CN219180477U - Flexible electronic tag chip reverse packaging device - Google Patents
Flexible electronic tag chip reverse packaging device Download PDFInfo
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- CN219180477U CN219180477U CN202223264983.9U CN202223264983U CN219180477U CN 219180477 U CN219180477 U CN 219180477U CN 202223264983 U CN202223264983 U CN 202223264983U CN 219180477 U CN219180477 U CN 219180477U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to a flexible electronic tag chip reverse packaging device which is used for packaging chips of electronic tags and is characterized by comprising a substrate conveying mechanism and two sets of mutually independent packaging mechanisms, wherein the two sets of packaging mechanisms respectively comprise a crystal disc mechanism and a mounting mechanism, the two sets of packaging mechanisms are independently arranged on the substrate conveying mechanism, substrate adjusting mechanisms are arranged between the two sets of packaging equipment, the pressing distance of adjusting rollers is adjusted according to the spacing of the electronic tags with different sizes, so that the two sets of packaging mechanisms are aligned with the positions of the chips on the tags at the same time, and the two sets of packaging mechanisms can work at the same time; because the two sets of packaging mechanisms are completely independent and have no shared equipment, the two sets of packaging mechanisms independently operate and do not interfere with each other, and the risk of collision is avoided; and two crystal disc mechanisms are arranged on the same side of the substrate conveying mechanism, so that operation control of operators is facilitated, and production efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of automatic processing of electronic tags, in particular to a flexible electronic tag chip reverse packaging device.
Background
Radio frequency identification (RFID, radio Frequency Identification) technology is a contactless automatic identification technology. The method automatically identifies the target object in a wireless radio frequency mode, does not need manual intervention in identification work, can simultaneously identify a plurality of targets, can realize remote reading, can work in various severe environments, and establishes communication with the electronic tag through an electromagnetic field or radio waves by a reader-writer so as to automatically identify and track the article.
The electronic tag is a main information carrier in RFID, and the structure of the electronic tag mainly comprises a base material, an antenna (antenna metal body) and a chip. The electronic tag may identify the item information and then utilize radio frequency identification technology to incorporate the item into the management and control of the network.
At present, a chip of a flexible electronic tag on the market adopts a wafer implanted with convex points, and the chip is thermally pressed on an aluminum etched antenna through conductive adhesive by using a reverse packaging process. In the disclosed patent document CN203084758U, an X-direction moving module, an electronic tag inlay placing platform, a wafer tray and a wafer transfer module which can move left and right are arranged on the frame, a Y-direction moving module which can move back and forth is arranged on the X-direction moving module, and a Z-direction moving module which can move up and down is arranged on the Y-direction moving module; the Z-direction moving module is provided with a binding head; the number of the binding heads is two, namely a left binding head and a right binding head; the corresponding Z-direction moving modules are two independent Z-direction moving modules, namely a left Z-direction moving module and a right Z-direction moving module; the corresponding Y-direction moving modules are two independent Y-direction moving modules, namely a left Y-direction moving module and a right Y-direction moving module. In this technical scheme, two binding heads share X to and Y to the guide rail, make two binding heads during operation to hold down each other or interfere, influence work efficiency, and two wafer disks set up respectively in the left and right sides of frame, make operating personnel need consider the wafer disk of equipment both sides simultaneously, the inconvenient production efficiency that also can reduce of operation.
Meanwhile, as the distance between the two sets of independent mounting devices is fixed, the sizes of the electronic tags are different, the mounting positions of the chips deviate from the positions of the mounting devices, and the two sets of mounting devices cannot work simultaneously.
Disclosure of Invention
In view of the foregoing, it is necessary to provide a flexible electronic tag chip flip-chip packaging device that has two sets of mounting devices that do not interfere with each other, can automatically adjust the mounting position of the chip, and has a simple structure.
