JP3126708B1 - Heat radiation spacer - Google Patents
Heat radiation spacerInfo
- Publication number
- JP3126708B1 JP3126708B1 JP11302394A JP30239499A JP3126708B1 JP 3126708 B1 JP3126708 B1 JP 3126708B1 JP 11302394 A JP11302394 A JP 11302394A JP 30239499 A JP30239499 A JP 30239499A JP 3126708 B1 JP3126708 B1 JP 3126708B1
- Authority
- JP
- Japan
- Prior art keywords
- heat
- hole
- sheet
- heat radiation
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【要約】
【課題】張り付け時の作業性を向上させた放熱スペーサ
を得る。
【解決手段】放熱器１と発熱電子部品６との間に設けら
れる放熱スペーサ８が、発熱電子部品６の放熱部６ａに
応じた大きさの貫通孔１２が形成された補助板１０と、
貫通孔１２を覆って補助板１０に取り付けられた放熱シ
ート１４とを備えている。放熱部６ａは凸状に形成され
ると共に、貫通孔１２に放熱部６ａが挿入されて放熱シ
ート１４の放熱部６ａに対する位置決めがされる。ま
た、放熱シート１４に切欠を形成して、挿入時に放熱部
６ａの一部が覗けるようにした。An object of the present invention is to provide a heat radiation spacer having improved workability at the time of attaching. A heat dissipation spacer provided between a radiator and a heat-generating electronic component includes an auxiliary plate provided with a through-hole having a size corresponding to a heat-radiating portion of the heat-generating electronic component.
A heat dissipation sheet 14 attached to the auxiliary plate 10 so as to cover the through hole 12. The heat radiating portion 6a is formed in a convex shape, and the heat radiating portion 6a is inserted into the through hole 12 to position the heat radiating sheet 14 with respect to the heat radiating portion 6a. In addition, a cutout is formed in the heat radiation sheet 14 so that a part of the heat radiation part 6a can be seen when inserted.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、放熱器と発熱電子
部品の放熱部との間に設けられる放熱スペーサに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating spacer provided between a heat radiator and a heat radiating portion of a heat-generating electronic component.
【０００２】[0002]
【従来の技術】従来より、トランジスタ、サイリスタ等
の発熱電子部品を使用する際に、発生する熱を効率よく
放熱するため、発熱電子部品に放熱シートを介して放熱
器を取り付けている。最近の電子機器の高密度化に伴
い、ＣＰＵに使用されるＩＣ、ＬＳＩ等の発熱電子部品
の放熱対策も重要になっている。このような発熱電子部
品においても、放熱シートを介して放熱器を取り付けて
いる。2. Description of the Related Art Conventionally, a radiator is attached to a heat-generating electronic component via a heat-radiating sheet in order to efficiently radiate generated heat when using a heat-generating electronic component such as a transistor or a thyristor. With the recent increase in the density of electronic devices, heat dissipation measures for heat-generating electronic components such as ICs and LSIs used in CPUs have also become important. In such a heat-generating electronic component, a radiator is attached via a heat-radiating sheet.
【０００３】放熱シートは、熱伝導性のフィラーを含有
するシリコーンゴムをシート状に形成したものが用いら
れている。フィラーとしては、窒化ホウ素、窒化ケイ
素、窒化アルミニウム、アルミナ、マグネシア、炭化ケ
イ素等が用いられ、放熱シートに熱伝導性を付与してい
る。As the heat radiation sheet, a sheet formed of silicone rubber containing a thermally conductive filler is used. As the filler, boron nitride, silicon nitride, aluminum nitride, alumina, magnesia, silicon carbide, or the like is used to impart thermal conductivity to the heat dissipation sheet.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、放熱シ
ートの発熱電子部品への張り付けの際に、発熱電子部品
の発熱部が張り付ける放熱シートの陰になってしまい、
発熱部に合わせて放熱シートを張り付け難く、張り付け
時の作業性がよくないという問題があった。However, when the heat-dissipating sheet is attached to the heat-generating electronic component, the heat-generating portion of the heat-generating electronic component is shaded by the heat-dissipating sheet to be attached.
