CN217903105U

CN217903105U - Radio frequency device tube shell and radio frequency packaging device

Info

Publication number: CN217903105U
Application number: CN202221840511.0U
Authority: CN
Inventors: 王振辉; 王加大
Original assignee: Shenzhen Times Suxin Technology Co Ltd
Current assignee: Shenzhen Times Suxin Technology Co Ltd
Priority date: 2022-07-15
Filing date: 2022-07-15
Publication date: 2022-11-25
Anticipated expiration: 2032-07-15

Abstract

The utility model provides a radio frequency device tube and radio frequency encapsulation device, relate to semiconductor package technical field, the radio frequency device tube includes the basement flange, enclose shell and apron, it sets up on the basement flange to enclose the shell, the apron sets up on enclosing the shell, apron and basement flange set up respectively in the upper and lower side of enclosing the shell, and be formed with the holding cavity that is used for holding radio frequency device between apron and the basement flange, the basement flange is provided with the draw-in groove with enclosing the two of shell, another is provided with the card and holds the lug, the lug assembly is held to the card, so that the basement flange card is held in the bottom of enclosing the shell, thereby guaranteed the basement flange and enclosed the reliable connection between the shell. During actual bonding, the separation between the substrate flange and the enclosure shell caused by bonding failure due to temperature change is avoided, and the bonding effect is better. Compared with the prior art, the utility model discloses promoted the basement flange and enclosed the combination reliability between the shell to gas tightness and firmness have been guaranteed.

Description

Radio frequency device tube shell and radio frequency packaging device

Technical Field

The utility model relates to a semiconductor package technical field particularly, relates to a radio frequency device tube and radio frequency encapsulation device.

Background

The ceramic package of the ceramic tube shell of the third-generation semiconductor gallium nitride high-power radio-frequency device has wide application field, and the ceramic package tube shell also shows diversified trend. In order to facilitate subsequent wafer bonding and routing, the flange substrate needs to be bonded with the enclosure shell and the epitaxial pins, and the enclosure shell is bonded with the cover plate to form a closed cavity. The cover plate and the enclosure shell are adhered to the flange by ceramic or LCP resin plastic and other materials. The cover plate and the LCP resin fence shell are adhered by a plurality of process methods, but the process methods can be completed by matching resin adhesive glue.

The inventor researches and discovers that in the prior art, the LCP resin plastic enclosure needs to be adhered to the flange by using a resin adhesive, the temperature during the sheet adhering operation needs to be 330-350 ℃, and the temperature exceeds the curing temperature of 280 ℃ of the temperature of the resin adhesive of the LCP resin plastic enclosure, so that the bonding degree of the adhesive for adhering the LCP resin plastic enclosure is deteriorated, the LCP resin plastic enclosure falls off, the packaging effect is influenced, and even the product fails.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a radio frequency device tube and radio frequency encapsulation device, it can avoid enclosing the condition emergence that the shell drops when the bonding die operation, has promoted encapsulation reliability.

The embodiment of the utility model is realized like this:

in a first aspect, the present invention provides a radio frequency device tube, including:

a base flange;

an enclosure disposed over the base flange;

and a cover plate arranged on the enclosure;

the cover plate and the base flange are respectively arranged on the upper side and the lower side of the enclosure, an accommodating cavity for accommodating a radio frequency device is formed between the cover plate and the base flange, one of the base flange and the enclosure is provided with a clamping groove, the other one of the base flange and the enclosure is provided with a clamping convex block, and the clamping convex block is assembled in the clamping groove so that the base flange is clamped at the bottom of the enclosure.

In an optional embodiment, the clamping convex blocks are arranged on the end surfaces of the two sides of the base flange, the clamping convex blocks protrude outwards from the end surface of the base flange, the bottoms of the two sides of the enclosure shell extend downwards to form stopping parts, the stopping parts are provided with bending convex blocks, and the bending convex blocks are bent inwards and form the clamping grooves together with the bottom of the enclosure shell.