The flexible electronic tag chip reverse packaging device comprises a substrate conveying mechanism and two sets of mutually independent packaging mechanisms, wherein the two sets of packaging mechanisms respectively comprise a crystal disc mechanism and a mounting mechanism, the two crystal disc mechanisms are arranged on the same side of the substrate conveying mechanism, and the two mounting mechanisms are arranged above the substrate conveying mechanism in parallel; the substrate conveying mechanism is used for conveying a flexible substrate, and the flexible substrate comprises two patch areas which are sequentially arranged; and a substrate adjusting mechanism is arranged between the two mounting mechanisms and is used for adjusting the position of at least one of the mounting areas, so that the mounting positions of the two mounting mechanisms and the mounting positions of the two mounting areas on the flexible substrate are respectively aligned.
Preferably, the wafer disc mechanism comprises a wafer chuck, a chuck horizontal moving mechanism, an ejection mechanism and a turnover mechanism, wherein the wafer chuck is arranged at the output end of the chuck horizontal moving mechanism, and the chuck horizontal moving mechanism is used for driving the wafer chuck to move horizontally so as to enable chips to be processed which are placed on the wafer chuck to move synchronously; the wafer chuck is provided with a loading through hole, a hollow area for placing chips to be processed is arranged below the wafer chuck, the ejection mechanism comprises an ejection cylinder and an ejection column, the ejection column is arranged at the output end of the ejection cylinder, and the top end of the ejection column corresponds to the loading through hole.
Preferably, the turnover mechanism comprises a vertical moving cylinder, a turnover arm and a turnover visual mechanism, wherein the top end of the turnover arm is provided with a vacuum chuck which is used for sucking a chip to be processed; the turnover arm is arranged at the output end of the turnover cylinder, and the turnover cylinder is used for rotating the turnover arm by 180 degrees and turning the vacuum chuck and the chip to be processed downwards to upwards; the vertical moving cylinder is used for moving the turnover arm up and down to enable the vacuum sucker to be close to the chip to be processed; the turning visual mechanism is arranged on one side of the turning arm, and detects the working state of the turning arm and the chip to be processed on the vacuum chuck through the turning visual camera.
Preferably, the mounting mechanism comprises a mounting mechanism and a mounting vision mechanism, the mounting mechanism comprises a mounting mechanism moving module and a mounting assembly, the mounting mechanism moving module comprises an X-axis module and a Z-axis module, the X-axis module is arranged above the substrate conveying mechanism in a crossing manner and is perpendicular to the transmission direction of the flexible substrate, the mounting assembly is arranged on the Z-axis module, and the mounting assembly is driven by the X-axis module and the Z-axis module to move horizontally or up and down respectively; the patch visual mechanism comprises a patch visual mechanism moving module and a patch visual camera, wherein the patch visual mechanism moving module is arranged above the X-axis module and used for driving the patch visual camera to move horizontally along the X-axis module.
Preferably, the substrate conveying mechanism further comprises a traction mechanism, the traction mechanism is arranged at one end of the substrate conveying mechanism, and the traction mechanism is used for driving the flexible substrate to move, so that the mounting position on the flexible substrate sequentially passes through the mounting mechanism.
Preferably, one end of the flexible substrate is fixedly pressed on the traction, and the other end of the flexible substrate is a free end.
Preferably, the substrate adjusting mechanism comprises an adjusting roller, an adjusting roller pressing cylinder and two supporting shafts, wherein the adjusting roller and the two supporting shafts are respectively arranged above and below the flexible substrate, the adjusting roller is arranged between the two supporting shafts in the section direction, the adjusting roller and the two supporting shafts are arranged in a 'delta' shape, and when the adjusting roller is pressed down, the flexible substrate is bent in radian.
Preferably, the patch area has a plurality of uniformly distributed mounting positions, and the distance between the mounting positions is determined according to the size of the electronic tag.
Preferably, the regulating roller is cylindrical, a plurality of raised annular pieces are sleeved on the outer side surface of the regulating roller, gaps are formed between the adjacent annular pieces, the size of the gaps is adjustable, and the gaps are used for avoiding chips attached to the flexible substrate.
