CN112813486A - PCB electroplating floating frame - Google Patents
PCB electroplating floating frame Download PDFInfo
- Publication number
- CN112813486A CN112813486A CN202011612873.XA CN202011612873A CN112813486A CN 112813486 A CN112813486 A CN 112813486A CN 202011612873 A CN202011612873 A CN 202011612873A CN 112813486 A CN112813486 A CN 112813486A
- Authority
- CN
- China
- Prior art keywords
- baffle
- bottom plate
- floating frame
- electroplating
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of circuit board processing equipment, in particular to a PCB electroplating floating frame. A PCB electroplating floating frame comprises side plates, a bottom plate, a bottom, a connecting block and a baffle plate. Be close to all being provided with the baffle between the connecting block with one side of the panel, the baffle is "V" shape symmetry setting in the bottom plate both sides, form an holding tank between the baffle, electroplate the board bottom and place in the holding tank, it is low mutually with holding tank both sides limit, it electroplates to put into the plating bath with whole floating frame, the electroplating process, it shields to set up "V" type in floating frame bottom, can restrain electric current bottom cross flow, thereby make PCB board bottom electroplate copper layer problem on the throne that is thick partially improve, the quality hidden danger that produces the clamp membrane has been eliminated.
Description
Technical Field
The invention relates to the technical field of circuit board processing equipment, in particular to a PCB electroplating floating frame.
Background
In the process of processing the circuit board, electroplating is often performed on the board surface of the circuit board substrate and in the conductive holes of the substrate to form metal layers on the board surface of the substrate and the sidewalls of the conductive holes, so how to perform electroplating becomes a hot point of research.
In the prior art, an electroplating device is often adopted to electroplate a substrate of a circuit board; the electroplating device comprises an electroplating bath and an electroplating floating frame, the electroplating floating frame comprises a floating strip and a stop plate, the floating strip is provided with a containing groove, and the stop plate is arranged at the bottom of the containing groove. During electroplating, the bottom end of the substrate of the circuit board is arranged in the accommodating groove, the bottom end of the substrate abuts against the stop plate, and then the electroplating floating frame and the circuit board are hung in the electroplating bath; the electroplating bath is provided with electroplating solution to electroplate the substrate of the circuit board, and metal layers are formed on two side surfaces of the substrate and the side walls of the conductive holes on the substrate so as to complete the electroplating of the substrate of the circuit board.
However, the floating frame in the prior art has larger buoyancy, so that the acting force of the PCB and the floating frame is larger, the friction between the PCB and the floating frame is increased, and the electroplating quality and effect of the PCB are influenced; meanwhile, current channeling occurs at the bottom of the floating frame in the electroplating process, so that the thickness of copper plated at the bottom of the PCB is too thick, and the potential quality hazard of film clamping is caused.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the PCB electroplating floating frame, the V-shaped shield is arranged at the bottom of the floating frame, the current bottom channeling can be inhibited, and the problem of the excessive thickness of the electroplated copper layer at the bottom of the PCB is improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a PCB electroplating floating frame, comprising:
the two side plates are arranged symmetrically at intervals;
the bottom plate is arranged between the side plates, the bottom plate is positioned at the bottom between the side plates, and the distance between two side edges of the bottom plate and the side plates on the same side of the bottom plate is the same;
the connecting blocks are symmetrically and uniformly arranged on the bottom plate at intervals, and one side of each connecting block, which is far away from the bottom plate, is connected with the corresponding side plate;
the baffle is close to same curb plate one side all be provided with between the connecting block the baffle, the baffle is "V" shape symmetry and sets up the bottom plate both sides, form an holding tank between the baffle.
Further, all be provided with first strengthening rib between the baffle, first strengthening rib one side all with the curb plate links to each other.
Furthermore, the baffle of tip deviate from both sides with all be provided with between the bottom plate the second strengthening rib
Further, the thickness of the baffle plate is 50 mm.
The invention has the beneficial effects that: 1. be close to all being provided with the baffle between the connecting block with one side of the panel, the baffle is "V" shape symmetry setting in the bottom plate both sides, form an holding tank between the baffle, electroplate the board bottom and place in the holding tank, it is low mutually with holding tank both sides limit, it electroplates to put into the plating bath with whole floating frame, the electroplating process, it shields to set up "V" type in floating frame bottom, can restrain electric current bottom cross flow, thereby make PCB board bottom electroplate copper layer problem on the throne that is thick partially improve, the quality hidden danger that produces the clamp membrane has been eliminated.
2. Be provided with the bottom plate between the curb plate, the bottom plate is located between the curb plate, and the bottom plate both sides limit is the same with the distance between the curb plate of its homonymy, compares in the great superficial strip of prior art volume, and the interval structure buoyancy of bottom plate and curb plate is littleer, reduces the effort between PCB board and the floating frame to reduce the friction of PCB board and floating frame, make the quality and the effect of PCB board electroplating better.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a front view of the present invention.
Wherein the figures include the following reference numerals: 01. electroplating plate, 1, curb plate, 2, bottom plate, 3, connecting block, 4, first strengthening rib, 5, second strengthening rib, 6, baffle.
Detailed Description
The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which presently preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for completeness and fully convey the scope of the invention to the skilled person.
