CN106484165B - Touch panel and manufacturing method thereof - Google Patents
Touch panel and manufacturing method thereof Download PDFInfo
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- CN106484165B CN106484165B CN201510546826.2A CN201510546826A CN106484165B CN 106484165 B CN106484165 B CN 106484165B CN 201510546826 A CN201510546826 A CN 201510546826A CN 106484165 B CN106484165 B CN 106484165B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 239000000853 adhesive Substances 0.000 claims abstract description 28
- 230000001070 adhesive effect Effects 0.000 claims abstract description 28
- 239000002245 particle Substances 0.000 claims description 41
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 description 14
- 238000003825 pressing Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Abstract
The invention discloses a touch panel and a manufacturing method thereof. The touch panel comprises a sensing electrode arranged on a substrate, the substrate is provided with a first bonding area, a plurality of first bonding pads are arranged on the first bonding area of the substrate and electrically connected to the sensing electrode, a plurality of second bonding pads are arranged on the second bonding area of the flexible printed circuit board, the second bonding pads correspond to the first bonding pads in the first bonding area, and anisotropic conductive adhesive is arranged between the second bonding area of the flexible printed circuit board and the first bonding area of the substrate, wherein the substrate further comprises a third bonding area, and the second bonding pads and the first bonding pads are in non-corresponding relation in the third bonding area.
Description
Technical Field
The present invention relates to touch technology, and more particularly, to a bonding pad configuration of a touch panel.
Background
In recent years, touch panels have been widely used in various electronic products, such as mobile phones, portable computers, palm computers, etc., and the touch panels and display panels are combined to form input/output interfaces of the electronic products. The touch panel generally includes sensing electrodes arranged in a touch array to provide a touch sensing function, and the sensing electrodes are electrically connected to a plurality of bonding pads located at a peripheral area of the touch panel through wires, and the bonding pads at the peripheral area of the touch panel are generally bonded with bonding pads on a flexible printed circuit board (flexible print circuit board; FPC) by using anisotropic conductive adhesive (anisotropic conductive film; ACF) through a pressing manner, so that electrical signals obtained by the sensing electrodes are transmitted to an integrated circuit on the flexible printed circuit board to determine and process touch signals.
After the anisotropic conductive paste is pressed, conductive particles contained in the anisotropic conductive paste are gathered through the substrate of the anisotropic conductive paste, so that the bonding pads on the peripheral area of the touch panel and the bonding pads on the flexible printed circuit board are electrically connected in a vertical direction. However, the current configuration of the bonding pads in the peripheral area of the touch panel is not easy to observe the condition of the conductive particles in the anisotropic conductive paste after the lamination step, and it is not possible to confirm whether the electrical connection between the bonding pads in the peripheral area of the touch panel and the bonding pads of the flexible printed circuit board is achieved.
Disclosure of Invention
In view of the fact that the state of the conductive particles of the anisotropic conductive paste cannot be confirmed in the prior art, some embodiments of the present invention provide a touch panel, including: the sensing electrode is arranged on the substrate, the substrate is provided with a first bonding area, a plurality of first bonding pads are arranged on the first bonding area of the substrate, and the first bonding pads are electrically connected to the sensing electrode; the second bonding pads are arranged on the second bonding region of the flexible printed circuit board, so that the second bonding pads correspond to the first bonding pads in the first bonding region; the anisotropic conductive adhesive is arranged between the second bonding area of the flexible printed circuit board and the first bonding area of the substrate, wherein the substrate further comprises a third bonding area, and the first bonding pads and the second bonding pads are in non-corresponding relation in the third bonding area.
According to some embodiments of the present invention, there is also provided a method for manufacturing a touch panel, including: forming a sensing electrode on a substrate, forming a plurality of first bonding pads on a first bonding region on the substrate, wherein the first bonding pads are electrically connected to the sensing electrode; providing a flexible printed circuit board with a plurality of second bonding pads formed on the second bonding region, wherein the second bonding pads correspond to the first bonding pads in the first bonding region; and bonding the second bonding region of the flexible printed circuit board with the first bonding region of the substrate through the anisotropic conductive adhesive, wherein the substrate further comprises a third bonding region, so that the first bonding pads and the second bonding pads are in a non-corresponding relationship in the third bonding region.
According to the invention, the first bonding pad on the substrate and the second bonding pad on the flexible printed circuit board are in a non-corresponding relation in the third bonding area by the configuration of the bonding pads on the substrate and the flexible printed circuit board, and after the first bonding pad on the substrate of the touch panel and the second bonding pad on the flexible printed circuit board are bonded by utilizing the anisotropic conductive adhesive through the bonding step, according to the embodiment of the invention, the anisotropic conductive adhesive in the third bonding area which is in the non-corresponding relation with the first bonding pad and the second bonding pad is not shielded by the first bonding pad or the second bonding pad, so that the conductive particle state of the anisotropic conductive adhesive can be observed through the third bonding area, and further whether the electric connection between the first bonding pad on the substrate of the touch panel and the second bonding pad on the flexible printed circuit board is achieved is confirmed.
