CN219276871U - Diamond metal composite structure and heat conducting fin - Google Patents
Diamond metal composite structure and heat conducting fin Download PDFInfo
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Abstract
The application relates to the technical field of heat conducting materials, in particular to a diamond metal composite structure and a heat conducting sheet. The diamond metal composite structure comprises a composite layer, wherein the composite layer comprises a diamond layer and a metal composite layer, the diamond layer is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise diamond particles and a metallization layer; the metal composite layer is arranged outside the diamond layer and is used for filling gaps and vacancies between the diamond core-shell structures. The diamond metal composite structure of this application is the composite layer, and every layer diamond layer is by a plurality of size homogeneity, the square crystal diamond core-shell structure of shape unanimity through close-packed arrangement formation, and this close pile ensures that individual layer diamond volume ratio maximize, and the effect of metallization layer and metal composite layer is in the thermal resistance between the minimum reduction diamond. The diamond layers with the same or different thickness are connected through the metal composite layer in a hot pressing mode to form the target size and shape, and the technology can obtain the high-heat-conductivity material in a low-cost and easy-processing mode.
Description
Technical Field
The application relates to the technical field of heat conducting materials, in particular to a diamond metal composite structure and a heat conducting sheet.
Background
High thermal conductivity materials are an important support for the development of high power components (particularly high frequency or high power chips) in the electronic industry at present. The heat conductivity of copper alloy and aluminum alloy commonly used in the current market is approximately below 100W/m.K, and is preferably about 850W/m.K or higher to meet the temperature control of high-power devices.
Diamond is the substance with the highest heat conductivity in nature, has a heat conductivity of 2200 to 2600W/(m·k) at normal temperature, has a thermal expansion coefficient of about 0.86×10-6/K, and is an insulator at room temperature. The metal copper has high heat conductivity, low price and easy processing, is the most commonly used packaging material, has the heat conductivity of 386W/(m.K) and the thermal expansion coefficient of 17 multiplied by 10 < -6 >/K, meets the service performance requirements of the electronic packaging substrate material for low thermal expansion coefficient and high heat conductivity, and has the current heat conductivity requirement reaching 800W/(m.K) which is higher than the performance limit of copper. Diamond is a good heat conducting material, but because diamond (including re-synthesized polycrystalline diamond, etc.) is difficult to process by itself, it cannot meet the shape requirements of the heat conducting strip. The diamond and metal copper or silver composite structure technology provided by the application can realize easy-processing high-heat-conductivity materials with low cost.
Disclosure of Invention
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and drawings hereof.
The purpose of the application is to overcome the defects and provide a diamond metal composite structure and a heat conducting fin. The diamond composite structure comprises a composite layer formed by a diamond layer and a metal composite layer, wherein the diamond layer is formed by closely stacking a plurality of diamond core-shell structures, the diamond core-shell structures comprise diamond particles and a metallized layer coated outside the diamond particles, and the metal composite layer is molten when diamond and metal are compounded due to the fact that the melting point of the metallized layer is higher than that of the metal composite layer, but the metallized layer is not molten, and good wetting between the diamond and the metal composite layer is formed through overformation of the metallized layer. In addition, the metal composite layer can fill gaps and vacant positions between the diamond core-shell structures in the melting process, so that the diamond metal composite structure is more tightly attached and stable, and meanwhile, the heat conductivity of the metal heat conducting strip can be greatly improved.
In a first aspect, the present application provides a diamond metal composite structure comprising a composite layer comprising
The diamond layer is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise diamond particles and a metallization layer coated outside the diamond particles;
and the metal composite layer is arranged outside the diamond layer and is used for filling gaps and vacancies between the diamond core-shell structures.
The diamond metal composite structure of this application is layered structure, and the composite layer promptly, and this composite layer includes diamond layer and metal composite layer, and wherein, the diamond layer is by a plurality of diamond core-shell structure through close-packed formation of arranging for diamond core-shell structure in the diamond layer arranges orderly and closely, and the volume ratio of diamond in the composite layer is improved to the at utmost. In addition, the diamond core-shell structure takes diamond particles as an inner core and a metallization layer as an outer shell, and the metallization layer is taken as a transition layer of the diamond inner core and the metal composite layer, so that the wetting angle between diamond and the metal composite layer is greatly reduced, the interface thermal resistance of the diamond-metal composite layer is reduced, and the aim of maximally improving the thermal conductivity of the composite structure is achieved by combining a large proportion of diamond volume ratio.
