CN218481191U - Flexible pressure sensing module - Google Patents
Flexible pressure sensing module Download PDFInfo
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- CN218481191U CN218481191U CN202222488665.4U CN202222488665U CN218481191U CN 218481191 U CN218481191 U CN 218481191U CN 202222488665 U CN202222488665 U CN 202222488665U CN 218481191 U CN218481191 U CN 218481191U
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- pressure sensing
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Abstract
The application provides a flexible pressure sensing module, which comprises a base material layer, a transmission line layer, a strain metal line and a resistance pressure sensing glue, wherein the transmission line layer and the strain metal line are respectively arranged on two opposite sides of the base material layer; the substrate layer runs through and is equipped with an at least blind hole, the partial filling of metal circuit that meets an emergency gets into the blind hole forms the electrically conductive hole, the electrically conductive jogged joint the transmission line layer with the pad. The flexible pressure sensing module directly forms the conductive hole by filling part of the strain metal circuit into the blind hole, so that no height offset or groove exists when the strain metal circuit is arranged, the resistance value is more stable, and the standard deviation is smaller.
Description
Technical Field
The application relates to the technical field of pressure sensors, in particular to a flexible pressure sensing module.
Background
The existing strain gauge type flexible pressure sensor generally measures the pressure value of the flexible pressure sensor subjected to the external pressure by using the strain effect of the self-resistance, and the flexible pressure sensor comprises a plurality of resistance pressure sensing sheets. In the prior art, each of the resistive pressure sensing pads generally includes a transmission line layer, a strain metal line disposed on one side of one of the signal transmission line layers, and a resistive pressure sensing adhesive disposed at an interval from the signal transmission line layer. In this kind of structure, the mode that the metal circuit that meets an emergency adopted printing silver thick liquid to form usually, and be in signal transmission line layer with be formed with the recess between the resistance pressure sensing glue, the height break appears to make the resistance value of each batch of resistance pressure sensing piece unstable, standard deviation is big.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a flexible pressure sensing module that solves the above problems.
The application provides a flexible pressure sensing module, which comprises a base material layer, a transmission line layer, a strain metal line and a resistance pressure sensing glue, wherein the transmission line layer and the strain metal line are respectively arranged on two opposite sides of the base material layer;
the substrate layer runs through and is equipped with an at least blind hole, the partial filling of metal circuit that meets an emergency gets into the blind hole forms the electrically conductive hole, the electrically conductive jogged joint the transmission line layer with the pad.
In some embodiments, the conductive via has a cross-sectional width of 0.25 to 0.125mm.
In some embodiments, the pad has a cross-sectional width of 0.3 to 0.4mm.
In some embodiments, the substrate layer has a thickness of 12 to 50 μm.
In some embodiments, a portion of the resistive pressure sensitive adhesive is disposed between the substrate layer and the leads.
In some embodiments, a portion of the leads is located between the substrate layer and the resistive pressure sensitive adhesive, which encapsulates the leads.
In some embodiments, the lead has a thickness of less than 5 μm.
In some embodiments, the flexible pressure sensing module includes at least two strain metal lines disposed at intervals, each of the resistive pressure sensing adhesives is electrically connected to two of the leads, and the two leads are disposed at intervals at two ends of the resistive pressure sensing adhesive.
In some embodiments, the transmission line layer includes a plurality of signal lines spaced apart from each other, and each of the signal lines is electrically connected to one of the pads through a conductive via.
In some embodiments, the strained metal line is made of conductive silver paste; the material of substrate layer is polyimide.
Compared with the prior art, the application has the following beneficial effects:
the application provides flexible pressure sensing module through in the substrate layer forms the blind hole, and in the substrate layer surface forms the metal circuit that meets an emergency, and is partial simultaneously the metal circuit that meets an emergency fills and gets into the blind hole directly forms the electrically conductive hole is setting there is not height offset or recess when meeting an emergency the metal circuit to make the resistance value more stable, standard deviation is littleer.
In addition, because the traditional scheme of electroplating the hole copper is not adopted, a selective plating hole ring is not needed on the transmission line layer, the whole structure is smoother, and the strain stability of the flexible pressure sensing module is favorably further improved. In addition, compare in the scheme of traditional electroplating hole copper, in this application direct in printing electrically conductive silver thick liquid in the blind hole forms the electrically conductive hole can avoid the cracked risk of hole copper bending.
In addition, by controlling the thickness of the leads, the flatness and uniformity of the resistive pressure sensitive adhesive can be maintained. Through setting up resistance pressure sensitive adhesive cladding lead wire, the electrically conductive effect is better, can effectively reduce noise (noise) in the operation.
Drawings
Fig. 1 is a schematic cross-sectional view of a flexible pressure sensing module according to a first embodiment of the present application.
Fig. 2 is a top view of the flexible pressure sensing module shown in fig. 1.
