CN212411147U - Small-space high-performance heat dissipation module and tablet computer - Google Patents
Small-space high-performance heat dissipation module and tablet computer Download PDFInfo
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- CN212411147U CN212411147U CN202021387250.2U CN202021387250U CN212411147U CN 212411147 U CN212411147 U CN 212411147U CN 202021387250 U CN202021387250 U CN 202021387250U CN 212411147 U CN212411147 U CN 212411147U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a satisfy little space high performance heat dissipation module and panel computer of small-size, big consumption, good installation, quick maintenance. The heat dissipation device comprises a hard disk heat dissipation cold plate, a CPU heat dissipation cold plate, a heat pipe and a fan module, wherein the CPU heat dissipation cold plate is attached to a CPU and a network chip, the hard disk heat dissipation cold plate is attached to a hard disk chip, the fan module comprises a mounting plate, a fan cover plate and heat dissipation fins) and a heat dissipation fan, the heat dissipation fins and the heat dissipation fan are detachably connected to the mounting plate, the fan cover plate is arranged on the heat dissipation fins and the heat dissipation fan, heat dissipation holes are formed in the fan cover plate, and the heat pipe is connected.
Description
Technical Field
The utility model relates to a heat dissipation module, concretely relates to little space high performance heat dissipation module can satisfy in the narrow and small space of panel computer, convenient dismantlement, and heat dispersion is high.
Background
The heat dissipation of the tablet computer generally utilizes a shell for heat dissipation, but the heat dissipation capability can only guarantee dozens of watts. Today tablet computers seek high performance, small size. High performance and high heating power consumption are encountered; small size, small heat dissipation space and insufficient heat dissipation capacity; small size, poor maintainability and assembly performance and the like.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that the heat dissipation space of above-mentioned current panel computer is little, the heat-sinking capability is not enough, the utility model provides a satisfy little space high performance heat dissipation module and panel computer of small-size, big consumption, good installation, fast maintenance.
The utility model discloses a realize above-mentioned purpose, realize through following technical scheme:
the utility model provides a little space high performance heat dissipation module, including hard disk heat dissipation cold drawing, CPU heat dissipation cold drawing, heat pipe and fan module, CPU heat dissipation cold drawing and CPU and network chip laminating, hard disk heat dissipation cold drawing and the laminating of hard disk chip, fan module includes mounting panel, fan apron, heat radiation fins) and radiator fan, heat radiation fins and radiator fan can dismantle the connection on the mounting panel, and set up the fan apron on heat radiation fins and the radiator fan, be equipped with the louvre on the fan apron, CPU heat dissipation cold drawing and fan apron are connected to the heat pipe.
Furthermore, an air duct accessory is arranged on the fan cover plate.
Furthermore, the heat pipe, the CPU heat dissipation cold plate and the fan cover plate are in gapless fit through a welding mode.
Furthermore, the CPU heat dissipation cold plate, the cover plate and the heat dissipation fins are of a welded integrated structure.
A tablet personal computer is provided with a small-space high-performance heat dissipation module, wherein the small-space high-performance heat dissipation module is arranged on a tablet computer shell, and heat dissipation fins are positioned at an air outlet from a heat dissipation fan to the tablet computer shell.
The utility model has the advantages that:
1. the heat of a CPU, a hard disk, a network chip and the like concentrated by high heat in the whole machine is taken away by a fan;
2. the form of detachable fan cover at the bottom is adopted, the space of the radiating fins is enlarged, and the radiating area is enlarged by more than 60%;
3. the heat pipe is used for rapidly conducting the heat at the high-heat position to the radiating fins;
4. and a reasonable assembly form is adopted, so that the installation, the disassembly, the maintenance and the like are convenient.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 shows a schematic view of the internal structure of a selected embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of FIG. 1B-B.
Fig. 3 is a schematic view of an external display according to a selected embodiment of the present invention.
Fig. 4 is a schematic diagram of a selected embodiment of the present invention (with the fan cover removed).
In the figure: 1 flat panel casing, 2 apron, 3 heat pipes, 4 hard disk heat dissipation cold drawing, 5 fasteners, 6 CPU heat dissipation cold drawing, 7 fan apron, 8 heat dissipation fins, 9 radiator fan, 10 wind channel accessories.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate directions
The positional or positional relationship is based on that shown in the drawings and is for convenience of description and simplicity of illustration only
The description as set forth is not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be taken as limiting the invention.
The utility model provides a little space high performance heat dissipation module, including hard disk heat dissipation cold drawing 4, CPU heat dissipation cold drawing 6, heat pipe 3 and fan module, CPU heat dissipation cold drawing 6 and laminating of CPU and network chip, hard disk heat dissipation cold drawing 4 and the laminating of hard disk chip through heat conduction silicone grease, realize its heat conduction to hard disk heat dissipation cold drawing 4, hard disk heat dissipation cold drawing 4 passes through fastener 5 and is connected with CPU heat dissipation cold drawing 6, the middle heat conduction pad that fills, the realization is conducted the heat on the hard disk heat dissipation cold drawing 4 to CPU heat dissipation cold drawing 6.
