layer high film thickness electroplating anode conductive structure of claim 2, wherein: the upper anode basket (3) is fixedly connected with a supporting leg (31), the supporting leg (31) is bent, the bent part of the supporting leg (31) is abutted to the side wall of the side anode basket (7), and the supporting leg (31) is electrically connected with the conductive connecting strip (4).

4. The roll-to-roll continuous plating IC leadframe nickel layer high film thickness electroplating anode conductive structure of claim 2, wherein: the bottom of lower positive pole basket (2) is convex setting, the convex opening in bottom of lower positive pole basket (2) is towards the inside of lower positive pole basket (2), cleaning port (21) have been seted up on lower positive pole basket (2), demountable installation has titanium otter board (23) on cleaning port (21).

5. The roll-to-roll continuous plating IC leadframe nickel layer high film thickness electroplating anode conductive structure of claim 1, wherein: and a fixing piece (24) is fixedly connected to the lower anode basket (2), and the fixing piece (24) is used for being fixedly connected with the sub-tank (1).

6. The roll-to-roll continuous plating IC leadframe nickel layer high film thickness electroplating anode conductive structure of claim 1, wherein: the support groove (18) is formed in the sub groove (1), the support groove (18) is internally overlapped with the support plate (6), and the support plate (6) is used for supporting the upper anode basket (3).

7. The roll-to-roll continuous plating IC leadframe nickel layer high film thickness anode conductive structure of claim 6, wherein: the upper anode basket (3) is fixedly connected with a limiting piece (32), the limiting piece (32) is clamped on the side wall of the sub-groove (1), and the limiting piece (32) is used for limiting the upper anode basket (3).

8. The roll-to-roll continuous plating IC leadframe nickel layer high film thickness electroplating anode conductive structure of claim 1, wherein: the drainage device is characterized in that a drainage block (15) is fixedly connected in the sub-groove (1), a drainage channel (16) is formed in the drainage block (15), and the drainage channel (16) is used for communicating the sub-groove (1) with the main groove.

9. The roll-to-roll continuous plating IC leadframe nickel layer high film thickness plating anode conductive structure of claim 8, wherein: the water injection device is characterized in that water injection blocks (12) are fixedly connected to two sides of the sub-groove (1), water injection channels (13) are formed in the water injection blocks (12), water inlets (14) of the water injection channels (13) are formed in the bottoms of the water injection blocks (12), and the water injection channels (13) are communicated with the drainage channels (16).

10. The roll-to-roll continuous nickel layer high film thickness plated anode conductive structure of an IC leadframe according to any one of claims 1-9, wherein: the side wall of the sub groove (1) is connected with a water baffle (17) in a sliding manner along the vertical direction, and the water baffle (17) is positioned above the electroplating sheet (5).