In the flexible electronic tag chip reverse packaging device, two sets of packaging mechanisms are independently arranged on the substrate conveying mechanism, the substrate adjusting mechanism is arranged between the two sets of packaging equipment, and the pressing distance of the adjusting roller is adjusted according to the distances between electronic tags with different sizes, so that the two sets of packaging mechanisms are aligned with the chip positions on the tags at the same time, and the two sets of packaging mechanisms can work at the same time; because the two sets of packaging mechanisms are completely independent and have no shared equipment, the two sets of packaging mechanisms independently operate and do not interfere with each other, and the risk of collision is avoided; and two crystal disc mechanisms are arranged on the same side of the substrate conveying mechanism, so that operation control of operators is facilitated, and production efficiency is improved. The product of the utility model has simple structure, easy production, low cost and convenient popularization.
Drawings
Fig. 1 is a schematic structural diagram of a flexible electronic tag chip flip-chip packaging device according to an embodiment of the present utility model.
Fig. 2 is a schematic structural diagram (front view) of a flexible electronic tag chip flip-chip packaging device according to an embodiment of the present utility model.
Fig. 3 is a schematic structural diagram of a flexible substrate (in a non-depressed state) of a flexible electronic tag chip flip-chip packaging apparatus according to an embodiment of the present utility model.
Fig. 4 is a schematic structural diagram (in a pressed state) of a flexible substrate of the flexible electronic tag chip flip-chip packaging device according to an embodiment of the present utility model.
Fig. 5 is a schematic diagram of a pressing state of a flexible substrate of the flexible electronic tag chip flip package device according to an embodiment of the present utility model.
Fig. 6 is a schematic structural diagram of an adjusting roller of the flexible electronic tag chip flip-chip packaging device according to an embodiment of the present utility model.
Detailed Description
The present utility model will be described in detail with reference to specific embodiments and drawings.
Referring to fig. 1 and 2, a flexible electronic tag chip flip-chip packaging device 100 according to an embodiment of the present utility model is shown, and is used for chip packaging of electronic tags, and includes a substrate conveying mechanism 30 and two sets of mutually independent packaging mechanisms 10 and 20, wherein the two sets of packaging mechanisms 10 and 20 respectively include a wafer disc mechanism 11 and 21 and a mounting mechanism 15 and 25, the two wafer disc mechanisms 11 and 21 are disposed on the same side of the substrate conveying mechanism 30, and the two mounting mechanisms 15 and 25 are disposed above the substrate conveying mechanism 30 in parallel; the substrate conveying mechanism 30 is configured to convey a flexible substrate 32, as shown in fig. 3, where the flexible substrate 32 includes two sequentially arranged patch areas 321; a substrate adjusting mechanism 31 is disposed between the two mounting mechanisms 15, 25, and the substrate adjusting mechanism 31 is configured to adjust a position of at least one of the mounting areas 321, so that the mounting positions of the two mounting mechanisms 15, 25 on the two mounting areas 321 on the flexible substrate 32 are aligned respectively.
Specifically, when the mounting positions of the two mounting mechanisms 15, 25 are taken as the center line and the mounting region 321 passes through the center line from below the mounting mechanisms 15, 25, the mounting mechanism mounts the chip to be processed on the mounting position of the mounting region 321. Preferably, the mounting positions on the two mounting areas are aligned with the center lines of the two mounting mechanisms 15, 25, respectively, in order in the transfer direction.
Specifically, one mounting mechanism 15, 25 corresponds to one wafer disc mechanism 11, 21, and the mounting mechanism 15, 25 sucks chips from the corresponding wafer disc mechanism 11, 21 and mounts the chips on a flexible substrate.
