CN102026520A - Radiation device - Google Patents

Radiation device Download PDF

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Publication number
CN102026520A
CN102026520A CN2009101770563A CN200910177056A CN102026520A CN 102026520 A CN102026520 A CN 102026520A CN 2009101770563 A CN2009101770563 A CN 2009101770563A CN 200910177056 A CN200910177056 A CN 200910177056A CN 102026520 A CN102026520 A CN 102026520A
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CN
China
Prior art keywords
blow vent
heat
passage
room
wind dispelling
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Granted
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CN2009101770563A
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Chinese (zh)
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CN102026520B (en
Inventor
洪银树
尹佐国
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Sunonwealth Electric Machine Industry Co Ltd
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Sunonwealth Electric Machine Industry Co Ltd
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Priority to CN 200910177056 priority Critical patent/CN102026520B/en
Publication of CN102026520A publication Critical patent/CN102026520A/en
Application granted granted Critical
Publication of CN102026520B publication Critical patent/CN102026520B/en
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Abstract

The invention discloses a radiation device, which comprises a shell, at least one heat-conducting plate and at least one fan unit, wherein the shell has a first accommodating space, the heat-conducting plate divides the accommodating space into a first accommodating chamber and a second accommodating chamber; the heat-conducting plate isolates the first accommodating chamber from the second accommodating chamber; the first accommodating chamber has a plurality of vents, and the second accommodating chamber is used for accommodating a plurality of electronic elements; the fan unit is arranged in the first accommodating chamber and has at least one air inlet and one air outlet, which are communicated with the two vents respectively; and because the heat-conducting plate absorbs the heat generated by the electronic elements and the fan unit forms a circulating air flow in the first accommodating chamber to continuously blow and cool the heat-conducting plate, the temperature of the second accommodating chamber and the temperature of the electronic elements are lowered, and the service life and stability of the electronic devices are protected against influences of dust impurity or aqueous vapor.

Description

Heat abstractor
Technical field
The present invention is about a kind of heat abstractor, especially a kind of heat abstractor of avoiding aqueous vapor and the running of dust impurity effect electronic component.
Background technology
Most electronic product all must with himself electronic component (for example: microprocessor or wafer ... etc.) concentrate and be placed in the shell spare, but fast lifting along with electronic product usefulness, add upper casing spare inner space and mostly be the not good confined space of ventilation and heat, cause electronic component when running, to be easy to generate high heat, cause the temperature of shell spare inner space also to raise easily, therefore in order to make electronic component can maintain normal operation under the suitable processing temperature, and prolonging its useful life, electronic product mostly utilizes heat abstractors such as fan or radiating fin that the electronic component of shell spare inner space is dispelled the heat.
A kind of heat abstractor of now using please refer to shown in Fig. 1 and 2, and it comprises a housing 7 and two fan units 8, and wherein this housing 7 has an accommodation space 71 and two assembly mouths 72, and this accommodation space 71 can be for several electronic components 9 are set.This two assembly mouth 72 selects to be opened in the end face and the side of this housing 7, and this two fan unit 8 correspondence respectively is arranged at this two assembly mouth 72.
When respectively this electronic component 9 continues running, the high temperature that this electronic component 9 produces can cause the temperature in this accommodation space 71 to rise gradually, by this wherein the extraneous normal temperature air of a fan unit 8 guiding enter in this accommodation space 71 and carry out heat exchange with this electronic component 9, the heat energy that this electronic component 9 of absorption of air is produced, and the high temperature air that utilizes this another fan unit 8 will finish heat exchange detaches this accommodation space 71 and is disposed to the external world, reach the purpose that in this accommodation space 71, forms the circulation heat radiation whereby, to promote the integral heat sink effect of these housing 7 inside.
