CN217643853U

CN217643853U - Heat sink device

Info

Publication number: CN217643853U
Application number: CN202221622195.XU
Authority: CN
Inventors: 徐少平
Original assignee: Ecarx Hubei Tech Co Ltd
Current assignee: Ecarx Hubei Tech Co Ltd
Priority date: 2022-06-27
Filing date: 2022-06-27
Publication date: 2022-10-21
Anticipated expiration: 2032-06-27

Abstract

The utility model provides a heat dissipation device, include: the heat dissipation device comprises a heat dissipation body, wherein an installation part for installing a heat dissipation workpiece is arranged on the heat dissipation body; the metal heat conducting part is at least partially arranged on the mounting part and is respectively attached to the heat dissipation workpiece and the mounting part, so that the heat of the heat dissipation workpiece is conducted to the heat dissipation body through the metal heat conducting part; and a magnetic member disposed on the mounting portion, the magnetic member fixing the metal heat conduction portion to the mounting portion by a magnetic force of the magnetic member. The utility model provides an use the liquid metal as the low problem of heat-conducting medium's security among the prior art.

Description

Heat sink device

Technical Field

The utility model relates to a chip heat dissipation technical field particularly, relates to a heat abstractor.

Background

With the development of science and technology, various fields are researched and expanded towards intellectualization and humanization, for example, automobiles are taken as examples, intelligent cockpit is embodied more and more humanization, and in a controller of the intelligent cockpit, the integration level of a circuit board is higher and higher, so the computing power of a chip is gradually enhanced, and the chip with high computing power brings the problem of high heat consumption.

The existing heat dissipation mode usually comprises a heat source, a heat conduction interface material and a heat radiator, wherein general heat conduction interface materials comprise heat conduction silica gel, heat conduction silicone grease, heat conduction adhesive water, heat conduction double-sided adhesive and the like, the heat conduction materials have low heat conductivity and cannot be completely attached to a chip, in the prior art, although liquid metal is used as the heat conduction interface material, most of the liquid metal takes silicon as a base material, and forms such as the liquid metal heat conduction silica gel or the liquid metal heat conduction silicone grease are made, so the heat conduction coefficient of the liquid metal is greatly reduced.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a heat dissipating device to solve the problem of low safety of using liquid metal as a heat conducting medium in the prior art.

In order to achieve the above object, the present invention provides a heat dissipation device, including: the heat dissipation device comprises a heat dissipation body, wherein an installation part for installing a heat dissipation workpiece is arranged on the heat dissipation body; the metal heat conducting part is at least partially arranged on the mounting part and is respectively attached to the heat dissipation workpiece and the mounting part, so that the heat of the heat dissipation workpiece is conducted to the heat dissipation body through the metal heat conducting part; and a magnetic member disposed on the mounting portion, the magnetic member fixing the metal heat-conducting portion on the mounting portion by magnetic force of the magnetic member.

Further, the mounting portion includes: the heat dissipation body is provided with a bottom end face, a protruding block is arranged on the bottom end face of the heat dissipation body and protrudes relative to the bottom end face of the heat dissipation body, a limiting groove is formed in the protruding block, at least part of the metal heat conduction part is arranged on the groove bottom face of the limiting groove, and the heat dissipation workpiece is arranged in the limiting groove; the magnetic part is arranged on the convex block.

Further, the height of the protruding block is larger than 4mm, and the depth of the limiting groove is smaller than 0.5mm.

Further, the magnetic part is arranged around the protruding block and fixedly connected with the protruding block.

Furthermore, the heat dissipation device also comprises heat dissipation holes which are arranged on the convex blocks and communicated with the limiting grooves; the metal heat conduction part comprises a first heat conduction part and a second heat conduction part which are connected with each other, the first heat conduction part is arranged on the bottom surface of the limiting groove, and the second heat conduction part is arranged in the heat dissipation hole.

Further, the aperture of the heat dissipation hole is 1.5mm to 3mm; and/or the heat dissipation holes are multiple, and the heat dissipation holes are uniformly arranged on the protruding block at intervals.

