CN107887356B - A kind of radiator for closed structure high heat flux density device - Google Patents
A kind of radiator for closed structure high heat flux density device Download PDFInfo
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- CN107887356B CN107887356B CN201710947362.5A CN201710947362A CN107887356B CN 107887356 B CN107887356 B CN 107887356B CN 201710947362 A CN201710947362 A CN 201710947362A CN 107887356 B CN107887356 B CN 107887356B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of high-efficiency radiator for closed structure high heat flux density device, it includes liquid metals pipeline and radiating fin, the liquid metals pipeline is filled with flowable liquid metals through in the radiating fin in the liquid metals pipeline.It further include transfer tube, the transfer tube is set on the liquid metals pipeline and for driving the liquid metal flow in liquid metals pipeline.The present invention makes liquid metal self-loopa cold plate using processing methods such as monoblock cast or welding, and heat sink, heat sink, radiating fin, liquid metal pipeline are integrated, and farthest reduces system thermal resistance, and heat transfer efficiency is high；Liquid metal has the thermal conductivity much higher than water, air and many nonmetal mediums, therefore the relatively traditional water cooling of liquid metal heat radiation device can realize more efficient heat transportation and limit heat-sinking capability.
Description
Technical field
The invention belongs to technical field of heat dissipation, in particular to a kind of collection liquid metal, forced air cooling device, transfer tube and one
The low energy consumption of body cold plate, small size, high reliability novel efficient heat radiator.
Background technique
Currently, the integrated level and heat flow density of device are also being obviously improved with the raising of electronic functionalities.Merely
Use forced air cooling can no longer meet thermal design index, and heating device need to be fixed on by liquid using traditional liquid cooling scheme
On cold plate, heat is effectively taken away by the liquid energy of flow.But the pact of the secondary cooling device space needed for traditional liquid cooling
Shu Changchang becomes its restrictive design factor, while also bringing along energy consumption under low temperature and increasing, manage between traditional liquid cooling source and equipment
The problem of road connects.
Especially since the particularity of application environment, many electronic equipments are required using closed structure design and external world's tide
Wet, mould, salt fog air exclusion, therefore can not directly be radiated to device with traditional fan, heat sinking technology is needed, by device
Heat is lasting, it is quick, efficiently export at equipment cover board radiating fin, then provide the stabilization gas of high speed, orientation to cover board fin
Stream, heat is distributed into equipment surrounding air.
In consideration of it, the present inventor provides a kind of high-efficiency radiator for closed structure high heat flux density device,
It can effectively solve the problem that above-mentioned technical problem, obtain good heat dissipation effect.
Summary of the invention
The object of the present invention is to provide a kind of high-efficiency radiators for closed structure high heat flux density device, use liquid
Body metal is recycled, and heat transfer efficiency is high and safe and reliable.
In order to achieve the above object, the present invention provides a kind of high-efficiency radiator for closed structure high heat flux density device,
Including liquid metals pipeline and radiating fin, the liquid metals pipeline is through in the radiating fin, and the liquid
Flowable liquid metals is filled in body metallic conduit.
The high-efficiency radiator for closed structure high heat flux density device, further includes transfer tube, the transfer tube
It is set on the liquid metals pipeline and for driving the liquid metal flow in liquid metals pipeline.
The high-efficiency radiator for closed structure high heat flux density device, further includes heat sink, the heat sink
Below the radiating fin.
The high-efficiency radiator for closed structure high heat flux density device, further includes heat sink, the heat absorption
Device is located at the heat below the heat sink and for absorbing closed structure heat-generating components inside.
The high-efficiency radiator for closed structure high heat flux density device, wherein the liquid metal pipeline, dissipate
Hot fin, heat sink and heat sink pass through monoblock cast or welded molding.
The high-efficiency radiator for closed structure high heat flux density device, further includes forced air cooling device, described
Forced air cooling device is set to the side of radiating fin and for cooling down to radiating fin.
The high-efficiency radiator for closed structure high heat flux density device, wherein the forced air cooling device is recommended
But it is not limited to Piezoelectric Ceramic Fan.
The high-efficiency radiator for closed structure high heat flux density device, wherein the liquid metal is at room temperature
The metal of liquid can be presented.