In some embodiments, the volume ratio of the diamond layer to the metal composite layer is 7-9.5:3-0.5. According to the diamond metal composite structure, the shape and the size of the diamond are reasonably selected, the arrangement optimization is performed, the proportion of the diamond is improved by the maximum proportion, and the thermal conductivity of the diamond metal composite structure is greatly improved by using the diamond surface metallization and the copper/silver simple substance as the connecting layer.
In some embodiments, the metallized layer has a melting point that is higher than the melting point of the metal composite layer. The diamond-metal composite layer is high in melting point, low in melting point and used as a metal composite layer, and when diamond and metal are compounded, the metal composite layer can be melted, but the metal layer cannot be melted, and the structure reduces an originally larger wetting angle between the diamond and the metal. In addition, the metal composite layer can fill gaps and vacant positions between the diamond core-shell structures in the melting process, so that the thermal resistance of each part of the diamond metal composite structure is reduced, and meanwhile, the thermal conductivity of the metal heat conducting strip can be greatly improved.
In some embodiments, the volume ratio of the diamond layer to the metal composite layer is 7-9.5:3-0.5; the melting point of the metallization layer is higher than that of the metal composite layer. According to the diamond-metal composite layer, the volume ratio between the diamond layer and the metal composite layer is reasonably set, the metal composite layer with high melting point and low melting point is selected as the metal composite layer, when diamond and metal are compounded, the metal composite layer can be melted, but the metal composite layer cannot be melted, and the structure reduces an original larger wetting angle between the diamond and the metal. In addition, the metal composite layer can fill gaps and vacant positions between the diamond core-shell structures in the melting process, so that the thermal resistance of each part of the diamond metal composite structure is reduced, and meanwhile, the thermal conductivity of the metal heat conducting strip can be greatly improved.
In some embodiments, the diamond is a square crystal diamond. According to the diamond packing device, diamond is formed into square crystals, so that the diamond can be easily distributed into a two-dimensional close-packed structure, and meanwhile the volume occupation ratio of the diamond can be maximized.
In some embodiments, the metallization layer is a titanium layer, a copper layer, or an iron layer; the metal composite layer is a copper layer or a silver layer. Because the heat conductivity of the simple metal part is close to the theoretical heat conductivity of the original metal, the metallized layer is set to be a simple titanium layer, a copper layer or an iron layer, and the metal composite layer is set to be a simple copper layer or a silver layer, so that the highest heat conductivity is ensured on the premise that the metal crystals are good during hot-pressed sintering.
In some embodiments, the diamond particles have a particle size of 25 μm to 600 μm. According to the diamond volume ratio maximizing method, the particle size of the diamond particles is set to be 25-600 microns, and diamond layers with different sizes are selected according to the size and shape of a target part, so that the volume ratio of the diamond is maximized.
In some embodiments, the metallization layer has a thickness of 1-3nm. The thickness of the metallization layer is set to be 1-3nm, and the diamond is metallized in advance to reduce the wetting angle between the diamond and the metal composite layer, so that the interface thermal resistance is reduced.
In a second aspect, the present application provides a diamond-metal composite thermally conductive sheet comprising a plurality of diamond-metal composite structures, the diamond-metal composite structures comprising a composite layer comprising
The diamond layer is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise diamond particles and a metallization layer coated outside the diamond particles;
and the metal composite layer is arranged outside the diamond layer and is used for filling gaps and vacancies between the diamond core-shell structures and playing a role in thermal connection.
The diamond metal composite heat conducting sheet is composed of a plurality of diamond metal composite structures, the diamond composite structures comprise composite layers which are composed of diamond layers and metal composite layers, wherein the diamond layers are formed by closely stacking a plurality of diamond core-shell structures, the diamond core-shell structures comprise diamond particles and metallized layers which are coated outside the diamond particles, and the metal composite layers are molten when diamond and metal are compounded due to the fact that the melting point of the metallized layers is higher than that of the metal composite layers, but the metallized layers are not molten, and therefore the composite yield of diamond metal can be greatly improved. In addition, the metal composite layer can fill gaps and vacant positions between the diamond core-shell structures in the melting process, so that the diamond metal composite structure is more tightly attached and stable, and meanwhile, the heat conductivity of the metal heat conducting strip can be greatly improved.
