CN217508588U

CN217508588U - Power module, power supply controller and electric vehicle

Info

Publication number: CN217508588U
Application number: CN202221654643.4U
Authority: CN
Inventors: 陶黎
Original assignee: Suzhou Huichuan United Power System Co Ltd
Current assignee: Suzhou Huichuan United Power System Co Ltd
Priority date: 2022-06-29
Filing date: 2022-06-29
Publication date: 2022-09-27
Anticipated expiration: 2032-06-29

Abstract

The utility model discloses a power module, a power controller and an electric vehicle, wherein the power module comprises an MOS tube, a heat dissipation component, a first heat conduction layer and a first fixing adhesive layer, the heat dissipation component is provided with a heat dissipation surface, the heat dissipation surface is provided with an installation position, the MOS tube is arranged at the installation position, the first heat conduction layer is clamped between the heat dissipation surface and the MOS tube, the first fixing adhesive layer is arranged at the heat dissipation surface and is abutted against the side edge of the MOS tube, the first fixing adhesive layer is used for limiting the MOS tube at the installation position after curing, thus, the limit arrangement of the MOS tube on the heat dissipation surface is realized after the first fixing adhesive layer is cured, the MOS tube is ensured to be limited at the installation position and not to generate position deviation in the subsequent heat curing process, thus, the limit tool in the existing scheme can be replaced by the first fixing adhesive layer, the MOS tubes with different sizes can be limited by the first fixing adhesive layer, thereby reducing the production cost of the workshop.

Description

Power module, power supply controller and electric vehicle

Technical Field

The utility model relates to a power electron device technical field, in particular to power module, electrical source controller and electric vehicle.

Background

The MOS tube of the power module generates a certain amount of heat during the operation process, so that the MOS tube needs to be fixedly mounted on the radiator, and the single tube module is cooled by the radiator.

At present in the course of working, because need be to the first heat-conducting layer between MOS pipe and the radiator, for example, just can guarantee MOS pipe fixed mounting on the radiator after carrying out the thermosetting to heat conduction silicone grease, consequently need carry on spacingly to the MOS pipe before the thermosetting, avoid thermosetting in-process MOS pipe to take place the offset, but current mode all carries on spacingly to the MOS pipe through spacing frock, lead to when the MOS pipe size is different, need corresponding different spacing frock of setting up to carry on spacingly to the MOS pipe of not unidimensional, thereby lead to the increase of workshop manufacturing cost.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a power module aims at through setting up first fixed glue film between MOS pipe and radiator unit to realize realizing through first fixed glue film solidification that current MOS pipe spacing needs on radiator unit realizes spacingly through spacing frock through spacing setting up on radiator unit, leads to the technical problem that workshop manufacturing cost increases.

In order to achieve the above object, the utility model provides a power module, power module includes MOS pipe, radiator unit, first heat-conducting layer and first fixed glue film, radiator unit has the cooling surface, the cooling surface is equipped with the installation position, the MOS pipe is located the installation position, first heat-conducting layer clamp is located the cooling surface with between the MOS pipe, first fixed glue film is located the cooling surface, and the butt in the side of MOS pipe, first fixed glue film makes after being used for the solidification MOS pipe is spacing to be located the installation position.

Optionally, the MOS transistor includes a tube main body and a plurality of pins, the tube main body is disposed at the mounting location, the first thermal conductive layer is sandwiched between the heat dissipation surface and the tube main body, the first fixing adhesive layer abuts against a side edge of the tube main body, and the plurality of pins are mounted on the tube main body and electrically connected to the tube main body.

Optionally, the pipe main body is of a square structure and has at least one group of opposite angles, two sides of the pipe main body are arranged, one side of the pipe main body is arranged at the opposite angle of the pipe main body, and the first fixing glue layer is arranged at the opposite angle of the pipe main body.

Optionally, the number of the MOS tubes is at least two, the heat dissipation assembly has a length direction, and the at least two MOS tubes are arranged at intervals along the length direction of the heat dissipation assembly.

