CN218941636U

CN218941636U - Heat dissipation mechanism of framework board card

Info

Publication number: CN218941636U
Application number: CN202223018836.3U
Authority: CN
Inventors: 李宇哲
Original assignee: Xi'an Shenzhou Feihang Technology Co ltd
Current assignee: Xi'an Shenzhou Feihang Technology Co ltd
Priority date: 2022-11-14
Filing date: 2022-11-14
Publication date: 2023-04-28
Anticipated expiration: 2032-11-14

Abstract

The utility model discloses a heat dissipation mechanism of a framework board card, which belongs to the technical field of heat dissipation in a closed environment, and comprises the following components: the clamping plate assembly comprises a plurality of vertically arranged clamping plates, an upper cover connected with the box body is arranged at the top of the clamping plate assembly, a lower cover connected with the box body is arranged at the bottom of the clamping plate assembly, a gap is reserved between the upper cover and the lower cover and the inner wall of the box body, and a heat dissipation channel is formed in the upper cover between adjacent clamping plates; a heat dissipation plate is arranged between the upper cover and the lower cover; the top of one side of the board card assembly is provided with a first fan arranged on the upper cover, and the bottom of the other side of the board card assembly is provided with a second fan arranged on the lower cover. This application is under airtight environment, through the fan and the upper cover and the lower cover that set up, forms a passageway of being convenient for the wind circulation with the box is inside, and hot-blast cooling that utilizes the heating panel when the lower cover is passed through, and hot-blast temperature reduces, blows out the back from the lower cover, and the fan by the upper cover top inhales again and circulates the cooling, realizes cooling to the panel card.

Description

Heat dissipation mechanism of framework board card

Technical Field

The utility model relates to the technical field of heat dissipation in a closed environment, in particular to a heat dissipation mechanism of a framework board card.

Background

At present, under a closed environment, two heat dissipation modes are adopted, one is pure cold conduction, a heat dissipation conduction plate is customized on each board card, heat of a heating element of the board card is conducted to a frame, and then the heat is conducted to a shell through the frame; the heat sink is customized by each board card in a pure conduction mode, so that the cost is high, the weight is large, and the efficiency is low.

And the heat of the board card is conducted to the outer side through the heat pipe, the inner part is also a closed space and isolated from the outer side, and the heat is taken away by using the radiating fins and the fan at the outer side. The mode is mainly used for notebook computers, and has the defect that the board card cannot move and is fixed.

However, the second heat dissipation method is not suitable for the structure of the CPCI board card, and the CPCI board card is characterized in that each board card is convenient to be independently inserted and removed and replaced, and the above problem exists in using one heat dissipation method.

In view of this, a new heat dissipation mechanism for a board card is designed.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model provides a heat dissipation mechanism for a framework board card, which comprises a board card assembly and a main board, wherein the board card assembly and the main board are arranged in a box body, the board card assembly comprises a plurality of vertically arranged board cards,

the top of the board card assembly is provided with an upper cover, the upper cover is connected with the inner wall of the box body, the bottom of the board card assembly is provided with a lower cover, the lower cover is connected with the bottom of the box body, gaps are reserved between the upper cover and the inner wall of the box body, and a heat dissipation channel is formed in the upper cover between adjacent clamping boards;

a heat dissipation plate is arranged between the upper cover and the lower cover and is positioned outside the upper cover and the board card assembly;

the top of one side of the board card assembly is provided with a first fan arranged on the upper cover, the main board is positioned below the first fan, and the bottom of the other side of the board card assembly is provided with a second fan arranged on the lower cover;

an air outlet which is opposite to the first fan is formed in the lower cover;

the first fan runs, wind with heat generated by the running of the main board flows out of the second fan from the air outlet through a gap between the lower cover and the inner wall of the box body, part of the wind blows to the first fan, a circulating air duct is integrally formed, and heat exchange is realized in the flowing of the wind; and the heat carried by the other part of wind is dissipated out of the box body through the heat dissipation pore canal.

Further, a display screen is arranged on one side of the top of the box body, and an operation panel is arranged on the top of the box body;

the operation panel and the display screen are respectively connected with a main board arranged in the box body.

Furthermore, a plurality of cooling fins are arranged between the lower cover and the bottom of the box body, and the cooling fins are arranged in parallel and have the same arrangement direction as the wind direction.

Furthermore, a plurality of heat dissipation grooves are formed in the bottom of the box body, and heat conduction rubber pads are arranged in the grooves.

