CN218038873U - Paste series ceramic capacitor - Google Patents
Paste series ceramic capacitor Download PDFInfo
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- CN218038873U CN218038873U CN202222397300.0U CN202222397300U CN218038873U CN 218038873 U CN218038873 U CN 218038873U CN 202222397300 U CN202222397300 U CN 202222397300U CN 218038873 U CN218038873 U CN 218038873U
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Abstract
The utility model provides a paste dress series connection ceramic capacitor, includes ceramic chip and insulating encapsulate, its characterized in that: the lower surface of the ceramic chip is provided with two convex supporting parts; the surface of the ceramic chip is provided with a first conducting layer, a second conducting layer and a third conducting layer, the first conducting layer is provided with a first electrode part and a first welding part which are communicated, the second conducting layer is provided with a second electrode part and a second welding part which are communicated, the first welding part is arranged on the surface of one convex supporting part, the second welding part is arranged on the surface of the other convex supporting part, the third conducting layer is provided with two third electrode parts which are communicated, and the two third electrode parts respectively correspond to the first electrode part and the second electrode part in position; the first welding part and the second welding part are both arranged outside the insulating packaging body. The utility model is suitable for a surface mounting of printed circuit board need not additionally to set up the pin moreover, has saved processes such as the bending of pin, welding during the preparation, is favorable to improving production efficiency and reduction in production cost.
Description
Technical Field
The utility model relates to a condenser, concretely relates to subsides dress series connection ceramic capacitor.
Background
A ceramic capacitor is a capacitor having a ceramic as a dielectric. In some circuits, in order to prevent a short circuit caused by the failure of a capacitor and improve safety, a mode of connecting two capacitors connected in series is generally adopted to replace the original capacitor, so that the short circuit condition can be avoided under the condition that one capacitor fails and the other capacitor still can normally work. However, in order to mount two capacitors, two capacitor mounting positions need to be reserved on a line (such as a circuit board), which is inconvenient to mount and occupies a large mounting space.
The patent specification of the chinese utility model with the granted publication number CN208189401U discloses a series ceramic capacitor, which is equivalent to two capacitors connected in series, has high voltage endurance and reliability, and has a small thickness, and is convenient to install, however, two ceramic chips side by side at the left and right sides need to be used, the size of the width direction is large, the space between two pins is also large, and the space occupies a large space during installation, and the connection and fixation between the two ceramic chips are realized through a connecting wire, and the deformation or damage of the series ceramic capacitor is easily caused by the bending of the connecting wire during actual use; moreover, the pins of the series ceramic capacitor are generally linear pins, and are mounted in the element jacks on the printed circuit board in an insertion manner, so that a large mounting space is required, and the printed circuit board is required to be drilled during assembly, and the pins are influenced by the thickness, pitch and aperture of the printed circuit board, so that the series ceramic capacitor is not beneficial to automatic and large-scale production and has high cost.
In recent years, mounted electronic components (also called mounted electronic components or electronic components suitable for surface mounting) are increasingly widely used, and research and development of mounted electronic components are also widely carried out in the industry. The chinese utility model patent specification with the grant publication number CN210142586U discloses a patch type monolithic series ceramic capacitor, which comprises a ceramic chip, an insulating encapsulation body and two pins; two upper electrodes are arranged on the upper surface of the ceramic chip, two lower electrodes are arranged on the lower surface of the ceramic chip, and the two lower electrodes respectively correspond to the two upper electrodes in position; the two pins are respectively welded with the two lower electrodes, and the two upper electrodes are connected with each other, or the two pins are respectively welded with the two upper electrodes, and the two lower electrodes are connected with each other; the insulating packaging body packages the ceramic chip, the two upper electrodes and the two lower electrodes, and also packages parts of the pins welded with the upper electrodes or the lower electrodes; the parts of the two pins outside the insulating packaging body are respectively provided with a sheet-shaped horizontal connecting section. The patch type monolithic series ceramic capacitor is equivalent to two capacitors connected in series, the two capacitors automatically distribute withstand voltage, the withstand voltage capability of the patch type monolithic series ceramic capacitor can be improved, in addition, in the using process, under the condition that one capacitor is damaged, the other capacitor can still maintain the performance, the whole capacitor can be continuously used, and the reliability is improved. The two capacitors are formed on the same ceramic chip, so that the structure of the capacitor is more compact and firm. Because two capacitors are formed on the same ceramic chip, only one capacitor mounting position is needed, and the parts of the two pins outside the insulating encapsulating body are arranged into the sheet-shaped horizontal connecting sections, the surface mounting device can be suitable for the surface mounting of the printed circuit board, is convenient to mount, occupies small mounting space, is easy to realize automatic and large-scale production, and is beneficial to improving the production efficiency and reducing the production cost.
