CN217965289U

CN217965289U - Laser processing device with clamping device

Info

Publication number: CN217965289U
Application number: CN202221405656.8U
Authority: CN
Inventors: 成奎栋
Original assignee: Eo Technics Co ltd Suzhou
Current assignee: Eo Technics Co ltd Suzhou
Priority date: 2022-06-08
Filing date: 2022-06-08
Publication date: 2022-12-06
Anticipated expiration: 2032-06-08

Abstract

The laser processing device with the clamping device comprises a rack, a workbench arranged in the middle of the rack, a vacuum plate arranged on the workbench and used for bearing an adsorption substrate, at least two guide rails fixed on the rack along the X direction, and a plurality of clamping systems arranged on two sides of the workbench and capable of moving along the guide rails. The edge part of the substrate is moved and fixed along the X direction by a plurality of clamping systems arranged at two sides of the substrate, the substrate is in close contact with the vacuum plate by vacuum adsorption, the whole area of the substrate is uniformly fixed on the vacuum plate, the distortion or bending influence of the substrate due to clamping is minimized, the vacuum water leakage problem caused by the distortion of the substrate can be inhibited, and the clamping systems can move at high speed by a guide plate and a cylinder because the substrate is stably fixed on the vacuum plate, thereby shortening the laser processing operation time.

Description

Laser processing device with clamping device

Technical Field

The utility model relates to a laser beam machining device with clamping device.

Background

In order to perform a processing operation, for example, a laser marking operation, on a substrate such as an LCD panel by using a laser, it is necessary to mount and fix a substrate to be processed on a stage. For this reason, conventionally, both sides of the substrate are fixed by fixing claws of a clamping device, or the substrate is fixed by sucking the substrate onto a stage by a vacuum device. However, since the degree of bending and the direction of bending are different depending on the type of substrate, there is a disadvantage that it is difficult to minimize the bending of the substrate when the conventional chucking method is used.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a laser beam machining device with clamping device.

In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a laser beam machining device with clamping device, include the frame, set up in workstation in the middle of the frame, place in be used for bearing the vacuum plate of adsorbing the base plate on the workstation, still include along X direction be fixed in two at least guide rails in the frame, a plurality of can follow the guide rail remove set up in the clamping system of workstation both sides, it is a plurality of clamping system symmetry sets up, every clamping system including can slide set up in guide board on the guide rail, be fixed in cylinder on the guide board, be fixed in be used for on the cylinder fixedly the fixed plate of base plate. The edge part of the substrate is moved and fixed along the X direction by a plurality of clamping systems arranged at two sides of the substrate, the substrate is in close contact with the vacuum plate by vacuum adsorption, the whole area of the substrate is uniformly fixed on the vacuum plate, the distortion or bending influence of the substrate due to clamping is minimized, the vacuum water leakage problem caused by the distortion of the substrate can be inhibited, and the clamping systems can move at high speed by a guide plate and a cylinder because the substrate is stably fixed on the vacuum plate, thereby shortening the laser processing operation time.

Preferably, the fixing plate is movably disposed in an up-down direction by the cylinder, and the fixing plate is disposed to move in the X direction in synchronization with the guide plate. The clamping system and the laser processing device are miniaturized and simplified.

Preferably, a plurality of vacuum holes are formed in the vacuum plate, and the plurality of vacuum holes are circular holes or quadrangular holes.

Preferably, a manifold which is correspondingly communicated with the plurality of vacuum holes is arranged in the workbench, one end of the manifold is connected with the vacuum plate, and the other end of the manifold is connected with a vacuum pump.

Preferably, the guide plate is movable toward and away from a central position of the housing.

Preferably, the fixing plate includes a plurality of fixing grooves capable of being matched with the edge of the substrate to be clamped and fixed.

Preferably, the fixing grooves on the two sides of the workbench are matched and correspondingly arranged.

Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages: 1. the utility model discloses a plurality of clamping systems that set up in base plate both sides remove fixed base plate edge part along the X direction, through vacuum adsorption messenger base plate and vacuum plate in close contact with, make the total area of base plate evenly fix to the vacuum plate on, make the base plate warp or crooked influence reach the minimizing because of pressing from both sides tightly, and can restrain the vacuum water leakage problem that arouses because the base plate twists, because the base plate is fixed on the vacuum plate steadily, clamping system can pass through guide plate and cylinder high-speed removal, shorten laser beam machining operation time;

2. the fixed plate can move in the up-and-down direction through the air cylinder, and the fixed plate synchronous guide plate moves in the X direction, so that the miniaturization and the simplification of a clamping system and a laser processing device are realized.

