CN213211005U - Pressure sensor, pressure sensing module and electronic equipment - Google Patents
Pressure sensor, pressure sensing module and electronic equipment Download PDFInfo
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- CN213211005U CN213211005U CN202022373185.4U CN202022373185U CN213211005U CN 213211005 U CN213211005 U CN 213211005U CN 202022373185 U CN202022373185 U CN 202022373185U CN 213211005 U CN213211005 U CN 213211005U
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Abstract
The utility model provides a pressure sensor, forced induction module and electronic equipment. Wherein, pressure sensor includes: the sensor comprises a sensor body, a detection circuit and a control circuit, wherein a stress concentration area is arranged in the central area of the sensor body, a plurality of first bonding pads are arranged in the edge area of the sensor body, the detection circuit is arranged in the central area of the sensor body and corresponds to the stress concentration area, and the detection circuit comprises a plurality of strain elements and a plurality of reference elements positioned outside the strain elements; and each strain element and each reference element are electrically connected with the control circuit board through the first bonding pad so as to output electric signals. The utility model discloses a pressure sensor is welding formula pressure sensor, realizes being connected with control circuit board's electricity through the pad that sets up all around, and the position of button can be arranged according to the actual need of oneself to reduce the cycle that customer development pressure sensor module was used, convenient production, reduce cost.
Description
Technical Field
The utility model belongs to the technical field of the forced induction, concretely relates to pressure sensor, forced induction module and an electronic equipment.
Background
With the technological progress and social development, the pressure sensing technology is widely applied in the consumer electronics industry (such as mobile phones, earphones, notebook computers, household appliances and the like), and the pressure switch, the pressure function key and the like are applied through the pressure sensor. At present, most of application schemes of the pressure sensor are to customize the sensor according to the structural characteristics of products. Different products have different structures, so the designed sensors are also different greatly. Moreover, the conventional custom sensor solution requires a design and production cycle, and the actual production of the sensor requires a long time. In the subsequent functional verification, the next sensor production cycle is needed when the sensor needs to be changed in design, which results in longer development cycle and lower efficiency of the actual pressure sensor application.
Therefore, for solving the above-mentioned problem that needs come the customization sensor according to the product structure, the utility model provides a pressure sensor and a forced induction module, this forced induction module is modularization, standardized unified encapsulation, and the position of button can be arranged according to the needs of oneself to the customer to reduce the cycle that customer development pressure sensor module was used.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a pressure sensor, forced induction module and an electronic equipment.
An aspect of the present invention provides a pressure sensor, including: the sensor comprises a sensor body, a stress concentration area is arranged in the central area of the sensor body, and a plurality of first bonding pads are arranged in the edge area of the sensor body;
a detection circuit provided in a central region of the sensor body and corresponding to the stress concentration region, the detection circuit including a plurality of strain elements and a plurality of reference elements located outside the strain elements; and the number of the first and second groups,
each strain element and each reference element are electrically connected with the control circuit board through the first bonding pad so as to transmit pressure signals.
Optionally, the plurality of strain elements are arranged at intervals along the width direction of the sensor body;
the plurality of reference elements are respectively arranged on two sides of the plurality of strain elements along the length direction of the sensor body.
Optionally, the reference element is arranged coaxially with the strain element; or,
the reference element is disposed crosswise to the strain element axis.
Optionally, the sensor main body includes a flexible circuit board and a reinforcing plate; wherein,
the central area of the flexible circuit board is provided with the detection circuit, the peripheral area of the flexible circuit board is provided with the first bonding pads, and orthographic projections of the first bonding pads on the flexible circuit board fall outside the flexible circuit board;
the stiffening plate is provided with at least one stress concentration groove penetrating through the thickness of the stiffening plate.
Optionally, the sensor body comprises a printed circuit board;
the central area of the sensor body is provided with the detection circuit, and the peripheral area of the sensor body is provided with the first bonding pads, and orthographic projections of the first bonding pads on the sensor body fall in the sensor body;
the sensor body is provided with at least one stress concentrating groove through its thickness.
Optionally, the pressure sensor further comprises at least one reinforcement pad disposed at a central region of a side of the sensor body board facing away from the detection circuit.
Optionally, the pressure sensor includes a plurality of reinforcing bonding pads, and the reinforcing bonding pads are symmetrically disposed on two sides of the stress concentration groove.
Optionally, the first bonding pad is in a long strip shape, and a length direction of the first bonding pad is parallel to a length direction of the sensor body.