Preferably, the wafer disc mechanisms 11 and 21 include wafer chucks 111 and 211, chuck horizontal movement mechanisms, ejection mechanisms 12 and 22 and turnover mechanisms 13 and 23, wherein the wafer chucks 111 and 211 are arranged at the output ends of the chuck horizontal movement mechanisms, and the chuck horizontal movement mechanisms are used for driving the wafer chucks 111 and 211 to move horizontally so as to enable chips to be processed placed on the wafer chucks 111 and 211 to move synchronously; the wafer chucks 111 and 211 are provided with loading through holes, hollow areas for placing chips to be processed are arranged in the hollow areas, the ejection mechanisms 12 and 22 are arranged below the wafer chucks 111 and 211, the ejection mechanisms 12 and 22 comprise ejection cylinders and ejection columns, the ejection columns are arranged at the output ends of the ejection cylinders, and the top ends of the ejection columns correspond to the loading through holes.
Specifically, the wafer chucks 111 and 211 are in a sheet shape, and the feeding through holes are located in the central areas of the wafer chucks 111 and 211 and used for placing chips to be processed. The chuck horizontal moving mechanism comprises a chuck moving motor and a horizontal screw rod, and the chuck moving motor drives the wafer chucks 111 and 211 to move along the horizontal screw rod so that chips to be processed placed on the wafer chucks 111 and 211 synchronously move.
Specifically, the horizontal screw rod includes an X-axis screw rod and a Y-axis screw rod that are perpendicular to each other, the wafer chucks 111, 211 moving motor includes an X-axis motor and a Y-axis motor, and the X-axis motor and the Y-axis motor respectively drive the wafer chucks 111, 211 to move horizontally along the X-axis screw rod and the Y-axis screw rod, so that chips to be processed placed on the wafer chucks 111, 211 sequentially pass through the top ends of the ejection columns.
Preferably, the turnover mechanisms 13 and 23 comprise a vertical moving cylinder, a turnover arm and a turnover vision mechanism, wherein the top end of the turnover arm is provided with a vacuum chuck which is used for sucking a chip to be processed; the turnover arm is arranged at the output end of the turnover cylinder, and the turnover cylinder is used for rotating the turnover arm by 180 degrees and turning the vacuum chuck and the chip to be processed downwards to upwards; the vertical moving cylinder is used for moving the turnover arm up and down to enable the vacuum sucker to be close to the chip to be processed; the turnover visual mechanisms 14 and 24 are arranged on one side of the turnover arm, and the turnover visual mechanisms 14 and 24 detect the working state of the turnover arm and the chip to be processed on the vacuum chuck through a turnover visual camera.
Specifically, the top end of the ejection column is disposed in the loading through hole area and moves up and down in the loading through hole area, and the ejection column ejects the chip to be processed placed on the wafer chucks 111 and 211, so that the vacuum chuck can absorb the chip to be processed.
When the material is taken, the overturning cylinder enables the vacuum chuck to downwards, at the moment, the overturning arm stretches to the upper part of the wafer chucks 111 and 211, the vacuum chuck points to chips to be processed placed on the wafer chucks 111 and 211, and the vertical moving cylinder drives the overturning arm to downwards press, so that the vacuum chuck absorbs the chips to be processed.
After material is taken, the vertical moving cylinder drives the turning arm to move upwards so that the chip to be processed is separated from the wafer chucks 111 and 211, and the turning cylinder drives the turning arm to rotate 180 degrees so that the turning arm extends to the mounting mechanism and the vacuum chuck and the chip to be processed face upwards.
Specifically, the flip vision mechanism 14, 24 is used to detect the flip state of the flip arm, and whether the vacuum chuck suctions the chip to be processed.
Preferably, the mounting mechanism 15, 25 includes a mounting mechanism 16, 26 and a mounting vision mechanism 17, 27, the mounting mechanism 16, 26 includes a mounting mechanism moving module and a mounting assembly, the mounting mechanism 16, 26 moving module includes an X-axis module and a Z-axis module, the X-axis module is straddled over the substrate conveying mechanism 30 and is disposed perpendicular to the conveying direction of the flexible substrate 32, the mounting assembly is disposed on the Z-axis module, and the mounting assembly is driven by the X-axis module and the Z-axis module to move horizontally or up and down respectively; the patch vision mechanisms 17 and 27 comprise patch vision mechanism moving modules and patch vision cameras, the patch vision mechanisms 17 and 27 moving modules are arranged above the X-axis modules, and the patch vision mechanisms 17 and 27 moving modules are used for driving the patch vision cameras to horizontally move along the X-axis modules.