Yet, because this now directly imports outside air in this accommodation space 71 via this fan unit 8 with heat abstractor and carries out heat exchange, but outside air mostly contains aqueous vapor or is mixed with dust impurity, so that aqueous vapor and dust also enter in this accommodation space 71 easily when this now circulates heat radiation with heat abstractor, and then cause this electronic component 9 to make moist or the situation of short circuit takes place, even can damage this electronic component 9, shorten the useful life of electronic product.For these reasons, aforementioned now have necessity of being improved really with heat abstractor.
Summary of the invention
The object of the present invention is to provide a kind of heat abstractor, it is variously now improved with the shortcoming of heat abstractor at above-mentioned, can effectively reduce the running of aqueous vapor or dust impurity effect electronic component, prolongs the useful life of electronic component.
Another object of the present invention is to provide a kind of heat abstractor, the heat energy that electronic component is produced is directed to another space and dispels the heat effectively.
A further object of the present invention is to provide a kind of heat abstractor, by the heat exchange area that increases between electronic component and the heat-conducting plate, to promote integral heat sink efficient.
For reaching aforementioned goal of the invention, technological means that the present invention used and the effect that can reach by this technological means include:
A kind of heat abstractor, it comprises a housing, at least one heat-conducting plate and at least one fan unit, this enclosure interior has an accommodation space, this heat-conducting plate is arranged in this accommodation space, and this accommodation space is divided into one first room and one second room, and this heat-conducting plate intercepts between this first room and second room, and this first room has several blow vents, this second room is in order to being installed with several electronic components, and direct or indirect being connected with this heat-conducting plate of this electronic component; This fan unit is arranged in this first room, and this fan unit has at least one air intake vent and at least one air outlet, the corresponding wherein blow vent that is communicated with this first room of this air intake vent, corresponding another blow vent that is communicated with this first room of this air outlet.
Above-mentioned heat abstractor, wherein this first room and this second room two rooms for not being interconnected.
Above-mentioned heat abstractor, wherein the quantity of this blow vent is two, and this first room is formed with a wind dispelling passage, and the two ends of this wind dispelling passage are connected with these two blow vents respectively.
Above-mentioned heat abstractor, wherein this fan unit includes one first fan unit and one second fan unit, this first fan unit and second fan unit are respectively equipped with an air intake vent and an air outlet, corresponding this one of them blow vent that is communicated with of the air intake vent of this first fan unit, corresponding this another blow vent that is communicated with of the air outlet of this second fan unit.
Above-mentioned heat abstractor, wherein this blow vent includes one first blow vent, second blow vent and one the 3rd blow vent, this first room is formed with a wind dispelling passage, the two ends of this wind dispelling passage are connected with this first blow vent and second blow vent respectively, the 3rd blow vent is formed at the side of this first room, and is connected with this wind dispelling passage.
Above-mentioned heat abstractor, wherein this fan unit has an air intake vent and an air outlet, corresponding the 3rd blow vent that is communicated with of this air intake vent, this air outlet is via corresponding this first blow vent that is communicated with of this wind dispelling passage.
Above-mentioned heat abstractor, wherein this first room is made of one first wind dispelling passage and one second wind dispelling passage, and this first wind dispelling passage is connected with this second wind dispelling passage.
Above-mentioned heat abstractor, wherein this blow vent includes one first blow vent and one second blow vent, and this first blow vent is positioned at an end of this first wind dispelling passage, and this second blow vent is positioned at an end of this second wind dispelling passage.
Above-mentioned heat abstractor, wherein this first wind dispelling passage and this second wind dispelling passage mutually the zone of intersection be an assembling district, this fan unit correspondence is arranged at this assembling district.
Above-mentioned heat abstractor, wherein this blow vent includes one the 3rd blow vent and a four-way gas port, and the 3rd blow vent and four-way gas port are formed at the top and the bottom in this assembling district respectively.
Above-mentioned heat abstractor, wherein this fan unit has one first air intake vent, second air intake vent, first air outlet and one second air outlet, corresponding the 3rd blow vent that is communicated with of this first air intake vent, corresponding this four-way gas port that is communicated with of this second air intake vent, this first air outlet is connected with this first blow vent via this first wind dispelling passage, and this second air outlet is connected with this second blow vent via this second wind dispelling passage.