FIG. 3 is a schematic cross-sectional view of the flexible pressure sensing module shown in FIG. 1 from another perspective.
Fig. 4 is a schematic cross-sectional view of a flexible pressure sensing module according to a second embodiment of the present application.
FIG. 5 is a top view of the flexible pressure sensing module of FIG. 4.
FIG. 6 is a schematic cross-sectional view of the flexible pressure sensing module shown in FIG. 4 from another perspective.
Description of the main elements
Flexible pressure sensing module 100, 200
Strained metal line 30
Conductive via 31
Resistance pressure sensitive adhesive 40
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, 2 and 3, a flexible pressure sensing module 100 is provided according to a first embodiment of the present application. The flexible pressure sensing module 100 includes a substrate layer 10, a transmission line layer 20, a strained metal line 30, and a resistive pressure sensing adhesive 40. The transmission line layer 20 with the metal line that meets an emergency 30 set up respectively in the relative both sides of substrate layer 10, resistance pressure sensitive adhesive 40 set up in one side of substrate layer 10, and with the metal line that meets an emergency 30 is in same one side, resistance pressure sensitive adhesive 40 with the metal line that meets an emergency 30 interval sets up.
The substrate layer 10 is provided with at least one blind hole 11, part of the transmission line layer 20 is exposed from the blind hole 11, and part of the strained metal line 30 is filled into the blind hole 11 to form a conductive hole 31, so that the conductive hole 31 electrically connects the strained metal line 30 and the transmission line layer 20. The strained metal line 30 includes at least one pad 301 and a lead 302 correspondingly connected to the pad 301, and the lead 302 is connected to the resistive pressure sensing adhesive 40.
The transmission line layer 20 includes at least one signal line 21, and each signal line 21 is electrically connected to one of the pads 301. The signal line 21 is connected to an external processing circuit (not shown) so as to input a constant voltage and output an electrical signal to the flexible pressure sensing module 100.
The resistance pressure-sensitive adhesive 40 is made of a high-resistance pressure-sensitive resistance conductor, specifically, a high-resistance carbon paste, a metal wire, or other high-resistance composite conductor and polymer material. When the resistance pressure sensitive adhesive 40 is subjected to strain caused by different external forces, the resistance value of the resistance pressure sensitive adhesive 40 will change along with the magnitude of the strain.
In this embodiment, the forward projection of a portion of the lead 302 is located on the resistive pressure sensitive adhesive 40. The strain metal circuit 30 is made of conductive silver paste. In the actual manufacturing process, the resistance pressure-sensitive adhesive 40 is arranged on part of the surface of the substrate layer 10, and then conductive silver paste is printed to form the strain metal circuit 30, so that part of the lead 302 covers part of the resistance pressure-sensitive adhesive 40, and the resistance pressure-sensitive adhesive 40 is connected with the strain metal circuit 30.
The substrate layer 10 has flexibility, and the material of the substrate layer may be one or more of Polyimide (PI), thermoplastic Polyimide (TPI), polyethylene Terephthalate (PET), polyethylene Naphthalate (PEN), polyethylene (PE), polyvinyl chloride (PVC), and other high polymer materials. In this embodiment, the material of the substrate layer 10 is polyimide.
In this embodiment, the thickness of the substrate layer 10 may be 12 to 50 μm, and is not suitable for being too thick, so as to ensure that the conductive vias 31 are completely filled with conductive silver paste. The width of electrically conductive hole 31 is 0.25 ~ 0.125mm, the width of pad 301 is 0.3 ~ 0.4mm, has this width through the setting pad 301 to can avoid when 11 regional printing electrically conductive silver thick liquid of blind hole, because counterpoint error leads to the printing off normal.
A plurality of groups of the conductive holes 31 may be disposed on the substrate layer 10, and each group includes more than two conductive holes 31. In this embodiment, each of the resistance voltage sensing adhesives 40 is correspondingly connected to two of the strained metal lines 30, two ends of the resistance voltage sensing adhesive 40 are disposed at intervals on the two strained metal lines 30, and each of the strained metal lines 30 is electrically connected to one of the signal lines 21 through one of the conductive vias 31.
When the flexible pressure sensing module 100 works, the substrate layer 10 is stressed by an external force, and the resistance pressure sensing adhesive 40 deforms along with the external force, so that the resistance value of the resistance pressure sensing adhesive 40 is changed from R to R + Δ R, the voltage applied to the resistance pressure sensing adhesive 40 is changed by Δ V, an external circuit can calculate Δ R according to the relationship between Δ V and Δ R, and then the stress magnitude of the resistance pressure sensing adhesive 40 is calculated according to the stress-strain relationship between Δ R and the resistance pressure sensing adhesive 40.