In another aspect of the present invention, a pressure sensing module is provided, which includes a control circuit board and at least one pressure sensor, wherein the pressure sensor is the pressure sensor described above; wherein,
one side of the control circuit board facing the pressure sensor is provided with a plurality of second bonding pads, and each second bonding pad is electrically connected with the corresponding first bonding pad on each pressure sensor.
The utility model discloses an on the other hand provides an electronic equipment, including pressing the panel, electronic equipment still includes the foretell record the forced induction module, the control circuit board laminating sets up press the regional back of pressing of panel.
The utility model provides a pressure sensor, include: the sensor comprises a sensor body, a detection circuit and a control circuit, wherein a stress concentration area is arranged in the central area of the sensor body, a plurality of first bonding pads are arranged in the edge area of the sensor body, the detection circuit is arranged in the central area of the sensor body and corresponds to the stress concentration area, and the detection circuit comprises a plurality of strain elements and a plurality of reference elements positioned outside the strain elements; and each strain element and each reference element are electrically connected with the control circuit board through the first bonding pad so as to transmit pressure signals. The utility model discloses a pressure sensor is pressure welding formula pressure sensor, realizes being connected with control circuit board's electricity through the pad that sets up all around, and the position of button can be arranged according to the actual need of oneself to reduce the cycle that customer development forced induction module was used, convenient production, reduce cost.
Drawings
Fig. 1 is a front view of a pressure sensor according to an embodiment of the present invention;
fig. 2 is a rear view of a pressure sensor according to another embodiment of the present invention;
fig. 3 is a front view of a pressure sensor according to another embodiment of the present invention;
fig. 4 is a rear view of a pressure sensor according to another embodiment of the present invention;
fig. 5 is a front view of a pressure sensor according to another embodiment of the present invention;
fig. 6 is a front view of a pressure sensor according to another embodiment of the present invention;
fig. 7 is a rear view of a pressure sensor according to another embodiment of the present invention;
fig. 8 is a rear view of a pressure sensor according to another embodiment of the present invention;
fig. 9 is a rear view of a pressure sensor according to another embodiment of the present invention;
fig. 10 is a rear view of a pressure sensor according to another embodiment of the present invention;
fig. 11 is a schematic structural diagram of a pressure sensing module according to another embodiment of the present invention;
fig. 12 is an assembly view of a pressure sensing module according to another embodiment of the present invention;
fig. 13 is an assembly view of a pressure sensing module according to another embodiment of the present invention;
fig. 14 is a schematic structural diagram of a pressure sensing module according to another embodiment of the present invention;
fig. 15 is an assembly view of a pressure sensing module according to another embodiment of the present invention;
fig. 16 is an assembly view of a pressure sensing module according to another embodiment of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. Based on the described embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Unless otherwise specifically stated, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which the present invention belongs. As used in this application, the terms "comprises" or "comprising," or the like, do not specify the presence of stated shapes, numbers, steps, acts, operations, elements, components, and/or groups thereof, nor do they preclude the presence or addition of one or more other different shapes, numbers, steps, acts, operations, elements, components, and/or groups thereof. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number and order of the indicated features.
In some descriptions of the present invention, unless expressly stated or limited otherwise, the terms "mounted," "connected," or "fixed" and the like are not intended to be limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect through an intermediate medium, communication between two elements, or interaction between two elements. Also, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate an orientation or positional relationship based on that shown in the drawings, and are used only to indicate a relative positional relationship, which may also be changed accordingly when the absolute position of the object being described is changed.
As shown in fig. 1 to 10, in one aspect of the present invention, there is provided a pressure sensor 100, including: a sensor body 110, a central region of the sensor body 110 being provided with a stress concentration region 111, an edge region of the sensor body 110 being provided with a plurality of first pads 112, and a detection circuit 113, the detection circuit 113 being provided at the central region of the sensor body and corresponding to the stress concentration region, and the detection circuit 113 including a plurality of strain elements 113a and a plurality of reference elements 113b located outside the strain elements 113 a; and, each strain element 113a and each reference element 113b are electrically connected with the control circuit board through the first pads 112 to transmit a pressure signal.
The pressure sensor of this embodiment is welding formula pressure sensor, is provided with the pad through the sensor main part all around to realize being connected with control circuit board's electricity, the customer can arrange the position of button according to own actual need, with the cycle that reduces customer development forced induction module and use, convenient production, reduce cost.
Exemplarily, as shown in fig. 11 to 16, the pressure sensor 100 of the present embodiment may be electrically connected to the control circuit board 210 through the first bonding pad 112 to implement stress transmission, deformation and electrical signal transmission, of course, a bonding layer may be further disposed between the pressure sensor and the control circuit board to implement adhesion, fixation and deformation transmission through the bonding layer, and then, the electrical connection is implemented through the first bonding pad to transmit the electrical signal.