Above-mentioned heat abstractor is wherein in the integrally formed accommodation space of being located at this housing of this heat-conducting plate.
Above-mentioned heat abstractor is wherein in the dismountable accommodation space that is arranged at this housing of this heat-conducting plate.
Above-mentioned heat abstractor, wherein heat-conducting plate is provided with several radiating fins, respectively be arranged in parallel between this radiating fin in this wind dispelling passage, and respectively this radiating fin extends towards the direction of this another blow vent from this one of them blow vent.
Above-mentioned heat abstractor, wherein heat-conducting plate is provided with several radiating fins, respectively be arranged in parallel between this radiating fin in this wind dispelling passage, and respectively this radiating fin extends towards the direction of this second blow vent from this first blow vent.
Above-mentioned heat abstractor, wherein heat-conducting plate is provided with several radiating fins, respectively is arranged in parallel between this radiating fin in this wind dispelling passage.
Therefore the present invention has following advantage compared to existing technology owing to have said structure:
The present invention absorbs the heat energy that the electronic component in this second room produces by this heat-conducting plate, and form circulating current via the fan unit in this first room this heat-conducting plate is continued the wind dispelling heat radiation, reduce this second room and temperature of electronic component whereby, and can avoid dust impurity or aqueous vapor to enter useful life and stability that this second room influences electronic product.
Description of drawings
Fig. 1 for now use heat abstractor perspective view;
Fig. 2 is existing partial sectional view of complying with 2-2 line shown in Figure 1 with heat abstractor;
Fig. 3 decomposes and perspective view for the solid of first embodiment of heat abstractor of the present invention;
Fig. 4 is top perspective and the air flow direction schematic diagram of first embodiment of heat abstractor of the present invention;
Fig. 5 is the side sectional view of heat abstractor of the present invention according to 5-5 line shown in Figure 4;
Fig. 6 decomposes and perspective view for the solid of second embodiment of heat abstractor of the present invention;
Fig. 7 is top perspective and the air flow direction schematic diagram of second embodiment of heat abstractor of the present invention;
Fig. 8 is the side sectional view of heat abstractor of the present invention according to 8-8 line shown in Figure 7;
Fig. 9 decomposes and perspective view for the solid of the 3rd embodiment of heat abstractor of the present invention;
Figure 10 is top perspective and the air flow direction schematic diagram of the 3rd embodiment of heat abstractor of the present invention.
[main element symbol description]
(the present invention)
1 housing, 11 accommodation spaces, 111 first rooms
112 second room 111a, the first wind dispelling passage 111b, the second wind dispelling passage
1,111 first blow vents, 1,112 second blow vents 1113 the 3rd blow vent
1114 four-way gas ports, 2 heat-conducting plates, 21 radiating fins
3 fan unit 3a, the first fan unit 3b, second fan unit
31 air intake vent 31a, the first air intake vent 31b, second air intake vent
32 air outlet 32a, the first air outlet 32b, second air outlet
9 electronic component H heat radiation conduit T assemble the district
(existing using)
7 housings, 71 accommodation spaces, 72 assembly mouths
8 fan units, 9 electronic components
Embodiment
For above-mentioned and other purpose of the present invention, feature and advantage can be become apparent, preferred embodiment of the present invention cited below particularly, and conjunction with figs. are described in detail below:
Please refer to shown in Figure 3, the heat abstractor of first embodiment of the invention be mainly used in generally coat internal electronic element by housing electronic product (for example: camera, electronics numerical digit player, notebook computer or Satellite Navigation Set ... etc.), it comprises a housing 1, at least one heat-conducting plate 2 and at least one fan unit 3, this housing 1 inside has an accommodation space 11, this heat-conducting plate 2 can be selected directly to be formed in this accommodation space 11 by integrally formed mode, perhaps dismountable assembling mode is arranged in this accommodation space 11, so that this accommodation space 11 is separated into two rooms, wherein a room is in order to be provided with this fan unit 3 for this, and this other room then in order to ccontaining several electronic components 9 (for example: circuit board, microprocessor or wafer etc.).In addition, the material of this heat-conducting plate 2 selects for use the metal material (for example: aluminium, copper, gold, silver or its alloy etc.) of the high capacity of heat transmission to make.