Drawings
FIG. 1 is a schematic cross-sectional view of a touch panel according to some embodiments of the invention;
FIG. 2A is a schematic diagram illustrating a stacked structure of a second bonding pad on a flexible printed circuit board and a first bonding pad on a substrate according to some embodiments of the present invention;
FIG. 2B is a schematic diagram illustrating a stacked structure of the second bonding pads on the FPC and the first bonding pads on the substrate according to other embodiments of the present invention;
FIG. 2C is a schematic diagram illustrating a stacked structure of a second bonding pad on a flexible printed circuit board and a first bonding pad on a substrate according to still other embodiments of the present invention;
FIG. 3A is a schematic view of an enlarged partial cross section of an area E of the touch panel of FIG. 1 according to some embodiments of the present invention;
FIG. 3B is a schematic view of a partial enlarged cross-section of a region E of the touch panel of FIG. 1 according to other embodiments of the present invention;
FIG. 4 is a schematic cross-sectional view of a touch panel according to other embodiments of the invention;
fig. 5 is a schematic cross-sectional view of a touch panel according to still other embodiments of the invention.
Symbol description
100-touch panel;
100A to a touch control area;
100P to peripheral region;
101. 102, 113 to a substrate;
103 to a sensing electrode;
BA1 to first junction;
BA2 to a second junction;
BA3 to third junction region;
105 to a first bonding pad;
107 to flexible printed circuit board;
109 to a second bonding pad;
105F, 109F to functional bond pads;
105D, 109D to dummy bond pads;
105B-1, 105B-2, 105B-3, 109B-1, 109B-2, 109B-3 to blank areas;
111-anisotropic conductive adhesive;
111-1 to an insulating base material;
111-2 to conductive particles;
111-3 to an insulating film;
115 to a light shielding layer;
w1-width;
p1-space;
d1 to a first distance;
d2 to a second distance;
h1 and h2 to thickness.
Detailed Description
Fig. 1 is a schematic cross-sectional view of a touch panel 100 according to some embodiments of the invention. In some embodiments, the touch panel 100 may be a capacitive, resistive touch panel, or other type of touch panel requiring a bonding pad for transmitting electrical signals from a touch area to a peripheral area, the touch panel 100 includes a substrate 101, in some embodiments, the substrate 101 is a light-transmitting insulating film, such as a Polyimide (PI) film, and the sensing electrode 103 of the touch panel 100 is formed on the substrate 101 and located in the touch area 100A, in some embodiments, the sensing electrode 103 includes a plurality of first axial electrodes and a plurality of second axial electrodes (not depicted), and the first axial electrodes and the second axial electrodes are alternately arranged in an insulating manner to form a touch sensing array. In some other embodiments, the sensing electrode 103 may include other forms of touch sensing arrays.
The touch panel 100 further includes a plurality of first bonding pads (bonding pads) 105 or called sensing pads (sensor bonding pads) formed on the substrate 101 and located in the peripheral region 100P, the first bonding pads 105 are electrically connected to the plurality of first axial electrodes and the plurality of second axial electrodes of the sensing electrodes 103 respectively via wires (not shown in fig. 1), and in order to transmit the electrical signals detected by the sensing electrodes 103 to an external circuit for processing, a Flexible Printed Circuit (FPC) 107 is provided, wherein the Flexible Printed Circuit (FPC) 107 has a plurality of second bonding pads 109 or called flexible printed circuit bonding pads (FPC bonding pads) formed thereon, and the second bonding pads 109 are electrically connected to an integrated circuit chip (not shown in fig. 1) on the Flexible Printed Circuit (FPC) 107.
In some embodiments, the first bonding pad 105 and the second bonding pad 109 are bonded together by pressing an anisotropic conductive paste (ACF) 111, so as to confirm whether the electrical connection between the first bonding pad 105 and the second bonding pad 109 is achieved, whether the conductive particles in the anisotropic conductive paste (ACF) 111 pass through the insulating substrate of the anisotropic conductive paste (ACF) 111 may be observed, and since the conductive particles are generally made of a metal material, when the conductive particles in the anisotropic conductive paste (ACF) 111 pass through the insulating substrate of the anisotropic conductive paste (ACF) 111, a reflection phenomenon of the conductive particles may be observed by an optical microscope.