In an alternative embodiment, the upper surfaces of the retention bumps are flush with the upper surface of the base flange and are each engaged with the bottom end face of the containment shell, the lower surfaces of the retention bumps are engaged with the upper surfaces of the bending bumps, and the inner side surfaces of the bending bumps are engaged with the end face of the base flange.

In an optional embodiment, a first adhesive layer is coated on a surface of the clamping protrusion, and the clamping protrusion is adhered to the inner wall of the clamping groove through the first adhesive layer.

In an alternative embodiment, the thickness of the first adhesive layer is between 0.08 and 0.12 mm.

In an optional embodiment, the clamping grooves are formed in the edges of the two sides of the base flange, the bottoms of the two sides of the enclosure extend downwards to form a stopping portion, the stopping portion is provided with the clamping convex blocks, and the clamping convex blocks are bent inwards relative to the stopping portion.

In an alternative embodiment, the base flange includes a base portion and a retaining portion, the retaining groove is formed in the retaining portion, the base portion has a larger width than the retaining portion, and the base portion is engaged with a lower side surface of the retaining protrusion.

In an optional embodiment, the cross section of the latching protrusion is triangular, the slot is disposed at the end face of the base flange, and the cross section of the slot is matched with the latching protrusion.

In an alternative embodiment, a recess is provided at an end of the enclosure remote from the base flange, and the cover plate is at least partially embedded in the recess.

In optional embodiment, the apron includes the portion of closing of an organic whole setting and inlays the portion of establishing, it sets up to inlay the portion of establishing the bottom that the portion closed to the downward arch, the portion lid that closes is established enclose on the shell, it inlays the portion of establishing and establishes in the recess.

In an alternative embodiment, the surface of the embedding part is coated with a second adhesive layer, and the embedding part is adhered to the inner wall of the groove through the second adhesive layer.

In an alternative embodiment, the thickness of the second adhesive layer is between 0.08 and 0.12 mm.

In an optional embodiment, the embedding portion is annular, and the shape of the groove is matched with the shape of the embedding portion and is annularly distributed on the surrounding shell.

In a second aspect, the present invention provides a radio frequency package device, including a radio frequency device and a radio frequency device case as in any one of the foregoing embodiments, wherein the radio frequency device is accommodated in the accommodating cavity.

The embodiment of the utility model provides a beneficial effect is:

the embodiment of the utility model provides a radio frequency device tube is provided with the draw-in groove at basement flange and enclosing the two of shell, and another is provided with the card and holds the lug, and the card is held the lug and is assembled in the draw-in groove to make basement flange card hold in the bottom of enclosing the shell, thereby guaranteed basement flange and enclosed the reliable connection between the shell. During actual bonding, the separation between the substrate flange and the enclosure shell caused by bonding failure due to temperature change is avoided, and the bonding effect is better. Compared with the prior art, the utility model discloses promoted the basement flange and enclosed the combination reliability between the shell to gas tightness and firmness have been guaranteed.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on these drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a radio frequency device case provided in a first embodiment of the present invention at a first viewing angle;

fig. 2 is a schematic structural diagram of a radio frequency device case provided in the first embodiment of the present invention at a second viewing angle;

fig. 3 is a schematic structural diagram of a radio frequency device package provided in the first embodiment of the present invention at a third viewing angle;

fig. 4 is a schematic structural diagram of a radio frequency device case according to a second embodiment of the present invention;

fig. 5 is a schematic structural diagram of a radio frequency device package according to a third embodiment of the present invention.

An icon:

100-radio frequency device shell; 110-a base flange; 111-a base portion; 113-a catch; 130-an enclosure; 131-a stopper portion; 133-bending the bump; 135-grooves; 150-a cover plate; 151-a closure portion; 153-embedding part; 170-card slot; 190-catching the bumps.