However, when the chip-type monolithic series ceramic capacitor is manufactured, two pins need to be bent and welded with two lower electrodes or two upper electrodes respectively, so that the number of processes is large, the production efficiency is affected, and the production cost is increased.
Disclosure of Invention
The utility model aims to solve the technical problem that a dress series connection ceramic capacitor is provided, this kind of dress series connection ceramic capacitor is equivalent to two condensers of establishing ties, not only is applicable to printed circuit board's surface mounting, need not to set up the pin moreover, is favorable to improving production efficiency and reduction in production cost. The technical scheme is as follows:
the utility model provides a paste dress series connection ceramic capacitor, includes ceramic chip and insulating encapsulation body, its characterized in that: the lower surface of the ceramic chip is provided with two protruding support parts; the surface of the ceramic chip is provided with a first conducting layer, a second conducting layer and a third conducting layer, the first conducting layer is provided with a first electrode part and a first welding part which are communicated, the second conducting layer is provided with a second electrode part and a second welding part which are communicated, the first welding part is arranged on the surface of one convex supporting part, the second welding part is arranged on the surface of the other convex supporting part, the third conducting layer is provided with two third electrode parts which are communicated, and the two third electrode parts respectively correspond to the first electrode part and the second electrode part in position; the ceramic chip, the first electrode part, the second electrode part and the two third electrode parts are encapsulated by the insulating encapsulating body, and the first welding part and the second welding part are both positioned outside the insulating encapsulating body.
In the series ceramic capacitor for mounting, the first electrode part, the second electrode part and the two third electrode parts form four electrodes of the series ceramic capacitor for mounting, namely the first electrode part, the second electrode part and the two third electrode parts play the same roles as two upper electrodes and two lower electrodes in the conventional series ceramic capacitor (such as a patch type monolithic series ceramic capacitor with an authorization notice number of CN 210142586U); the first welding part and the second welding part are both positioned outside the insulating packaging body and are used as welding parts when the series ceramic capacitor is mounted, and the welding parts are welded with corresponding parts on the printed circuit board to play the same role as two pins in the conventional series ceramic capacitor (such as a patch type monolithic series ceramic capacitor with the authorization notice number of CN 210142586U). The utility model discloses a first conducting layer constitutes first electrode portion and first weld part, adopt the second conducting layer to constitute second electrode portion and second weld part, adopt the third conducting layer to constitute two third electrode portions, first conducting layer, the second conducting layer, third conducting layer accessible sputtering technology or printing, fire the technology and form (the material that is used for making first conducting layer, the second conducting layer, the third conducting layer can be the same with current ceramic capacitor's electrode), need not additionally to set up the pin, thereby saved the processes such as buckling, welding of pin.
Preferably, the first welding portion and the second welding portion are respectively disposed on the lower surfaces of the two protrusion supporting portions.
In a preferred embodiment, the first conductive layer further has a first connecting portion, and the first electrode portion is communicated with the first welding portion through the first connecting portion; the second conducting layer is also provided with a second connecting part, and the second electrode part is communicated with the second welding part through the second connecting part.
Preferably, the third conductive layer further includes a third connection portion, and the two third electrode portions are connected to each other through the third connection portion.
In a preferred embodiment, the two third electrode portions are disposed on the upper surface of the ceramic chip, and the first electrode portion and the second electrode portion are both disposed on the lower surface of the ceramic chip. In a more preferred embodiment, the first connecting portion and the first welding portion are respectively disposed on a side surface and a lower surface of one of the protrusion supporting portions; the second connecting part and the second welding part are respectively arranged on the side surface and the lower surface of the other protruding supporting part. Preferably, the lower surface of the ceramic chip is further provided with a barrier strip (the barrier strip is integrally formed with the ceramic chip), and the barrier strip is positioned between the first electrode part and the second electrode part and plays a role in increasing creepage distance.