Optionally, the number of the heat dissipation surfaces is two, the two heat dissipation surfaces are arranged on two opposite sides of the heat dissipation assembly, the number of the MOS tubes is at least two, and one of the MOS tubes is correspondingly arranged on one of the heat dissipation surfaces of the heat dissipation assembly.

Optionally, the heat dissipation assembly includes a heat sink and a heat conducting insulator, the heat conducting insulator is disposed on the heat sink and forms the heat dissipation surface, and the first heat conducting layer is sandwiched between the heat conducting insulator and the MOS tube.

Optionally, the power module further includes a second heat conduction layer and a second fixing adhesive layer, the second heat conduction layer is clamped between the heat sink and the heat conduction insulating member, the second fixing adhesive layer is arranged on the heat sink and abutted against the side of the heat conduction insulating member, and the second fixing adhesive layer is used for enabling the heat conduction insulating member to be limited on the heat sink after being cured.

Optionally, the heat conducting insulating member is of a square structure and has at least one set of opposite angles, two sides of the heat conducting insulating member are provided, one side of the heat conducting insulating member is provided at one opposite angle of the heat conducting insulating member, and the second fixing adhesive layer is provided at the opposite angle of the heat conducting insulating member.

Optionally, the heat conducting insulator is a ceramic sheet or an aluminum substrate.

Optionally, the first fixing adhesive layer and/or the second fixing adhesive layer is UV adhesive.

Optionally, the heat conducting insulating member is a heat conducting adhesive film, one film surface of the heat conducting adhesive film is adhered to the first heat conducting layer, and the other film surface of the heat conducting adhesive film is adhered to the heat dissipating surface.

To achieve the above object, an embodiment of the present invention provides a power supply controller, which includes the power module as described above.

To achieve the above object, an embodiment of the present invention provides an electric vehicle including the power supply controller as described above.

The utility model discloses technical scheme is through setting up radiator unit's cooling surface with first fixed glue film, and the butt in the side of MOS pipe, thereby after solidifying through first fixed glue film, realize the spacing setting of MOS pipe on the cooling surface, guarantee at follow-up thermosetting in-process, the MOS pipe can spacing setting on the installation position and can not take place the offset, so, the spacing frock in the current scheme is replaced to the first fixed glue film of accessible, alright carry on spacingly to not unidimensional MOS pipe through first fixed glue film, thereby can reduce the manufacturing cost in workshop.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the power module of the present invention;

fig. 2 is a schematic structural diagram of another embodiment of the power module of the present invention;

FIG. 3 is a cross-sectional schematic view of the power module shown in FIG. 2;

fig. 4 is a schematic structural diagram of another embodiment of the power module of the present invention;

fig. 5 is a schematic structural diagram of another embodiment of the power module of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Power module	333	Ceramic wafer
10	MOS tube	335	Aluminum substrate
				11	Tube body	337	Heat-conducting adhesive film
13	Pin	40	The first heat conducting layer
				30	Heat radiation assembly	50	First fixed glue layer
31	Heat radiator	70	The second heat conducting layer
				33	Heat conduction insulating part	90	Second fixed glue layer
331	Heat radiation surface

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a power module 100.

In the embodiment of the present invention, as shown in fig. 1 to fig. 5, the power module 100 includes a MOS Transistor 10(MOSFET, Metal-Oxide-Semiconductor Field-Effect Transistor), a heat dissipation assembly 30, a first heat conduction layer 40 and a first fixing adhesive layer 50, the heat dissipation assembly 30 has a heat dissipation surface 331, the heat dissipation surface 331 is provided with an installation position, the MOS Transistor 10 is provided with the installation position, the first heat conduction layer 40 is clamped between the heat dissipation surface 331 and the MOS Transistor 10, the heat dissipation surface 331 is provided with the first fixing adhesive layer 50, and is abutted against the side of the MOS Transistor 10, and the first fixing adhesive layer 50 is used for limiting the MOS Transistor 10 in the installation position after being cured.