There is a problem that it is difficult to attach the heat radiation sheet to the heat generating portion, and the workability at the time of attaching is not good.
【０００５】本発明の課題は、張り付け時の作業性を向
上させた放熱スペーサを提供することにある。An object of the present invention is to provide a heat radiating spacer having improved workability at the time of sticking.
【０００６】[0006]
【課題を解決するための手段】かかる課題を達成すべ
く、本発明は課題を解決するため次の手段を取った。即
ち、放熱器と発熱電子部品との間に設けられる放熱スペ
ーサにおいて、前記発熱電子部品の凸状に形成された放
熱部に応じた大きさの貫通孔が形成された補助板と、前
記貫通孔を覆って前記補助板に取り付けられた放熱シー
トとを有し、前記貫通孔に前記放熱部が挿入されて前記
放熱シートの前記放熱部に対する位置決めがされること
を特徴とする放熱スペーサがそれである。In order to achieve the above object, the present invention takes the following means to solve the problem. That is, in a radiating spacer provided between the radiator and the heat-generating electronic component, an auxiliary plate having a through-hole having a size corresponding to a heat-radiating portion formed in a convex shape of the heat-generating electronic component. And a heat radiation sheet covering the through hole and attached to the auxiliary plate , wherein the heat radiation portion is inserted into the through hole, and
The heat radiation spacer is characterized in that the heat radiation sheet is positioned with respect to the heat radiation part .
【０００７】その際、前記凸状の放熱部の高さと、前記
補助板の厚さとを略同一に形成するとよい。In this case, it is preferable that the height of the convex heat radiating portion and the thickness of the auxiliary plate are substantially the same.
【０００８】更に、前記放熱シートは、前記放熱部を前
記貫通孔に挿入した際に、前記放熱部の一部を覗ける大
きさに形成してもよい。その際、前記貫通孔は矩形に形
成され、前記放熱シートは、四隅が切り欠かれて、前記
放熱部の一部を覗ける構成としてもよい。あるいは、前
記放熱シートは、その一方の幅を前記貫通孔よりも小さ
く形成して、前記放熱部の一部を覗ける構成としてもよ
い。前記放熱シートは、補強材により補強されているも
のでもよい。あるいは、前記放熱シートは、補強材によ
り補強された補強層と、前記放熱部に接触する伝熱層と
を備えているものでもよい。 Further, the heat dissipation sheet may be formed in such a size that a part of the heat dissipation portion can be seen when the heat dissipation portion is inserted into the through hole. In this case, the through hole may be formed in a rectangular shape, and the heat dissipation sheet may have a configuration in which four corners are cut out so that a part of the heat dissipation portion can be seen. Alternatively, the heat dissipation sheet may be formed so that one width thereof is smaller than the through hole so that a part of the heat dissipation portion can be seen. The heat dissipation sheet is reinforced by a reinforcing material.
May be. Alternatively, the heat dissipation sheet is made of a reinforcing material.
And a heat transfer layer in contact with the heat radiating portion.
May be provided.
【０００９】また、放熱器と発熱電子部品との間に設け
られる放熱スペーサにおいて、前記発熱電子部品の放熱
部に応じた大きさの貫通孔が形成された補助板と、前記
貫通孔を覆って前記補助板に取り付けられた放熱シート
とを有し、前記補助板に前記貫通孔と別に位置決め孔を
形成すると共に、前記位置決め孔に前記発熱電子部品の
凸部が挿入されて前記放熱シートの前記放熱部に対する
位置決めがされることを特徴とする放熱スペーサがそれ
である。前記補助板には、片面に接着層を設けてもよ
い。[0009] Further , provided between the radiator and the heat-generating electronic parts.