In another specific embodiment, the first electrode portion and the second electrode portion are both disposed on the upper surface of the ceramic chip, and the two third electrode portions are disposed on the lower surface of the ceramic chip. In a more preferable embodiment, the first connecting portion is disposed on a side surface of the ceramic chip, and the first welding portion is disposed on a lower surface of one of the protrusion supporting portions; the second connecting part is arranged on the side surface of the ceramic chip, and the second welding part is arranged on the lower surface of the other protrusion supporting part; the first connecting part and the second connecting part are respectively positioned at two sides of the ceramic chip. Preferably, the ceramic chip further has a barrier strip (the barrier strip is integrated with the ceramic chip) on the upper surface thereof, and the barrier strip is located between the first electrode part and the second electrode part to increase creepage distance.
Generally, the two third electrode portions are disposed side by side (e.g., left-right side by side or front-back side by side), and the first electrode portion and the second electrode portion are disposed side by side (e.g., left-right side by side or front-back side by side).
In a specific scheme, the ceramic chip is a rectangular sheet, the first electrode part, the second electrode part and the two third electrode parts are rectangular, and the two protruding supporting parts are respectively arranged at two ends of the ceramic chip. The ceramic chip may have another shape, such as a figure 8, a circle (in this case, the first electrode portion, the second electrode portion, and the two third electrode portions are each substantially semicircular), or an ellipse (in this case, the first electrode portion, the second electrode portion, and the two third electrode portions are each semi-elliptical).
Typically, the ceramic chip is made integral with two bump supports.
Generally, the insulating envelope is an epoxy envelope. The insulating packaging body can also be made of plastic with insulating and flame-retardant functions.
The ceramic chip is a ceramic capacitor dielectric sheet.
The utility model discloses a subsides dress series ceramic capacitor is equivalent to two condensers of series connection, not only is applicable to printed circuit board's surface mounting, and it is little to occupy installation space, need not additionally to set up the pin moreover, has saved processes such as the buckling, the welding of pin during the preparation, is favorable to improving production efficiency and reduction in production cost.
Drawings
Fig. 1 is a schematic structural diagram of a preferred embodiment 1 of the present invention;
FIG. 2 is a top view of FIG. 1 (without the epoxy encapsulant shown);
FIG. 3 is a bottom view of FIG. 1 (without the epoxy encapsulant shown);
fig. 4 is a schematic structural view of a preferred embodiment 2 of the present invention;
FIG. 5 is a top view of FIG. 4 (without the epoxy encapsulant shown);
FIG. 6 is a bottom view of FIG. 4 (without the epoxy encapsulant shown);
fig. 7 is a schematic structural diagram of a preferred embodiment 3 of the present invention;
fig. 8 is a schematic structural diagram of a preferred embodiment 4 of the present invention.
Detailed Description
Example 1
As shown in fig. 1 to 3, the mounted series ceramic capacitor includes a ceramic chip 1 and an insulating package 2; the lower surface of the ceramic chip 1 is provided with two convex supporting parts 3; the surface of the ceramic chip 1 is provided with a first conductive layer 4, a second conductive layer 5 and a third conductive layer 6, the first conductive layer 4 is provided with a first electrode part 41 and a first welding part 42 which are communicated, the second conductive layer 5 is provided with a second electrode part 51 and a second welding part 52 which are communicated, the first welding part 42 is arranged on the surface of one convex supporting part 3, the second welding part 52 is arranged on the surface of the other convex supporting part 3, the third conductive layer 6 is provided with two third electrode parts 61 and 62 which are communicated, and the two third electrode parts 61 and 62 are respectively corresponding to the first electrode part 41 and the second electrode part 51; the insulating package 2 encloses the ceramic chip 1, the first electrode portion 41, the second electrode portion 51, and the two third electrode portions 61 and 62, and the first welding portion 42 and the second welding portion 52 are located outside the insulating package 2.
In this embodiment, the first conductive layer 4 further has a first connection portion 43, and the first electrode portion 41 is communicated with the first welding portion 42 through the first connection portion 43; the second conductive layer 5 further has a second connection portion 53, and the second electrode portion 51 communicates with the second soldering portion 52 through the second connection portion 53.
