CN218499463U - Heat radiation module - Google Patents
Heat radiation module Download PDFInfo
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- CN218499463U CN218499463U CN202221275517.8U CN202221275517U CN218499463U CN 218499463 U CN218499463 U CN 218499463U CN 202221275517 U CN202221275517 U CN 202221275517U CN 218499463 U CN218499463 U CN 218499463U
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- heat
- heat dissipation
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Abstract
The utility model discloses a heat dissipation module. The heat dissipation module comprises a heat dissipation piece and a heat conduction medium layer. The heat dissipation member is disposed around at least a portion of the layer of heat transfer medium, or the layer of heat transfer medium is disposed around at least a portion of the heat dissipation member, and a surface of the heat dissipation member is configured to be disposed adjacent to a heat generation source. The thickness of the heat-conducting medium layer is at least larger than that of the heat dissipation piece.
Description
Technical Field
The utility model relates to a heat dissipation module especially relates to a prevent excessive heat dissipation module of liquid metal fin.
Background
With the advancement of technology, the number of electronic components contained in electronic equipment is increasing, and the heat generated during the operation of the electronic components is increasing, so that the heat dissipation problem has become a problem to be solved by the manufacturers of electronic equipment.
At present, when liquid metal is used as a heat dissipation interface material, in order to prevent short circuit caused by liquid metal overflow and leakage, a silicon substrate paste material is often used around a heat source (such as a central processing unit or a graphic processor) to prevent leakage, or a dispensing method is used to cure surrounding parts to prevent short circuit.
However, the above method is time consuming in production and requires fixing the dispensing equipment, which increases the cost and time.
Therefore, how to improve the heat dissipation effect of the heat dissipation device by improving the structural design to overcome the above-mentioned defects has become one of the important issues to be solved by the industry.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that, not enough to prior art provides a heat radiation module.
In order to solve the above technical problem, the present invention provides a heat dissipation module, which includes a heat dissipation member and a heat conductive medium layer. The heat dissipation member is disposed around at least a portion of the layer of heat transfer medium, or the layer of heat transfer medium is disposed around at least a portion of the heat dissipation member, and a surface of the heat dissipation member is configured to be disposed adjacent to a heat generation source. The thickness of the heat conducting medium layer is at least larger than that of the heat dissipation piece.
Preferably, the ratio of the thickness of the heat-conducting medium layer to the thickness of the heat sink is 1.2 to 1.5.
Preferably, the heat dissipation member is formed of a liquid metal, and the heat conductive medium layer is formed of a paste-like heat dissipation paste.
Preferably, when the heat dissipation element is disposed around at least a portion of the heat conducting medium layer, the heat dissipation element has a hollow region, and the heat conducting medium layer is disposed in the hollow region.
Preferably, the hollow area is rectangular, circular, triangular or polygonal.
Preferably, a profile of the heat-conducting medium layer is aligned with a profile of the hollow area.
Preferably, a profile of the heat-conducting medium layer is smaller than a profile of the hollow area.
Preferably, a profile of the heat-conducting medium layer is greater than a profile of the hollow area.
Preferably, a ratio of an area of the heat conductive medium layer to an area of the heat sink is 0.1 to 0.15.
Preferably, the heat conductive medium layer is disposed in the vicinity of the heat generating source at an area corresponding to 5% to 15% of a central portion of the heat generating source.
Preferably, when the heat-conducting medium layer is disposed around at least a portion of the heat sink, the heat-conducting medium layer is disposed in the vicinity of the heat generating source at a position corresponding to 10% of the area of at least one side of the heat generating source.
The utility model has the advantages of the beneficial effects of the utility model provide a heat radiation module, it can be through "the heat dissipation piece sets up around at least partly heat conduction medium layer, or heat conduction medium layer sets up around at least partly heat dissipation piece, and the surface of heat dissipation piece is greater than at least with the thickness of neighbouring setting near the source that generates heat" and "heat conduction medium layer" the technical scheme of the thickness of heat dissipation piece to avoid the heat dissipation piece excessive, and can maintain the heat dispersion of heat dissipation piece. In addition, through the technical scheme, the anti-overflow leakage device can be directly led into the heat dissipation module, so that the design is simplified, the cost increase caused by the increase of equipment in a production line can be reduced, and the assembly time of the production line can be shortened.
For a further understanding of the nature and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are provided for reference and illustration purposes only and are not intended to limit the invention.
Drawings
Fig. 1 is a top view of a heat dissipation module according to a first embodiment of the present invention.