Preferably, referring to fig. 3 and 4, the substrate conveying mechanism 30 further includes a traction mechanism, which is disposed at one end of the substrate conveying mechanism 30, and the traction mechanism is configured to drive the flexible substrate 32 to move, so that the mounting position on the flexible substrate 32 sequentially passes through the mounting mechanisms 15 and 25. Preferably, one end of the flexible substrate 32 is fixedly pressed on the traction mechanism, and the other end of the flexible substrate 32 is a free end.
Preferably, the substrate adjusting mechanism 31 includes an adjusting roller 311, an adjusting roller 311 pressing cylinder, and two support shafts 312, the adjusting roller 311 and the two support shafts 312 are respectively disposed above and below the flexible substrate 32, the adjusting roller 311 is disposed between the two support shafts 312, as shown in fig. 5, in the cross-section direction, the adjusting roller 311 and the two support shafts 312 are arranged in a "pin" shape, and when the adjusting roller 311 is pressed down, the flexible substrate 32 is curved in an arc.
Specifically, when the adjusting roller 311 is pushed down by the pushing cylinder of the adjusting roller 311, the flexible substrate 32 passing between the adjusting roller 311 and the two supporting shafts 312 moves along the tangential direction of the outer sides of the adjusting roller 311 and the supporting shafts 312.
Specifically, the adjustment roller 311 is depressed to different degrees, so that the flexible substrate 32 has different curvature.
Preferably, the patch area 321 has a plurality of uniformly distributed mounting positions, and the distance between the mounting positions is determined according to the size of the electronic tag.
Specifically, the different sizes of the flexible substrate 32 and the different types of electronic labels change the distance between the mounting positions on the patch area 321.
When the flexible substrate 32 has a bend with different radians, the positions of the patch areas 321 at the free end of the flexible substrate 32 are fine-tuned due to the fixing of one end of the flexible substrate 32, so that the mounting positions of the two patch areas 321 correspond to the mounting position center lines of the mounting mechanisms 15 and 25.
Specifically, the mounting vision means 17, 27 is for detecting whether the mounting position on the mounting area 321 corresponds to the mounting position center line of the mounting means 15, 25.
Preferably, referring to fig. 6, the adjusting roller 311 is cylindrical, a plurality of raised ring members 3111 are sleeved on an outer side surface of the adjusting roller 311, gaps are formed between adjacent ring members 3111, and the size of the gaps can be adjusted, and the gaps are used for avoiding chips attached to the flexible substrate 32.
Specifically, an annular groove is formed between the adjacent annular members 3111, and the annular groove is used for avoiding the attached chip.
Specifically, in this embodiment, the two sets of packaging mechanisms 10 and 20 include a first packaging mechanism 10 and a second packaging mechanism 20, where the first packaging mechanism 10 and the second packaging mechanism 20 are disposed back-to-back, so that the two sets of packaging mechanisms 10 and 20 operate independently, do not interfere with each other, and do not have risk of collision.
The first packaging mechanism 10 includes a first wafer disc mechanism 11 and a first mounting mechanism 15, the second packaging mechanism 20 includes a second wafer disc mechanism 21 and a second mounting mechanism 25, and the first wafer disc mechanism 11 and the second wafer disc mechanism 21 are arranged on the same side of the substrate conveying mechanism 30 in parallel, so that an operator can realize control operation on the two sets of packaging mechanisms 10 and 20 only by operating on one side of the device.
The first mounting mechanism 15 includes a first mounting mechanism 16 and a first mounting vision mechanism 17, the second mounting mechanism 25 includes a second mounting mechanism 26 and a second mounting vision mechanism 27, and the first mounting mechanism 16 and the second mounting mechanism 26 are disposed parallel to each other and have a space, and the first mounting mechanism 16 and the second mounting mechanism 26 are fixedly mounted, so that the distance between the first mounting mechanism 16 and the second mounting mechanism 26 is fixed.
