CN219068715U

CN219068715U - Device for cooling large heat flux device by using magnetic field

Info

Publication number: CN219068715U
Application number: CN202122476826.3U
Authority: CN
Inventors: 王增辉; 孟旭; 倪明玖
Original assignee: University of Chinese Academy of Sciences
Current assignee: University of Chinese Academy of Sciences
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2023-05-23
Anticipated expiration: 2031-10-14

Abstract

The utility model relates to the technical field of cooling of large heat flux devices, and discloses a device for realizing cooling of large heat flux devices by utilizing a magnetic field and a micro-channel structure, which solves the problems that the device for realizing cooling of large heat flux devices in the current market needs a pump to be actively driven, the pump occupies a large space, consumes a large amount of electric energy, and the driving force of a traditional flow channel actively driven by utilizing the magnetic field and a thermoelectric effect is limited. The micro-channel type heat generating device comprises a heat generating device, wherein a conductive fluid loop is arranged at the top of the heat generating device, the outer wall of the conductive fluid loop is made of red copper metal, a micro-channel structure is arranged in the conductive fluid loop, and the conductive fluid loop is positioned in a magnetic field area generated by a magnet. The utility model can realize the active flow of the liquid metal by utilizing the magnetic field and the thermoelectric current generated by the temperature difference between the channel and the wall surface of the liquid metal, and has the advantages of space saving, large heat dissipation area, large driving force and good heat dissipation effect without using the driving of a pump.

Description

Device for cooling large heat flux device by using magnetic field

Technical Field

The utility model belongs to the technical field of cooling of large heat flux devices, and particularly relates to a device for cooling a large heat flux device by utilizing a magnetic field and a micro-channel.

Background

The current market uses conductive fluid to cool the large heat flux density device, which needs to be driven by electromagnetic pump, the electromagnetic pump drives the conductive fluid to circulate to take out the heat of the large heat flux density device, and the conductive fluid is cooled by water cooling or air cooling, and then flows to the electromagnetic pump to circulate. In addition, a scheme is adopted, wherein a thermal current is generated on the surface of the micro-channel structure by utilizing the temperature difference between the electronic device and the environment, and the conductive fluid is driven to flow and exchange heat by utilizing the interaction between a magnetic field and the current.

The existing cooling of the heat flux device has the following defects:

1. the electromagnetic pump occupies a large space in a mode of driving the conductive fluid to exchange heat, the heat exchange area is limited, and a large amount of electric energy is consumed.

2. The thermoelectric effect self-driving mode is utilized, so that the thermoelectric current generated by the runner without the micro-channel structure is small, and the driving force is weak.

Disclosure of Invention

Aiming at the situation, in order to overcome the defects of the prior art, the utility model provides a device for realizing the cooling of a device with large heat flux density by utilizing a magnetic field and a micro-channel, which effectively solves the problems that the device for realizing the cooling of the device with large heat flux density by utilizing the magnetic field in the current market needs an electromagnetic pump to be actively driven, has small space-limited heat dissipation area, consumes a large amount of electric energy and is self-driven by utilizing a thermoelectric effect but does not have the micro-channel structure of constantan material.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an utilize magnetic field and micro channel to realize device cooling of big heat flux density device, includes the device that generates heat, the conductive fluid return circuit is installed at the top of generating heat the device, and the outer wall of conductive fluid return circuit is red copper metal, has arranged micro channel structure in the conductive fluid return circuit, and the conductive fluid return circuit is in the magnetic field area that magnet produced, the internally mounted of conductive fluid return circuit has radiator fan.

Preferably, the conductive fluid circuit comprises a conductive fluid, a liquid metal or a conductive metal powder.

Preferably, the conductive fluid is one of gallium, gallium alloy, mercury, potassium sodium alloy, saline solution, or conductive metal powder, for example.

Preferably, the material of the channel structure is a copper sheet.

Preferably, the heat dissipation fan is an electrically driven forced convection type heat dissipation mechanism.

A method for cooling a high heat flux density device using a magnetic field and micro-channels, comprising the steps of:

s1, the high heat flux density device is arranged above a high heat flux density device to be cooled through a conductive fluid circulation loop, the high heat flux density device is arranged below a channel structure, an electric fan is arranged above the high heat flux density device to dissipate heat, the temperature is low, and a temperature gradient is formed in the upper and lower directions of an interface between conductive fluid and the channel structure.

S2, a large heat flux device is arranged below the channel structure, the temperature is high, the electric fan is arranged above the channel structure to dissipate heat, the temperature is low, and a temperature gradient is formed in the up-down direction of the interface between the conductive fluid and the channel structure. According to the thermoelectric effect principle, a temperature gradient is formed at the interface of the conductive fluid and the channel structure so as to generate thermoelectric force, and thermoelectric current is generated in the conductive fluid and the channel structure, wherein the magnitude of the thermoelectric current is positively correlated with the thermoelectric coefficient difference between the two materials, and the constantan material and the conductive fluid have larger thermoelectric coefficient difference and small resistance value;

and S3, under the action of the magnetic field, the electromagnetic force (Lorentz force) acts, the conductive fluid is driven to flow in the circulation loop, and the larger the thermal current is, the larger the driving force is.

Compared with the prior art, the utility model has the beneficial effects that:

1) Compared with a liquid metal cooling device driven by an electromagnetic pump, the circulation of the conductive fluid does not need the driving of the electromagnetic pump, and the conductive fluid can circulate in a loop under the action of electromagnetic force by utilizing the thermoelectric current generated by a channel structure and a conductive fluid interface. The utility model has simple structure, small occupied area and large heat dissipation area, and does not need to consume extra electric energy.