In other embodiments, the periphery of the conductive particles in the Anisotropic Conductive Film (ACF) 111 is further coated with an insulating film, when the insulating film is broken by the lamination step, the conductive particles in the Anisotropic Conductive Film (ACF) 111 can electrically connect the first bonding pad 105 and the second bonding pad 109, and when the insulating film is broken, the conductive particles can generate a reflection phenomenon, and by observing whether the conductive particles have the reflection phenomenon, it can be determined whether the first bonding pad 105 and the second bonding pad 109 are electrically connected.
Referring to fig. 2A, a schematic lamination diagram of a positional correspondence between a second bonding pad 109 on a flexible printed circuit 107 and a first bonding pad 105 on a substrate 101 in a peripheral region of a touch panel according to some embodiments of the invention is shown. As shown in fig. 2A, a plurality of first bonding pads 105 are disposed on the first bonding area BA1 of the substrate 101, and these first bonding pads 105 are electrically connected to the sensing electrode 103 shown in fig. 1. The plurality of second bonding pads 109 are disposed on the second bonding area BA2 of the flexible printed circuit board 107, the second bonding pads 109 include a plurality of functional bonding pads (functional pads) 109F and at least one dummy bonding pad (dummy pads) 109D, the functional bonding pads 109F of the second bonding pads 109 correspond to the first bonding pads 105 in the first bonding area BA1, such that the functional bonding pads 109F have a function of transmitting electrical signals, and the dummy bonding pads 109D of the second bonding pads 109 do not need to transmit electrical signals, and the functional bonding pads 109F and the dummy bonding pads 109D may be disposed in the second bonding area BA2 in an equidistant (pitch) manner. According to some embodiments of the present invention, the substrate 101 further includes a third bonding area BA3, such that the first bonding pad 105 and the second bonding pad 109 are in a non-corresponding relationship in the third bonding area BA3, i.e. the dummy bonding pad 109D of the second bonding pad 109 does not correspond to any of the first bonding pads 105 in the third bonding area BA 3.
The anisotropic conductive adhesive 111 (shown in fig. 1) is disposed between the second bonding area BA2 of the flexible printed circuit board 107 and the first bonding area BA1 of the substrate 101, and also has the anisotropic conductive adhesive 111 between the second bonding area BA2 of the flexible printed circuit board 107 and the third bonding area BA3 of the substrate 101. In some embodiments, the first bonding pad 105 may also include a plurality of functional bonding pads and optionally dummy bonding pads (not shown in fig. 2A), wherein the functional bonding pads have a function of transmitting electrical signals, and the dummy bonding pads do not need to transmit electrical signals, and the positions of the functional bonding pads of the first bonding pad 105 are configured corresponding to the positions of the functional bonding pads 109F of the second bonding pad 109.
According to some embodiments of the present invention, at least one blank region 105B-1 may be disposed between the first bonding pads 105 such that the position of at least one dummy bonding pad 109D of the second bonding pad 109 corresponds to the blank region 105B-1. According to some embodiments of the present invention, a first bonding pad 105 that would otherwise correspond to the second bonding pad 109 may be removed, thereby creating a blank 105B-1. As shown in fig. 2A, in some embodiments, the third bonding area BA3 on the substrate 101 may include two blank areas 105B-1 and 105B-2, respectively disposed at two side areas of the first bonding pads 105.
According to some embodiments of the present invention, the width W1 of the blank 105B-1 is greater than the pitch P1 between two immediately adjacent first bond pads 105 (which may be functional bond pads and dummy bond pads), and in some embodiments, the width W1 may be 2.5 times to 3.5 times the pitch P1. In the preferred embodiment, the center-to-center spacing of each first bond pad 105 is approximately equal to 2 times the spacing P1, and each first bond pad 105 has a width that is the spacing P1, so that the preferred embodiment of the width W1 is 3 times the spacing P1. However, the actual pitch of the edge of each first bonding pad 105 may be slightly larger or smaller than the pitch P1 due to the manufacturing process capability.
Referring again to fig. 1, another substrate 102 is provided under the substrate 101 as a protective cover plate (cover plate), and a light shielding layer 115 for masking the wiring of the peripheral region of the touch panel is formed on the peripheral region 110P of the substrate 102, the substrate 101 is attached to the other substrate 102 (protective cover plate) and the light shielding layer 115, and the light shielding layer 115 is interposed between the substrate 101 (light-transmitting insulating film) and the other substrate 102 (protective cover plate). After the second bonding pads 109 on the flexible printed circuit board 107 are bonded to the first bonding pads 105 on the substrate 101 through the anisotropic conductive adhesive 111 by pressing, in order to confirm the condition of conductive particles in the anisotropic conductive adhesive in the whole batch of products, one of the products having adhered the first bonding pads 105 to the second bonding pads 109 can be taken out, and the flexible printed circuit board 107 is disassembled for inspection, in this embodiment, the first bonding pads 105 and the sensing electrodes 103 formed on the substrate 101 are disassembled along with the substrate 101 and the flexible printed circuit board 107.