However, the different sizes of the substrates or the different sizes of the electronic labels may make the distances between the mounting positions on the patch areas 321 different, and when the mounting position on one patch area 321 is aligned with the position of one patch mechanism, the mounting position on the other patch area 321 is not necessarily aligned with the position of the other patch mechanism.
When the mounting position on one of the patch areas 321 is aligned with the position of one of the patch mechanisms, and the mounting position on the other patch area 321 is not aligned with the position of the other patch mechanism, the adjustment roller 311 is pressed down by different distances, so that the flexible substrate 32 generates different radians, and the position of the other patch area 321 is adjusted, so that the mounting position on the other patch area 321 is aligned with the position of the other patch mechanism.
Specifically, in the present embodiment, the first wafer disc mechanism 11 includes a first wafer chuck 111, a first card horizontal movement mechanism, a first ejection mechanism 12, a first flip-chip mechanism 13, and a first flip-chip vision mechanism 14; the second wafer mechanism 21 includes a second wafer chuck 211, a second card horizontal moving mechanism, a second ejection mechanism 22, a second flipping mechanism 23, and a second flipping vision mechanism 24, and functions of each component are described above and will not be described again.
In the flexible electronic tag chip packaging device 100, two sets of packaging mechanisms 10 and 20 are independently arranged on the substrate conveying mechanism 30, the substrate adjusting mechanism 31 is arranged between the two sets of packaging equipment, and the pressing distance of the adjusting roller 311 is adjusted according to the spacing of electronic tags with different sizes, so that the two sets of packaging mechanisms 10 and 20 are aligned with the chip positions on the tags at the same time, and the two sets of packaging mechanisms 10 and 20 can work at the same time; because the two sets of packaging mechanisms 10 and 20 are completely independent and have no shared equipment, the two sets of packaging mechanisms 10 and 20 independently operate and do not interfere with each other, and the risk of collision is avoided; and the two crystal disc mechanisms 11 and 21 are arranged on the same side of the substrate conveying mechanism 30, so that the operation and control of operators are facilitated, and the production efficiency is improved. The product of the utility model has simple structure, easy production, low cost and convenient popularization.
It should be noted that the present utility model is not limited to the above embodiments, and those skilled in the art can make other changes according to the inventive spirit of the present utility model, and these changes according to the inventive spirit of the present utility model should be included in the scope of the present utility model as claimed.
Claims (9)
1. The flexible electronic tag chip reverse packaging device is used for packaging the electronic tag chip and is characterized by comprising a substrate conveying mechanism and two sets of mutually independent packaging mechanisms, wherein the two sets of packaging mechanisms respectively comprise a crystal disc mechanism and a mounting mechanism, the two crystal disc mechanisms are arranged on the same side of the substrate conveying mechanism, and the two mounting mechanisms are arranged above the substrate conveying mechanism in parallel; the substrate conveying mechanism is used for conveying a flexible substrate, and the flexible substrate comprises two patch areas which are sequentially arranged; and a substrate adjusting mechanism is arranged between the two mounting mechanisms and is used for adjusting the position of at least one of the mounting areas, so that the mounting positions of the two mounting mechanisms and the mounting positions of the two mounting areas on the flexible substrate are respectively aligned.
2. The flexible electronic tag chip packaging device according to claim 1, wherein the wafer disc mechanism comprises a wafer chuck, a chuck horizontal moving mechanism, an ejection mechanism and a turnover mechanism, the wafer chuck is arranged at an output end of the chuck horizontal moving mechanism, and the chuck horizontal moving mechanism is used for driving the wafer chuck to move horizontally so as to enable chips to be processed, which are placed on the wafer chuck, to move synchronously; the wafer chuck is provided with a loading through hole, a hollow area for placing chips to be processed is arranged below the wafer chuck, the ejection mechanism comprises an ejection cylinder and an ejection column, the ejection column is arranged at the output end of the ejection cylinder, and the top end of the ejection column corresponds to the loading through hole.