In this embodiment, it can be understood that the first heat conduction layer 40 may be a heat conductive silicone grease or a heat conductive solder paste, the MOS transistor 10 is fixedly disposed on the heat dissipation assembly 30, and the generated heat is dissipated through the heat dissipation assembly 30, so that the MOS transistor 10 is fixedly disposed on the heat dissipation assembly 30 through the first heat conduction layer 40, and the first heat conduction layer 40 has high thermal conductivity and insulation property, but since the first heat conduction layer 40 needs to be thermally cured to fix the MOS transistor 10 on the heat dissipation assembly 30, the first adhesive layer 50 needs to be disposed before thermal curing to limit the MOS transistor 10.

The technical scheme of this application is through being provided with first fixed glue film 50 under the thermocuring condition still not at first heat-conducting layer 40 to through solidifying first fixed glue film 50, make first fixed glue film 50 can make the spacing setting of MOS pipe 10 on heat radiation component 30's installation position after the solidification, thereby follow-up thermocuring in-process to first heat-conducting layer 40, guarantee that MOS pipe 10 can not take place the offset. Compared with the prior art, the MOS tube 10 is limited by the limiting tool, the technical scheme of the application does not need to arrange different limiting tools to limit the MOS tubes 10 with different sizes, and only needs to confirm the position between the MOS tube 10 and the heat dissipation assembly 30 and then arrange the first fixing adhesive layer 50, thereby improving the universality of the first fixing adhesive layer 50, reducing the design of the limiting tool, simplifying the flow of a workshop production line, reducing the production cost, and improving the mounting precision of the MOS tube 10 and the heat dissipation assembly 30 because the limiting tool and the MOS tube 10 are arranged on the limiting tool and have tolerance, in addition, because the limiting tool is cancelled, when the model of the MOS tube 10 is changed, only the arrangement mode of the first fixing adhesive layer 50 needs to be changed, the limiting tool does not need to be manufactured or replaced again, and the production efficiency of a workshop is improved, and when carrying out the thermosetting to first heat-conducting layer 40, need not to take spacing frock again and carry out the thermosetting to can reduce curing equipment's utilization ratio, thereby can reduce curing equipment's energy consumption.

In an embodiment of the present invention, referring to fig. 2, the MOS transistor 10 includes a tube main body 11 and a plurality of pins 13, the tube main body 11 is disposed at the mounting position, the first heat conduction layer 40 is sandwiched between the heat dissipation surface 331 and the tube main body 11, the first fixing adhesive layer 50 abuts against the side of the tube main body 11, and the plurality of pins 13 are disposed on the tube main body 11 and electrically connected to the tube main body 11.

In this embodiment, the MOS transistor 10 includes the main body 11 and the plurality of pins 13, the connection between the main body 11 and the pins 13 may be an integrated structure or a split structure, and it can be understood that the main body 11 is attached to the mounting position of the heat dissipating surface 331, so that the first heat conducting layer 40 is clamped between the heat dissipating surface 331 and the main body 11 under the condition that the heat of the whole MOS transistor 10 is transferred to the heat dissipating assembly 30 through the main body 11 to achieve heat dissipation, and therefore, the side of the first adhesive layer 50 abuts against the side of the main body 11, thereby achieving the limiting effect on the main body 11. Here, the number of the leads 13 is two or three, and the like, and is not limited herein.

In an embodiment of the present invention, referring to fig. 2, the tube body 11 is a square structure and has at least one set of opposite angles, two sides of the tube body 11 are provided, one side of the tube body 11 is disposed at the opposite angle of the tube body 11, and the first fixing glue layer 50 is disposed at the opposite angle of the tube body 11.

In this embodiment, because pipe main part 11 is square structure, consequently pipe main part 11 has a set of diagonal angle, when first fixed glue film 50 carries on spacingly to the side of a set of diagonal angle department, can guarantee that it is spacing by first fixed glue film 50 on 11 relative both sides of pipe, when having guaranteed spacing effect, reduce the quantity to first fixed glue film 50, reduce the manufacturing cost in workshop. And when the pipe main part 11 has two sets of diagonal angles, and when the line cross arrangement of two sets of diagonal angles, first fixed glue film 50 can carry on spacingly to the side of two sets of diagonal angles, can guarantee the side of two sets of diagonal angles of pipe main part 11, and whole homoenergetic promptly can be carried on spacingly by first fixed glue film 50, improves the spacing effect to pipe main part 11.