It should be understood that the strain element and the reference element of the present embodiment are printed resistors, and the first pad can be used as an input terminal, an output terminal, a power supply or a ground terminal to form a conductive circuit with the strain element and the reference element.
It should be noted that, the detection circuit of the present embodiment may adopt any one of a voltage dividing circuit, a current dividing circuit, a wheatstone bridge, a half bridge, a full bridge or other bridge circuits, and accordingly, the specific positions and the number of the strain elements and the reference elements are not particularly limited, for example, one, that is, a single resistor, may also be provided, and 4 may also be provided to form a wheatstone bridge. Also, when the strain element is disposed in the central region of the sensor body, the reference element may be disposed on either or both sides of the strain element.
For example, as shown in fig. 1 to 6, a plurality of strain elements 113a are arranged at intervals in the width direction of the sensor body 110, and a plurality of reference elements 113b are respectively disposed at both sides of the plurality of strain elements 113a in the length direction of the sensor body 110. As shown in fig. 1 and 5, in some embodiments, the reference element 113b is disposed coaxially with the strain element 113a, although in other embodiments, as shown in fig. 2 and 6, the reference element 113b may also be disposed axially across the strain element 113 a. That is, the reference elements may be coaxially arranged at the left and right ends of the strain element, or vertically arranged at the left and right ends of the strain element.
It should be further noted that the type of the pressure sensor is not specifically limited in this embodiment, for example, an FPC flexible circuit board pressure sensor may be adopted, or a PCB printed circuit board sensor may be adopted, and those skilled in the art may select the pressure sensor according to actual needs.
Specifically, as shown in fig. 1 to 4, in some embodiments, when the pressure sensor is an FPC flexible circuit board sensor, the sensor body 110 includes a flexible circuit board 110a and a reinforcing plate 110b, wherein a central region of the flexible circuit board 110a is provided with a detection circuit 113, wherein a plurality of strain elements 113a included in the detection circuit are arranged at intervals along a width direction of the flexible circuit board 110a, and a plurality of reference elements 113b are respectively disposed on two sides of the plurality of strain elements 113a along a length direction of the flexible circuit board 110a (the reference elements 113b are disposed coaxially with or cross the strain elements 113 a). And a plurality of first pads 112 are arranged in the peripheral area of the flexible circuit board 110a, and the orthographic projections of the plurality of first pads 112 on the flexible circuit board 110a fall outside the flexible circuit board 110a, which is equivalent to the plurality of first pads arranged outside the flexible circuit board). In addition, the reinforcing plate 110b is provided with at least one stress concentration groove 114 penetrating the thickness thereof, for example, two stress concentration grooves are symmetrically provided at the end portions of the reinforcing plate, and a stress concentration region 111 is formed in the middle region of the stress concentration groove to facilitate stress concentration and increase deformation.
It should be noted that, in this embodiment, neither the number nor the shape of the stress concentration grooves is specifically limited, and the stress concentration grooves may be arranged in a U shape, or may be in a V shape, a rectangular shape, or other slotted forms that are easy to generate stress concentration.
It should be further noted that, in this embodiment, the number and the shape of the first pads are not specifically limited, for example, one first pad may be respectively disposed at four corners of the flexible circuit board, and of course, other numbers of first pads may also be disposed.
It should be further noted that, in this embodiment, the pad is not specifically limited, and may be a single-sided pad or a double-sided pad, and may be set according to actual needs.
For example, as shown in fig. 11 to 13, when the pressure sensor 100 of the present embodiment is attached to the control circuit board 210, the pressure sensor is electrically connected to the control circuit board through a plurality of first pads on the pressure sensor, so as to transmit stress, deformation and electrical signals.
Specifically, as shown in fig. 5 to 10, in another embodiment, when the pressure sensor is a PCB sensor, the sensor body 110 includes a PCB, and the central area of the sensor body 110 is provided with a detection circuit 113, wherein a plurality of strain elements 113a included in the detection circuit are arranged at intervals along the width direction of the sensor body 110, and a plurality of reference elements 113b are respectively disposed on two sides of the plurality of strain elements 113a along the length direction of the sensor body 110 (the reference elements 113b are disposed coaxially with the strain elements 113a, or disposed crosswise). And, the peripheral area of the sensor body 110 is provided with a plurality of first pads 112, the orthographic projection of the plurality of first pads 112 on the sensor body 110 falls within the sensor body 110 (equivalent to the plurality of first pads being provided around the sensor body); the sensor body 110 is provided with at least one stress concentration groove 114 through its thickness, for example, two stress concentration grooves 114 are symmetrically provided at the ends of the sensor body 110, and the middle region of the stress concentration grooves forms a stress concentration region 111 to facilitate stress concentration and increase deformation. That is, the printed circuit board of the present embodiment corresponds to a substrate, and the detection circuit and the first pad are provided on the substrate.