3. The flexible electronic tag chip packaging device according to claim 2, wherein the flip mechanism comprises a vertical moving cylinder, a flip arm and a flip vision mechanism, wherein a vacuum chuck is arranged at the top end of the flip arm and is used for sucking a chip to be processed; the turnover arm is arranged at the output end of the turnover cylinder, and the turnover cylinder is used for rotating the turnover arm by 180 degrees and turning the vacuum chuck and the chip to be processed downwards to upwards; the vertical moving cylinder is used for moving the turnover arm up and down to enable the vacuum sucker to be close to the chip to be processed; the turning visual mechanism is arranged on one side of the turning arm, and detects the working state of the turning arm and the chip to be processed on the vacuum chuck through the turning visual camera.
4. The flexible electronic tag chip packaging device according to claim 1, wherein the mounting mechanism comprises a mounting mechanism and a mounting vision mechanism, the mounting mechanism comprises a mounting mechanism moving module and a mounting assembly, the mounting mechanism moving module comprises an X-axis module and a Z-axis module, the X-axis module is arranged above the substrate conveying mechanism in a crossing manner and is perpendicular to the conveying direction of the flexible substrate, the mounting assembly is arranged on the Z-axis module, and the mounting assembly is driven by the X-axis module and the Z-axis module to move horizontally or up and down respectively; the patch visual mechanism comprises a patch visual mechanism moving module and a patch visual camera, wherein the patch visual mechanism moving module is arranged above the X-axis module and used for driving the patch visual camera to move horizontally along the X-axis module.
5. The flexible electronic tag chip packaging device of claim 1, wherein the substrate conveying mechanism further comprises a traction mechanism, the traction mechanism is arranged at one end of the substrate conveying mechanism, and the traction mechanism is used for driving the flexible substrate to move so that the mounting position on the flexible substrate sequentially passes through the mounting mechanism.
6. The flexible electronic tag chip packaging device according to claim 5, wherein one end of the flexible substrate is fixedly pressed on the traction mechanism, and the other end of the flexible substrate is a free end.
7. The flexible electronic tag chip packaging device according to claim 5, wherein the substrate adjusting mechanism comprises an adjusting roller, an adjusting roller pressing cylinder and two supporting shafts, the adjusting roller and the two supporting shafts are respectively arranged above and below the flexible substrate, the adjusting roller is arranged between the two supporting shafts, the adjusting roller and the two supporting shafts are arranged in a 'delta' shape in the cross section direction, and the flexible substrate is enabled to have radian bending when the adjusting roller is pressed down.
8. The flexible electronic tag chip flip-chip packaging apparatus according to claim 1, wherein the patch area has a plurality of uniformly distributed mounting positions, and a distance between the mounting positions is determined according to a size of the electronic tag.
9. The flexible electronic tag chip packaging device according to claim 7, wherein the regulating roller is cylindrical, a plurality of raised annular pieces are sleeved on the outer side face of the regulating roller, gaps are formed between adjacent annular pieces, the size of the gaps can be adjusted, and the gaps are used for avoiding chips attached to the flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223264983.9U CN219180477U (en) | 2022-12-07 | 2022-12-07 | Flexible electronic tag chip reverse packaging device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223264983.9U CN219180477U (en) | 2022-12-07 | 2022-12-07 | Flexible electronic tag chip reverse packaging device |
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| CN219180477U true CN219180477U (en) | 2023-06-13 |
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| CN202223264983.9U Active CN219180477U (en) | 2022-12-07 | 2022-12-07 | Flexible electronic tag chip reverse packaging device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117096064A (en) * | 2023-09-21 | 2023-11-21 | 恩纳基智能科技无锡有限公司 | Double-station high-precision flip packaging equipment |
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2022
- 2022-12-07 CN CN202223264983.9U patent/CN219180477U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117096064A (en) * | 2023-09-21 | 2023-11-21 | 恩纳基智能科技无锡有限公司 | Double-station high-precision flip packaging equipment |
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