Detailed Description

To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are part of the embodiments of the present invention, rather than all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when used, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element indicated must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As disclosed in the background art, the conventional package structure generally comprises a flange and a rail housing upper cover, and the rail housing and the flange and the rail housing and the upper cover are fixedly bonded together by a resin adhesive. However, since the enclosure casing is usually made of LCP resin plastic, which is adhered to the flange by using a resin adhesive, the temperature of the sheet-adhering operation needs to be 330 ℃ to 350 ℃, which exceeds the curing temperature of 280 ℃ of the temperature of the LCP resin plastic enclosure resin adhesive, so that the adhesive for adhering the LCP resin plastic enclosure may have poor bonding degree, resulting in the peeling of the LCP resin plastic enclosure. Meanwhile, the adhesive on the surface of the upper cover bonded with the fence shell can overflow to the outside of the fence shell during bonding, so that welding spots in a routing area are polluted, and the bonding reliability of the welding spots is influenced.

In order to solve the problem that the apron bonds the bonding agent and spills over the pollution solder joint on the rail casing to and enclose the shell in order to break through LCP resin plastics and can not exceed the restriction that 280 ℃ required to the temperature in bonding die processing operation process, avoid LCP resin plastics to enclose the adhesive bonding degree variation of shell when the bonding die operation and lead to LCP resin plastics to enclose the condition that the shell drops and take place, the utility model provides a radio frequency device tube and radio frequency encapsulation device carries out the detailed description to this structure below.

First embodiment

Referring to fig. 1 to fig. 3, the present embodiment provides an rf device package 100, which can prevent the casing 130 from falling off during the die bonding operation, thereby improving the package reliability. Meanwhile, the bonding agent on the upper part can be prevented from overflowing to pollute a routing area, and the bonding reliability of the bonding pad is ensured.

The radio frequency device package 100 provided by this embodiment includes a base flange 110, an enclosure 130, and a cover plate 150, wherein the enclosure 130 is disposed on the base flange 110, and the cover plate 150 is disposed on the enclosure 130, wherein the cover plate 150 and the base flange 110 are respectively disposed on the upper and lower sides of the enclosure 130, and an accommodating cavity for accommodating the radio frequency device is formed between the cover plate 150 and the base flange 110, one of the base flange 110 and the enclosure 130 is provided with a clamping groove 170, and the other is provided with a clamping protrusion 190, and the clamping protrusion 190 is assembled in the clamping groove 170, so that the base flange 110 is clamped at the bottom of the enclosure 130.

In this embodiment, the base flange 110 may be provided with a retaining protrusion 190, and the enclosure 130 may be provided with a retaining groove 170, so that the base flange 110 can be retained at the bottom of the enclosure 130. Of course, in other preferred embodiments of the present invention, the base flange 110 may also be provided with a clamping groove 170, and the enclosure 130 is provided with a clamping protrusion 190, which can also realize the clamping and fastening between the base flange 110 and the enclosure 130. The present embodiment is assembled in the locking groove 170 by the locking protrusion 190, so that the base flange 110 is locked at the bottom of the enclosure 130, thereby ensuring a reliable connection between the base flange 110 and the enclosure 130. In the actual bonding process, the separation between the base flange 110 and the enclosure 130 caused by bonding failure due to temperature change is avoided, so that the bonding effect is better.

In this embodiment, the two side end surfaces of the base flange 110 are provided with the retaining protrusions 190, the retaining protrusions 190 protrude outward from the end surface of the base flange 110, the bottom portions of the two sides of the enclosure 130 extend downward and form the stopping portions 131, the stopping portions 131 are provided with the bending protrusions 133, the bending protrusions 133 are bent inward, and form the locking grooves 170 together with the bottom portion of the enclosure 130. Specifically, the catching protrusions 190 are integrally provided at both side edges of the base flange 110 and protrude outward. Meanwhile, the bending protrusions 133 are only located at two sides of the enclosure 130, and two ends of the clamping groove 170 are in a through state, so that during actual installation, the clamping protrusions 190 on the base flange 110 and the clamped end portions can be aligned and installed, and then the base flange 110 and the enclosure 130 are pushed relatively, so that clamping of the base flange 110 and the enclosure 130 is completed.