It should be noted that, in this embodiment, neither the number nor the shape of the stress concentration grooves is specifically limited, and the stress concentration grooves may be arranged in a U shape, or may be in a V shape, a rectangular shape, or other slotted forms that are easy to generate stress concentration.
It should be noted that, in this embodiment, the shape of the first pad is not particularly limited, and may be a square, a rectangle, a circle, or the like.
For example, referring to fig. 5 to 7, the first bonding pads 112 disposed around the sensor body 110 are square, and referring to fig. 8, the first bonding pads 112 disposed around the sensor body 110 are elongated, and the length direction of the first bonding pads 112 is parallel to the length direction of the sensor body 110, so as to transmit stress and deformation and be electrically connected to the control circuit board.
In order to further fix the pressure sensor and the control circuit board, a reinforcing pad may be further provided on a side of the pressure sensor facing the control circuit board. Specifically, as shown in fig. 9 and 10, the pressure sensor 100 further includes at least one reinforcement pad 115, and the reinforcement pad 115 is disposed at a central region of a side of the sensor body 110 facing away from the detection circuit 113. That is, the reinforcing pad serves only a certain fixing function and a function of transferring stress and deformation, and corresponds to an adhesive layer located between the pressure sensor and the control circuit board.
Optionally, the pressure sensor includes a plurality of reinforcing pads symmetrically disposed on both sides of the stress concentration groove. Illustratively, as shown in fig. 10, one reinforcing pad 115 is disposed on each of both sides of the stress concentration groove 114.
It is to be understood that the shape of the reinforcing pad is not particularly limited in this embodiment, and may be configured to be circular in some embodiments (see fig. 9), or rectangular in other embodiments (see fig. 10).
For example, as shown in fig. 14 to 16, when the pressure sensor 100 of the present embodiment is attached to the control circuit board 210, the pressure sensor is electrically connected to the control circuit board through a plurality of first pads on the pressure sensor, so as to transmit stress, deformation and electrical signals.
As shown in fig. 11 and 14, another aspect of the present invention provides a pressure sensing module 200, which includes a control circuit board 210 and at least one pressure sensor 100, wherein the pressure sensor employs the pressure sensor described above, and the specific structure thereof refers to the above description, which is not limited herein. Wherein, a side of the control circuit board 210 facing the pressure sensors is provided with a plurality of second pads (not shown in the figure), and each second pad is electrically connected with a corresponding plurality of first pads on each pressure sensor.
It should be noted that the second pad of this embodiment may be an integral pad, and may also include a plurality of sub-second pads, for example, when four corners of the pressure sensor are respectively provided with one first pad, and there are four first pads, correspondingly, the second pad may include four sub-second pads, so that each sub-second pad corresponds to each first pad one to one, and the number of the sub-second pads is the same, so as to implement electrical connection.
It should be further explained that, the laminating of pressure sensor accessible tie coat and control circuit board of this embodiment, with transmission stress and deformation, this tie coat can be the double faced adhesive tape adhesive linkage, ya keli foamed adhesive tape linkage, AB glue adhesion layer, the epoxy adhesive linkage, silica gel adhesive linkage or other similar thing adhesive linkage that glues, of course, can also be pressure sensor central zone and consolidate the pad, thus, can play the effect of adhesion and transmission deformation, can also fix pressure sensor, play the effect of laminating, the first pad and the control circuit board welding at rethread pressure sensor both ends, in order to realize the transmission signal of telecommunication.
As shown in fig. 12, 13, 15 and 16, another aspect of the present invention provides an electronic device 300, which includes a pressing panel 310, and the electronic device 300 further includes the aforementioned pressure sensing module 200, and the control circuit board 210 is attached to the back of the pressing area of the pressing panel 310. That is to say, the control circuit board is directly attached to the pressing panel to transmit stress and deformation, and when the pressing panel 310 is directly pressed, the stress is transmitted to the control circuit board and then transmitted to the pressure sensor.
It should be noted that, in this embodiment, the bonding manner between the control circuit board and the pressing panel is not particularly limited, and a double-sided adhesive layer, an acrylic adhesive layer, an AB adhesive layer, an epoxy adhesive layer, a silicone adhesive layer, or other similar adhesive layers may also be used for bonding.
It should be understood that fig. 12, 13, 15 and 16 are equivalent to the assembly schematic diagram of the pressure sensing module, and it is obvious to those skilled in the art that the key positions can be arranged according to actual needs without customizing the pressure sensors.