Further, the heat dissipating device further includes: and the sealing part is arranged between the heat dissipation workpiece and the groove wall surface of the limiting groove, is respectively attached to the heat dissipation workpiece and the groove wall surface of the limiting groove, and extends along the circumferential direction of the heat dissipation workpiece.

Further, the heat dissipation device further includes: radiating fin, the setting is kept away from the one end of installation department at the heat dissipation body, and radiating fin includes relative stiff end and the free end that sets up, and radiating fin's stiff end and this body coupling of heat dissipation, radiating fin's free end orientation are kept away from the direction extension of heat dissipation body.

Furthermore, a plurality of radiating fins are uniformly arranged along the extending direction of the radiating body at intervals; the vertical distance between two adjacent radiating fins is larger than 4mm.

Further, the height of the radiating fin is larger than 10mm; and/or the minimum thickness of the radiating fin is less than 2mm.

By applying the technical scheme of the utility model, the heat dissipation device comprises a heat dissipation body, a metal heat conduction part and a magnetic part, and the heat dissipation body is provided with an installation part for installing a heat dissipation workpiece; at least part of the metal heat conduction part is arranged on the mounting part, and the metal heat conduction part is respectively attached to the heat dissipation workpiece and the mounting part, so that the heat of the heat dissipation workpiece is conducted to the heat dissipation body through the metal heat conduction part; the magnetic member is disposed on the mounting portion, and the metal heat conduction portion is fixed to the mounting portion by a magnetic force of the magnetic member. Set up like this at the produced heat of heat dissipation work piece operation in-process, can be through the quick conduction of metal heat conduction portion to the body that dispels the heat to utilize the heat dissipation body to dispel the heat, for the stability of reinforcing metal heat conduction portion, set up the magnetic part on the installation department, utilize the magnetic force of magnetic part to make metal heat conduction portion fix on the installation department like this, improved the security performance of heat dissipation work piece in the use.

Drawings

The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the scope of the invention. In the drawings:

fig. 1 shows a schematic structural view of an embodiment of a heat dissipation device according to the present invention;

fig. 2 shows a schematic structural view of a heat dissipating body of a heat dissipating device according to the present invention;

fig. 3 shows a cross-sectional view of a heat sink according to the present invention.

Wherein the figures include the following reference numerals:

100. a heat dissipation workpiece; 200. a circuit board; 1. a heat dissipation body; 2. an installation part; 3. a metal heat conduction portion; 4. a magnetic member; 21. a protruding block; 22. a limiting groove; 20. the bottom surface of the groove; 5. heat dissipation holes; 31. a first heat-conducting portion; 32. a second heat conduction portion; 6. a sealing member; 7. and (4) radiating fins.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Referring to fig. 1 to 3, the present invention provides a heat dissipation device, including: the heat dissipation device comprises a heat dissipation body 1, wherein an installation part 2 for installing a heat dissipation workpiece 100 is arranged on the heat dissipation body 1; the metal heat conducting part 3, the metal heat conducting part 3 is at least partially set up on the mounting part 2, the metal heat conducting part 3 is laminated with heat-dissipating work piece 100 and mounting part 2 separately, so as to make the heat of the heat-dissipating work piece 100 conduct to the heat-dissipating body 1 through the metal heat conducting part 3; and a magnetic member 4 provided on the mounting portion 2, the magnetic member 4 fixing the metal heat conduction portion 3 to the mounting portion 2 by a magnetic force of the magnetic member 4.

According to the utility model, the heat dissipation device comprises a heat dissipation body 1, a metal heat conduction part 3 and a magnetic part 4, wherein the heat dissipation body 1 is provided with an installation part 2 for installing a heat dissipation workpiece 100; the metal heat conducting part 3 is at least partially arranged on the mounting part 2, and the metal heat conducting part 3 is respectively attached to the heat dissipation workpiece 100 and the mounting part 2, so that the heat of the heat dissipation workpiece 100 is conducted to the heat dissipation body 1 through the metal heat conducting part 3; the magnetic member 4 is provided on the mounting portion 2, and the metal heat conduction portion 3 is fixed to the mounting portion 2 by the magnetic force of the magnetic member 4. Set up like this and dispel the heat that work piece 100 operation in-process produced, can be through the quick conduction of metal heat conduction portion 3 to on the heat dissipation body 1 to utilize the heat dissipation body 1 to dispel the heat, in order to strengthen the stability of metal heat conduction portion 3, set up magnetic part 4 on installation department 2, utilize the magnetic force of magnetic part 4 to make metal heat conduction portion 3 fix on installation department 2 like this, improved the security performance of heat dissipation work piece 100 in the use.