Heat radiation of the heat-generating electronic component
An auxiliary plate in which a through hole of a size corresponding to the part is formed,
Heat dissipation sheet covering the through hole and attached to the auxiliary plate
Having a positioning hole in the auxiliary plate separately from the through hole.
And forming the heating electronic component in the positioning hole.
A convex portion is inserted to the heat radiating sheet with respect to the heat radiating portion.
The heat radiation spacer characterized by being positioned
It is. The auxiliary plate may be provided with an adhesive layer on one side.
【００１０】[0010]
【発明の実施の形態】以下本発明の実施の形態を図面に
基づいて詳細に説明する。図１に示すように、１は大気
中に放熱する放熱器であり、本実施形態では放熱フィン
を用いている。放熱器１は放熱フィンに限らず、放熱板
等でもよく、あるいは、放熱フィンに電動ファンを取り
付けたものでもよい。Embodiments of the present invention will be described below in detail with reference to the drawings. As shown in FIG. 1, reference numeral 1 denotes a radiator that radiates heat to the atmosphere. In this embodiment, a radiator fin is used. The radiator 1 is not limited to the radiating fin, and may be a radiating plate or the like, or may be a radiating fin to which an electric fan is attached.
【００１１】２は電子基板であり、電子基板２上にはソ
ケット４が取り付けられている。ソケット４にはＩＣ、
ＬＳＩ等からなる発熱電子部品６が装着されている。発
熱電子部品６は、例えば、パソコンに用いられるＣＰＵ
等であり、放熱対策が必要な電子部品である。この発熱
電子部品６には、放熱部６ａが形成されており、本実施
形態では、放熱部６ａはほぼ正方形の矩形で凸状に突き
出されて形成されている。Reference numeral 2 denotes an electronic board on which a socket 4 is mounted. The socket 4 has an IC,
A heat-generating electronic component 6 such as an LSI is mounted. The heat generating electronic component 6 is, for example, a CPU used in a personal computer.
It is an electronic component that requires heat dissipation measures. A heat radiating portion 6a is formed on the heat-generating electronic component 6, and in the present embodiment, the heat radiating portion 6a is formed to project in a convex shape with a substantially square rectangle.
【００１２】放熱器１と発熱電子部品６との間には放熱
スペーサ８が設けられている。放熱スペーサ８は、図
２、図３に示すように、補助板１０を有し、本実施形態
では、補助板１０は、ポリエチレン、ＰＥＴ（ポリエチ
レンテレフタレート）等の絶縁性を有する板材から切り
出されて形成されている。また、補助板１０は、透明あ
るいは半透明のものである方が、後述する張り付け時の
作業性がよい。絶縁性を有する必要がない場合には、ア
ルミニウム板等の金属板により形成してもよく、その場
合にはプレス加工等により多量生産が容易にできる。A heat radiation spacer 8 is provided between the radiator 1 and the heat-generating electronic component 6. As shown in FIGS. 2 and 3, the heat radiation spacer 8 has an auxiliary plate 10. In the present embodiment, the auxiliary plate 10 is cut out from an insulating plate material such as polyethylene or PET (polyethylene terephthalate). Is formed. Moreover, the workability at the time of attaching, which will be described later, is better when the auxiliary plate 10 is transparent or translucent. If it is not necessary to have an insulating property, it may be formed of a metal plate such as an aluminum plate. In that case, mass production can be easily performed by press working or the like.
【００１３】補助板１０にはそのほぼ中央に貫通孔１２
が形成されている。貫通孔１２は、発熱電子部品６の放
熱部６ａに応じた大きさに形成されており、本実施形態
では、貫通孔１２に放熱部６ａを挿入可能に、放熱部６
ａの外形よりもわずかに大きなほぼ正方形の矩形に形成
されている。補助板１０の厚さは、凸状の放熱部６ａの
高さと略同一となるように形成されている。The auxiliary plate 10 has a through hole 12 substantially at its center.