It should be further noted that the electronic device in the present embodiment is not particularly limited, and may be, for example, a notebook computer, a mobile phone, a washing machine, and the like. The utility model provides a pressure sensor, forced induction module and electronic equipment. The utility model discloses a pressure sensor is pressure welding formula pressure sensor, realizes being connected with control circuit board's electricity through the pad that sets up all around to, the customer can arrange the position of button according to the actual need of oneself, with the cycle that reduces customer development pressure sensor module and use, convenient production, reduce cost.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A pressure sensor, comprising:
the sensor comprises a sensor body, a stress concentration area is arranged in the central area of the sensor body, and a plurality of first bonding pads are arranged in the edge area of the sensor body;
a detection circuit provided in a central region of the sensor body and corresponding to the stress concentration region, the detection circuit including a plurality of strain elements and a plurality of reference elements located outside the strain elements; and the number of the first and second groups,
each strain element and each reference element are electrically connected with the control circuit board through the first bonding pad so as to transmit pressure signals.
2. The pressure sensor according to claim 1, wherein the plurality of strain elements are arranged at intervals in a width direction of the sensor body;
the plurality of reference elements are respectively arranged on two sides of the plurality of strain elements along the length direction of the sensor body.
3. A pressure sensor according to claim 2, wherein the reference element is arranged coaxially with the strain element; or,
the reference element is disposed crosswise to the strain element axis.
4. A pressure sensor according to any of claims 1 to 3, wherein the sensor body comprises a flexible circuit board and a stiffener; wherein,
the central area of the flexible circuit board is provided with the detection circuit, the peripheral area of the flexible circuit board is provided with the first bonding pads, and orthographic projections of the first bonding pads on the flexible circuit board fall outside the flexible circuit board;
the stiffening plate is provided with at least one stress concentration groove penetrating through the thickness of the stiffening plate.
5. A pressure sensor as claimed in any one of claims 1 to 3, wherein the sensor body comprises a printed circuit board;
the central area of the sensor body is provided with the detection circuit, and the peripheral area of the sensor body is provided with the first bonding pads, and orthographic projections of the first bonding pads on the sensor body fall in the sensor body;
the sensor body is provided with at least one stress concentrating groove through its thickness.
6. A pressure sensor as claimed in claim 5, further comprising at least one stiffening pad provided at a central region of a side of the sensor body facing away from the detection circuit.
7. The pressure sensor of claim 6, wherein the pressure sensor comprises a plurality of reinforcement pads symmetrically disposed on either side of the stress concentrating channel.
8. The pressure sensor according to claim 5, wherein the first pad has an elongated shape, and a longitudinal direction of the first pad is parallel to a longitudinal direction of the sensor body.
9. A pressure sensing module, characterized by comprising a control circuit board and at least one pressure sensor, wherein the pressure sensor adopts the pressure sensor of any one of claims 1 to 8; wherein,
one side of the control circuit board facing the pressure sensor is provided with a plurality of second bonding pads, and each second bonding pad is electrically connected with the corresponding first bonding pad on each pressure sensor.
10. An electronic device comprising a pressing panel, wherein the electronic device further comprises the pressure sensing module set according to claim 9, and the control circuit board is attached to the back of the pressing area of the pressing panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022373185.4U CN213211005U (en) | 2020-10-22 | 2020-10-22 | Pressure sensor, pressure sensing module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022373185.4U CN213211005U (en) | 2020-10-22 | 2020-10-22 | Pressure sensor, pressure sensing module and electronic equipment |
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| CN213211005U true CN213211005U (en) | 2021-05-14 |
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| CN202022373185.4U Active CN213211005U (en) | 2020-10-22 | 2020-10-22 | Pressure sensor, pressure sensing module and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113324683A (en) * | 2021-05-21 | 2021-08-31 | 维沃移动通信有限公司 | Electronic device |
| CN113503808A (en) * | 2021-07-23 | 2021-10-15 | 深圳瑞湖科技有限公司 | Forced induction structure suitable for curved surface deformation detects |
-
2020
- 2020-10-22 CN CN202022373185.4U patent/CN213211005U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113324683A (en) * | 2021-05-21 | 2021-08-31 | 维沃移动通信有限公司 | Electronic device |
| WO2022242601A1 (en) * | 2021-05-21 | 2022-11-24 | 维沃移动通信有限公司 | Electronic device |
| CN113503808A (en) * | 2021-07-23 | 2021-10-15 | 深圳瑞湖科技有限公司 | Forced induction structure suitable for curved surface deformation detects |
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