Drawings

FIG. 1 is a schematic perspective view of a laser processing apparatus;

FIG. 2 is a front view of the laser machining apparatus;

FIG. 3 is a schematic view of a vacuum plate;

FIGS. 4 a-6 b are schematic views of a process for clamping a vacuum plate;

wherein, 1, a frame; 2. a work table; 21. a manifold; 3. a vacuum plate; 31. a vacuum hole; 4. a guide rail; 5. a clamping system; 51. a guide plate; 52. a cylinder; 53. a fixing plate; 54. fixing grooves; 6. a substrate.

Detailed Description

The laser processing device with the clamping device shown in the figures comprises a frame 1, a workbench 2 arranged in the middle of the frame 1, and a vacuum plate 3 placed on the workbench 2 and used for bearing an adsorption substrate 6, wherein the substrate 6 can be an LCD panel or a PCB and the like.

The laser processing device further comprises two guide rails 4 fixed on the machine frame 1 along the X direction, and two clamping systems 5 which can move along the guide rails 4 and are arranged on two sides of the workbench 2, wherein the two clamping systems 5 are symmetrically arranged.

Each clamping system 5 includes a guide plate 51 slidably disposed on the guide rail 4, an air cylinder 52 fixed to the guide plate 51, and a fixing plate 53 fixed to the air cylinder 52 for fixing the base plate 6, the fixing plate 53 being movably disposed in the up-down direction by the air cylinder 52, the fixing plate 53 being movably disposed in the X direction in synchronization with the guide plate 51. The cylinder adopts compact cylinders such as air compression cylinder.

The vacuum plate 3 is provided with a plurality of vacuum holes 31, and the plurality of vacuum holes 31 are circular holes or quadrangular holes.

A manifold 21 communicating with the plurality of vacuum holes 31 is provided in the table 2, one end of the manifold 21 is connected to the vacuum plate 3, and the other end of the manifold 21 is connected to a vacuum pump.

The guide plate 51 is movable toward and away from the center position of the housing 1.

The fixing plate 53 includes a plurality of fixing grooves 54 capable of being clamped and fixed in cooperation with the edge of the substrate 6. The fixing plate 53 functions to fix the edge portion of the substrate loaded on the vacuum plate by moving up and down. The fixing grooves are used to fix the four-directional edge portions of the substrate, and the fixing grooves 54 on the two sides of the working table 2 are correspondingly matched with each other.

In the clamping system with the structure, the edge part of the substrate is fixed on the vacuum plate through a plurality of fixing plates arranged at two sides of the substrate, and the substrate is tightly contacted with the vacuum plate through vacuum adsorption, so that the whole area of the substrate is uniformly fixed on the vacuum plate.

Therefore, the substrate can be prevented from being deformed due to the clamping, and the problem of vacuum water leakage due to the warpage of the substrate can be suppressed.

In addition, since the substrate is stably fixed to the vacuum plate, the chucking system can be moved at high speed, and thus the laser processing operation time can be shortened, and the chucking system and the laser processing apparatus can be miniaturized and simplified.

Referring to fig. 4a and 4b, the clamping systems 5 provided on both sides of the vacuum plate are moved in a direction away from the vacuum plate 3.

In this process, the guide plate 51 is driven to move in a direction away from the vacuum plate 3, and the air cylinder 52 is driven upward to move the fixing plate 53 upward in a direction away from the vacuum plate 3.

Specifically, the guide plate 51 is driven to move in a direction away from the vacuum plate 3, that is, the guide plate 51 provided on the left side of the vacuum plate 3 moves in the-x direction, and the guide plate 51 provided on the right side of the vacuum plate 3 moves in the x direction.

Therefore, the cylinder 52 and the fixed plate 53 also move in a direction away from the vacuum plate 3 in conjunction with the guide plate 51.

In addition, the air cylinders 52 provided at both sides of the vacuum plate 3 are driven upward, and the fixed plate 53 is moved upward.

That is, if the air cylinders 52 provided on both sides of the vacuum plate 3 are driven and moved in the z direction, the fixed plate 53 is also moved in the z direction away from the vacuum plate 3.

As above, when the chucking system 5 is completely moved and opened, the substrate 6 may be loaded on the upper surface of the vacuum plate 3.

Referring to fig. 5a and 5b, the clamping systems 5 provided at both sides of the vacuum plate 3 are moved in a direction approaching the vacuum plate 3.