Fig. 2 is a side view of a heat dissipation module according to a first embodiment of the present invention.
Fig. 3 is another top view of the heat dissipation module according to the first embodiment of the present invention.
Fig. 4 is another top view of the heat dissipation module according to the first embodiment of the present invention.
Fig. 5 is a top view of a heat dissipation module according to a second embodiment of the present invention.
Fig. 6 is a side view of a heat dissipation module according to a second embodiment of the present invention.
Description of the reference numerals
1-a heat dissipation part, 11-a peripheral area, 12-a hollow area, 2-a heat conducting medium layer, 3-a heating source and 4-a support plate.
Detailed Description
The following is a description of the embodiments of the present invention relating to a "heat dissipation device" with specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present invention. The utility model discloses the concrete embodiment of accessible other differences is carried out or is used, and each item detail in this specification also can be based on different viewpoints and application, does not deviate from the utility model discloses a carry out various modifications and changes under the design. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
[ first embodiment ]
Referring to fig. 1 to 4, a first embodiment of the present invention provides a heat dissipation module, which includes: a heat sink 1 and a heat-conducting medium layer 2. The heat sink 1 is disposed around at least a portion of the heat conductive medium layer 2, and a surface of the heat sink 1 may be disposed adjacent to a heat generating source 3, for example, an upper surface or a lower surface of the heat sink 1 may be disposed adjacent to the heat generating source 3.
The heat sink 1 may include a heat dissipation material with a high heat dissipation coefficient, and has a first state and a second state. For example, the first state may be a solid state, and the second state may be a liquid state, which is not limited by the present invention. Specifically, when the heat sink 1 absorbs the heat energy generated by the operation of the heat generating source 3, the heat energy can be changed from the first state to the second state (for example, from a solid state to a liquid state). In a preferred embodiment, the heat sink 1 may be formed of a liquid metal. In addition, the heat dissipating member 1 has a thickness, the thickness of the heat dissipating member 1 can be adjusted according to a size of the heat source 3, in an embodiment, the thickness of the heat dissipating member 1 can be 0.1 millimeter (mm) to 2.0 millimeters (mm), which is not limited by the present invention.
Further, as shown in fig. 1, 3 and 4, the heat dissipating member 1 is a hollow frame structure, that is, the heat dissipating member 1 has a peripheral region 11 and a hollow region 12, the shape of the hollow region 12 can be rectangular, circular, triangular, polygonal, etc., and in a preferred embodiment, the shape of the hollow region 12 is rectangular.
The heat conductive medium layer 2 may include a paste-like heat dissipation paste. It is noted that the thermal conductivity of the paste-like thermal paste may be between 3W/mK and 5W/mK. In addition, the paste heat-dissipating paste may be formed by mixing a matrix and a filler, the matrix may be made of silicone resin, polyurethane or acrylate polymer, and the filler may be made of alumina, boron nitride, zinc oxide, aluminum nitride or magnesium oxide.
As described above, the heat sink 1 is disposed around the heat-conducting medium layer 2, that is, the heat-conducting medium layer 2 is disposed in the hollow region 12 of the heat sink 1. In a preferred embodiment, the heat-conducting medium layer 2 may be disposed in the hollow region 12 of the heat sink 1 by coating. As shown in fig. 1, the heat-conducting medium layer 2 may completely fill the hollow area 12 of the heat sink 1, i.e., the profile of the heat-conducting medium layer 2 is aligned with the profile of the hollow area 12 of the heat sink 1 when viewed from above the heat dissipation module. As shown in fig. 3, the heat-conducting medium layer 2 may not completely fill the hollow area 12 of the heat sink 1, i.e. the profile of the heat-conducting medium layer 2 is smaller than the profile of the hollow area 12 of the heat sink 1 when viewed from above the heat sink module. As shown in fig. 4, the heat-conducting medium layer 2 may also completely fill the hollow area 12 of the heat sink 1 and be applied to the upper surface (or lower surface) of the peripheral area 11 of the heat sink 1, i.e., the profile of the heat-conducting medium layer 2 is greater than the profile of the hollow area 12 of the heat sink 1 when viewed from above (or below) the heat sink module.