Specifically, the utility model discloses in, metal heat conduction portion 3 is including the magnetic liquid metal material who has the iron-based, and it has greatly reduced the heat conduction thermal resistance on the heat conduction route, has improved heat abstractor's radiating efficiency, and simultaneously, the liquid metal that has the iron-based has magnetic effect, has guaranteed the security of the liquid metal material who has the iron-based in the use through magnetic part 4.

In a specific implementation, as shown in fig. 1 and 2, the mounting portion 2 includes: the heat dissipation device comprises a protruding block 21, a limiting groove 22 and a heat dissipation workpiece 100, wherein the protruding block 21 is arranged on the bottom end face of the heat dissipation body 1, the protruding block 21 protrudes relative to the bottom end face of the heat dissipation body 1, at least part of the metal heat conduction part 3 is arranged on the groove bottom face 20 of the limiting groove 22, and the heat dissipation workpiece 100 is arranged in the limiting groove 22; the magnetic member 4 is disposed on the protruding block 21. The arrangement is convenient for installing the heat dissipation workpiece 100 on the heat dissipation body 1, the limiting groove 22 is used for limiting the heat dissipation workpiece 100, and meanwhile, the convex block 21 is used for facilitating the installation of the magnetic part 4.

Preferably, the height of the protruding block 21 is greater than 4mm, and the depth of the limiting groove 22 is less than 0.5mm. Wherein, protruding piece 21 is connected with heat dissipation body 1 including relative stiff end and the free end that sets up, the stiff end of protruding piece 21, and the free end orientation is kept away from heat dissipation body 1's direction protrusion, and the direction of height of protruding piece 21 is unanimous with spacing recess 22's depth direction, and the direction of height of protruding piece 21 is stiff end to the direction of free end, and at this within range, heat abstractor's overall structure compactness and miniaturized design have been guaranteed.

In the present application, the magnetic member 4 is disposed around the protruding block 21 and fixedly connected to the protruding block 21. Thus, the magnetic force applied by the magnetic member 4 to the metal heat conduction portion 3 is uniformly distributed around the metal heat conduction portion 3, so that the metal heat conduction portion 3 is uniformly stressed to be stable.

As shown in fig. 2, the heat dissipating device further includes heat dissipating holes 5, the heat dissipating holes 5 are disposed on the protruding blocks 21 and communicated with the limiting grooves 22; the metal heat conduction part 3 comprises a first heat conduction part 31 and a second heat conduction part 32 which are connected with each other, the first heat conduction part 31 is arranged on the groove bottom surface of the limiting groove 22, and the second heat conduction part 32 is arranged in the heat dissipation hole 5. Wherein, the heat radiation holes 5 are used to further improve the efficiency of heat conduction from the heat radiation workpiece 100 to the heat radiation body 1.

Preferably, the aperture of the heat dissipation hole 5 is 1.5mm to 3mm; and/or, the heat dissipation holes 5 are multiple, and the multiple heat dissipation holes 5 are uniformly arranged on the convex block 21 at intervals. The length of the radiating holes 5 is lower than the height of the protruding block 21, and the plurality of radiating holes 5 increase the contact area between the metal heat conducting part 3 and the radiating body 1, reduce the thermal resistance between the radiating body 1 and the metal heat conducting part 3, and improve the heat exchange rate between the two.