In this embodiment, the two third electrode portions 61 and 62 are provided on the upper surface of the ceramic chip 1, and the first electrode portion 41 and the second electrode portion 51 are both provided on the lower surface of the ceramic chip 1. The first connecting portion 43 and the first welding portion 42 are respectively arranged on the side surface and the lower surface of one of the protrusion supporting portions 3; the second connecting portion 53 and the second welding portion 52 are provided on the side surface and the lower surface of the other projection support portion 3, respectively.
The third conductive layer 6 further has a third connection portion 63, and the two third electrode portions 61 and 62 communicate with each other through the third connection portion 63.
The two third electrode portions 61 and 62 are arranged side by side (e.g., left-right side by side or front-back side by side), and the first electrode portion 41 and the second electrode portion 51 are arranged side by side (e.g., left-right side by side or front-back side by side).
In this embodiment, the ceramic chip 1 is a rectangular piece, the first electrode portion 41, the second electrode portion 51, and the two third electrode portions 61 and 62 are rectangular, and the two protrusion support portions 3 are respectively located at two ends of the ceramic chip 1. In this embodiment, the third connection portion 63 is also rectangular (the width of the third connection portion 63 may be smaller than the width of the third electrode portions 61 and 62, or may be equal to the width of the third electrode portions 61 and 62).
The ceramic chip 1 is made integral with two raised support portions 3.
The insulating envelope 2 is an epoxy envelope.
In the mounted series ceramic capacitor, the first electrode part 41, the second electrode part 51 and the two third electrode parts 61 and 62 form four electrodes of the mounted series ceramic capacitor; the first welding portion 42 and the second welding portion 52 are both located outside the insulating envelope 2, and are used as welding portions for mounting the series ceramic capacitor and are welded with corresponding portions on the printed circuit board.
The mounted series ceramic capacitor can be manufactured by the following steps: firstly, preparing a ceramic chip 1 with two convex supporting parts 3 by adopting a ceramic dielectric material through conventional pressing, sintering and other processes; then, forming a first conductive layer 4, a second conductive layer 5 and a third conductive layer 6 by a conventional sputtering process (exposing the parts of the ceramic chip 1 and the two protrusion supporting parts 3 on which the first conductive layer 4, the second conductive layer 5 and the third conductive layer 6 need to be formed) or a printing and firing process; then, the ceramic chip 1, the first electrode portion 41, the first connection portion 43, the second electrode portion 51, the second connection portion 53, and the two third electrode portions 61 and 62 are encapsulated by the epoxy encapsulation 2 (a portion of the first connection portion close to the first soldering portion, and a portion of the second connection portion close to the second soldering portion may also be exposed outside the epoxy encapsulation), and the first soldering portion 42 and the second soldering portion 52 are exposed outside the epoxy encapsulation.
Example 2
As shown in fig. 4 to 6, in the present embodiment, the ceramic chip 1 has a 8-shaped configuration, and the top surface of the ceramic chip 1 has a large width at the portions corresponding to the two third electrode portions 61 and 62 and a small width at the portions corresponding to the third connecting portions 63.
The rest of the structure of this embodiment is the same as embodiment 1.
Example 3
As shown in fig. 7, in this embodiment, in addition to embodiment 1, the barrier bars 7 are further provided on the lower surface of the ceramic chip 1 (the barrier bars 7 are integrally formed with the ceramic chip 1), and the barrier bars 7 are located between the first electrode portions 41 and the second electrode portions 51, so as to increase the creepage distance.
Example 4
As shown in fig. 8, in the present embodiment, the first electrode portion 41 and the second electrode portion 51 are both provided on the upper surface of the ceramic chip 1, and the two third electrode portions 61, 62 are provided on the lower surface of the ceramic chip 1. The first connection portion 43 is provided on the side surface of the ceramic chip 1, and the first welding portion 42 is provided on the lower surface of one of the convex support portions 3; the second connecting portion 53 is provided on the side surface of the ceramic chip 1, and the second soldering portion 52 is provided on the lower surface of the other projection support portion 3; the first connection portion 42 and the second connection portion 52 are respectively located on both sides of the ceramic chip 1. The rest of the structure of this embodiment is the same as embodiment 1.