Further, the heat-conducting medium layer 2 has an area, and a ratio of the area of the heat-conducting medium layer 2 to the area of the heat sink 1 is 0.1 to 0.15, and in a preferred embodiment, a ratio of the area of the heat-conducting medium layer 2 to the area of the heat sink 1 is 0.12. In addition, the heat-conducting medium layer 2 has a thickness (i.e. the distance from the bottom surface to the top surface of the heat-conducting medium layer 2), and the thickness of the heat-conducting medium layer 2 is at least greater than that of the heat sink 1, and in a preferred embodiment, the ratio of the thicknesses of the heat-conducting medium layer 2 and the heat sink 1 is 1.2 to 1.5. Therefore, when the heat dissipation member 1 absorbs the heat energy generated by the operation of the heat source 3, the heat dissipation member 1 in the second state is changed from the first state to the second state (for example, from a solid state to a liquid state), and the heat dissipation member 1 in the second state can be mixed with the heat-conducting medium layer 2, so that the heat dissipation member 1 in the second state is concentrated toward the hollow region 12 through the viscosity of the heat-conducting medium layer 2, thereby preventing the heat dissipation member 1 in the second state from overflowing, and maintaining the heat dissipation performance of the heat dissipation member 1.
Further, since the heat-conductive medium layer 2 is disposed in the hollow region 12 of the heat sink 1, and the surface of the heat sink 1 is disposed adjacent to the heat generation source 3, the heat-conductive medium layer 2 is also disposed adjacent to the heat generation source 3. In the present embodiment, the heat conductive medium layer 2 may be disposed in the vicinity of the heat generating source 3 corresponding to at least a portion of the heat generating source 3. In a preferred embodiment, the heat conductive medium layer 2 is disposed in the vicinity of the heat generating source 3 at an area corresponding to 5% to 15% of the central portion of the heat generating source 3, and more preferably, the heat conductive medium layer 2 is disposed in the vicinity of the heat generating source 3 at an area corresponding to 10% to 12% of the central portion of the heat generating source 3. Therefore, when the heat sink 1 absorbs the heat energy generated by the operation of the heat source 3, the heat sink 1 is changed from the first state to the second state (for example, from a solid state to a liquid state), so that the heat sink 1 in the second state can be concentrated toward the hollow region 12, and the heat sink 1 in the second state is prevented from overflowing.
The heat source 3 may be a Central Processing Unit (CPU), a Graphic Processing Unit (GPU), a Microcontroller (MCU), a Microprocessor (MPU), an Application Specific Integrated Circuit (ASIC), or other electronic components, which is not limited by the present invention.
However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.
[ second embodiment ]
Referring to fig. 5 and 6, fig. 5 and 6 are a top view and a side view of a heat dissipation module according to a second embodiment of the present invention, respectively. The second embodiment is mainly different from the first embodiment in that the heat sink 1 has a structure without a hollow space, and the heat-conducting medium layer 2 is disposed around at least a portion of the heat sink 1. It should be noted that other structures of the heat dissipation module of the second embodiment are similar to those of the first embodiment, and are not described herein again.
Specifically, in the present embodiment, as shown in fig. 5, the heat dissipation member 1 may be disposed on two carrier plates 4 to form an H-shape in overall appearance, and the heat-conducting medium layer 2 may be disposed adjacent to at least a portion of the outer periphery of the heat dissipation member 1 by coating, in a preferred embodiment, the heat-conducting medium layer 2 is disposed on the upper side and the lower side of the outer periphery of the heat dissipation member 1, that is, the heat-conducting medium layer 2 is disposed in the upper and lower recesses of the H-shape. Therefore, when the heat sink 1 absorbs the heat energy generated by the operation of the heat source 3, the heat sink 1 is changed from the first state to the second state (for example, from a solid state to a liquid state), so as to prevent the heat sink 1 in the second state from overflowing from the upper and lower H-shaped recesses. It is noted that, as shown in fig. 6, the heat sink 1 may also be disposed adjacent to the heat generating source 3 without passing through the carrier plate 4. Furthermore, the heat-conductive medium layer 2 may also be disposed adjacent to the entire periphery of the heat sink 1, that is, the heat-conductive medium layer 2 may be disposed around the entire heat sink 1.
In addition, as shown in fig. 6, the heat-conducting medium layer 2 has a thickness, and the thickness of the heat-conducting medium layer 2 is at least greater than that of the heat sink 1, and in a preferred embodiment, the ratio of the thicknesses of the heat-conducting medium layer 2 and the heat sink 1 is 1.2 to 1.5. Therefore, when the heat sink 1 absorbs the heat energy generated by the operation of the heat source 3, the heat sink 1 is changed from the first state to the second state (for example, from a solid state to a liquid state), and the heat sink 1 having the second state can be mixed with the heat-conducting medium layer 2, so as to prevent the heat sink 1 having the second state from overflowing through the surrounding arrangement of the heat-conducting medium layer 2.