The high-efficiency radiator for closed structure high heat flux density device, wherein the liquid metal be gallium, mercury,
Gallium base bianry alloy, gallium based multicomponent alloy, gallium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy.
The high-efficiency radiator for closed structure high heat flux density device, in which: the transfer tube be electromagnetic pump,
Mechanical pump, piezoelectric pump or electrowetting pump.
The beneficial effects of the present invention are:
1, liquid metal self-loopa cold plate, heat sink, radiating fin are made using processing methods such as monoblock cast or welding
Piece, liquid metal pipeline are integrated, and farthest reduce system thermal resistance, and heat transfer efficiency is high；
2, liquid metal is not easy to evaporate, and is not easy to reveal, safe and non-toxic, and physico-chemical property is stablized, and easily recycles, be it is a kind of very
The flow working medium of safety, it is ensured that the efficient, long-term of cooling system, stable operation.The present invention designs liquid metal self-loopa
Pipe-line system is located at outside cover board, has prevented liquid leakage and has flowed to the danger for leading to PCB short circuit inside equipment；
3, liquid metal has the thermal conductivity much higher than water, air and many nonmetal mediums, therefore liquid metal heat radiation
The relatively traditional water cooling of device can realize more efficient heat transportation and limit heat-sinking capability；
4, the high conductance attribute of liquid metal makes it that the electromagnetic pump driving without any moving component, drive efficiency can be used
Height, noiseless, low energy consumption, thus performance is more reliable and more stable；
5, cooling air-flow is provided using forced air cooling device and blow to fin, guaranteeing the smaller premise of radiator overall dimensions
Under improve the cooling efficiency of fin.Air-flow only blows to fin, does not blow to inside equipment, therefore equipment can be used closed structure and set
Meter and external world's humidity, mould, salt fog air exclusion.
Detailed description of the invention
The invention will be described in more detail below based on embodiments and refering to the accompanying drawings.Wherein:
Fig. 1 is the working principle diagram of high-efficiency radiator according to the present invention；
Fig. 2 is the top view of high-efficiency radiator according to the present invention；
Fig. 3 is the perspective view of high-efficiency radiator according to the present invention；
Fig. 4 is the side view of high-efficiency radiator according to the present invention.
In the accompanying drawings, identical component uses identical appended drawing reference.Attached drawing is not according to actual ratio.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings.
Firstly, as shown in Figure 1, it provides a kind of high efficiency and heat radiation for closed structure high heat flux density device for the present invention
The working principle diagram of device.The working principle of the invention is: liquid metals pipeline 12 forms a circuit and it is filled with liquid
Body metal, be provided on liquid metals pipeline 12 heat sink 11 for absorbing closed structure heat-generating components inside heat,
Radiating fin 13 and heat sink for driving the transfer tube 2 of liquid metal flow and for radiating to liquid metals
14.When the liquid metals in liquid metals pipeline 12 is absorbed into heat from heat sink 11, radiating fin 13 and heat sink 14
It radiates jointly to liquid metals.In addition, the wherein side of the radiating fin 13 and heat sink 14 is additionally provided with forced wind
Device for cooling 3 further strengthens the heat dissipation effect to liquid metals for being radiated, being cooled down to radiating fin 13 and heat sink 14
Fruit.
Specifically, as shown in Figures 2 to 4, high-efficiency radiator of the invention includes at least: liquid metal self-loopa integration
Cold plate 1, transfer tube 2 and forced air cooling device 3.Wherein, the liquid metal self-loopa cold plate 1 includes heat sink 11, liquid
Body metallic conduit 12, radiating fin 13 and heat sink 14, especially as shown in Fig. 2, the liquid metals pipeline 12 can be used appoint
What shape bending extends through in the radiating fin 13, and the heat sink 14 is located at 13 lower section of radiating fin, institute
It states heat sink 11 and is located at 14 lower section of heat sink and the heat for absorbing closed structure heat-generating components inside.
Preferably, the shape of the liquid metals pipeline 12 needs to design according to structure design, and titanium alloy can be selected in pipeline
The metallic conduits such as pipe, stainless steel tube, copper pipe.