In an embodiment of the present invention, as shown in fig. 1 to fig. 2, the number of the MOS transistors 10 is at least two, the heat dissipation assembly 30 has a length direction, and the at least two MOS transistors 10 are arranged at intervals along the length direction of the heat dissipation assembly 30.

In this embodiment, the number of the MOS transistors 10 may be two, three or four, and the number of the MOS transistors 10 is specifically limited, and the number of the MOS transistors 10 may be selected according to the requirement of the power module 100, and when at least two MOS transistors 10 are arranged at intervals along the length direction of the heat dissipation assembly 30, the space in the length direction of the heat dissipation assembly 30 can be reasonably utilized, and the space in other directions is reduced, so that the space utilization rate of the power module 100 can be rationalized.

In an embodiment of the present invention, there are two heat dissipation surfaces 331, two heat dissipation surfaces 331 are disposed on two opposite sides of the heat dissipation assembly 30, at least two MOS transistors 10 are disposed, and one MOS transistor 10 is disposed on one heat dissipation surface 331 of one heat dissipation assembly 30.

In this embodiment, the two heat dissipation surfaces 331 are disposed on two opposite sides of the heat dissipation assembly 30, that is, the heat dissipation assembly 30 has a width direction, and the two heat dissipation surfaces 331 are disposed on two sides of the heat dissipation assembly 30 along the width direction and both can have heat dissipation performance, so that the heat dissipation assembly 30 has the two heat dissipation surfaces 331 to realize heat dissipation of the MOS transistor 10, thereby making full use of the heat dissipation performance of the heat dissipation assembly 30 and improving the utilization rate of the heat dissipation assembly 30.

In an embodiment of the present invention, referring to fig. 1 to 3, the heat dissipation assembly 30 includes a heat sink 31 and a heat conductive insulating member 33, the heat conductive insulating member 33 is disposed on the heat sink 31, the heat dissipation surface 331 is formed on the heat conductive insulating member 33, and the first heat conduction layer 40 is sandwiched between the heat conductive insulating member 33 and the MOS tube 10.

In this embodiment, the heat dissipation assembly 30 includes a heat sink 31 and a heat conducting insulator 33, it is understood that the heat sink 31 may be a liquid cooling heat sink or an air cooling heat sink, the heat conducting insulator 33 may be a ceramic plate 333, an aluminum substrate 335, or a heat conducting adhesive film 337, when the MOS tube 10 is disposed on the heat dissipation surface 331 of the heat conducting insulator 33, the MOS tube 10 can be fixedly disposed on the heat dissipation surface 331 through the first heat conducting layer 40, and therefore the first fixing adhesive layer 50 is disposed on the heat dissipation surface 331 of the heat conducting insulator 33 and abuts against a side edge of the MOS tube 10, so as to achieve a limit arrangement of the MOS tube 10 on the heat dissipation surface 331 of the heat conducting insulator 33.

In an embodiment of the present invention, referring to fig. 1 and fig. 3, the power module 100 further includes a second heat conduction layer 70 and a second fixing adhesive layer 90, the second heat conduction layer 70 is sandwiched between the heat sink 31 and the heat conducting insulating member 33, the second fixing adhesive layer 90 is disposed on the heat sink 31 and abuts against the side of the heat conducting insulating member 33, and the second fixing adhesive layer 90 is used for limiting the heat conducting insulating member 33 on the heat sink 31 after being cured.

In this embodiment, after the MOS transistor 10 is attached to the heat conducting and insulating member 33, the heat conducting and insulating member 33 needs to be fixedly attached to the heat sink 31, and thus the second heat conducting layer 70 needs to be disposed to ensure the fixed connection between the heat conducting and insulating member 33 and the heat sink 31, and therefore, before the second heat conducting layer 70 is not thermally cured, the second adhesive layer 90 needs to be disposed to limit the position of the heat conducting and insulating member 33 on the heat sink 31. The second heat conduction layer 70 may be heat conductive silicone grease or heat conductive solder paste, and has high heat conductivity and insulation properties.