Further, since the heat conductive medium layer 2 is disposed around at least a portion of the heat sink 1, the heat conductive medium layer 2 may be disposed in the vicinity of the heat generating source 3 corresponding to at least a portion of the heat generating source 3. In a preferred embodiment, the heat-conducting medium layer 2 is disposed near the heat-generating source 3 at a position corresponding to 5% to 15% of the area of at least one side of the heat-generating source 3, and more preferably, the heat-conducting medium layer 2 is disposed near the heat-generating source 3 at a position corresponding to 10% of the area of at least one side of the heat-generating source 3. Therefore, when the heat sink 1 absorbs the heat energy generated by the operation of the heat source 3, the heat sink 1 is changed from the first state to the second state (for example, from a solid state to a liquid state), so as to enhance the surrounding arrangement of the heat-conducting medium layer 2 and prevent the heat sink 1 in the second state from overflowing.
However, the above-mentioned example is only one of the possible embodiments and is not intended to limit the present invention.
[ advantageous effects of embodiments ]
The utility model discloses an one of them beneficial effect lies in, the utility model provides a heat radiation module, it can be through "the radiating piece sets up around at least some heat conduction medium layer, or the heat conduction medium layer sets up around at least some heat dissipation spare, and the surface of radiating piece is greater than at least with the thickness of adjacent setting near the source that generates heat" and "heat conduction medium layer" the technical scheme of the thickness "of radiating piece to avoid the radiating piece excessive, and can maintain the heat dispersion of radiating piece. In addition, through the technical scheme, the anti-overflow leakage device can be directly led into the heat dissipation module, so that the design is simplified, the cost increase caused by the increase of equipment in a production line can be reduced, and the assembly time of the production line can be shortened.
The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention, so that all the equivalent technical changes made by the contents of the specification and the drawings are included in the scope of the claims of the present invention.
Claims (11)
1. A heat dissipation module, comprising:
a heat sink; and
a heat conducting medium layer;
wherein the heat dissipation element is disposed around at least a portion of the layer of heat conductive medium, or the layer of heat conductive medium is disposed around at least a portion of the heat dissipation element, and a surface of the heat dissipation element is configured to be disposed adjacent to a heat source;
wherein, a thickness of the heat conducting medium layer is at least larger than a thickness of the heat dissipation member.
2. The heat dissipation module of claim 1, wherein the ratio of the thickness of the layer of heat-conducting medium to the thickness of the heat dissipation member is 1.2 to 1.5.
3. The heat dissipation module of claim 1, wherein the heat dissipation element is formed of a liquid metal, and the layer of heat conductive medium is formed of a paste-like thermal paste.
4. The heat dissipation module of claim 1, wherein when the heat dissipation element is disposed around at least a portion of the layer of heat conductive medium, the heat dissipation element has a hollow region, and the layer of heat conductive medium is disposed in the hollow region.
5. The heat dissipation module of claim 4, wherein the hollow area is rectangular, circular, or triangular.
6. The heat dissipation module of claim 4, wherein a profile of the thermal medium layer is aligned with a profile of the hollow area.
7. The heat dissipation module of claim 4, wherein a profile of the thermal medium layer is smaller than a profile of the hollow area.
8. The heat dissipation module of claim 4, wherein a profile of the layer of heat-conducting medium is greater than a profile of the hollow region.
9. The heat dissipation module of claim 4, wherein a ratio of an area of the layer of heat conductive medium to an area of the heat dissipation member is 0.1 to 0.15.
10. The heat dissipation module according to claim 4, wherein the heat conductive medium layer is disposed in the vicinity of the heat generation source at an area corresponding to 5% to 15% of a central portion of the heat generation source.
11. The heat dissipation module of claim 1, wherein when the heat conductive medium layer is disposed around at least a portion of the heat dissipation member, the heat conductive medium layer is disposed in the vicinity of the heat generation source at a position corresponding to 10% of an area of at least one side of the heat generation source.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111204554U TWM631518U (en) | 2022-05-04 | 2022-05-04 | Heat dissipation module |
| TW111204554 | 2022-05-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218499463U true CN218499463U (en) | 2023-02-17 |
Family
ID=84613195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221275517.8U Active CN218499463U (en) | 2022-05-04 | 2022-05-25 | Heat radiation module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN218499463U (en) |
| TW (1) | TWM631518U (en) |
-
2022
- 2022-05-04 TW TW111204554U patent/TWM631518U/en unknown
- 2022-05-25 CN CN202221275517.8U patent/CN218499463U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM631518U (en) | 2022-09-01 |
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