Heat-conducting plate 2 quantity of present embodiment are one, and this heat-conducting plate 2 is separated into one first room 111 and one second room 112 with this accommodation space 11, and this heat-conducting plate 2 intercepts between this first room 111 and second room 112.Be formed with one first wind dispelling passage 111a in this first room 111, be formed with several blow vents on this first room 111, wherein first room 111 of present embodiment selects to be provided with one first blow vent 1111 and one second blow vent 1112, this first blow vent 1111 is positioned at the end of this first wind dispelling passage 111a, and 1112 of this second blow vents are positioned at the other end of this first wind dispelling passage 111a.
This fan unit 3 is arranged in this first room 111, and can be chosen as tube-axial fan or blowing-type fan on demand, the fan unit 3 of present embodiment is selected from two tube-axial fans, it is respectively one first fan unit 3a and one second fan unit 3b, and this first fan unit 3a and the second fan unit 3b are arranged at the two ends of this first wind dispelling passage 111a respectively.This first fan unit 3a and one second fan unit 3b are respectively equipped with an air intake vent 31 and an air outlet 32, air intake vent 31 corresponding these first blow vents 1111 that are communicated with of this first fan unit 3a, 32 corresponding these second blow vents 1112 that are communicated with of the air outlet of this second fan unit 3b.
Please refer to shown in Fig. 3 to 5, when the heat abstractor of first embodiment of the invention is applied to electronic product, several electronic components 9 of electronic product are placed in second room 112 of this housing 1, wherein this portions of electronics element 9 directly is covered on a side of this heat-conducting plate 2, and other electronic components 9 that are not covered on these heat-conducting plate 2 one sides then can be selected to be connected with this heat-conducting plate 2 via a heat radiation conduit H (Heat Pipe) or other heat conducting elements.
Respectively this electronic component 9 is easy to generate high heat under operating state, cause the temperature in this second room 112 more and more higher, wherein this heat-conducting plate 2 can absorb the heat energy of electronic component 9 generations that are covered on the one side, perhaps this electronic component 9 sees through this heat radiation conduit H conduction and next heat energy, and makes the temperature of this heat-conducting plate 2 also raise relatively.At this moment, the air intake vent 31 of this first fan unit 3a sees through this first blow vent 1111 and introduces normal temperature air from the external world, and normal temperature air is sent in this first wind dispelling passage 111a by the air outlet 32 of this first fan unit 3a, continue to carry out heat exchange by normal temperature air, to reduce the temperature of this heat-conducting plate 2 with this heat-conducting plate 2; Then, the high temperature air of finishing heat exchange is inhaled into the air intake vent 31 of this second fan unit 3b, and be disposed to the external world, and then in this first wind dispelling passage 111a, form the circulation radiating airflow this heat-conducting plate 2 is continued to dispel the heat via the air outlet 32 of this second fan unit 3b.
The present invention mainly utilizes a side draught of this heat-conducting plate 2 to receive the heat energy that the electronic component 9 in this second room 112 produces, and in this first room 111, form circulating current via this fan unit 3 opposite side of this heat-conducting plate 2 is continued the wind dispelling heat radiation, reduce the temperature of this second room 112 and electronic component 9 whereby.In addition, because first room 111 of the present invention and second room 112 are two separate space, may be selected to be between this first room 111 and this second room 112 and be interconnected or be not communicated with mutually, and present embodiment selects this first room 111 not to be communicated with this second room 112 as execution mode, the dust impurity or the aqueous vapor that make this fan unit 3 suck from the external world can not enter in this second room 112, this electronic component 9 can be because of the influence of dust impurity or aqueous vapor short circuit or make moist, further prolong the useful life and the stability of electronic product.