Since the material of the first bonding pad 105 is metal such as molybdenum, aluminum, molybdenum, etc., and the material of the second bonding pad 109 is copper, the adhesion force of the copper foil to the flexible printed circuit board is better than that of the molybdenum, aluminum, molybdenum, or other oxide to the substrate 101, and therefore, when the flexible printed circuit board 107 is peeled off from the substrate 101, the first bonding pad 105 is peeled off from the substrate 101 and is adhered to the second bonding pad 109. If the blank area 105B-1 or 105B-2 is not provided between the first bonding pads 105, all the first bonding pads 105 will be opposite to the second bonding pads 109, and the first bonding pads 105 and the second bonding pads 109 are opaque, so that it is impossible to observe whether the insulating film around the conductive particles in the anisotropic conductive adhesive 111 is crushed. When the blank area 105B-1 or 105B-2 is provided in the third bonding area BA3 of the substrate 101, at least one of the dummy bonding pads 109D is not attached with the first bonding pad 105, so that the state of the conductive particles can be observed on the dummy bonding pad 109D not attached with the first bonding pad 105.
Furthermore, since the distance between the dummy bonding pad 109D and the substrate 101 is larger than the distance between the functional bonding pad 109F and the first bonding pad 105, when the insulating film (or the insulating paste) on the periphery of the conductive particles in the anisotropic conductive paste 111 is not confirmed to be broken on the dummy bonding pad 109D attached by the first bonding pad 105, it is confirmed that the conductive particles between the functional bonding pad 109F and the first bonding pad 105 are also broken, and further that the first bonding pad 105 is electrically connected to the second bonding pad 109.
In addition, by peeling the substrate 101 (light-transmitting insulating film) from the other substrate 102 (protective cover plate) and the light-shielding layer 115, since the substrate 101 is a light-transmitting film and the first bonding pad 105 is not present in the blank areas 105B-1, 105B-2, the condition of the conductive particles after the lamination process can be observed from the blank areas 105B-1, 105B-2 on the substrate 101 (light-transmitting insulating film) side, thereby judging whether or not the electrical connection between the second bonding pad 109 and the first bonding pad 105 is achieved. On the contrary, if the first bonding pads 105 do not have the blank areas 105B-1 or 105B-2, the conductive particles in the anisotropic conductive paste are trapped between each of the first bonding pads 105 and each of the second bonding pads 109, and it cannot be observed whether the conductive particles in the anisotropic conductive paste achieve the electrical connection between the second bonding pads 109 and the first bonding pads 105.
As shown in fig. 2A, in some embodiments, the blank areas 105B-1, 105B-2 between the first bonding pads 105 may be disposed on both side areas of the first bonding pads 105, thereby observing the bonding effect of the bonding fabrication process on the bonding pads at both side positions of the bonding area. Although fig. 2A depicts the first bond pad 105 as having one blank area 105B-1, 105B-2 on each side area, other configurations of the number and location of blank areas may be used in other embodiments.
Fig. 2B is a schematic diagram of a lamination of the position correspondence between the second bonding pad 109 on the flexible printed circuit board 107 and the first bonding pad 105 on the substrate 101 according to other embodiments of the present invention, as shown in fig. 2B, in some embodiments, besides disposing one blank area 105B-1, 105B-2 on each of the two side areas of the first bonding pad 105, a blank area 105B-3 may be disposed on the middle area of the first bonding pad 105, and the positions of these blank areas 105B-1, 105B-2, 105B-3 correspond to the dummy bonding pad 109D of the second bonding pad 109, by disposing the blank areas 105B-1, 105B-2, 105B-3 on both ends and the middle area of the first bonding pad 105, the pressing effect of the pressing head of the pressing device on the bonding pads on the left and right sides and the middle position of the bonding area can be further confirmed, and the uniform pressing effect of both ends and middle area can be achieved by adjusting the process parameter conditions of the pressing device.
In addition, as shown in fig. 2B, the first bonding pad 105 may include a plurality of functional bonding pads 105F and selectively disposed dummy bonding pads 105D, and the dummy bonding pads 105D may be disposed at both sides of the blank areas 105B-1, 105B-2. While fig. 2B depicts the first bond pad 105 as having one blank 105B-1, 105B-2 at each end between two dummy bond pads 105D and one blank 105B-3 in between two functional bond pads 105F, other numbers and locations of functional bond pads 105F, dummy bond pads 105D, and blank 105B-1, 105B-2, 105B-3 may be employed in other embodiments.