In order to fix the heat-dissipating workpiece 100 in the retaining groove 22, the heat-dissipating device further includes: and the sealing part 6 is arranged between the heat dissipation workpiece 100 and the groove wall surface of the limiting groove 22, the sealing part 6 is respectively attached to the heat dissipation workpiece 100 and the groove wall surface of the limiting groove 22, and the sealing part 6 extends along the circumferential direction of the heat dissipation workpiece 100. The gap between the sealing component 6 and the groove wall surfaces of the heat dissipation workpiece 100 and the limiting groove 22 is in interference fit, the sealing component 6 is a sealing ring, and the height of the sealing ring is higher than the thickness of the heat dissipation workpiece 100, so that the liquid metal material with the iron base in the metal heat conduction part 3 is prevented from overflowing in the installation process.

In order to improve the heat dissipation efficiency of the heat dissipation body 1, as shown in fig. 3, the heat dissipation device further includes: radiating fin 7 sets up the one end of keeping away from installation department 2 at heat dissipation body 1, and radiating fin 7 is connected with heat dissipation body 1 including relative stiff end and the free end that sets up, radiating fin 7's stiff end, and radiating fin 7's free end orientation is kept away from the direction extension of heat dissipation body 1. Preferably, the heat radiation fins 7 are plate-shaped, and the heat absorbed by the heat radiation body 1 is radiated by the heat radiation fins 7.

In the specific implementation process, a plurality of radiating fins 7 are provided, and the plurality of radiating fins 7 are uniformly arranged at intervals along the extending direction of the radiating body 1; the vertical distance between two adjacent radiating fins 7 is more than 4mm. The arrangement enables a heat dissipation gap to be formed between two adjacent heat dissipation fins 7, and the heat dissipation efficiency of the heat dissipation body 1 can be improved.

Preferably, the height of the heat dissipating fins 7 is greater than 10mm; and/or the minimum thickness of the heat dissipation fins 7 is less than 2mm. This is provided to ensure that the heat sink fins 7 can absorb as much heat as possible from the heat sink body 1.

The heat dissipation work piece 100 of this application uses the chip as an example, the chip is installed on circuit board 200, at first with the high temperature resistant glue film of inboard coating of magnetic part 4, later paste magnetic part 4 in the outside of protrusion piece 21, but treat glue solidification back magnetic part 4 in the high temperature resistant glue film and fix completely on protrusion piece 21, later with the magnetic liquid metal coating that has the iron-based on spacing recess 22 the tank bottom surface 20 and in the louvre 5, the magnetic liquid metal that has the iron-based adsorbs in tank bottom surface 20 and louvre 5 stably under the magnetic force of magnetic part 4. Preferably, the magnetic member 4 is a magnet.

Further, the sealing component 6 is sleeved on the chip, the heat dissipation body 1 is directly buckled on the chip, the chip is just installed in the limiting groove 22, the surface of the chip is in contact with the magnetic liquid metal on the groove bottom surface 20, at the moment, the liquid metal can infiltrate into the surface of the chip and is in full contact with the surface of the chip, and the thermal resistance between the surface of the chip and the liquid metal is reduced to the minimum.

In addition, if circuit board 200 needs the maintenance, when will dispelling heat the body 1 and dismantle, magnetic liquid metal is under the magnetic force effect of magnetic part 4, and partial liquid metal remains on the chip surface, and remaining liquid metal can keep on the tank bottom surface of spacing recess 22, can not flow to and cause the device short circuit risk on circuit board 200.

From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:

according to the utility model, the heat dissipation device comprises a heat dissipation body 1, a metal heat conduction part 3 and a magnetic part 4, wherein the heat dissipation body 1 is provided with an installation part 2 for installing a heat dissipation workpiece 100; at least part of the metal heat conducting part 3 is arranged on the mounting part 2, and the metal heat conducting part 3 is respectively attached to the heat dissipation workpiece 100 and the mounting part 2, so that the heat of the heat dissipation workpiece 100 is conducted to the heat dissipation body 1 through the metal heat conducting part 3; the magnetic member 4 is provided on the mounting portion 2, and the metal heat conduction portion 3 is fixed to the mounting portion 2 by the magnetic force of the magnetic member 4. Set up like this and dispel the heat that work piece 100 operation in-process produced, can be through the quick conduction of metal heat conduction portion 3 to on the heat dissipation body 1 to utilize the heat dissipation body 1 to dispel the heat, in order to strengthen the stability of metal heat conduction portion 3, set up magnetic part 4 on installation department 2, utilize the magnetic force of magnetic part 4 to make metal heat conduction portion 3 fix on installation department 2 like this, improved the security performance of heat dissipation work piece 100 in the use.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the accompanying drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