As shown in fig. 1-2, a PCB electroplating floating frame comprises two side plates 1, a bottom plate 2, a bottom, a connecting block 3 and a baffle 6, wherein the two side plates 1 are symmetrically arranged at intervals; the bottom plate 2 is arranged between the side plates 1, the bottom plate 2 is positioned between the side plates 1, the distance between two side edges of the bottom plate 2 and the side plates 1 on the same side is the same, compared with a floating strip with larger volume in the prior art, the floating strip has smaller space structure buoyancy between the bottom plate 2 and the side plates 1, and the acting force between the PCB and the floating frame is reduced, so that the friction between the PCB and the floating frame is reduced, and the electroplating quality and effect of the PCB are better; the connecting blocks 3 are symmetrically and uniformly arranged on the bottom plate 2 at intervals, and one sides of the connecting blocks 3 away from the bottom plate 2 are connected with the corresponding side plates 1; all be provided with baffle 6 between being close to connecting block 3 with 1 one side of curb plate, baffle 6 is "V" shape symmetry and sets up in 2 both sides of bottom plate, form an holding tank between the baffle 6, it places in the holding tank to electroplate 01 bottom of board, it is low mutually with holding tank both sides limit, electroplate in putting into the plating bath with whole floating frame, among the electroplating process, it shields to set up "V" type in floating frame bottom, can the bottom cross flow of suppression electric current, thereby make PCB board bottom copper electroplating layer partial thickness problem improve, the quality hidden danger that produces the clamp film has been eliminated.
The test comparison results are as follows:
test results before the absence of the baffle
Test results with the baffle
Further, all be provided with first strengthening rib 4 between baffle 6, first strengthening rib 4 one side all links to each other with curb plate 1, has strengthened the structural stability between baffle 6 and the structural strength of whole floating frame.
Further, baffle 6 of tip deviates from all to be provided with second strengthening rib 5 between both sides and the bottom plate 2, has further strengthened the structural stability of baffle 6 and the structural strength of whole floating frame
Further, the thickness of the baffle 6 is 50 mm.
The above examples are merely representative of preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, various changes, modifications and substitutions can be made without departing from the spirit of the present invention, and these are all within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (4)
1. A PCB electroplating floating frame comprises:
the two side plates are arranged symmetrically at intervals;
the bottom plate is arranged between the side plates, the bottom plate is positioned at the bottom between the side plates, and the distance between two side edges of the bottom plate and the side plates on the same side of the bottom plate is the same;
the connecting blocks are symmetrically and uniformly arranged on the bottom plate at intervals, and one side of each connecting block, which is far away from the bottom plate, is connected with the corresponding side plate;
the baffle is close to same curb plate one side all be provided with between the connecting block the baffle, the baffle is "V" shape symmetry and sets up the bottom plate both sides, form an holding tank between the baffle.
2. A PCB electroplating float according to claim 1, wherein:
all be provided with first strengthening rib between the baffle, first strengthening rib one side all with the curb plate links to each other.
3. A PCB electroplating float according to claim 1, wherein:
the baffle of tip deviate from both sides with all be provided with between the bottom plate the second strengthening rib.
4. A PCB electroplating float according to claim 1, wherein:
the thickness of the baffle plate is 50 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011612873.XA CN112813486A (en) | 2020-12-30 | 2020-12-30 | PCB electroplating floating frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011612873.XA CN112813486A (en) | 2020-12-30 | 2020-12-30 | PCB electroplating floating frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112813486A true CN112813486A (en) | 2021-05-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011612873.XA Pending CN112813486A (en) | 2020-12-30 | 2020-12-30 | PCB electroplating floating frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112813486A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201801625U (en) * | 2010-09-10 | 2011-04-20 | 陈中和 | Structure of galvanization floating bed |
| CN202744647U (en) * | 2012-04-12 | 2013-02-20 | 竞铭机械股份有限公司 | Floating type cathode shielding plate |
| CN203814047U (en) * | 2014-04-10 | 2014-09-03 | 深圳市迅捷兴电路技术有限公司 | Electroplating floating frame |
| CN204162822U (en) * | 2014-10-21 | 2015-02-18 | 深圳市迅捷兴电路技术有限公司 | Electroplating cathode shield and plating tank |
| CN204281879U (en) * | 2014-11-28 | 2015-04-22 | 涟水县苏杭科技有限公司 | A kind of scaffold of wiring board copper plating device |
| CN205710980U (en) * | 2016-06-22 | 2016-11-23 | 苏州翔邦达机电有限公司 | It is applicable to the scaffold system of pcb board plating |
| CN206529538U (en) * | 2017-02-27 | 2017-09-29 | 东莞同昌电子有限公司 | Circuit board electroplating scaffold |
| CN209906918U (en) * | 2019-04-28 | 2020-01-07 | 邑升顺电子(深圳)有限公司 | PCB electroplating floating frame |
-
2020
- 2020-12-30 CN CN202011612873.XA patent/CN112813486A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201801625U (en) * | 2010-09-10 | 2011-04-20 | 陈中和 | Structure of galvanization floating bed |
| CN202744647U (en) * | 2012-04-12 | 2013-02-20 | 竞铭机械股份有限公司 | Floating type cathode shielding plate |
| CN203814047U (en) * | 2014-04-10 | 2014-09-03 | 深圳市迅捷兴电路技术有限公司 | Electroplating floating frame |
| CN204162822U (en) * | 2014-10-21 | 2015-02-18 | 深圳市迅捷兴电路技术有限公司 | Electroplating cathode shield and plating tank |
| CN204281879U (en) * | 2014-11-28 | 2015-04-22 | 涟水县苏杭科技有限公司 | A kind of scaffold of wiring board copper plating device |
| CN205710980U (en) * | 2016-06-22 | 2016-11-23 | 苏州翔邦达机电有限公司 | It is applicable to the scaffold system of pcb board plating |
| CN206529538U (en) * | 2017-02-27 | 2017-09-29 | 东莞同昌电子有限公司 | Circuit board electroplating scaffold |
| CN209906918U (en) * | 2019-04-28 | 2020-01-07 | 邑升顺电子(深圳)有限公司 | PCB electroplating floating frame |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210518 |