Moreover, being arranged at electronic components 9 in this second room 112 can select directly to paste this heat-conducting plate 2 or indirectly via this heat radiation conduit H connected mode, the heat energy that this electronic component 9 is produced can the more direct and integral heat sink effect of the present invention of being dispelled the heat by heat conduction to this heat-conducting plate 2, and then effectively promote fast.
Please refer to shown in Figure 6ly, it discloses the heat abstractor of second embodiment of the invention.Compared to first embodiment, first room 111 of second embodiment is provided with one first blow vent 1111, one second blow vent 1112 and one the 3rd blow vent 1113, wherein this first blow vent 1111 is positioned at the end of this first wind dispelling passage 111a, 1112 of this second blow vents are positioned at the other end of this first wind dispelling passage 111a, the 3rd blow vent 1113 is formed at a wherein side (present embodiment is with first room, 111 end faces signal in the accompanying drawing) of this first room 111, and is connected with this first wind dispelling passage 111a; In addition, second blow vent 1112 of present embodiment can be assembled in the interior end of this first wind dispelling passage 111a for these fan unit 3 contrapositions.
Please refer to shown in Fig. 6 to 8, heat-conducting plate 2 sides of present embodiment are provided with several radiating fins 21, wherein respectively be arranged in parallel between this radiating fin 21 in this first wind dispelling passage 111a, and respectively this radiating fin 21 extends towards the direction of this second blow vent 1112 from this first blow vent 1111.This fan unit 3 is selected from a blowing-type fan, and it has an air intake vent 31 and an air outlet 32, these air intake vent 31 corresponding the 3rd blow vents 1113 that are communicated with, and 32 of this air outlets see through corresponding this first blow vent 1111 that is communicated with of this first wind dispelling passage 111a.
Present embodiment is received the heat energy that the electronic component 9 in this second room 112 produces by a side draught of this heat-conducting plate 2, this moment, the air intake vent 31 via this fan unit 3 imported normal temperature air from the external world, and the air outlet 32 that sees through this fan unit 3 is sent normal temperature air into this first wind dispelling passage 111a, so that normal temperature air is to this heat-conducting plate 2 and the heat radiation of radiating fin 21 wind dispellings, take away the heat energy of accumulating in this heat-conducting plate 2 and radiating fin 21, reduce the temperature of this heat-conducting plate 2, and the high temperature air of finishing heat exchange promptly directly drains into the external world via this first blow vent 1111.Whereby, the present invention can effectively reduce this second room 112 and be positioned at the temperature of its inner electronic component 9, and can avoid dust impurity or aqueous vapor to enter useful life and stability that this second room 112 influences electronic product.
Please refer to shown in Figure 9ly, it discloses the heat abstractor of third embodiment of the invention.Compared to second embodiment, the 3rd embodiment utilizes two heat-conducting plates 2 that this accommodation space 11 is separated into this first room 111 and second room 112, wherein this first room 111 is the L type room that one first wind dispelling passage 111a and one second wind dispelling passage 111b are constituted, and this first wind dispelling passage 111a is connected with this second wind dispelling passage 111b, this first wind dispelling passage 111a and this second wind dispelling passage 111b zone of intersection mutually are an assembling district T, for these fan unit 3 corresponding assemblings.This first room 111 has one first blow vent 1111, one second blow vent 1112, one the 3rd blow vent 1113 and a four-way gas port 1114, wherein this first blow vent 1111 is positioned at the end of this first wind dispelling passage 111a, this second blow vent 1112 is positioned at the end of this second wind dispelling passage 111b, 1114 corresponding respectively top and bottoms that are opened in this assembling district T of the 3rd blow vent 1113 and four-way gas port.In addition, the 3rd blow vent 1113 of present embodiment can be assembled in this assembling district T for these fan unit 3 contrapositions.