Wherein, liquid metal self-loopa integration cold plate 1 can be used the processing methods such as monoblock cast or welding and fill heat absorption
It sets 11, liquid metal pipeline 12, radiating fin 13 and heat sink 14 to be made of one, to maximize reduction system thermal resistance.Wherein,
The structure of liquid metal self-loopa integration cold plate 1 can be derived as the diversified forms such as cover board, cavity.
The transfer tube 2 is set on the liquid metals pipeline 12, and for driving in liquid metals pipeline 12
Liquid metal flow.Preferably, the transfer tube 2 is that electromagnetic pump, mechanical pump, piezoelectric pump or electrowetting pump, but not limited to this.
In addition, the forced air cooling device 3 may be disposed at the side of radiating fin 13, for dropping to radiating fin 13
Temperature, to cool down to the liquid metals of liquid metals pipeline 12.Preferably, the forced air cooling device 3 is piezoelectric ceramics
Fan, but not limited to this.High reliablity is selected, low energy consumption, and noise is small and structure size is small, the flexible forced air cooling of mounting means
Device is pointedly laid out to reach maximum radiating efficiency according to the specific constructive form of equipment.
The liquid metal is gallium, mercury, gallium base bianry alloy, the gallium based multicomponent alloy, gallium base that liquid can be presented at room temperature
Alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy.It should be noted that traditional liquid cooling heat radiation system makes heat-dissipating pipe using pump
In coolant liquid (water or organic solution) recycle and radiate.However, the liquid metal of flowing, which has, is much higher than nonmetallic stream
Therefore the thermal conductivity of body theoretically substitutes water using liquid metal, can obtain high heat-sinking capability.The present invention utilizes drive
Dynamic pump 2 drives liquid metal flows to complete Heat transmission, and efficiency of thermal transfer is controlled by liquid metal flux.
The advantages of set of the present invention liquid metal high-efficiency heat conduction technology and forced air cooling heat loss through convection technology, in conjunction with advanced
Technique devises a set of low energy consumption, small size, high reliability novel efficient heat radiator.The technical scheme is that sufficiently sharp
One self-loopa heat is formed using the liquid metal in transfer tube driving pipeline with the high thermal conductivity and mobility of liquid metal
Transport system is measured, the heat generated when liquid metal continuously works device takes to from radiating fin from heat sink,
Forced air cooling device provides high speed, the steady air flow of orientation blows to fin, and the heat in fin is distributed into surrounding air, from
And the temperature of liquid metal in pipeline is reduced, the liquid metal after cooling flows to heat sink again, recycles repeatedly, continues
Heat is taken away from chip constantly, achievees the effect that reduce device temperature.
In conclusion the present invention has the advantages that
1, using the processing methods such as monoblock cast or welding make liquid metal self-loopa cold plate, heat sink, heat sink,
Radiating fin, liquid metal pipeline are integrated, and farthest reduce system thermal resistance, and heat transfer efficiency is high；
2, liquid metal is not easy to evaporate, and is not easy to reveal, safe and non-toxic, and physico-chemical property is stablized, and easily recycles, be it is a kind of very
The flow working medium of safety, it is ensured that the efficient, long-term of cooling system, stable operation.The present invention designs liquid metal self-loopa
Pipe-line system is located at outside cover board, has prevented liquid leakage and has flowed to the danger for leading to PCB short circuit inside equipment；
3, liquid metal has the thermal conductivity much higher than water, air and many nonmetal mediums, therefore liquid metal heat radiation
The relatively traditional water cooling of device can realize more efficient heat transportation and limit heat-sinking capability；
4, the high conductance attribute of liquid metal makes it that the electromagnetic pump driving without any moving component, drive efficiency can be used
Height, noiseless, low energy consumption, thus performance is more reliable and more stable；
5, cooling air-flow is provided using forced air cooling device and blow to fin, guaranteeing the smaller premise of radiator overall dimensions
Under improve the cooling efficiency of fin.Air-flow only blows to fin, does not blow to inside equipment, therefore equipment can be used closed structure and set
Meter and external world's humidity, mould, salt fog air exclusion.
Although by reference to preferred embodiment, invention has been described, the case where not departing from the scope of the present invention
Under, various improvement can be carried out to it and can replace component therein with equivalent.Especially, as long as there is no structures to rush
Prominent, items technical characteristic mentioned in the various embodiments can be combined in any way.The invention is not limited to texts
Disclosed in specific embodiment, but include all technical solutions falling within the scope of the claims.