Are formed. The through-hole 12 is formed in a size corresponding to the heat-radiating portion 6 a of the heat-generating electronic component 6. In the present embodiment, the heat-radiating portion 6 a is inserted into the through-hole 12.
It is formed in a substantially square rectangle slightly larger than the outer shape of a. The thickness of the auxiliary plate 10 is formed so as to be substantially the same as the height of the convex heat radiating portion 6a.
【００１４】また、補助板１０には貫通孔１２を覆って
放熱シート１４が取り付けられている。放熱シート１４
は、本実施形態では、液状シリコーンゴムと窒化ホウ
素、窒化ケイ素、窒化アルミニウム、アルミナ、マグネ
シア、炭化ケイ素等のフィラーとを混合した後、加硫し
てシート状に形成したもので、その厚みは０．３ｍｍ程
度である。フィラーを混合するので、放熱シート１４を
透明に形成できない。尚、放熱シート１４単体で粘着性
を有する。A heat radiation sheet 14 is attached to the auxiliary plate 10 so as to cover the through hole 12. Heat dissipation sheet 14
In the present embodiment, a liquid silicone rubber and a filler such as boron nitride, silicon nitride, aluminum nitride, alumina, magnesia, and silicon carbide are mixed and vulcanized to form a sheet. It is about 0.3 mm. Since the filler is mixed, the heat dissipation sheet 14 cannot be formed transparent. Note that the heat radiation sheet 14 alone has adhesiveness.
【００１５】放熱シート１４は、貫通孔１２よりも一回
り大きなほぼ正方形の矩形に形成されており、貫通孔１
２の縁に沿って、貫通孔１２の全体をほぼ覆うように補
助板１０の表面１０ａ側に取り付けられている。また、
放熱シート１４の四隅に切欠１６が形成されており、切
欠１６から貫通孔１２の四隅の一部が覗けるように形成
されている。The heat radiating sheet 14 is formed in a substantially square rectangle slightly larger than the through hole 12.
Along the edge of No. 2, it is attached to the surface 10a side of the auxiliary plate 10 so as to substantially cover the entire through hole 12. Also,
Notches 16 are formed at the four corners of the heat dissipation sheet 14, and are formed so that some of the four corners of the through hole 12 can be seen through the notches 16.
【００１６】放熱シート１４には、ガラス繊維等の補強
材が含有されたものを用いてもよい。これにより、張り
付け時の破損等を防止できる。また、図４に示すよう
に、放熱シート１４は、ガラス繊維等の補強材が含有さ
れた補強層１４ａと、放熱部６ａ側に設けられた伝熱層
１４ｂとを備えたものでもよい。これにより、放熱シー
ト１４の強度の向上と、伝熱性能の向上との両立を図る
ようにしてもよい。The heat radiation sheet 14 may contain a reinforcing material such as glass fiber. This can prevent breakage or the like at the time of attaching. Further, as shown in FIG. 4, the heat dissipation sheet 14 may include a reinforcement layer 14a containing a reinforcement such as glass fiber and a heat transfer layer 14b provided on the heat dissipation portion 6a side. Thereby, both the improvement of the strength of the heat radiation sheet 14 and the improvement of the heat transfer performance may be achieved.
【００１７】一方、補助板１０の裏面１０ｂ側には、貫
通孔１２を除いて、接着層１８が設けられている。接着
層１８は両面接着テープを貼って形成してもよく、ある
いは、接着剤の層を直接形成してもよい。この接着層１
８にライナー２０を貼って、放熱スペーサ８を運搬・保
管できるようにしている。On the other hand, an adhesive layer 18 is provided on the back surface 10b side of the auxiliary plate 10 except for the through holes 12. The adhesive layer 18 may be formed by applying a double-sided adhesive tape, or a layer of an adhesive may be directly formed. This adhesive layer 1
A liner 20 is adhered to the heat sink 8 so that the heat radiation spacer 8 can be transported and stored.