Moreover, the fan unit 3 of present embodiment has one first air intake vent 31a, one second air intake vent 31b, one first air outlet 32a and one second air outlet 32b, in this fan unit 3 is assembled in this assembling district T, corresponding the 3rd blow vent 1113 that is communicated with of this first air intake vent 31a; Corresponding this four-way gas port 1114 that is communicated with of this second air intake vent 31b; This first air outlet 32a is connected with this first blow vent 1111 via this first wind dispelling passage 111a; This second air outlet 32b is connected with this first blow vent 1112 via this second wind dispelling passage 111b.
Present embodiment absorbs the heat energy that the electronic component 9 in this second room 112 produces simultaneously by this two heat-conducting plate 2, import normal temperature air via this first air intake vent 31a and the second air intake vent 31b from the external world this moment, and see through this first air outlet 32a and the second air outlet 32b sends into normal temperature air respectively in this first wind dispelling passage 111a and the second wind dispelling passage 111b, so that normal temperature air is taken away the heat energy of accumulating in this two heat-conducting plate 2 to this two heat-conducting plates, 2 wind dispellings heat radiation, reduce the temperature of this two heat-conducting plate 2, and the high temperature air of finishing heat exchange can directly drain into the external world via this first blow vent 1111 and second blow vent 1112 respectively, in this first wind dispelling passage 111a and the second wind dispelling passage 111b, form circulating current respectively whereby, be positioned at electronic component 9 temperature of this second room 112 with reduction, and can avoid dust impurity or aqueous vapor to enter useful life and stability that this second room 112 influences electronic product.
Then, present embodiment utilizes this two heat-conducting plate 2 significantly to increase heat exchange area between itself and this second room 112 and the electronic component 9, the circulating current that forms in this first wind dispelling passage 111a and the second wind dispelling passage 111b respectively by this fan unit 3 carries out the wind dispelling heat radiation to this two heat-conducting plate 2 simultaneously, make the present invention can effectively promote whole radiating efficiency really, keep this electronic component 9 and under stable working temperature, operate.

Claims (16)

1. heat abstractor is characterized in that comprising:
A housing, inside have an accommodation space;
At least one heat-conducting plate is arranged in this accommodation space, and this accommodation space is divided into one first room and one second room, and this heat-conducting plate intercepts between this first room and second room, and this first room has several blow vents; And
At least one fan unit, be arranged in this first room, this fan unit has at least one air intake vent and at least one air outlet, a corresponding air intake vent, the air outlet of the corresponding connection of another blow vent of this first room of being communicated with of one of them blow vent of this first room.
2. heat abstractor according to claim 1 is characterized in that: this first room and this second room two rooms for not being interconnected.
3. heat abstractor according to claim 1 and 2 is characterized in that: the quantity of this blow vent is two, and this first room is formed with a wind dispelling passage, and the two ends of this wind dispelling passage are connected with these two blow vents respectively.
4. heat abstractor according to claim 3, it is characterized in that: this fan unit includes one first fan unit and one second fan unit, this first fan unit and second fan unit are respectively equipped with an air intake vent and an air outlet, corresponding this one of them blow vent that is communicated with of the air intake vent of this first fan unit, corresponding this another blow vent that is communicated with of the air outlet of this second fan unit.
5. heat abstractor according to claim 1 and 2, it is characterized in that: this blow vent includes one first blow vent, second blow vent and one the 3rd blow vent, this first room is formed with a wind dispelling passage, the two ends of this wind dispelling passage are connected with this first blow vent and second blow vent respectively, the 3rd blow vent is formed at the side of this first room, and is connected with this wind dispelling passage.
6. heat abstractor according to claim 5 is characterized in that: this fan unit has an air intake vent and an air outlet, corresponding the 3rd blow vent that is communicated with of this air intake vent, and this air outlet is via corresponding this first blow vent that is communicated with of this wind dispelling passage.
7. heat abstractor according to claim 1 and 2 is characterized in that: this first room is made of one first wind dispelling passage and one second wind dispelling passage, and this first wind dispelling passage is connected with this second wind dispelling passage.