In an embodiment of the present invention, as shown in fig. 1, the heat conducting and insulating member 33 is a square structure and has at least one set of opposite angles, two sides of the heat conducting and insulating member 33 are provided, one side of the heat conducting and insulating member 33 is located at an opposite angle of the heat conducting and insulating member 33, and the second fixing adhesive layer 90 is located at an opposite angle of the heat conducting and insulating member 33.

In this embodiment, because heat conduction insulating part 33 is square structure, therefore heat conduction insulating part 33 has a set of diagonal angle, when second fixed glue film 90 carries on spacingly to the side of a set of diagonal angle department, can guarantee that all can be spacing by second fixed glue film 90 on the relative both sides of heat conduction insulating part 33, when having guaranteed spacing effect, reduce the quantity to second fixed glue film 90, reduce the manufacturing cost in workshop. And when heat conduction insulating part 33 had two sets of diagonal angles, and when the line cross arrangement of two sets of diagonal angles, the fixed glue film 90 of second can carry on spacingly to the side of two sets of diagonal angles department, can guarantee the side of two sets of diagonal angles department of heat conduction insulating part 33, whole homoenergetic promptly can be carried on spacingly by the fixed glue film 90 of second, improves the spacing effect to heat conduction insulating part 33.

In an embodiment of the present invention, as shown in fig. 2 and 4, the heat conducting insulator 33 is a ceramic sheet 333 or an aluminum substrate 335.

In this embodiment, when the heat conducting insulator 33 is the ceramic sheet 333, the MOS transistor 10 with medium power can be heat conducting and insulating, and the price is relatively lower than that of the aluminum substrate 335; when the heat conducting insulator 33 is an aluminum substrate 335, although the price is relatively expensive compared to the price of the ceramic sheet 333, for the high-power MOS transistor 10, the aluminum substrate 335 needs to be disposed to achieve heat conduction and insulation of the high-power MOS transistor 10, wherein the aluminum substrate 335 may include a circuit layer, an insulating layer, and a metal base layer, and the three are disposed from top to bottom along the height direction of the heat conducting insulator 33, the circuit layer may be an aluminum foil, the insulating layer may be a PP (Polypropylene) substrate, and the metal base layer may be an aluminum substrate, and the materials of the circuit layer, the insulating layer, and the metal base layer are not specifically limited herein.

In an embodiment of the present invention, the first fixing adhesive layer 50 and/or the second fixing adhesive layer 90 is UV adhesive.

In this embodiment, the first fixing adhesive layer 50 and the second fixing adhesive layer 90 may be UV adhesive (Ultraviolet curable adhesive), so that the first fixing adhesive layer 50 and the second fixing adhesive layer 90 can be cured by Ultraviolet Rays, and the UV adhesive has the properties of non-volatility, fast curing property, high transparency, and the like. In other embodiments, the first fixing adhesive layer 50 and/or the second fixing adhesive layer 90 may be 502 glue.

In an embodiment of the present invention, referring to fig. 5, the heat conducting insulating member 33 is a heat conducting adhesive film 337, one film surface of the heat conducting adhesive film 337 is adhered to the first heat conducting layer 40, and the other film surface of the heat conducting adhesive film 337 is adhered to the heat dissipating surface 331.

In this embodiment, the thermal conductive adhesive film 337 is suitable for conducting heat and insulating the low power MOS transistor 10, and compared with the ceramic sheet 333 and the aluminum substrate 335, the price of the thermal conductive adhesive film 337 is the lowest, which can reduce the production cost. In some embodiments, the thermal adhesive film and the MOS transistor 10 can be directly fixed by adhesion, so that the first thermal conductive layer 40 can be eliminated, and the structure of the power module 100 is simpler.