2) Compared with the traditional flow channel driven by the thermoelectric effect, the channel structure has larger thermoelectric coefficient difference with the conductive fluid, has small resistance value, can generate larger thermoelectric current, and realizes that the conductive fluid flows fast in a loop under the action of electromagnetic force, and has high heat exchange coefficient and large heat exchange quantity.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic view of the overall structure of the present utility model;

in the figure: 1. a heat generating device; 2. a conductive fluid circuit; 3. a red copper metal outer wall; 4. a channel structure; 5. a magnetic field region; 6. a heat radiation fan.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the first embodiment, as shown in fig. 1, the utility model comprises a heating device 1, a conductive fluid circuit 2 is installed at the upper part of the heating device 1, the outer wall surface of the conductive fluid circuit 2 is a red copper metal outer wall 3, a channel structure 4 is arranged in the conductive fluid circuit 2, a magnetic field area 5 is arranged, and a cooling fan 6 is installed inside the conductive fluid circuit 2.

In the second embodiment, based on the first embodiment, the outer wall of the conductive fluid circuit 2 is made of red copper metal, and the heat of the device with high heat flux is transferred to the conductive fluid by the way that the red copper is conductive.

In the third embodiment, the conductive fluid circuit 2 includes a conductive fluid, a liquid metal or a conductive metal powder, and the conductive fluid or the conductive metal powder is in a high temperature region generated by the thermal power of the high heat flux density device and in a low temperature region generated by the rotational cooling of the cooling fan 6 by the arrangement of the conductive fluid circuit 2.

In the fourth embodiment, the magnetic field area 5 is implemented by using an electromagnetic field or a permanent magnet, and the arrangement of the magnetic field area 5 determines whether the conductive fluid is in a counterclockwise or clockwise direction according to the direction of the conductive fluid.

In the fifth embodiment, based on the first embodiment, the heat dissipation fan 6 is an electrically driven forced convection type heat dissipation mechanism, and by setting the heat dissipation fan 6, a cold source is provided for the conductive fluid, and a temperature gradient is formed at the interface between the conductive fluid and the channel structure 4.

A method for cooling a high heat flux density device using a magnetic field, comprising the steps of:

s1, the high heat flux density device is arranged above a high heat flux density device to be cooled through a conductive fluid circulation loop, the high heat flux density device is arranged below the channel structure 4, the temperature is high, the electric fan is arranged above the high heat flux density device to dissipate heat, the temperature is low, and a temperature gradient is formed in the upper and lower directions of an interface between conductive fluid and the channel structure 4.

S2, a large heat flux device is arranged below the channel structure 4, the temperature is high, the electric fan is arranged above the channel structure to dissipate heat, the temperature is low, and a temperature gradient is formed in the up-down direction of the interface between the conductive fluid and the channel structure 4. According to the thermoelectric effect principle, a temperature gradient is formed at the interface between the conductive fluid and the channel structure 4 so as to generate thermoelectric force, and thermoelectric current is generated in the conductive fluid and the channel structure 4, wherein the magnitude of the thermoelectric current is positively correlated with the thermoelectric coefficient difference between the two materials, and the constantan material and the conductive fluid have larger thermoelectric coefficient difference;

Working principle: when the device works, the conductive fluid circulation loop is arranged above the large heat flux device to be cooled, and the large heat flux device is arranged below the channel structure 4 in the conductive fluid loop 2, so that the temperature is high; the electric fan is arranged above the radiator to radiate heat, so that the temperature is low. The temperature gradient is formed at the interface between the conductive fluid and the channel structure 4, the thermoelectric force is generated at the interface between the conductive fluid and the channel structure 4 according to the thermoelectric effect principle, the thermoelectric current is generated in the conductive fluid, the conductive fluid is driven to flow in a circulation loop under the action of the electromagnetic force under the action of the magnetic field area 5, the flow of the conductive fluid is anticlockwise or clockwise and is related to the direction of the magnetic field, under the condition that the temperature gradient is fixed, the flow rate of the conductive fluid is positively correlated with the thermoelectric coefficient difference between the channel structure 4 and the conductive fluid, the larger the thermoelectric coefficient difference is, the larger the generated thermoelectric current is, the electromagnetic force is larger, the driving force is stronger, the flow of the conductive fluid is enhanced, the heat exchange quantity is increased, and in the circulation process, the heat is taken away through the convection heat exchange of the electrically driven forced convection fan above.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A device for realizing cooling of a large heat flux device by utilizing a magnetic field and micro-channels comprises a heating device (1) and is characterized in that a conductive fluid loop (2) is arranged at the upper part of the heating device (1), the outer wall surface of the conductive fluid loop (2) is a red copper metal outer wall (3), a channel structure (4) is arranged in the conductive loop, the heating device (1) is positioned in a magnetic field area (5), and a cooling fan (6) is arranged in the conductive fluid loop (2).

2. The device for cooling a high heat flux density device using a magnetic field and micro-channels according to claim 1, wherein the channel structure (4) is made of constantan sheet.

3. An apparatus for cooling a high heat flux density device using magnetic fields and micro-channels according to claim 1, characterized in that the conductive fluid circuit (2) comprises a conductive fluid, a liquid metal or a conductive metal powder.

4. An apparatus for achieving high heat flux density device cooling using magnetic fields and microchannels as set forth in claim 3 wherein: the conductive fluid is one of a metal powder such as a graft, a graft alloy, mercury, a potassium-sodium alloy, a salt solution, or a conductive metal powder.

5. The apparatus of claim 1, wherein the heat dissipating fan (6) is an electrically driven forced convection type heat dissipating mechanism.