Compared with the prior art, the flexible pressure sensing module 100 provided by the application is through in the substrate layer 10 forms the blind hole 11, and in the substrate layer 10 surface forms the strain metal circuit 30, and simultaneously some the strain metal circuit 30 fills and gets into the blind hole 11 directly forms the conductive via 31, thereby there is not height offset or recess when setting up the strain metal circuit 30 to provide more stable printing resistance and standard deviation. In addition, because a traditional electroplating hole copper scheme is not adopted, a selective plating hole ring is not needed on the transmission line layer 20, the whole structure is smoother, and the strain stability of the flexible pressure sensing module 100 is further improved. In addition, compare in the scheme of traditional electroplating hole copper, in this application direct in printing electrically conductive silver thick liquid forms in the blind hole 11 the electric conduction hole can avoid the cracked risk of hole copper bending.
Referring to fig. 4, 5 and 6, a second embodiment of the present application provides another flexible pressure sensing module 200, where the flexible pressure sensing module 200 has substantially the same structure as the flexible pressure sensing module 100, except that:
the forward projection of a part of the resistance pressure sensitive adhesive 40 is located on the lead 302, that is, a part of the lead 302 is located between the substrate layer 10 and the resistance pressure sensitive adhesive 40, and the three sides of the lead 302 except the side facing the substrate layer 10 are surrounded by the resistance pressure sensitive adhesive 40. In an actual manufacturing process, the strained metal line 30 is formed on the surface of the substrate layer 10, and then conductive silver paste is printed on one side of the lead 302 partially departing from the substrate layer 10 to form the strained metal line 30, so that part of the resistance voltage-sensing adhesive 40 wraps the lead 302 to realize connection, and the other part of the resistance voltage-sensing adhesive 40 is tightly attached to the surface of the substrate layer 10.
In this embodiment, the strained metal line 30 has a thickness of less than 5 μm. By controlling the thickness of the strained metal line 30, the flatness and uniformity of the resistive pressure sensitive adhesive 40 can be maintained.
Compared with the prior art, the flexible pressure sensing module 200 has better conductive effect by arranging the resistive pressure sensing adhesive 40 to coat the lead 302 on three sides, and can effectively reduce noise (noise) in operation.
It should be understood by those skilled in the art that the above embodiments are only for illustrating the present application and are not used as limitations of the present application, and that suitable modifications and changes of the above embodiments are within the scope of the claims of the present application as long as they are within the spirit and scope of the present application.
Claims (10)
1. A flexible pressure sensing module is characterized by comprising a substrate layer, a transmission line layer, a strain metal line and a resistance pressure sensing adhesive, wherein the transmission line layer and the strain metal line are respectively arranged on two opposite sides of the substrate layer, the resistance pressure sensing adhesive and the strain metal line are arranged on the same side of the substrate layer at intervals, the strain metal line comprises a bonding pad and a lead connected with the bonding pad, and the lead is connected to the resistance pressure sensing adhesive;
the substrate layer runs through and is equipped with an at least blind hole, the partial filling of metal circuit that meets an emergency gets into the blind hole forms the electrically conductive hole, the electrically conductive jogged joint the transmission line layer with the pad.
2. The flexible pressure sensing module of claim 1, wherein the cross-sectional width of the conductive via is 0.25 mm to 0.125mm.
3. The flexible pressure sensing module of claim 1, wherein the pad has a cross-sectional width of 0.3 mm to 0.4mm.
4. The flexible pressure sensitive module of claim 1, wherein the substrate layer has a thickness of 12 to 50 μm.
5. The flexible pressure sensing module of claim 1, wherein a portion of the resistive pressure sensing adhesive is disposed between the substrate layer and the leads.
6. The flexible pressure sensing module of claim 1, wherein a portion of the leads is positioned between the substrate layer and the resistive pressure sensing adhesive, the resistive pressure sensing adhesive encapsulating the leads.
7. The flexible pressure sensing module of claim 6, wherein the leads have a thickness of less than 5 μm.
8. The flexible pressure sensing module of claim 1, wherein the flexible pressure sensing module comprises at least two strained metal lines spaced apart from each other, each of the resistive pressure sensing traces is electrically connected to two of the leads, and the two leads are spaced apart from each other at opposite ends of the resistive pressure sensing trace.
9. The flexible pressure sensing module of claim 1, wherein the transmission line layer includes a plurality of spaced apart signal lines, each of the signal lines being electrically connected to one of the pads through a conductive via.
10. The flexible pressure sensing module of claim 1, wherein the strained metal line is made of conductive silver paste; the material of substrate layer is polyimide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222488665.4U CN218481191U (en) | 2022-09-20 | 2022-09-20 | Flexible pressure sensing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222488665.4U CN218481191U (en) | 2022-09-20 | 2022-09-20 | Flexible pressure sensing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218481191U true CN218481191U (en) | 2023-02-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222488665.4U Active CN218481191U (en) | 2022-09-20 | 2022-09-20 | Flexible pressure sensing module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218481191U (en) |
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- 2022-09-20 CN CN202222488665.4U patent/CN218481191U/en active Active
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