Claims (8)
1. a kind of radiator for closed structure high heat flux density device, it is characterised in that: including liquid metal self-loopa one
Body cold plate, the liquid metal self-loopa integration cold plate include liquid metals pipeline and radiating fin, the liquid gold
Metal conduit is filled with flowable liquid metals through in the radiating fin in the liquid metals pipeline；
The liquid metal self-loopa integration cold plate further includes heat sink, and the heat sink is located at below the radiating fin；
The liquid metal self-loopa integration cold plate further includes heat sink, and the heat sink is located at below the heat sink
And the heat for absorbing closed structure heat-generating components inside, the heat sink are arranged on liquid metals pipeline；
The structure of the liquid metal self-loopa integration cold plate is cover board or cavity form.
2. the radiator according to claim 1 for closed structure high heat flux density device, it is characterised in that: further include
Transfer tube, the transfer tube are set on the liquid metals pipeline and for driving the liquid metals in liquid metals pipeline
Flowing.
3. the radiator according to claim 1 for closed structure high heat flux density device, it is characterised in that: the liquid
State metallic conduit, radiating fin, heat sink and heat sink pass through monoblock cast or welded molding.
4. the radiator according to claim 1 for closed structure high heat flux density device, it is characterised in that: further include
Forced air cooling device, the forced air cooling device are set to the side of radiating fin and for cooling down to radiating fin.
5. the radiator according to claim 4 for closed structure high heat flux density device, it is characterised in that: described strong
Compeling air cooling equipment is Piezoelectric Ceramic Fan.
6. the radiator according to claim 1 for closed structure high heat flux density device, it is characterised in that: the liquid
State metal is the metal that liquid can be presented at room temperature.
7. the radiator according to claim 6 for closed structure high heat flux density device, it is characterised in that: the liquid
State metal is gallium, mercury, gallium base bianry alloy, gallium based multicomponent alloy, gallium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy.
8. the radiator according to claim 2 for closed structure high heat flux density device, it is characterised in that: the drive
Dynamic pump is electromagnetic pump, mechanical pump, piezoelectric pump or electrowetting pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710947362.5A CN107887356B (en) | 2017-10-12 | 2017-10-12 | A kind of radiator for closed structure high heat flux density device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710947362.5A CN107887356B (en) | 2017-10-12 | 2017-10-12 | A kind of radiator for closed structure high heat flux density device |
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| CN107887356A CN107887356A (en) | 2018-04-06 |
| CN107887356B true CN107887356B (en) | 2019-10-15 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109462162A (en) * | 2018-12-12 | 2019-03-12 | 云南电网有限责任公司电力科学研究院 | A kind of liquid metal heat radiation device |
| CN111629566B (en) * | 2020-06-12 | 2022-08-16 | 北京无线电测量研究所 | Piezoelectric driving liquid phase temperature equalizing device |
| CN113202714A (en) * | 2021-04-15 | 2021-08-03 | 恒大恒驰新能源汽车研究院(上海)有限公司 | Lighting device, heat dissipation assembly and driving pump |
| CN116581094B (en) * | 2023-05-10 | 2024-04-12 | 东莞宜安科技股份有限公司 | Liquid metal heat abstractor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203038911U (en) * | 2013-01-07 | 2013-07-03 | 北京依米康散热技术有限公司 | Heat radiation device based on liquid metal |
| CN104136873A (en) * | 2012-02-21 | 2014-11-05 | 华为技术有限公司 | Cooling system and method for cooling a heat generating unit |
| CN105914189A (en) * | 2016-04-20 | 2016-08-31 | 中国科学院理化技术研究所 | Microfluidic chip heat radiation device |
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- 2017-10-12 CN CN201710947362.5A patent/CN107887356B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104136873A (en) * | 2012-02-21 | 2014-11-05 | 华为技术有限公司 | Cooling system and method for cooling a heat generating unit |
| CN203038911U (en) * | 2013-01-07 | 2013-07-03 | 北京依米康散热技术有限公司 | Heat radiation device based on liquid metal |
| CN105914189A (en) * | 2016-04-20 | 2016-08-31 | 中国科学院理化技术研究所 | Microfluidic chip heat radiation device |
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