【００１８】次に、本実施形態の放熱スペーサの作動に
ついて説明する。ます、放熱スペーサ８からライナー２
０を剥がし、接着層１８側を発熱電子部品６に重ね発熱
電子部品６に張り付ける。その際、貫通孔１２に放熱部
６ａを挿入し、放熱部６ａに放熱シート１４を取り付け
る。Next, the operation of the heat radiation spacer of this embodiment will be described. First, the heat radiation spacer 8 to the liner 2
Then, the adhesive layer 18 is overlapped on the heat-generating electronic component 6 and is attached to the heat-generating electronic component 6. At this time, the heat radiating portion 6a is inserted into the through hole 12, and the heat radiating sheet 14 is attached to the heat radiating portion 6a.
【００１９】貫通孔１２に放熱部６ａを挿入するとき、
放熱シート１４により貫通孔１２が覆われているので、
貫通孔１２と放熱部６ａとの位置を合わせ難い。そこ
で、切欠１６を介して貫通孔１２に挿入される放熱部６
ａの四隅を覗くと挿入が容易になる。When inserting the heat radiating portion 6a into the through hole 12,
Since the heat dissipation sheet 14 covers the through hole 12,
It is difficult to align the positions of the through holes 12 and the heat radiating portions 6a. Therefore, the heat radiating portion 6 inserted into the through hole 12 through the notch 16 is provided.
Looking into the four corners of "a" facilitates insertion.
【００２０】貫通孔１２と放熱部６ａとの位置が一致す
るように、切欠１６から覗きながら、貫通孔１２に放熱
部６ａを挿入すると、放熱部６ａと放熱シート１４との
位置がずれることなく張り付けることができる。このよ
うに、貫通孔１２に放熱部６ａを挿入するだけで、放熱
部６ａと放熱シート１４との位置決めが行われるので、
張り付け作業が容易であり、扱い易い。多量生産する場
合でも、簡単に張り付けできるので作業が容易である。
しかも、補助板１０の厚さと凸状の放熱部６ａの高さが
略同一であるので、貫通孔１２に放熱部６ａを挿入する
と、放熱シート１４が接触する。よって、放熱部６ａへ
の放熱シート１４の張り付け時の作業性が向上する。Inserting the heat radiating portion 6a into the through hole 12 while looking through the notch 16 so that the position of the heat radiating portion 6a coincides with the position of the heat radiating portion 6a. Can be stuck. In this way, since the positioning of the heat radiating portion 6a and the heat radiating sheet 14 is performed only by inserting the heat radiating portion 6a into the through hole 12,
Pasting work is easy and easy to handle. Even in the case of mass production, the work can be done easily because it can be easily attached.
Moreover, since the thickness of the auxiliary plate 10 and the height of the convex heat radiating portion 6a are substantially the same, when the heat radiating portion 6a is inserted into the through hole 12, the heat radiating sheet 14 comes into contact. Therefore, workability at the time of attaching the heat radiation sheet 14 to the heat radiation portion 6a is improved.
【００２１】また、放熱シート１４に直接さわることな
く、放熱シート１４を放熱部６ａに張り付けることがで
きるので、放熱シート１４の機械的強度が弱く、破損し
易いものでも、破損させることなく張り付けることがで
きるので、張り付け時の作業性が向上する。従って、放
熱シート１４は、フィラーの充填量が多く、熱伝導性の
よいものでも使用できる。更に、ライナー２０を剥すと
きに、乱雑に扱うと放熱シート１４が崩れるが、補助板
１０により放熱シート１４の崩れの心配がなく扱い易
い。Further, since the heat radiating sheet 14 can be attached to the heat radiating portion 6a without directly touching the heat radiating sheet 14, even if the heat radiating sheet 14 has a low mechanical strength and is easily damaged, it is attached without being damaged. Therefore, workability at the time of attaching is improved. Therefore, the heat radiation sheet 14 can be used even if it has a large amount of filler and good thermal conductivity. Further, when the liner 20 is peeled off, the heat dissipation sheet 14 may be broken if handled in a rough manner, but the auxiliary plate 10 is easy to handle without fear of the heat dissipation sheet 14 being broken.