For ease of description, spatially relative terms such as "over 8230," "upper surface," "above," and the like may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; above" may include both orientations "at 8230; \8230; above" and "at 8230; \8230; below". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipating device, comprising:

the heat dissipation device comprises a heat dissipation body (1), wherein an installation part (2) for installing a heat dissipation workpiece (100) is arranged on the heat dissipation body (1);

the metal heat conducting part (3) is at least partially arranged on the mounting part (2), and the metal heat conducting part (3) is respectively attached to the heat dissipation workpiece (100) and the mounting part (2) so that the heat of the heat dissipation workpiece (100) is conducted to the heat dissipation body (1) through the metal heat conducting part (3);

and the magnetic part (4) is arranged on the mounting part (2), and the metal heat conduction part (3) is fixed on the mounting part (2) through the magnetic force of the magnetic part (4).

2. The heat sink as claimed in claim 1, wherein the mounting portion (2) comprises:

the heat dissipation device comprises a protruding block (21) arranged on the bottom end face of the heat dissipation body (1), wherein the protruding block (21) protrudes relative to the bottom end face of the heat dissipation body (1), a limiting groove (22) is formed in the protruding block (21), at least part of the metal heat conduction part (3) is arranged on the groove bottom face of the limiting groove (22), and the heat dissipation workpiece (100) is arranged in the limiting groove (22);

the magnetic part (4) is arranged on the convex block (21).

3. The heat sink as claimed in claim 2, characterized in that the height of the protruding block (21) is greater than 4mm and the depth of the limiting groove (22) is less than 0.5mm.

4. The heat sink according to claim 2, characterized in that the magnetic element (4) is arranged around the protruding block (21) and is fixedly connected to the protruding block (21).

5. The heat dissipating device according to claim 2, further comprising heat dissipating holes (5), wherein the heat dissipating holes (5) are provided on the protruding blocks (21) and communicate with the retaining grooves (22);

the metal heat conducting portion (3) comprises a first heat conducting portion (31) and a second heat conducting portion (32) which are connected with each other, the first heat conducting portion (31) is arranged on the groove bottom face of the limiting groove (22), and the second heat conducting portion (32) is arranged in the heat dissipation hole (5).

6. The heat dissipation device according to claim 5, wherein the aperture of the heat dissipation hole (5) is 1.5mm to 3mm; and/or the presence of a gas in the gas,

the heat dissipation holes (5) are arranged in a plurality, and the heat dissipation holes (5) are evenly arranged on the protruding block (21) at intervals.

7. The heat dissipating device of claim 2, further comprising:

the sealing component (6) is arranged between the heat dissipation workpiece (100) and the wall surface of the limiting groove (22), the sealing component (6) is attached to the wall surface of the heat dissipation workpiece (100) and the wall surface of the limiting groove (22) respectively, and the sealing component (6) extends in the circumferential direction of the heat dissipation workpiece (100).

8. The heat dissipating device of claim 1, further comprising:

radiating fin (7), set up and be in radiating body (1) is kept away from the one end of installation department (2), radiating fin (7) are including relative stiff end and the free end that sets up, radiating fin's (7) stiff end with radiating body (1) is connected, radiating fin's (7) free end orientation is kept away from the direction of radiating body (1) extends.

9. The heat sink according to claim 8, wherein the heat dissipating fin (7) is plural, and the plural heat dissipating fins (7) are arranged at regular intervals along the extending direction of the heat dissipating body (1);

the vertical distance between two adjacent radiating fins (7) is larger than 4mm.

10. The heat sink as claimed in claim 9, characterised in that the height of the heat sink fins (7) is greater than 10mm; and/or the presence of a gas in the gas,

the minimum thickness of the radiating fins (7) is less than 2mm.