Fig. 2C is a schematic lamination diagram of the positional correspondence between the second bonding pads 109 on the flexible printed circuit board 107 and the first bonding pads 105 on the substrate 101 according to still other embodiments of the present invention, as shown in fig. 2C, in some embodiments, the blank areas 109B-1, 109B-2, 109B-3 may be disposed between the second bonding pads 109, and the dummy bonding pads 105D of the first bonding pads 105 may correspond to the blank areas 109B-1, 109B-2, 109B-3, and the dummy bonding pads 105D may be disposed on the third bonding area BA3 on the substrate 101, such that the first bonding pads 105 and the second bonding pads 109 are not in the corresponding relationship in the third bonding area BA 3.
Fig. 3A is an enlarged partial cross-sectional view of a region E of the touch panel 100 of fig. 1, as shown in fig. 3A, between the second bonding pad 109 of the flexible printed circuit board 107 and the first bonding pad 105 of the substrate 101, an anisotropic conductive paste 111 is provided, wherein the anisotropic conductive paste 111 includes an insulating substrate 111-1 and a plurality of conductive particles 111-2 dispersed in the insulating substrate 111-1, and after the second bonding pad 109 on the flexible printed circuit board 107 and the first bonding pad 105 on the substrate 101 are pressed, the anisotropic conductive paste 111 between the second bonding pad 109 and the first bonding pad 105 is pressed, wherein the conductive particles 111-2 are gathered through the insulating substrate 111-1 after being pressed, such that an electrical connection (e.g. an electrical connection in a Z direction) is generated between the second bonding pad 109 and the first bonding pad 105 in a direction perpendicular to the surface direction of the flexible printed circuit board 107 and the substrate 101, but an electrical connection (e.g. an electrical connection in a X, Y direction is not generated in a direction parallel to the surface direction of the flexible printed circuit board 107 and the substrate 101).
As shown in fig. 3A, the first bonding pad 105 has a thickness h1, for example, the thickness h1 may be 0.2 μm to 0.4 μm, and in a preferred embodiment, the thickness h1 may be 0.3 μm, and the second bonding pad 109 has a thickness h2, for example, the thickness h2 may be 3 μm to 30 μm, and in a preferred embodiment, the thickness h2 may be 8 μm to 25 μm. The thickness h1 is determined by the metal trace (trace) between the sensing electrode 103 and the first bonding pad 105, and the thickness h1 is smaller than the thickness h2 because the metal trace is thinner and is easy to break, so the thickness h1 cannot be too thick when the metal trace overlaps the first bonding pad 105. In some embodiments, the thickness h2 of the second bond pad 109 is 10 to 100 times the thickness h1 of the first bond pad 105, e.g., the thickness h2 may be about 10 μm and the thickness h1 about 1 μm.
According to some embodiments of the present invention, the second bonding pad 109 is spaced apart from the blank region 105B-1 on the substrate 101 by a first distance d1 (less than about 12.4 μm), the second bonding pad 109 is spaced apart from the first bonding pad 105 by a second distance d2 (less than about 12 μm), the first distance d1 is greater than the second distance d2, and the difference between the first distance d1 and the second distance d2 is about the thickness h1 (i.e., between about 0.2 μm and 0.4 μm), so that when the conductive particles 111-2 are observed to have passed through the insulating substrate 111-1 from the blank region 105B-1, it is more confirmed that the conductive particles 111-2 between the second bonding pad 109 and the first bonding pad 105 have indeed passed through the insulating substrate 111-1 to achieve the electrical connection in the vertical direction, because the second distance d2, which is smaller, can be determined to achieve the desired bonding effect when the first distance d1, which is greater, has achieved the desired bonding effect.
Fig. 3B is a schematic partial enlarged cross-sectional view of an area E of the touch panel 100 of fig. 1 according to other embodiments of the present invention, as shown in fig. 3B, the periphery of the conductive particles 111-2 in the anisotropic conductive adhesive 111 is further covered with the insulating film 111-3, and after the second bonding pad 109 on the flexible printed circuit board 107 and the first bonding pad 105 on the substrate 101 are pressed, the anisotropic conductive adhesive 111 is pressed, and the insulating film 111-3 on the periphery of the conductive particles 111-2 is broken, so that the electrical connection between the second bonding pad 109 and the first bonding pad 105 can be achieved.