【００２２】放熱部６ａに放熱スペーサ８を取り付けた
後、放熱器１を放熱シート１４に重ねて取り付ける。こ
れにより、放熱部６ａからの熱が放熱シート１４を介し
て放熱器１に伝達され、放熱器１から大気中に放熱され
る。放熱シート１４に熱伝導性のよいものを使用するこ
とができるので、冷却効率が向上する。After the radiating spacer 8 is attached to the radiating portion 6a, the radiator 1 is attached to the radiating sheet 14 so as to overlap. Thus, heat from the heat radiating portion 6a is transmitted to the radiator 1 via the heat radiating sheet 14, and is radiated from the radiator 1 to the atmosphere. Since a heat radiating sheet 14 having good thermal conductivity can be used, cooling efficiency is improved.
【００２３】次に、前述した実施形態と異なる第２実施
形態について、図５によって説明する。尚、前述した実
施形態と同じ部材については同一番号を付して詳細な説
明を省略する。この放熱スペーサ２１は、前述したと同
じ補助板１０を有し、貫通孔１２には前述した放熱シー
ト１４と形状の異なる放熱シート２２が貫通孔１２を覆
って取り付けられている。この放熱シート２２は、長方
形の矩形に形成されており、その短い方の幅が、ほぼ正
方形の貫通孔１２の幅よりも小さく形成されており、放
熱シート２２を貫通孔１２を覆うように取り付けた際
に、貫通孔１２の一部が覗くように構成されている。こ
の場合も前述したと同様に、放熱スペーサ２１を発熱電
子部品６に取り付ける際に、放熱部６ａの一部を覗くこ
とができ、挿入が容易である。Next, a second embodiment different from the above-described embodiment will be described with reference to FIG. Note that the same members as those in the above-described embodiment are denoted by the same reference numerals, and detailed description is omitted. The heat radiation spacer 21 has the same auxiliary plate 10 as described above, and a heat radiation sheet 22 having a different shape from the heat radiation sheet 14 described above is attached to the through hole 12 so as to cover the through hole 12. The heat radiating sheet 22 is formed in a rectangular shape, and the shorter width is formed to be smaller than the width of the substantially square through hole 12, and the heat radiating sheet 22 is attached so as to cover the through hole 12. In this case, a part of the through-hole 12 is configured to be seen. Also in this case, as described above, when the heat radiation spacer 21 is attached to the heat-generating electronic component 6, a part of the heat radiation part 6a can be seen, and the insertion is easy.
【００２４】更に、第３実施形態の放熱スペーサ３１に
ついて、図６によって説明する。補助板３２には貫通孔
３４が形成されており、この貫通孔３４を覆って放熱シ
ート３６が取り付けられている。この放熱シート３６
は、前述したものとは異なり、貫通孔３４の全体を覆う
大きさに形成されている。Further, the heat radiation spacer 31 of the third embodiment will be described with reference to FIG. A through hole 34 is formed in the auxiliary plate 32, and a heat radiation sheet 36 is attached so as to cover the through hole 34. This heat dissipation sheet 36
Is formed in a size that covers the entire through hole 34, unlike the above.
【００２５】補助板３２には、放熱シート３６から離れ
た位置に、楕円状の位置決め孔３８が形成されている。
この位置決め孔３８に対応して、発熱電子部品６に位置
決め孔３８に挿入可能な楕円状の凸部を形成することに
より、放熱スペーサ３１の取付の際に、これを利用して
位置決めできる。An elliptical positioning hole 38 is formed in the auxiliary plate 32 at a position away from the heat radiation sheet 36.
By forming an elliptical convex portion that can be inserted into the positioning hole 38 in the heat-generating electronic component 6 corresponding to the positioning hole 38, positioning can be performed by using this when the heat radiation spacer 31 is attached.