In addition, a barrier strip (the barrier strip and the ceramic chip are made into a whole) can be arranged on the upper surface of the ceramic chip, and the barrier strip is positioned between the first electrode part and the second electrode part and plays a role in increasing the creepage distance.
Claims (10)
1. The utility model provides a paste dress series connection ceramic capacitor, includes ceramic chip and insulating encapsulation body, its characterized in that: the lower surface of the ceramic chip is provided with two convex supporting parts; the surface of the ceramic chip is provided with a first conductive layer, a second conductive layer and a third conductive layer, the first conductive layer is provided with a first electrode part and a first welding part which are communicated, the second conductive layer is provided with a second electrode part and a second welding part which are communicated, the first welding part is arranged on the surface of one projection supporting part, the second welding part is arranged on the surface of the other projection supporting part, the third conductive layer is provided with two third electrode parts which are communicated, and the two third electrode parts respectively correspond to the first electrode part and the second electrode part; the ceramic chip, the first electrode part, the second electrode part and the two third electrode parts are encapsulated by the insulating encapsulating body, and the first welding part and the second welding part are both positioned outside the insulating encapsulating body.
2. The mounted series ceramic capacitor of claim 1, wherein: the first welding part and the second welding part are respectively arranged on the lower surfaces of the two protruding supporting parts.
3. The mounted series ceramic capacitor of claim 1, wherein: the first conducting layer is also provided with a first connecting part, and the first electrode part is communicated with the first welding part through the first connecting part; the second electrode part is communicated with the second welding part through the second connecting part; the third conductive layer is also provided with a third connecting part, and the two third electrode parts are communicated through the third connecting part.
4. The mounted series ceramic capacitor of claim 3, wherein: the two third electrode parts are arranged on the upper surface of the ceramic chip, and the first electrode part and the second electrode part are arranged on the lower surface of the ceramic chip;
the first connecting part and the first welding part are respectively arranged on the side surface and the lower surface of one protruding supporting part; the second connecting part and the second welding part are respectively arranged on the side surface and the lower surface of the other protruding supporting part.
5. The mounted series ceramic capacitor of claim 4, wherein: the lower surface of the ceramic chip is also provided with a barrier strip, the barrier strip and the ceramic chip are manufactured into a whole, and the barrier strip is positioned between the first electrode part and the second electrode part.
6. The mounted series ceramic capacitor of claim 3, wherein: the first electrode part and the second electrode part are arranged on the upper surface of the ceramic chip, and the two third electrode parts are arranged on the lower surface of the ceramic chip;
the first connecting part is arranged on the side surface of the ceramic chip, and the first welding part is arranged on the lower surface of one protruding supporting part; the second connecting part is arranged on the side surface of the ceramic chip, and the second welding part is arranged on the lower surface of the other protrusion supporting part; the first connecting part and the second connecting part are respectively positioned at two sides of the ceramic chip.
7. The mounted series ceramic capacitor of claim 6, wherein: the upper surface of the ceramic chip is also provided with a barrier strip, the barrier strip and the ceramic chip are manufactured into a whole, and the barrier strip is positioned between the first electrode part and the second electrode part.
8. The mounted series ceramic capacitor as claimed in any one of claims 1-7, wherein: the two third electrode portions are arranged side by side, and the first electrode portion and the second electrode portion are arranged side by side.
9. The mounted series ceramic capacitor as claimed in any one of claims 1-7, wherein: the ceramic chip is a rectangular sheet, the first electrode part, the second electrode part and the two third electrode parts are rectangular, and the two protruding supporting parts are respectively arranged at two ends of the ceramic chip.
10. The mounted series ceramic capacitor as claimed in any one of claims 1-7, wherein: the ceramic chip and the two protruding supporting parts are manufactured into a whole; the insulating packaging body is an epoxy resin packaging body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222397300.0U CN218038873U (en) | 2022-09-09 | 2022-09-09 | Paste series ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222397300.0U CN218038873U (en) | 2022-09-09 | 2022-09-09 | Paste series ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218038873U true CN218038873U (en) | 2022-12-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222397300.0U Active CN218038873U (en) | 2022-09-09 | 2022-09-09 | Paste series ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218038873U (en) |
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2022
- 2022-09-09 CN CN202222397300.0U patent/CN218038873U/en active Active
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