In this process, the guide plate 51 is driven to move in a direction approaching the vacuum plate 3. Specifically, the guide plate 51 is driven to move in a direction approaching the vacuum plate 3. That is, the guide plate 51 provided on the left side of the vacuum plate 3 moves in the x direction, and the guide plate 51 provided on the right side of the vacuum plate 3 moves in the-x direction. 5

In this case, since the air cylinder 52 is not driven, the fixed plate 53 maintains the same height as the lane 4a and the lane 4 b.

Referring to fig. 6a and 6b, the clamping systems 5 provided at both sides of the vacuum plate 3 fix the edge portion of the substrate 6 loaded on the vacuum plate 3. In this process, the air cylinder 52 moves the fixing plate 53 downward, thereby fixing the substrate 6.

Specifically, the air cylinders 52 provided on both sides of the vacuum plate 3 move the fixed plates 53 in a direction approaching the vacuum plate 3.

That is, the air cylinders 52 provided at both sides of the vacuum plate 3 move in the-z direction, and the fixing plates 53 also move in the-z direction in conjunction with this, thereby fixing the edge portion of the substrate 6.

Next, the substrate 6 is adsorbed on the upper surface of the vacuum plate 3 by operating a vacuum pump connected to the manifold. That is, if the vacuum unit is driven to make the vacuum holes 31 of the vacuum plate 3 and the flow paths of the manifold 21 in a vacuum state, the substrate 6 can be vacuum-adsorbed on the upper surface of the vacuum plate 3. Accordingly, the entire substrate 6 can be uniformly fixed on the upper surface of the vacuum plate 3, and the edge portion of the substrate 6 is fixed by the chucking system 5, so that the substrate bending due to chucking can be minimized.

As described above, in a state where the substrate 6 is fixed to the vacuum plate 3 by the chucking system, the laser beam is irradiated to the substrate 6 by the laser system, and a desired laser processing work can be efficiently performed.

As described above, in the chucking system, the edge portion of the substrate 6 is fixed to the vacuum plate 3 by the plurality of chucking systems 5 provided at both sides of the substrate 6, and the substrate 6 is brought into close contact with the vacuum plate 3 by vacuum suction, whereby the entire area of the substrate 6 can be uniformly fixed to the vacuum plate 3.

Therefore, the degree of the substrate 6 being distorted or bent by the clamping can be minimized, and the problem of vacuum water leakage due to the distortion of the substrate 6 can be suppressed.

In addition, since the substrate 6 can be stably fixed to the vacuum plate, the substrate 6 can be moved at high speed, and thus the laser processing operation time can be shortened. In addition, the clamp system 5 has the guide plate 51 and the air cylinder 52 of a compact structure, and can realize miniaturization and simplification of the clamp unit and the laser processing apparatus.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims

1. The utility model provides a laser processing device with clamping device, includes frame (1), set up in workstation (2) in the middle of frame (1), place in be used for bearing the weight of vacuum plate (3) that adsorb base plate (6) on workstation (2), its characterized in that: still include along the X direction be fixed in two at least guide rail (4), a plurality of following on frame (1) guide rail (4) remove set up in clamping system (5) of workstation (2) both sides, it is a plurality of clamping system (5) symmetry sets up, every clamping system (5) including can slide set up in guide board (51) on guide board (4), be fixed in cylinder (52) on guide board (51), be fixed in be used for on cylinder (52) fixing plate (53) of base plate (6).

2. The laser processing apparatus with a clamping apparatus according to claim 1, wherein: the fixing plate (53) is provided to be movable in the vertical direction by the cylinder (52), and the fixing plate (53) is provided to be movable in the X direction in synchronization with the guide plate (51).

3. The laser processing apparatus with a clamping apparatus according to claim 1, wherein: a plurality of vacuum holes (31) are formed in the vacuum plate (3), and the vacuum holes (31) are circular holes or quadrangular holes.

4. The laser processing apparatus with a clamping apparatus according to claim 3, wherein: the vacuum plate is characterized in that a manifold (21) which is correspondingly communicated with the vacuum holes (31) is arranged in the workbench (2), one end of the manifold (21) is connected with the vacuum plate (3), and the other end of the manifold (21) is connected with a vacuum pump.

5. The laser processing apparatus with a clamping apparatus according to claim 1, wherein: the guide plate (51) can move close to and away from the central position of the frame (1).

6. The laser processing apparatus with a clamping apparatus according to claim 1, wherein: the fixing plate (53) comprises a plurality of fixing grooves (54) which can be matched with the edge of the substrate (6) to clamp and fix.

7. The laser processing apparatus with a clamping apparatus according to claim 6, wherein: the fixing grooves (54) on the two sides of the workbench (2) are matched and correspondingly arranged.