Further, a plurality of ribs which are arranged in parallel are arranged on the outer surfaces of the two sides of the heat dissipation plate.

The utility model has the beneficial effects that:

through the hot air suction that sets up between the first fan with the integrated circuit board, then hot air gets into between lower cover and the bottom half along the air intake, hot-blast when passing the fin, give the fin with heat transfer, then the fin passes through the casing with heat transfer to external world, then the hot-blast operation of temperature reduction discharges in the lower cover through the second fan, flow to the heating panel outside, then a part wind takes place heat exchange with the casing of box, the wind after another part temperature reduction moves along the heating panel, blow to the upper cover top, be inhaled by first fan again, begin circulation secondary heat dissipation process, so reciprocating make the radiating effect of integrated circuit board promote.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of the overall structure provided by the present utility model;

FIG. 2 is a schematic view of the internal structure provided by the present utility model;

FIG. 3 is a schematic view of the structure of the upper cover provided by the utility model;

fig. 4 is a schematic view of the structure of the lower cover provided by the utility model.

Reference numerals: 1 is a box body, 2 is a board card, 3 is an upper cover, 4 is a lower cover, 5 is a heat dissipation plate, 6 is a first fan, 7 is a second fan, 8 is an operation panel, 9 is a display screen, and 10 is a heat dissipation plate.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the embodiments of the present utility model will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1 to 4, a heat dissipation mechanism of an architecture board card includes:

the clamping plate assembly and the main plate are arranged in the metal box body 1, the clamping plate assembly comprises a plurality of vertically arranged plate cards 2,

the top of the board card assembly is provided with an upper cover 3, the upper cover 3 is fixedly connected with the inner wall of the box body 1, the bottom of the board card assembly is provided with a lower cover 4, and the lower cover 4 is fixedly connected with the bottom of the box body 1; gaps are reserved between the upper cover 3, the lower cover 4 and the inner wall of the box body 1, and a heat dissipation channel is formed in the upper cover 3 between adjacent clamping plates 2;

wherein, the upper cover 3 and the lower cover 4 are provided with a plurality of opposite clamping grooves, and the board card 2 is correspondingly clamped between the two opposite clamping grooves;

a heat dissipation plate 5 is fixedly arranged between the upper cover 3 and the lower cover 4, and the heat dissipation plate 5, the upper cover 3 and the outer side of the board card assembly; the heat dissipation plate 5 is fixedly connected with the edges of the upper cover 3 and the lower cover 4, and a penetrating heat dissipation channel is formed in the top of the upper cover 3; the heat dissipation channel is used for transferring hot air between the boards and is sucked by the first fan; a heat dissipation channel, namely a notch between adjacent clamping grooves;

a first fan 6 mounted on the upper cover 3 is arranged at the top of one side of the board card assembly, the main board is positioned below the first fan 6, and a second fan 7 mounted on the lower cover 4 is arranged at the bottom of the other side of the board card assembly; the first fan and the second fan are silent fans, and the main function of the first fan is to blow the main board directly, and meanwhile, hot air between the boards is sucked and then sent into the lower cover;

a space is reserved between the lower cover 4 and the bottom of the box body 1, and an air outlet opposite to the first fan 6 is arranged on the lower cover 4;

the first fan 6 is operated, wind with heat generated by the operation of the main board flows out of the second fan 7 from the air outlet through a gap between the lower cover 3 and the inner wall of the box body, part of the wind blows to the first fan 6, a circulating air channel is integrally formed, and heat exchange is realized in the flowing of the wind; the heat carried by the other part of the wind is dissipated out of the box via the housing.

In some embodiments, a display screen 9 is hinged to one side of the top of the case, and an operation panel 8 is fixedly arranged on the top of the case 1;

the operation panel 8 and the display screen 9 are respectively electrically connected with a main board arranged in the box body 1.

The operation panel is equivalent to an operation keyboard of the notebook computer, and the display screen is used for displaying images; the inside top that is close to of box goes out to be provided with the mounting bracket, operating panel and mounting bracket fixed connection.

In some embodiments, a plurality of cooling fins 10 are disposed between the lower cover 4 and the bottom of the case 1, where the cooling fins 10 are disposed in parallel, and the direction of the arrangement is the same as the wind direction. The upper and lower sides of the cooling fin 10 are respectively connected with the lower cover 4 and the box 1.