【００２６】以上本発明はこの様な実施形態に何等限定
されるものではなく、本発明の要旨を逸脱しない範囲に
おいて種々なる態様で実施し得る。The present invention is not limited to such an embodiment at all, and can be implemented in various modes without departing from the gist of the present invention.
【００２７】[0027]
【発明の効果】以上詳述したように本発明の放熱スペー
サは、補助板を用いているので、張り付け時の作業性が
向上するという効果を奏する。また、貫通孔により位置
決めすることにより、あるいは、位置決め孔により位置
決めすることにより、放熱部と放熱シートとの位置がず
れることなく容易に張り付けることができる。更に、放
熱部の一部を覗けるようにすることにより、貫通孔への
放熱部の挿入が容易になり、張り付け時の作業性が向上
する。As described in detail above, since the heat radiation spacer of the present invention uses the auxiliary plate, it has an effect of improving the workability at the time of attaching. In addition, position by through hole
Or by positioning holes
By deciding, the position of the heat radiating portion and the heat radiating sheet can be easily attached without shifting. Further, by allowing a part of the heat radiating portion to be seen, insertion of the heat radiating portion into the through hole is facilitated, and workability at the time of sticking is improved.
【図１】本発明の一実施形態としての放熱スペーサを取
り付けた状態を示す一部断面図である。FIG. 1 is a partial cross-sectional view showing a state where a heat radiation spacer as one embodiment of the present invention is attached.
【図２】本実施形態の放熱スペーサの正面図である。FIG. 2 is a front view of a heat radiation spacer of the present embodiment.
【図３】図２のＡＡ断面図である。FIG. 3 is a sectional view taken along the line AA of FIG. 2;
【図４】他の実施形態の放熱シートを用いた放熱スペー
サの側面図である。FIG. 4 is a side view of a heat radiation spacer using a heat radiation sheet of another embodiment.
【図５】第２実施形態の放熱スペーサの正面図である。FIG. 5 is a front view of a heat radiation spacer according to a second embodiment.
【図６】第３実施形態の放熱スペーサの正面図である。FIG. 6 is a front view of a heat radiation spacer according to a third embodiment.
１…放熱器 ２…電子基板 ４…ソケット ６…発熱電子部品 ６ａ…放熱部 ８，２１，３１…放熱スペーサ １０，３２…補助板 １２，３４…貫通孔 １４，２２，３６…放熱シート １６…切欠 １８…接着層 ２０…ライナー ３８…位置決め孔 DESCRIPTION OF SYMBOLS 1 ... Heat radiator 2 ... Electronic board 4 ... Socket 6 ... Heat generation electronic component 6a ... Heat radiating part 8, 21, 31 ... Heat radiating spacer 10, 32 ... Auxiliary plate 12, 34 ... Through hole 14, 22, 36 ... Heat radiating sheet 16 ... Notch 18 ... Adhesive layer 20 ... Liner 38 ... Positioning hole
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/36 H05K 7/20 Continuation of the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01L 23/36 H05K 7/20
Claims (9)
る放熱スペーサにおいて、 前記発熱電子部品の凸状に形成された放熱部に応じた大
きさの貫通孔が形成された補助板と、 前記貫通孔を覆って前記補助板に取り付けられた放熱シ
ートとを有し、前記貫通孔に前記放熱部が挿入されて前
記放熱シートの前記放熱部に対する位置決めがされるこ
とを特徴とする放熱スペーサ。1. A heat radiation spacer provided between a radiator and a heat-generating electronic component, comprising: an auxiliary plate having a through-hole having a size corresponding to a convex heat-radiating portion of the heat - generating electronic component; A heat radiation sheet attached to the auxiliary plate so as to cover the through hole, wherein the heat radiation portion is inserted into the through hole and
A heat radiation spacer , wherein the heat radiation sheet is positioned with respect to the heat radiation part .