In some embodiments, the composite thermally conductive sheet has a thermal diffusion coefficient of 400 square meters per second to 550 square meters per second.
In some embodiments, the thermal conductivity of the composite thermal conductive sheet is 850W/(m×k) to 1000W/(m×k).
Through adopting foretell technical scheme, the beneficial effect of this application is:
the diamond metal composite structure of this application is the composite bed, and the composite bed includes diamond layer and metal composite layer, and every layer of diamond layer is by a plurality of size homogeneity, the square crystal diamond core-shell structure of shape unanimity through close-packed arrangement formation, and this close heap ensures that individual layer diamond volume ratio is maximized, and the effect of metallization layer and metal composite layer is in reducing the thermal resistance between the diamond as far as possible. The diamond layers with the same or different thickness are connected through the metal composite layer in a hot pressing mode to form the target size and shape, and the technology can obtain the high-heat-conductivity material in a low-cost and easy-processing mode. In addition, the diamond core-shell structure takes diamond particles as an inner core and a metallization layer as an outer shell, the metallization layer can play a role in protecting the diamond particles, and the metallization layer can be tightly attached to the combination of the metal composite layer, so that the diamond metal composite structure is more compact, and the interface thermal resistance is reduced.
According to the diamond metal composite layer, the volume ratio between the diamond layer and the metal composite layer is reasonably set, the metal composite layer with a high melting point and a low melting point is selected as the metal composite layer, and when diamond and metal are compounded, the metal composite layer is molten, but the metal composite layer is not molten, so that the composite heat conductivity of diamond metal is greatly improved. In addition, the metal composite layer can fill gaps and vacant positions between the diamond core-shell structures in the melting process, so that the diamond metal composite structure is more tightly attached and stable, and meanwhile, the heat conductivity of the metal heat conducting strip can be greatly improved.
According to the method, the diamonds are arranged to be square-crystal diamonds, so that the diamonds can be distributed in the same-direction close-packed mode on the three-dimensional direction, and the diamonds are generally distributed into the close-packed mode on the two-dimensional plane first and then stacked into the three-dimensional close-packed mode.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
It is apparent that such objects and other objects of the present application will become more apparent from the following detailed description of the preferred embodiments, which is to be read in connection with the accompanying drawings and figures.
The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular description of the preferred embodiments, as illustrated in the accompanying drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate the application and together with the description serve to explain the embodiment of the application, and do not constitute a limitation of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only one or several embodiments of the present application, and other drawings can be obtained according to such drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic illustration of a diamond-metal composite structure according to some embodiments of the present application;
fig. 2 is a schematic structural view of a diamond-metal composite heat conductive sheet according to some embodiments of the present application.
Reference numerals:
1. a composite layer;
11. a diamond layer;
111. diamond particles; 112. a metallization layer;
12. a metal composite layer;
2. and (3) a composite heat conducting fin.
Detailed Description
The following will describe embodiments of the present application in detail with reference to the drawings and examples, thereby how to apply technical means to the present application to solve technical problems, and realizing the technical effects can be fully understood and implemented accordingly. It should be noted that, as long as no conflict exists, each embodiment and each feature in each embodiment in the present application may be combined with each other, and the formed technical solutions are all within the protection scope of the present application.
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details or in the specific manner described herein.
Referring to fig. 1, fig. 1 is a schematic view of a diamond-metal composite structure according to some embodiments of the present application.
According to some embodiments of the present application, a diamond-metal composite structure is provided. The diamond metal composite structure comprises a composite layer 1, the composite layer 1 comprising a diamond layer 11 and a metal composite layer 12. The diamond layer 11 is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise diamond particles 111 and a metallization layer 112 coated outside the diamond particles 111; the metal composite layer 12 is disposed outside the diamond layer 11 and is used to fill gaps and vacancies between diamond core-shell structures.
The close-packed arrangement refers to the close-packed arrangement of all crystal faces in the same direction in the three-dimensional direction, and specifically refers to the close-packed arrangement of two-dimensional planes which are firstly arranged and then stacked into the three-dimensional close-packed arrangement.
The diamond core-shell structure refers to the diamond particles 111 as the inner core and the metallization layer 112 as the outer shell.
