CN110071050A - A kind of chip interconnection structure and preparation method thereof - Google Patents
A kind of chip interconnection structure and preparation method thereof Download PDFInfo
- Publication number
- CN110071050A CN110071050A CN201910331322.7A CN201910331322A CN110071050A CN 110071050 A CN110071050 A CN 110071050A CN 201910331322 A CN201910331322 A CN 201910331322A CN 110071050 A CN110071050 A CN 110071050A
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- metal
- small pieces
- chip
- nano
- nanoporous
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- 239000010949 copper Substances 0.000 claims description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 56
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
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Classifications
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- B22—CASTING; POWDER METALLURGY
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B22F3/11—Making porous workpieces or articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/811—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector the bump connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/81101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector the bump connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a bump connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
Abstract
Description
Claims (18)
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CN201910331322.7A CN110071050B (en) | 2019-04-24 | 2019-04-24 | Chip interconnection structure and preparation method thereof |
PCT/CN2019/123823 WO2020215738A1 (en) | 2019-04-24 | 2019-12-06 | Chip interconnection structure and preparation method therefor |
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CN201910331322.7A CN110071050B (en) | 2019-04-24 | 2019-04-24 | Chip interconnection structure and preparation method thereof |
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CN110071050B CN110071050B (en) | 2021-09-24 |
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WO (1) | WO2020215738A1 (en) |
Cited By (5)
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CN111446045A (en) * | 2020-05-27 | 2020-07-24 | 北京康普锡威科技有限公司 | Mixed-size nano copper paste and preparation method thereof |
WO2020215738A1 (en) * | 2019-04-24 | 2020-10-29 | 深圳第三代半导体研究院 | Chip interconnection structure and preparation method therefor |
CN111933603A (en) * | 2020-06-28 | 2020-11-13 | 深圳第三代半导体研究院 | Semiconductor chip packaging structure and preparation method thereof |
CN111942726A (en) * | 2020-06-29 | 2020-11-17 | 深圳第三代半导体研究院 | Sealing bag for sintering process and sintering process |
CN116190269A (en) * | 2023-02-14 | 2023-05-30 | 纳宇半导体材料(宁波)有限责任公司 | Protection device for chip bonding and packaging interconnection process and interconnection method |
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CN113782505B (en) * | 2021-09-24 | 2022-11-01 | 哈尔滨工业大学 | Surface smoothing and connecting method of diamond radiating fin |
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Also Published As
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WO2020215738A1 (en) | 2020-10-29 |
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