の厚さとを略同一に形成したことを特徴とする請求項１
記載の放熱スペーサ。 2. A height of the convex heat radiating portion and a thickness of the auxiliary plate are substantially equal to each other.
Heat dissipation spacer as described.
通孔に挿入した際に、前記放熱部の一部を覗ける大きさ
に形成したことを特徴とする請求項１又は請求項２記載
の放熱スペーサ。 Wherein the heat dissipation sheet, upon insertion of the heat radiating portion in the through hole, according to claim 1 or claim 2, wherein the forming part a peep size of the heat radiating portion Heat dissipation spacer.
シートは、四隅が切り欠かれて、前記放熱部の一部を覗
けることを特徴とする請求項３記載の放熱スペーサ。 Wherein said through hole is formed in a rectangular, the heat dissipation sheet, the four corners are cut away, the heat radiation spacer according to claim 3, wherein a peep a portion of the heat radiating portion.
貫通孔よりも小さく形成して、前記放熱部の一部を覗け
ることを特徴とする請求項３記載の放熱スペーサ。 Wherein said heat dissipating sheet, the width of the one formed smaller than the through hole, the heat radiation spacer according to claim 3, wherein a peep a portion of the heat radiating portion.
れていることを特徴とする請求項１ないし請求項５記載
の放熱スペーサ。 Wherein said heat dissipating sheet, claims 1 to 5 radiating spacer as claimed, characterized in that it is reinforced by the reinforcing member.
れた補強層と、前記放熱部に接触する伝熱層とを備えて
いることを特徴とする請求項１ないし請求項５記載の放
熱スペーサ。 Wherein said heat radiating sheet, a reinforcing layer which is reinforced by the reinforcing member, the heat radiation spacer according to claim 1 to claim 5 further characterized in that and a heat transfer layer in contact with the heat radiating portion .
る放熱スペーサにおいて、 前記発熱電子部品の放熱部に応じた大きさの貫通孔が形
成された補助板と、 前記貫通孔を覆って前記補助板に取り付けられた放熱シ
ートとを有し、前記補助板に前記貫通孔と別に位置決め
孔を形成すると共に、前記位置決め孔に前記発 熱電子部
品の凸部が挿入されて前記放熱シートの前記放熱部に対
する位置決めがされる ことを特徴とする放熱スペーサ。8. A device provided between a radiator and a heat-generating electronic component.
In the heat radiation spacer, a through hole having a size corresponding to a heat radiation part of the heat generating electronic component is formed.
An auxiliary plate formed, and a heat sink mounted on the auxiliary plate so as to cover the through hole.
And the auxiliary plate is positioned separately from the through hole.
To form a hole, the calling thermionic unit to the positioning hole
The convex part of the product is inserted into the
A heat dissipating spacer characterized by being positioned .
ことを特徴とする請求項１ないし請求項８記載の放熱ス
ペーサ。 9. The heat radiation spacer according to claim 1 , wherein an adhesive layer is provided on one side of said auxiliary plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11302394A JP3126708B1 (en) | 1999-10-25 | 1999-10-25 | Heat radiation spacer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11302394A JP3126708B1 (en) | 1999-10-25 | 1999-10-25 | Heat radiation spacer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP3126708B1 true JP3126708B1 (en) | 2001-01-22 |
| JP2001127222A JP2001127222A (en) | 2001-05-11 |
Family
ID=17908392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11302394A Expired - Fee Related JP3126708B1 (en) | 1999-10-25 | 1999-10-25 | Heat radiation spacer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3126708B1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4999060B2 (en) * | 2006-10-02 | 2012-08-15 | 古河電気工業株式会社 | Heat receiving member mounting structure |
| KR101732734B1 (en) * | 2009-11-25 | 2017-05-04 | 양태허 | Thermal conduction principle and device for intercrossed structure having different thermal characteristics |
-
1999
- 1999-10-25 JP JP11302394A patent/JP3126708B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001127222A (en) | 2001-05-11 |
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