The diamond metal composite structure of this application is layered structure, namely composite layer 1, and this composite layer 1 includes diamond layer 11 and metal composite layer 12, and wherein, diamond layer 11 is by a plurality of diamond core-shell structure through close packing arrangement formation for diamond core-shell structure in the diamond layer 11 arranges orderly and inseparable, and the volume ratio of diamond in composite layer 1 is improved to the at utmost. In addition, the diamond core-shell structure takes the diamond particles 111 as the inner core and the metallized layer 112 as the outer shell, and the metallized layer 112 is taken as the transition layer of the diamond inner core and the metal composite layer, so that the wetting angle between the diamond and the metal composite layer is greatly reduced, the interface thermal resistance of the diamond-metal composite layer is reduced, and the aim of maximally improving the thermal conductivity of the composite structure is achieved by combining a large proportion of diamond volume ratio.
According to some embodiments of the present application, optionally, the volume ratio of the diamond layer 11 to the metal composite layer 12 is 7-9.5:3-0.5. The volume ratio between the diamond layer 11 and the metal composite layer 12 is reasonably set, so that the heat conductivity of the diamond metal composite structure is greatly improved.
Optionally, according to some embodiments of the present application, the melting point of the metallization layer 112 is higher than the melting point of the metal composite layer 12. In the present application, the metal composite layer 12 having a high melting point is selected as the metal layer 112 and a low melting point is selected as the metal composite layer 12, and the metal composite layer 12 is melted when diamond is combined with metal, but the metal layer 112 is not melted, so that the composite yield of diamond metal is greatly improved. In addition, the metal composite layer 12 can fill gaps and vacant positions between the diamond core-shell structures in the melting process, so that the thermal resistance of each part of the diamond metal composite structure is reduced, and meanwhile, the thermal conductivity of the metal heat conducting sheet can be greatly improved.
According to some embodiments of the present application, optionally, the volume ratio of the diamond layer 11 to the metal composite layer 12 is 7-9.5:3-0.5; the melting point of the metallization layer 112 is higher than the melting point of the metal composite layer 12. By reasonably setting the volume ratio between the diamond layer 11 and the metal composite layer 12 and selecting the metal composite layer 12 with a high melting point as the metallization layer 112 and a low melting point as the metal composite layer 12, the metal composite layer 12 is melted but the metallization layer 112 is not melted during diamond and metal compounding, so that the compounding yield of diamond metal is greatly improved. In addition, the metal composite layer 12 can fill gaps and vacant positions between the diamond core-shell structures in the melting process, so that the thermal resistance of each part of the diamond metal composite structure is reduced, and meanwhile, the thermal conductivity of the metal heat conducting sheet can be greatly improved.
Optionally, according to some embodiments of the present application, the diamond is a diamond. According to the method, the diamonds are arranged to be square-crystal diamonds, so that the diamonds can be distributed in the same-direction close-packed mode on the three-dimensional direction, and the diamonds are generally distributed into the close-packed mode on the two-dimensional plane first and then stacked into the three-dimensional close-packed mode.
Optionally, the metallization layer 112 is a titanium layer, a copper layer, or an iron layer, according to some embodiments of the present application; the metal composite layer 12 is a copper layer or a silver layer. Since the thermal conductivity of the pure metal portion is close to the theoretical thermal conductivity of the original metal, the application sets the metallization layer 112 to be a pure titanium layer, a copper layer or an iron layer, and sets the metal composite layer 12 to be a pure copper layer or a silver layer, so that the highest thermal conductivity is ensured on the premise that the metal crystals are good during hot press sintering.
According to some embodiments of the present application, the diamond particles 111 may optionally have a particle size of 25 μm to 600 μm. The present application achieves the effect of maximizing the diamond ratio in order to meet different target thermally conductive sheet sizes by setting the particle diameter of the diamond particles 111 to 25 μm to 600 μm.
Further, the diamond particles 111 have a particle diameter of 300 μm to 500 μm.
Further, the diamond particles 111 have a particle diameter of 400 μm to 450 μm.
Optionally, the metallization layer 112 has a thickness of 1-3nm, according to some embodiments of the present application. The heat conduction function between the diamond particles 111 and the metallization layer 12 is greatly enhanced by setting the thickness of the metallization layer 112 to 1-3nm.
Further, the thickness of the metallization layer 112 is 2nm.