Furthermore, the present invention also provides a power supply controller (not shown in the drawings), which includes the power module 100 as described above.

It should be noted that, the detailed structure of the power module 100 may refer to the above-mentioned embodiment of the power module 100, and is not described herein again; because the utility model discloses an above-mentioned power module 100 has been used in the power supply controller, consequently, the utility model discloses a power module 100's embodiment includes all technical scheme of the whole embodiments of above-mentioned power module 100, and the technological effect that reaches is also identical, no longer gives unnecessary details here.

Furthermore, the present invention also provides an electric vehicle (not shown in the figure) including the power supply controller as described above.

It should be noted that, the detailed structure of the power supply controller may refer to the above embodiment of the power supply controller, and is not described herein again; because the utility model discloses an above-mentioned power supply controller has been used among the electric vehicle, consequently, the utility model discloses an embodiment of power supply controller includes all technical scheme of the whole embodiments of above-mentioned power supply controller, and the technological effect that reaches is also identical, no longer gives unnecessary details here.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A power module, characterized in that the power module comprises:

an MOS tube;

the heat dissipation assembly is provided with a heat dissipation surface, the heat dissipation surface is provided with an installation position, and the MOS tube is arranged at the installation position;

the first heat conduction layer is clamped between the heat dissipation surface and the MOS tube; and

the first fixing adhesive layer is arranged on the radiating surface and abutted against the side edge of the MOS tube, and the first fixing adhesive layer is used for limiting the MOS tube after being solidified and arranged on the mounting position.

2. The power module of claim 1, wherein the MOS transistor comprises:

the tube main body is arranged at the mounting position, the first heat conduction layer is clamped between the heat dissipation surface and the tube main body, and the first fixing adhesive layer abuts against the side edge of the tube main body; and

and the pins are arranged on the tube main body and are electrically connected with the tube main body.

3. The power module of claim 2 wherein said tube body is of square configuration and has at least one set of opposing corners;

the side of pipe main part is equipped with two, one the side of pipe main part is located one the diagonal department of pipe main part, first fixed glue film is located the diagonal department of pipe main part.

4. The power module of claim 1, wherein there are at least two of the MOS transistors, the heat dissipation assembly has a length direction, and at least two of the MOS transistors are spaced apart along the length direction of the heat dissipation assembly;

and/or, the cooling surface is equipped with two, two the cooling surface is located the relative both sides of radiator unit, the MOS pipe is equipped with two at least, one the MOS pipe is located one correspondingly radiator unit's cooling surface.

5. The power module of any of claims 1-4, wherein the heat dissipation assembly comprises:

a heat sink; and

the heat conduction insulating part is arranged on the radiator and forms the heat radiating surface, and the first heat conduction layer is clamped between the heat conduction insulating part and the MOS tube.

6. The power module of claim 5, further comprising a second thermally conductive layer and a second layer of securing glue;

the second heat conduction layer is clamped between the radiator and the heat conduction insulating part, the second fixing adhesive layer is arranged on the radiator and abutted against the side edge of the heat conduction insulating part, and the second fixing adhesive layer is used for limiting the heat conduction insulating part on the radiator after being cured.

7. The power module of claim 6 wherein said thermally conductive and insulating member is of a square configuration and has at least one set of opposing corners;

the side of heat conduction insulating part is equipped with two, one the side of heat conduction insulating part is located one the diagonal department of heat conduction insulating part, the second fixed glue film is located the diagonal department of heat conduction insulating part.

8. The power module of claim 6, wherein the thermally conductive insulator is a ceramic sheet or an aluminum substrate.

9. The power module of claim 6, wherein the first and/or second layer of securing glue is a UV glue.

10. The power module according to claim 5, wherein the heat conductive insulating member is a heat conductive adhesive film, one surface of the heat conductive adhesive film is attached to the first heat conductive layer, and the other surface of the heat conductive adhesive film is attached to the heat dissipation surface.

11. A power supply controller, characterized in that it comprises a power module according to any one of claims 1 to 10.

12. An electric vehicle characterized in that the electric vehicle includes the power supply controller according to claim 11.