According to the embodiment of the invention, in the third bonding area BA3 on the substrate 101, the first bonding pads 105 and the second bonding pads 109 are in a non-corresponding relationship, for example, the non-corresponding relationship is derived from the fact that the empty areas 105B-1, 105B-2, 105B-3 are arranged between the first bonding pads 105 or the empty areas 109B-1, 109B-2, 109B-3 are arranged between the second bonding pads 109, and when the flexible printed circuit board 107 is to be detached to observe the condition of the conductive particles 111-2 in the anisotropic conductive adhesive 111, the empty areas arranged between the first bonding pads 105 or between the second bonding pads 109 can prevent the conductive particles 111-2 from being shielded by the first bonding pads 105 or the second bonding pads 109, thereby observing whether the conductive particles 111-2 have a reflection phenomenon. Therefore, the provision of the blank region not only allows the condition of the conductive particles to be easily observed, but also makes it possible to more effectively confirm whether or not the electrical connection between the second bonding pad 109 and the first bonding pad 105 is actually achieved by observing the condition of the conductive particles in the blank region as described above.
Fig. 4 is a schematic cross-sectional view of a touch panel 100 according to another embodiment of the invention, the sensing electrode 103 and the first bonding pad 105 of the touch panel 100 are formed on the substrate 101, in some embodiments, the substrate 101 may be a glass substrate or a flexible plastic substrate, the flexible printed circuit 107 has a second bonding pad 109 thereon, the second bonding pad 109 is bonded with the first bonding pad 105 through an anisotropic conductive adhesive 111, and in some embodiments, the second bonding pad 109 and the first bonding pad 105 may be configured as shown in fig. 2A, 2B or 2C.
In addition, the touch panel 100 further includes another substrate 113 disposed above the flexible printed circuit 107, the substrate 113 serving as a protective cover, and a light shielding layer 115 formed on the inner surface of the substrate 113 in the peripheral region 100P. In this embodiment, after the second bonding pad 109 and the first bonding pad 105 are bonded by the anisotropic conductive adhesive 111 through the bonding step, the condition of the conductive particles 111-2 after the bonding step can be directly observed from the substrate 101 side through the blank region 105B-1 (shown in fig. 3A-3B) between the first bonding pads 105.
Fig. 5 is a schematic cross-sectional view of a touch panel 100 according to other embodiments of the present invention, in which a substrate 101 is used as a protective cover, and a sensing electrode 103 is formed on an inner surface of the substrate 101 and located in a touch area 100A. In addition, a light shielding layer 115 is formed on the inner surface of the substrate 101 in the peripheral region 100P, the first bonding pad 105 is formed on the light shielding layer 115, and the first bonding pad 105 can be connected to the sensing electrode 103 by a wire or other electrical connection, and the second bonding pad 109 on the flexible printed circuit 107 and the first bonding pad 105 are bonded by using an anisotropic conductive adhesive 111 through a pressing step, in this embodiment, the first bonding pad 105 is located between the anisotropic conductive adhesive 111 and the light shielding layer 115. In some embodiments, the configuration of the second bond pad 109 and the first bond pad 105 may be as shown in fig. 2A, 2B, or 2C. In this embodiment, since the light shielding layer 115 is formed on the peripheral region 100P of the substrate 101, the flexible printed circuit 107 is removed to confirm the condition of the conductive particles 111-2 after the lamination step.
In some embodiments, the blank is disposed at an end of the bonding pad having poor adhesion to the carrier (e.g., the substrate 101 or the flexible printed circuit board 107), for example, when the material of the first bonding pad 105 and the second bonding pad 109 are replaced such that the adhesion of the first bonding pad 105 to the substrate 101 is greater than the adhesion of the second bonding pad 109 to the flexible printed circuit board 107, at least one blank, such as the blank 109B-1, 109B-2 or 109B-3 shown in fig. 2C, is disposed between the second bonding pads 109 such that the position of at least one dummy bonding pad 105D of the first bonding pad 105 corresponds to the blank 109B-1, 109B-2 or 109B-3.
When the flexible printed circuit board 107 is detached from the substrate 101, the second bonding pad 109 is separated from the flexible printed circuit board 107 and is opposite to the first bonding pad 105 because the adhesion of the second bonding pad 109 to the flexible printed circuit board 107 is poor, and whether the conductive particles of the anisotropic conductive Adhesive (ACF) 111 pass through the insulating adhesive or the insulating film can be observed in the blank regions 109B-1, 109B-2, 109B-3 because the second bonding pad 109 is not present in the blank regions 109B-1, 109B-2, 109B-3. If the blank area 109B-1, 109B-2 or 109B-3 is not provided between the second bonding pads 109, all of the first bonding pads 105 and the second bonding pads 109 are abutted against each other, and it is impossible to observe whether the conductive particles of the anisotropic conductive Adhesive (ACF) 111 pass through the insulating adhesive or the insulating film.