It should be noted that, in the assembly stage, the clamping groove 170 limits the clamping protrusion 190 in the vertical direction, so as to prevent the substrate flange 110 from falling off downwards from the bottom of the enclosure 130, and after the subsequent bonding, the substrate flange 110 and the enclosure 130 can be fixed relatively.

In the present embodiment, the upper surface of the retention bump 190 is flush with the upper surface of the base flange 110 and both engage with the bottom end surface of the surrounding shell 130, the lower surface of the retention bump 190 engages with the upper surface of the bending bump 133, and the inner surface of the bending bump 133 engages with the end surface of the base flange 110. Specifically, the catching protrusion 190 is integrally provided at an upper side edge of the base flange 110 to form a T-shaped structure, which can be directly caught in the catching groove 170 at the time of assembly.

The term "joined state" as used in the present embodiment refers to surface-to-surface fitting or clearance fitting, and may refer to, for example, direct surface-to-surface fitting or surface-to-surface bonding with an adhesive.

In this embodiment, the surface of the latching protrusion 190 is coated with a first adhesive layer, and the latching protrusion 190 is adhered to the inner wall of the slot 170 through the first adhesive layer. Specifically, after the base flange 110 is completely assembled by clamping, the base flange 110 and the enclosure 130 can be adhered by resin adhesive, so that the base flange 110 and the enclosure 130 are kept adhered and fixed.

In the present embodiment, the capture bump 190 is disposed at a half of the thickness direction of the base flange 110, that is, the thickness of the capture bump 190 is half of the thickness of the base flange 110, for example, if the overall thickness of the base flange 110 is 1mm, the thickness of the capture bump 190 is 0.5mm, and the width of the capture bump 190 is 1mm. Meanwhile, the stopping portion 131 extends downwards 1.1mm from the bottom of the surrounding shell 130, the bending protruding block 133 is bent inwards 0.9mm, and the wall thickness of the bending portion is 0.4mm, so that the thickness of the gap between the clamping protruding block 190 and the inner wall of the clamping groove 170 is about 0.1mm, namely the assembling gap is about 0.1mm, and the adhesive is conveniently injected while the assembling is convenient.

In this embodiment, the thickness of the first adhesive layer is between 0.08 mm and 0.12 mm. Preferably, the thickness of the first adhesive layer is 0.1mm, so that the first adhesive layer can just fill the assembly gap, and the bonding and fixing effect is ensured.

It should be noted that, in the present embodiment, the descriptions of the relevant dimensions of the clamping bump 190, the clamping slot 170 and the first adhesive layer are all examples, and do not play any limiting role, and for different package dimensions, the set dimensions may all be adjusted according to actual situations.

It should be noted that the locking protrusion 190 in this embodiment can be installed from the end of the locking slot 170, and the assembly is completed after the base flange 110 and the enclosure 130 are pushed relatively, and the assembled flange can be placed in an oven and heated to 180 ℃ to allow the adhesive to bond the base flange 110 and the enclosure 130, and then the temperature is maintained for one hour to cure the flange.

In this embodiment, the end of the enclosure 130 away from the base flange 110 is provided with a groove 135, and the cover plate 150 is at least partially embedded in the groove 135. Specifically, the top end of the surrounding shell 130 is provided with the groove 135, and the cover plate 150 is partially embedded in the groove 135, so that the positioning is realized, the adhesive can be accommodated in the groove 135, the adhesive overflow phenomenon is slowed down, and the bonding reliability of the welding spots is prevented from being influenced by the pollution of the adhesive to the welding spots of the routing area.

The cover plate 150 includes an integrally disposed covering portion 151 and an embedding portion 153, the embedding portion 153 is disposed at the bottom of the covering portion 151 and protrudes downward, the covering portion 151 covers the enclosure 130, and the embedding portion 153 is embedded in the groove 135. Specifically, the embedding portion 153 is located on the bottom surface of the covering portion 151, and the height of the embedding portion 153 relative to the covering portion 151 is 0.2mm, and the depth of the groove 135 is 0.3mm, so that the embedding portion 153 can be completely embedded and buckled in the groove 135, and the positioning is completed.