Referring to fig. 2, fig. 2 is a schematic structural view of a diamond-metal composite heat conductive sheet according to some embodiments of the present application.
According to some embodiments of the present application, there is provided a diamond metal composite heat conductive sheet 2. The composite heat conductive sheet 2 includes a plurality of diamond metal composite structures including a composite layer 1.
The composite layer 1 comprises a diamond layer 11 and a metal composite layer 12, wherein the metal composite layer 12 is positioned outside the diamond layer 11.
The diamond layer 11 is formed by closely packing a plurality of diamond core-shell structures. The diamond core-shell structure comprises diamond particles 111 and a metallization layer 112 coating the diamond particles 111, in other words, the diamond core-shell structure takes the diamond particles 111 as an inner core and the metallization layer 112 as an outer shell.
The metal composite layer 12 is used for filling gaps and vacancies between the diamond core-shell structures, in other words, the metal composite layer 12 is located outside the diamond core-shell structures or/and at gaps and vacancies between the diamond core-shell structures, and plays a role in thermal connection.
The diamond metal composite heat conducting fin 2 is composed of a plurality of diamond metal composite structures, the diamond composite structures comprise a composite layer 1 which is composed of a diamond layer 11 and a metal composite layer 12, wherein the diamond layer 11 is formed by closely stacking a plurality of diamond core-shell structures, the diamond core-shell structures comprise diamond particles 111 and a metallized layer 112 which is coated outside the diamond particles 111, and the metal composite layer 12 is molten when diamond and metal are compounded due to the fact that the melting point of the metallized layer 112 is higher than that of the metal composite layer 12, but the metallized layer 112 is not molten, and therefore the composite heat conductivity of diamond metal is greatly improved. In addition, the metal composite layer 12 can fill gaps and vacant positions between the diamond core-shell structures in the melting process, a close-packed structure of the diamond in the composite structure in the three-dimensional direction is formed in the process, and meanwhile, the heat conductivity of the metal heat conducting strip can be greatly improved.
According to some embodiments of the present application, the thermal diffusion coefficient of the composite thermal conductive sheet 2 is optionally 400 square meters/s to 550 square meters/s. According to some embodiments of the present application, the thermal conductivity of the composite thermal conductive sheet 2 is optionally 800W/(m×k) to 1000W/(m×k).
Example 1
Referring to fig. 1, fig. 1 is a schematic view of a diamond-metal composite structure according to some embodiments of the present application. The embodiment provides a diamond metal composite structure.
The diamond-metal composite structure comprises a composite layer 1, wherein the composite layer 1 comprises a diamond layer 11 and a metal composite layer 12 in a volume ratio of 7:3. Wherein, the liquid crystal display device comprises a liquid crystal display device,
the diamond layer 11 is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise square crystal diamond particles 111 and a titanium layer coated outside the diamond particles 111.
The metal composite layer 12 is disposed outside the diamond layer 11 and is used to fill gaps and vacancies between diamond core-shell structures. The metal composite layer 12 is a copper layer.
The melting point of the titanium layer is higher than the melting point of the metal composite layer 12.
Example 2
Referring to fig. 1, fig. 1 is a schematic view of a diamond-metal composite structure according to some embodiments of the present application. The embodiment provides a diamond metal composite structure.
The diamond-metal composite structure comprises a composite layer 1, wherein the composite layer 1 comprises a diamond layer 11 and a metal composite layer 12 in a volume ratio of 8:2. Wherein, the liquid crystal display device comprises a liquid crystal display device,
the diamond layer 11 is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise square crystal diamond particles 111 and copper layers coated outside the diamond particles 111.
The metal composite layer 12 is disposed outside the diamond layer 11 and is used to fill gaps and vacancies between diamond core-shell structures. The metal composite layer 12 is a silver layer.
The copper layer has a melting point higher than that of the metal composite layer 12.
Example 3
Referring to fig. 1, fig. 1 is a schematic view of a diamond-metal composite structure according to some embodiments of the present application. The embodiment provides a diamond metal composite structure.
The diamond metal composite structure comprises a composite layer 1, wherein the composite layer 1 comprises a diamond layer 11 and a metal composite layer 12 in a volume ratio of 9:1. Wherein, the liquid crystal display device comprises a liquid crystal display device,
the diamond layer 11 is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise square crystal diamond particles 111 and an iron layer coated outside the diamond particles 111.