When the adhesion of the first bonding pad 105 to the substrate 101 is smaller than the adhesion of the second bonding pad 109 to the flexible printed circuit board 107, at least one empty region, such as the empty region 105B-1, 105B-2 or 105B-3 shown in fig. 2B, is disposed between the first bonding pads 105, i.e. the embodiments corresponding to fig. 3A and 3B.
Although the invention has been described in connection with the preferred embodiments, it will be understood by those skilled in the art that various changes, modifications and alterations may be made without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be determined from the following claims.
Claims (11)
1. A touch panel, comprising:
the sensing electrode is arranged on a substrate, wherein the substrate is provided with a first joint area;
a plurality of first bonding pads disposed on a first bonding region of the substrate, the first bonding pads being electrically connected to the sensing electrode;
the second bonding pads are arranged on a second bonding region of the flexible printed circuit board, and correspond to the first bonding pads in the first bonding region; and
an anisotropic conductive adhesive disposed between the second bonding region of the flexible printed circuit board and the first bonding region of the substrate,
the substrate also comprises a third bonding region, so that the first bonding pads and the second bonding pads are in non-corresponding relation in the third bonding region;
the third bonding region is located in a first empty region between the first bonding pads on the substrate, the width of the first empty region is larger than a distance between two adjacent first bonding pads, and the second bonding pads comprise a dummy bonding pad corresponding to the first empty region.
2. The touch panel of claim 1, wherein the second bonding pad is spaced apart from the first space region on the substrate by a first distance, the second bonding pad is spaced apart from the first bonding pad by a second distance, the first distance is greater than the second distance, and the difference between the first distance and the second distance is 0.2 μm to 0.4 μm.
3. The touch panel of claim 1, wherein the anisotropic conductive paste comprises an insulating substrate, and a plurality of conductive particles are dispersed in the insulating substrate, and the conductive particles in the third bonding region are not shielded by the first bonding pad or the second bonding pad.
4. The touch panel of claim 1, wherein the substrate is a protective cover, and the touch panel further comprises a light shielding layer disposed on the protective cover, and the first bonding pads are interposed between the light shielding layer and the anisotropic conductive adhesive.
5. The touch panel of claim 1, wherein the substrate is a transparent insulating film, the sensing electrode and the first bonding pads are directly disposed on the transparent insulating film, and the touch panel further comprises:
the protective cover plate is arranged below the light-transmitting insulating film; and
the light shielding layer is arranged on the protective cover plate and is arranged between the light-transmitting insulating film and the protective cover plate.
6. The touch panel of claim 1, wherein the thickness of the second bonding pads is 10 times to 100 times the thickness of the first bonding pads.
7. A method of manufacturing a touch panel, comprising:
forming a sensing electrode on a substrate;
forming a plurality of first bonding pads on a first bonding region of the substrate, wherein the first bonding pads are electrically connected to the sensing electrode;
providing a flexible printed circuit board, wherein a plurality of second bonding pads are formed on a second bonding region, and the second bonding pads correspond to the first bonding pads in the first bonding region; and
bonding the second bonding region of the flexible printed circuit board with the first bonding region of the substrate via an anisotropic conductive adhesive,
the substrate also comprises a third bonding region, so that the first bonding pads and the second bonding pads are in non-corresponding relation in the third bonding region;
the third bonding region corresponds to a first empty region between the first bonding pads, the width of the first empty region is larger than a distance between two adjacent first bonding pads, and the step of forming the second bonding pads comprises forming a functional bonding pad and a dummy bonding pad, wherein the position of the dummy bonding pad corresponds to the first empty region.
8. The method of claim 7, wherein the second bonding region of the flexible printed circuit board is bonded to the first bonding region of the substrate via a lamination process, the anisotropic conductive adhesive comprises an insulating substrate, and a plurality of conductive particles dispersed in the insulating substrate, and the conductive particles are directly observed from the third bonding region after the lamination process.
9. The method of claim 8, wherein the substrate is a transparent insulating film, the sensing electrode and the first bonding pads are directly formed on the transparent insulating film, and the method further comprises:
providing a protective cover plate;
forming a shading layer on the protection cover plate; and
attaching the light-transmitting insulating film to the protective cover plate and the light-shielding layer,
wherein the condition of the conductive particles after the lamination manufacturing process is observed from the third bonding area on the side of the transparent insulating film by peeling the transparent insulating film from the protective cover plate and the shading layer.
10. The method of claim 7, wherein the first bonding pads and the substrate have a first adhesion therebetween, the second bonding pads and the flexible printed circuit board have a second adhesion therebetween, and the third bonding region is formed between the first bonding pads when the first adhesion is smaller than the second adhesion, such that at least one of the second bonding pads corresponds to a first empty region between two of the first bonding pads.