In the embodiment, the embedding portion 153 is ring-shaped, and the shape of the groove 135 matches with the shape of the embedding portion 153 and is annularly distributed on the enclosure 130. Specifically, the width of the embedding part 153 is 0.2mm, and the width of the groove 135 is 0.3mm, so that the embedding part 153 has an assembly gap of about 0.1mm when being embedded in the groove 135, and glue filling is facilitated.

In other preferred embodiments of the present invention, the embedding portion 153 may also be linear, the bottom surface of the covering portion 151 is relatively provided with two embedding portions 153 arranged linearly, the top end of the surrounding shell 130 is also provided with two grooves 135 arranged linearly, and the two embedding portions 153 can be directly embedded into the two grooves 135, thereby achieving positioning.

In the present embodiment, the surface of the insertion portion 153 is coated with a second adhesive layer, and the insertion portion 153 is adhered to the inner wall of the groove 135 by the second adhesive layer. Wherein the thickness of the second adhesive layer is between 0.08 and 0.12 mm. Preferably, the thickness of the second adhesive layer is 0.1mm, so that the second adhesive layer can just fill the assembly gap between the embedding part 153 and the inner wall of the groove 135, and the adhesive fixation is realized.

It should be noted that, in the present embodiment, the descriptions of the relevant dimensions of the embedding portion 153, the groove 135 and the second adhesive layer are all for illustration and do not play any limiting role, and for different package dimensions, the set dimensions can be adjusted according to actual situations.

It is worth noting that, in this embodiment, the groove 135 is located at a center line position of the end surface of the surrounding shell 130, that is, two sides of the groove 135 are spaced from the inner and outer edges of the surrounding shell 130, and the embedded portion 153 is integrally and annularly distributed on the top of the covering portion 151, so that a labyrinth structure is formed between the embedded portion 153 and the groove 135, and the connection sealing performance between the cover plate 150 and the surrounding shell 130 is further ensured.

Of course, in other preferred embodiments of the present invention, the embedding portion 153 may also be integrally disposed on the top of the covering portion 151 in a boss shape, and the groove 135 may also be located inside the enclosure 130 and extend to communicate with the accommodating cavity, at this time, the embedding portion 153 is not only embedded in the groove 135, but also partially supported on the top of the accommodating cavity, and the second adhesive layer is coated on the portion of the embedding portion 153 embedded in the groove 135, which can also realize the sealing performance between the cover plate 150 and the enclosure 130.

In summary, the present embodiment provides an rf device package 100, wherein the base flange 110 is provided with a retaining protrusion 190, the enclosure 130 is provided with a retaining groove 170, and the retaining protrusion 190 is assembled in the retaining groove 170, so that the base flange 110 is retained at the bottom of the enclosure 130, thereby ensuring a reliable connection between the base flange 110 and the enclosure 130. Meanwhile, the first adhesive layer is arranged to maintain sealing, so that the separation between the substrate flange 110 and the enclosure 130 caused by adhesive failure due to temperature change is avoided during actual adhesion, and the bonding effect is better. In addition, a groove 135 is formed in the top end of the surrounding shell 130, an embedding portion 153 is correspondingly formed, the embedding portion 153 of the cover plate 150 is embedded into the groove 135, and sealing is kept through the arrangement of the second bonding layer, so that sealing connection between the cover plate 150 and the surrounding shell 130 is guaranteed, and meanwhile, the glue overflowing phenomenon is also slowed down.

Second embodiment

Referring to fig. 4, the present embodiment provides an rf device package 100, the basic structure and principle and the technical effect thereof are the same as those of the first embodiment, and for the sake of brief description, no part of the present embodiment is mentioned, and reference may be made to the corresponding contents in the first embodiment.