The metal composite layer 12 is disposed outside the diamond layer 11 and is used to fill gaps and vacancies between diamond core-shell structures. The metal composite layer 12 is a copper layer.
The melting point of the iron layer is higher than the melting point of the metal composite layer 12.
Example 4
Referring to fig. 2, fig. 2 is a schematic structural view of a diamond-metal composite heat conductive sheet according to some embodiments of the present application. The present embodiment provides a diamond metal composite heat conductive sheet 2.
The composite heat conductive sheet 2 includes a plurality of diamond metal composite structures including a composite layer 1.
The composite layer 1 comprises a diamond layer 11 and a metal composite layer 12, wherein the metal composite layer 12 is positioned outside the diamond layer 11.
The diamond layer 11 is formed by closely packing a plurality of diamond core-shell structures. The diamond core-shell structure comprises diamond particles 111 and a metallization layer 112 coating the diamond particles 111, in other words, the diamond core-shell structure takes the diamond particles 111 as an inner core and the metallization layer 112 as an outer shell.
The metal composite layer 12 is used for filling gaps and vacancies between the diamond core-shell structures, in other words, the metal composite layer 12 is located outside the diamond core-shell structures or/and at gaps and vacancies between the diamond core-shell structures.
It is to be understood that the embodiments disclosed herein are not limited to the particular process steps or materials disclosed herein, but are intended to extend to equivalents of such features as would be understood by one of ordinary skill in the relevant arts. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.
Reference in the specification to "an embodiment" means that a particular feature, or characteristic, described in connection with the embodiment is included in at least one embodiment of the application. Thus, appearances of the phrase or "an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment.
Furthermore, the described features or characteristics may be combined in any other suitable manner in one or more embodiments. In the above description, certain specific details are provided, such as thicknesses, numbers, etc., to provide a thorough understanding of embodiments of the present application. One skilled in the relevant art will recognize, however, that the application can be practiced without one or more of the specific details, or with other methods, components, materials, etc.
Claims (12)
1. A diamond-metal composite structure comprising a composite layer comprising
The diamond layer is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise diamond particles and a metallization layer coated outside the diamond particles;
and the metal composite layer is arranged outside the diamond layer and is used for filling gaps and vacancies between the diamond core-shell structures.
2. The diamond-metal composite structure according to claim 1, wherein the volume ratio of the diamond layer to the metal composite layer is 7-9.5:3-0.5.
3. The diamond-metal composite structure according to claim 1, wherein the metallized layer has a melting point higher than the metal composite layer.
4. The diamond-metal composite structure according to claim 1, wherein the volume ratio of the diamond layer to the metal composite layer is 7-9.5:3-0.5; the melting point of the metallization layer is higher than that of the metal composite layer.
5. The diamond-metal composite structure according to any one of claims 1 to 4, wherein the diamond is a square crystal diamond.
6. The diamond-metal composite structure according to any one of claims 1 to 4, wherein the metallization layer is a titanium layer, a copper layer or an iron layer; the metal composite layer is a copper layer or a silver layer.
7. The diamond-metal composite structure according to claim 5, wherein the metallization layer is a titanium layer, a copper layer, or an iron layer; the metal composite layer is a copper layer or a silver layer.
8. The diamond-metal composite structure according to any one of claims 1 to 4, wherein the diamond particles have a particle size of 25 μm to 600 μm.
9. The diamond-metal composite structure according to any one of claims 1 to 4, wherein the thickness of the metallization layer is 1 to 3nm.
10. The diamond metal composite heat conducting sheet is characterized by comprising a plurality of diamond metal composite structures, wherein the diamond metal composite structures comprise composite layers, and the composite layers comprise
The diamond layer is formed by closely stacking a plurality of diamond core-shell structures, and the diamond core-shell structures comprise diamond particles and a metallization layer coated outside the diamond particles;
and the metal composite layer is arranged outside the diamond layer and is used for filling gaps and vacancies between the diamond core-shell structures.
11. The diamond metal composite heat conductive sheet according to claim 10, wherein the heat diffusion coefficient of the composite heat conductive sheet is 400 square meters/s to 550 square meters/s.
12. The diamond metal composite heat conducting sheet according to claim 10, wherein the heat conducting coefficient of the composite heat conducting sheet is 850W/(m×k) to 1000W/(m×k).
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