The fan module comprises a mounting plate 2, a fan cover plate 7, radiating fins 8 and a radiating fan 9, wherein the radiating fins 8 and the radiating fan 9 are detachably connected to the mounting plate 2, the fan cover plate 7 is arranged on the radiating fins 8 and the radiating fan 9, radiating holes are formed in the fan cover plate 7, the heat pipe 3 is connected with the CPU radiating cold plate 6 and the fan cover plate 7, gapless fit is achieved through welding, and heat is conducted from the CPU radiating cold plate 6 to the fan cover plate 7. The air duct auxiliary 10 is fixed to the fan cover 7. When the fan works, the heat on the radiating fins 8 is quickly taken away, so that the heat of a CPU (central processing unit), a network chip, a hard disk and the like in the whole machine is transferred to the air outside the machine, and good heat dissipation is realized.
In this embodiment, the heat pipe 3, the CPU heat dissipation cold plate 6, and the fan cover plate 7 are in gapless fit by welding. The CPU heat dissipation cold plate 6, the cover plate 7 and the heat dissipation fins 8 are of a welded integral structure.
A tablet computer is provided with a small-space high-performance heat dissipation module, the small-space high-performance heat dissipation module is arranged on a tablet computer shell 1, and heat dissipation fins 8 are located at an air outlet from a heat dissipation fan 9 to the tablet computer shell 1.
The heat dissipation capability of the heat dissipation module is determined by the heat conduction capabilities of the CPU heat dissipation cold plate 6, the hard disk heat dissipation cold plate 4, the heat pipe 3, the cover plate 7, the heat dissipation fins 8, and the like, the heat dissipation area of the heat dissipation fins 8, the wind speed and the wind pressure of the heat dissipation fan 9, and the like. Through calculation, the heat dissipation fan 9 meeting the heat dissipation requirement of 40W is selected, the air volume and the air pressure are ensured, but the heat dissipation area of the heat dissipation fins 8 cannot meet the requirement of processing due to the problem of structural size. Therefore, by designing the fan cover plate 7, the flat-plate case 1 can be processed from the bottom, so that the local wall thickness of the flat-plate case 1 is thinned to 2mm from the original 8mm, the original 10mm on the right side of the depth of the radiating fins 8 is increased to 16mm, the radiating area is increased by 60%, and the radiating capacity is correspondingly improved.
Although the above addresses the installation space of the radiator fins 8, actual assembly is not feasible. The CPU heat-dissipating cold plate 6, the cover plate 2 and the heat-dissipating fins 8 must be welded and installed into a whole before being assembled, and must be installed from the inside of the casing. The installation matching area of the flat-panel case 1 and the cover plate 2 interferes with the lengthened area of the radiating fins 8, the flat-panel case cannot be installed in place, and the air duct auxiliary 10 blocks the translation of the welding part. Therefore, the air duct auxiliary 10 is designed to be installed at the bottom and then installed, the air duct auxiliary 10 is fixed on the fan cover plate 7, and the air duct auxiliary 10 and the fan cover plate 7 can be installed in place after the welding part and the cooling fan 9 are installed, so that the difficult problem of installation is solved, and the rapid installation, the disassembly, the maintenance and the like of the utility model are realized.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a little space high performance heat dissipation module which characterized in that: including hard disk heat dissipation cold plate (4), CPU heat dissipation cold plate (6), heat pipe (3) and fan module, CPU heat dissipation cold plate (6) and CPU and network chip laminating, hard disk heat dissipation cold plate (4) and hard disk chip laminating and be connected with CPU heat dissipation cold plate (6), fan module includes mounting panel (2), fan apron (7), cooling fin (8) and radiator fan (9) can be dismantled and be connected on mounting panel (2), and set up fan apron (7) on cooling fin (8) and radiator fan (9), be equipped with the louvre on fan apron (7), CPU heat dissipation cold plate (6) and fan apron (7) are connected in heat pipe (3).
2. The small-space high-performance heat dissipation module as recited in claim 1, wherein: an air duct accessory (10) is arranged on the fan cover plate (7).
3. The small-space high-performance heat dissipation module as recited in claim 1, wherein: the heat pipe (3), the CPU heat dissipation cold plate (6) and the fan cover plate (7) are in gapless fit through welding.
4. The small-space high-performance heat dissipation module as recited in claim 1, wherein: the CPU heat dissipation cold plate (6), the cover plate (7) and the heat dissipation fins (8) are of a welding integrated structure.
5. A tablet computer, comprising: the small-space high-performance heat dissipation module of any one of claims 1 to 4 is disposed on the flat-panel housing (1), and the heat dissipation fins (8) are located at the air outlet from the heat dissipation fan (9) to the flat-panel housing (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021387250.2U CN212411147U (en) | 2020-07-15 | 2020-07-15 | Small-space high-performance heat dissipation module and tablet computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021387250.2U CN212411147U (en) | 2020-07-15 | 2020-07-15 | Small-space high-performance heat dissipation module and tablet computer |
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| Publication Number | Publication Date |
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| CN212411147U true CN212411147U (en) | 2021-01-26 |
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| CN202021387250.2U Active CN212411147U (en) | 2020-07-15 | 2020-07-15 | Small-space high-performance heat dissipation module and tablet computer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113534906A (en) * | 2021-09-15 | 2021-10-22 | 深圳市海邻科信息技术有限公司 | Tablet personal computer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113534906A (en) * | 2021-09-15 | 2021-10-22 | 深圳市海邻科信息技术有限公司 | Tablet personal computer |
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