11. The method of claim 7, wherein the first bonding pads and the substrate have a first adhesion therebetween, the second bonding pads and the flexible printed circuit board have a second adhesion therebetween, and the third bonding region is formed between the second bonding pads when the first adhesion is greater than the second adhesion, such that at least one of the first bonding pads corresponds to a second empty region between two of the second bonding pads.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510546826.2A CN106484165B (en) | 2015-08-31 | 2015-08-31 | Touch panel and manufacturing method thereof |
| TW105100661A TWI588703B (en) | 2015-08-31 | 2016-01-11 | Touch panels and fabrication methods thereof |
| TW105200323U TWM521773U (en) | 2015-08-31 | 2016-01-11 | Touch panels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510546826.2A CN106484165B (en) | 2015-08-31 | 2015-08-31 | Touch panel and manufacturing method thereof |
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| CN106484165A CN106484165A (en) | 2017-03-08 |
| CN106484165B true CN106484165B (en) | 2023-10-24 |
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| CN201510546826.2A Active CN106484165B (en) | 2015-08-31 | 2015-08-31 | Touch panel and manufacturing method thereof |
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| TW (2) | TWI588703B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106484165B (en) * | 2015-08-31 | 2023-10-24 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
| CN110174965B (en) * | 2019-05-09 | 2022-05-20 | 业成科技（成都）有限公司 | Narrow-frame touch panel |
| CN110119225B (en) * | 2019-05-20 | 2022-05-10 | 业成科技（成都）有限公司 | Touch panel |
| CN110703954A (en) * | 2019-10-16 | 2020-01-17 | 业成科技（成都）有限公司 | Touch panel |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030032736A (en) * | 2001-10-19 | 2003-04-26 | 삼성전자주식회사 | Displaying substrate and liquid crystal display device having the same |
| CN101561728A (en) * | 2009-05-27 | 2009-10-21 | 友达光电股份有限公司 | Conductor junction point structure and touch-control panel applied thereto |
| CN202472601U (en) * | 2011-04-22 | 2012-10-03 | 扬升照明股份有限公司 | Touch control device |
| CN103294310A (en) * | 2013-05-09 | 2013-09-11 | 晟光科技股份有限公司 | Manufacture method of OGS (one glass solution) touch screen |
| CN104007866A (en) * | 2013-02-22 | 2014-08-27 | 和鑫光电股份有限公司 | Touch panel and circuit structure thereof |
| CN204990237U (en) * | 2015-08-31 | 2016-01-20 | 宸鸿科技(厦门)有限公司 | Touch panel |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100498359C (en) * | 2007-06-28 | 2009-06-10 | 友达光电股份有限公司 | Electric circuit connection detector, electronic equipment and detecting method |
| TWI404994B (en) * | 2009-12-14 | 2013-08-11 | Wintek Corp | Touch panel |
| WO2014007333A1 (en) * | 2012-07-06 | 2014-01-09 | 富士フイルム株式会社 | Capacitive touch panel, method for manufacture of same, and input device |
| CN103838407B (en) * | 2012-11-22 | 2018-01-16 | 宸鸿科技(厦门)有限公司 | Monolithic glass Trackpad and preparation method thereof |
| CN106484165B (en) * | 2015-08-31 | 2023-10-24 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method thereof |
-
2015
- 2015-08-31 CN CN201510546826.2A patent/CN106484165B/en active Active
-
2016
- 2016-01-11 TW TW105100661A patent/TWI588703B/en active
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030032736A (en) * | 2001-10-19 | 2003-04-26 | 삼성전자주식회사 | Displaying substrate and liquid crystal display device having the same |
| CN101561728A (en) * | 2009-05-27 | 2009-10-21 | 友达光电股份有限公司 | Conductor junction point structure and touch-control panel applied thereto |
| CN202472601U (en) * | 2011-04-22 | 2012-10-03 | 扬升照明股份有限公司 | Touch control device |
| CN104007866A (en) * | 2013-02-22 | 2014-08-27 | 和鑫光电股份有限公司 | Touch panel and circuit structure thereof |
| CN103294310A (en) * | 2013-05-09 | 2013-09-11 | 晟光科技股份有限公司 | Manufacture method of OGS (one glass solution) touch screen |
| CN204990237U (en) * | 2015-08-31 | 2016-01-20 | 宸鸿科技(厦门)有限公司 | Touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI588703B (en) | 2017-06-21 |
| CN106484165A (en) | 2017-03-08 |
| TWM521773U (en) | 2016-05-11 |
| TW201709036A (en) | 2017-03-01 |
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