In the present embodiment, the clamping groove 170 is disposed on the base flange 110, the retaining protrusion 190 is disposed at the bottom of the enclosure 130, and the relative positioning between the base flange 110 and the enclosure 130 is also achieved by the assembly of the retaining protrusion 190 and the clamping groove 170. Specifically, the edges of the two sides of the base flange 110 are provided with the locking grooves 170, the bottoms of the two sides of the surrounding shell 130 extend downward to form the stopping portions 131, the stopping portions 131 are provided with the locking protrusions 190, and the locking protrusions 190 are bent inward relative to the stopping portions 131.

In the present embodiment, the base flange 110 includes a base portion 111 and a catching portion 113 integrally provided, the catching groove 170 is opened on the catching portion 113, the base portion 111 has a width larger than that of the catching portion 113, and the base portion 111 is engaged with the lower side surface of the catching protrusion 190. In actual assembly, the width of the base portion 111 is greater than or equal to the width of the surrounding shell 130, the catching portions 113 are provided on the upper side surface of the base portion 111, and the portions of the upper side surface of the base portion 111 not shielded by the catching portions 113 are engaged with the lower side surfaces of the catching projections 190 while the catching portions 113 are engaged with the catching projections 190.

In this embodiment, the lower side wall of the card slot 170 coincides with the upper side surface of the base portion 111, that is, the card slot 170 is opened at the joint of the card holding portion 113 and the base portion 111. Moreover, a first adhesive layer is also disposed between the latching protrusion 190 and the inner wall of the latching slot 170, so as to achieve the adhesive fixation between the base flange 110 and the enclosure 130.

In this embodiment, by providing the base portion 111 with a larger width, the clamping protrusion 190 and the surrounding shell 130 can be better supported, and a better sealing and fixing effect can be ensured.

Third embodiment

Referring to fig. 5, the present embodiment provides an rf device package 100, the basic structure and principle and the technical effect thereof are the same as those of the first embodiment or the second embodiment, and for the sake of brief description, the corresponding contents in the first embodiment or the second embodiment can be referred to where this embodiment is not mentioned.

In the present embodiment, the clamping groove 170 is disposed on the base flange 110, the retaining protrusion 190 is disposed at the bottom of the enclosure 130, and the relative positioning between the base flange 110 and the enclosure 130 is also achieved by the assembly of the retaining protrusion 190 and the clamping groove 170. Specifically, the two side edges of the base flange 110 are provided with the locking grooves 170, the bottoms of the two sides of the enclosure 130 extend downward to form the stopping portions 131, the stopping portions 131 are provided with the locking protrusions 190, and the locking protrusions 190 are bent inward relative to the stopping portions 131.

In the present embodiment, the cross section of the retention projection 190 is triangular, the locking groove 170 is disposed at the end surface of the base flange 110, and the cross section of the locking groove 170 is matched with the retention projection 190. Specifically, the locking groove 170 is disposed at both side end surfaces of the base flange 110, and the cross-sectional shape of the locking groove 170 is V-shaped, which is adapted to the locking protrusion 190, i.e., the locking protrusion 190 can be fitted in the locking groove 170.

The radio frequency packaging device provided by the embodiment can reduce the number of molded surfaces of the triangular clamping lug 190 and the clamping groove 170 by arranging the triangular clamping lug 190 and the triangular clamping groove 170, is more convenient to manufacture, and reduces the demoulding difficulty. And meanwhile, the clamping effect is ensured, so that the base flange 110 and the enclosure 130 are kept relatively fixed.

Fourth embodiment

The present embodiment provides an rf package device, which includes an rf device and an rf device case 100, wherein the basic structure and principle of the rf device case 100 and the resulting technical effect are the same as those of the first embodiment, the second embodiment or the third embodiment, and for the sake of brief description, reference may be made to the corresponding contents in the first embodiment, the second embodiment or the third embodiment for the parts that are not mentioned in this embodiment.