The heat sink has the function of absorbing heat carried by hot air flowing through the surface of the heat sink; secondly, the absorbed heat is transmitted to the outside along the shell of the box body; specifically, when the hot air passes through the cooling fins, the heat is transferred to the cooling fins, then the cooling fins and the bottom shell of the box body are subjected to heat transfer, the heat is released from the shell at the bottom of the box body, and then the heat is transferred to the outside air, so that the temperature inside the box body is reduced.

In some embodiments, a plurality of heat dissipation grooves are formed in the bottom of the box 1, and heat-conducting rubber pads are arranged in the grooves.

The effect of the heat-conducting rubber pad is that the influence of the air with poor heat-conducting capacity is weakened, in addition, the metal cage is used for the box body, and therefore the capacity of conducting heat of the board card to the machine shell can be improved.

In some embodiments, a plurality of ribs arranged in parallel are arranged on the outer surfaces of two sides of the heat dissipation plate 5. The heat dissipation plate 5 is close to the heat dissipation pore canal on the side wall of the box body.

The heat dissipation plate has the functions that firstly, hot air between the boards is conveniently blown into the lower cover by matching with the first fan, so that the heat transfer process with the heat dissipation plate is convenient; and secondly, under the action of the first fan, heat between the boards is transferred to the inside of the box body, then a part of the heat is exchanged with the outside through the shell of the box body to reduce the temperature, and a part of the heat is used for cooling the boards by circulating air in the box body.

In the airtight state, the heat conductivity coefficient of air is: the heat conductivity coefficient of the aluminum alloy of 0.023W/m.k, 6061 is: 201W/m.k, the heat conductivity coefficient of the heat conducting rubber pad is: 3 to 11W/m.k. By contrast, air is very poor in heat transfer capability in a closed environment.

The thermal conductivity is 1m thick material under stable conditions, the temperature difference between the two side surfaces is 1 degree (K, °C), and the heat transferred through 1 square area is expressed in W/m.k in 1 hour. That is, the larger the unit area, the temperature difference and the time, the less heat is conducted, and the less heat is easily taken away.

Therefore, under the airtight condition, the thickness of the air from the heating device to the shell is reduced, and the heat conduction capacity is greatly improved by replacing the material with high heat conduction coefficient. The temperature around the chip can be more effectively ensured to be in a normal range.

All the adhesive heat conduction and heat transfer plate gaps are added with heat conduction rubber pads or heat conduction silicone grease, so that the influence of air with poor heat conduction capacity can be weakened. The box uses custom metal material, improves the ability of integrated circuit board heat to casing conduction.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.

Claims

1. A heat dissipation mechanism for an architecture board, comprising:

the clamping plate assembly and the main plate are arranged in the box body, the clamping plate assembly comprises a plurality of vertically arranged plate clamps,

the top of the clamping plate assembly is provided with an upper cover, the upper cover is connected with the inner wall of the box body, the bottom of the clamping plate assembly is provided with a lower cover, the lower cover is connected with the bottom of the box body, gaps are reserved between the upper cover and the inner wall of the box body, and a heat dissipation channel is formed in the upper cover between adjacent clamping plates;

a heat dissipation plate is arranged between the upper cover and the lower cover and is positioned outside the upper cover and the clamping plate assembly;

the top of one side of the clamping plate assembly is provided with a first fan arranged on the upper cover, the main board is positioned below the first fan, and the bottom of the other side of the clamping plate assembly is provided with a second fan arranged on the lower cover;

an air outlet which is opposite to the first fan is formed in the lower cover;

the first fan runs, wind with heat generated by the running of the main board flows out of the second fan from the air outlet through a gap between the lower cover and the inner wall of the box body, part of the wind blows to the first fan, a circulating air duct is integrally formed, and heat exchange is realized in the flowing of the wind; the heat carried by the other part of wind is dissipated out of the box body through the heat dissipation channel.

2. The heat dissipation mechanism of an architecture board card according to claim 1, wherein a display screen is arranged on one side of the top of the box body, and an operation panel is arranged on the top of the box body;

3. The heat dissipation mechanism of a board card according to claim 1, wherein a plurality of heat dissipation fins are arranged between the lower cover and the bottom of the box body, and the heat dissipation fins are arranged in parallel and have the same arrangement direction as the wind direction.

4. The heat dissipation mechanism of a board card according to claim 1, wherein a plurality of heat dissipation grooves are formed in the bottom of the box body, and heat conducting rubber pads are arranged in the grooves.

5. The heat dissipation mechanism of a shelf board as recited in claim 1, wherein,

and a plurality of ribs which are mutually parallel are arranged on the outer surfaces of the two sides of the heat dissipation plate.