8. heat abstractor according to claim 7, it is characterized in that: this blow vent includes one first blow vent and one second blow vent, this first blow vent is positioned at an end of this first wind dispelling passage, and this second blow vent is positioned at an end of this second wind dispelling passage.
9. heat abstractor according to claim 8 is characterized in that: this first wind dispelling passage and this second wind dispelling passage zone of intersection mutually are an assembling district, and this fan unit correspondence is arranged at this assembling district.
10. heat abstractor according to claim 9 is characterized in that: this blow vent includes one the 3rd blow vent and a four-way gas port in addition, and the 3rd blow vent and four-way gas port are formed at the top and the bottom in this assembling district respectively.
11. heat abstractor according to claim 10, it is characterized in that: this fan unit has one first air intake vent, second air intake vent, first air outlet and one second air outlet, corresponding the 3rd blow vent that is communicated with of this first air intake vent, corresponding this four-way gas port that is communicated with of this second air intake vent, this first air outlet is connected with this first blow vent via this first wind dispelling passage, and this second air outlet is connected with this second blow vent via this second wind dispelling passage.
12. heat abstractor according to claim 1 and 2 is characterized in that: this heat-conducting plate is integrally formed to be located in the accommodation space of this housing.
13. heat abstractor according to claim 1 and 2 is characterized in that: in the accommodation space that is arranged at this housing that this heat-conducting plate can be dismantled.
14. heat abstractor according to claim 3, it is characterized in that: this heat-conducting plate is provided with several radiating fins, respectively be arranged in parallel between this radiating fin in this wind dispelling passage, and respectively this radiating fin extends towards the direction of this another blow vent from this one of them blow vent.
15. heat abstractor according to claim 5, it is characterized in that: this heat-conducting plate is provided with several radiating fins, respectively be arranged in parallel between this radiating fin in this wind dispelling passage, and respectively this radiating fin extends towards the direction of this second blow vent from this first blow vent.
16. heat abstractor according to claim 7 is characterized in that: this heat-conducting plate is provided with several radiating fins, respectively is arranged in parallel between this radiating fin in this wind dispelling passage.
CN 200910177056 2009-09-18 2009-09-18 Radiation device Active CN102026520B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200910177056 CN102026520B (en) 2009-09-18 2009-09-18 Radiation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200910177056 CN102026520B (en) 2009-09-18 2009-09-18 Radiation device

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Publication Number Publication Date
CN102026520A true CN102026520A (en) 2011-04-20
CN102026520B CN102026520B (en) 2013-03-27

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102869209A (en) * 2011-07-08 2013-01-09 苏州徕卡节能电气技术有限公司 Independent air duct type power saving cabinet
CN103149992A (en) * 2012-12-28 2013-06-12 联宝(合肥)电子科技有限公司 Fan tandem type heat dissipation method and fan tandem type heat dissipation system
CN104684353A (en) * 2013-11-29 2015-06-03 Abb公司 Electric apparatus
CN109688768A (en) * 2018-12-29 2019-04-26 青岛小鸟看看科技有限公司 A kind of intelligent interaction device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2439977B (en) * 2006-07-07 2012-05-16 Trox Aitcs Ltd Cooling apparatus and methods for cooling
CN201528499U (en) * 2009-09-18 2010-07-14 建准电机工业股份有限公司 Heat radiating device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102869209A (en) * 2011-07-08 2013-01-09 苏州徕卡节能电气技术有限公司 Independent air duct type power saving cabinet
CN103149992A (en) * 2012-12-28 2013-06-12 联宝(合肥)电子科技有限公司 Fan tandem type heat dissipation method and fan tandem type heat dissipation system
CN104684353A (en) * 2013-11-29 2015-06-03 Abb公司 Electric apparatus
CN104684353B (en) * 2013-11-29 2017-07-21 Abb公司 Electrical equipment
CN109688768A (en) * 2018-12-29 2019-04-26 青岛小鸟看看科技有限公司 A kind of intelligent interaction device

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