In this embodiment, the rf package device includes an rf device and an rf device case 100, the rf device case 100 includes a base flange 110, an enclosure 130 and a cover plate 150, the enclosure 130 is disposed on the base flange 110, the cover plate 150 is disposed on the enclosure 130, wherein the cover plate 150 and the base flange 110 are disposed on the upper and lower sides of the enclosure 130 respectively, an accommodating cavity is formed between the cover plate 150 and the base flange 110, one of the base flange 110 and the enclosure 130 is provided with a clamping groove 170, the other one of the base flange 110 and the enclosure 130 is provided with a clamping protrusion 190, and the clamping protrusion 190 is assembled in the clamping groove 170, so that the base flange 110 is clamped at the bottom of the enclosure 130. The radio frequency device is accommodated in the accommodating cavity.

In the embodiment, the radio frequency device can be a third generation semiconductor gallium nitride high-power radio frequency device, and the basic structure and the packaging principle of the radio frequency device can refer to the existing radio frequency packaging device.

The present embodiment provides an rf packaging device, in which one of the substrate flange 110 and the enclosure 130 is provided with a clamping groove 170, and the other is provided with a clamping protrusion 190, and the clamping protrusion 190 is assembled in the clamping groove 170, so that the substrate flange 110 is clamped at the bottom of the enclosure 130, thereby ensuring a reliable connection between the substrate flange 110 and the enclosure 130. During actual bonding, separation between the substrate flange 110 and the enclosure 130 due to bonding failure caused by temperature change is avoided, so that the bonding effect is better, the sealing performance is ensured, and the structural stability of the radio frequency packaging device is better.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A radio frequency device package, comprising:

a base flange;

a containment shell disposed over the base flange;

and a cover plate arranged on the enclosure;

2. The rf device package as recited in claim 1, wherein the retaining protrusions are disposed on two side surfaces of the base flange, the retaining protrusions protrude outward from the side surfaces of the base flange, the bottom portions of the two sides of the enclosure extend downward and form stopping portions, the stopping portions are disposed with bending protrusions, the bending protrusions are bent inward and form the engaging slots together with the bottom portions of the enclosure.

3. The rf device package of claim 2, wherein the upper surfaces of the retention bumps are flush with the upper surface of the base flange and are each engaged with the bottom end surface of the enclosure, the lower surfaces of the retention bumps are engaged with the upper surfaces of the bending bumps, and the inner surfaces of the bending bumps are engaged with the end surface of the base flange.

4. The rf device package as recited in claim 1, wherein the two side edges of the base flange are provided with the locking slots, the bottom of the two sides of the enclosure extends downward and forms a stopping portion, the stopping portion is provided with the locking protrusions, and the locking protrusions are bent inward relative to the stopping portion.

5. The radio frequency device case as set forth in claim 4, wherein the base flange includes a base portion and a retaining portion, the catching groove is formed in the retaining portion, the base portion has a width larger than that of the retaining portion, and the base portion is engaged with a lower side surface of the retaining projection.

6. The radio frequency device package as in claim 4, wherein the latching protrusion has a triangular cross-section, the engaging groove is disposed at the end surface of the base flange, and the cross-sectional shape of the engaging groove is adapted to the latching protrusion.

7. A radio frequency device package as claimed in claim 1, wherein an end of the enclosure remote from the base flange is provided with a recess, the cover plate being at least partially embedded in the recess.

8. The radio frequency device package as claimed in claim 7, wherein the cover plate includes a covering portion and an embedding portion, the embedding portion is disposed at a bottom of the covering portion and protrudes downward, the covering portion covers the enclosure, and the embedding portion is embedded in the recess.

9. The radio frequency device package as claimed in claim 8, wherein the embedding portion is annular or linear, and the shape of the groove is adapted to the shape of the embedding portion.

10. A radio frequency packaged device comprising a radio frequency device and a radio frequency device package according to any of claims 1 to 9, said radio frequency device being housed in said housing cavity.