CN202923050U - Heat-conducting board, heat radiator and radiation fins - Google Patents
Heat-conducting board, heat radiator and radiation fins Download PDFInfo
- Publication number
- CN202923050U CN202923050U CN 201220501590 CN201220501590U CN202923050U CN 202923050 U CN202923050 U CN 202923050U CN 201220501590 CN201220501590 CN 201220501590 CN 201220501590 U CN201220501590 U CN 201220501590U CN 202923050 U CN202923050 U CN 202923050U
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- heat
- steel plate
- layer
- radiation
- fin
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Abstract
The utility model discloses a heat-conducting board, a heat radiator and radiation fins. The heat radiator comprises a plurality of radiation fins and a heat radiation base, wherein the radiation fins are arranged on the heat radiation base; each radiation fin is manufactured by stamping the heat-conducting board; the heat-conducting board comprises a steel plate layer and heat radiation layers electroplated on the surfaces at two sides of the steel plate layer; and the thickness of each heat radiation layer is 0.2-0.4 microns. An inner core of the heat-conducting board serves as the steel plate layer, the high structural strength can be achieved by adopting the small thickness, and thus the cost is low; as heat is mainly radiated by an outer surface, each heat radiation layer is mainly used for radiating the heat; the heat radiation layers can be made from materials with a high heat-conducting coefficient, thereby improving the overall heat conductivity; and the heat radiation layer is electroplated on the surfaces at the two sides of the steel plate layer, the heat radiation layer and the steel plate layer are tightly adhered, and thus the material consumption is small, the heat conductivity is high, and the heat radiation capability of the heat radiator can be greatly improved.
Description
Technical field
The utility model belongs to the heat abstractor field, relates in particular to a kind of heat conduction sheet material, radiator and fin thereof.
Background technology
Heat conduction sheet material of the prior art is all to adopt single material, for example, and aluminium, aluminium alloy, copper etc.; In order to guarantee the structural strength of the fin that heat conduction sheet material is worked it out, its thickness generally will be accomplished the 1.5mm left and right, therefore needs to use more raw material, and cost is high; In order to reach radiating efficiency preferably, just need to adopt the high sheet material of this class price of copper coin.Therefore how when guaranteeing heat-conducting plate equipment structure intensity, can reduce costs and can improve radiating efficiency is the problem that the utility model need to solve.
The utility model content
The purpose of this utility model is to provide heat conduction sheet material, radiator and the fin thereof that a kind of structural strength is high, cost is low, radiating efficiency is high.
In order to solve the problems of the technologies described above, the utility model provides a kind of heat conduction sheet material, comprises steel plate layer and plating at the heat dissipating layer of described steel plate layer double-sided surface, and the thickness of described heat dissipating layer is the 0.2-0.4 micron.
Wherein, the thickness of described steel plate layer is 0.2 ~ 0.4mm.
Wherein, the thickness of described steel plate layer is 0.3mm.
Wherein, described heat dissipating layer is copper plate or silver coating.
Wherein, the thickness of described heat dissipating layer is 0.3 micron.
The utility model also provides a kind of fin, and described fin is made by above-mentioned heat conduction plate stamping.
Simultaneously, the utility model further provides a kind of radiator, comprises a plurality of above-mentioned fin and heat dissipation base, and a plurality of described fin are arranged on heat dissipation base.
Wherein, be arranged in parallel between a plurality of described fin.
Wherein, a plurality of described fin are radial and are arranged on described heat dissipation base.
In the utility model, the inner core of heat conduction sheet material is the steel plate layer, can adopt less thickness to reach higher structural strength, and cost is low; Rely on outer surface to dispel the heat because heat radiation is main, therefore mainly rely on heat dissipating layer to dispel the heat; The material of the adoptable high thermal conductivity of heat dissipating layer improves bulk thermal conductivity; Heat dissipating layer is electroplated at steel plate layer double-sided surface, and both in conjunction with tight, consumptive material is few, and heat transfer efficiency is high, can greatly improve the heat-sinking capability of radiator.
Description of drawings
In order to be illustrated more clearly in the technical solution of the utility model, the below will do to introduce simply to the accompanying drawing of required use in embodiment, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the radiator that provides of the utility model preferred embodiment;
Fig. 2 is the structural representation of the radiator that provides of another embodiment of the utility model;
Fig. 3 is the structural representation of the heat conduction sheet material that provides of the utility model embodiment.
The specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.
See also Fig. 1, a kind of radiator that the utility model embodiment provides comprises a plurality of fin 1 and heat dissipation base 2, and a plurality of fin 1 are arranged on heat dissipation base 2.
In the present embodiment, be arranged in parallel between a plurality of described fin 1.As other embodiment, can be also, as shown in Figure 2, a plurality of described fin 1 are radial and are arranged on described heat dissipation base 2, and fit system both is according to being determined by the planform of heat dissipation equipment.Fix by the mode of draw-in groove between fin 1 and heat dissipation base 2 or by being welded and fixed etc.
Fin 1 is made by 10 punching presses of heat conduction sheet material, and as shown in Figure 3, described heat conduction sheet material 10 comprises steel plate layer 11 and electroplates heat dissipating layer 12 at described steel plate layer 11 double-sided surface.The inner core of heat conduction sheet material 10 is steel plate layer 11, can adopt less thickness to reach higher structural strength, and cost is low; Rely on outer surface to dispel the heat because heat radiation is main, therefore mainly rely on heat dissipating layer 12 to dispel the heat; The material of heat dissipating layer 12 adoptable high thermal conductivity improves bulk thermal conductivity.In the present embodiment, heat dissipating layer 12 is copper plate, and the thermal conductivity factor of copper is 401 k(W/(MK)), heat transfer efficiency is high.If radiator is used for the high-power LED light fixture, in order to improve radiating efficiency, heat dissipating layer 12 can adopt thermal conductivity factor to reach 429 k(W/(MK)) silver coating, perhaps adopt the material of other high thermal conductivity coefficients.
Heat dissipating layer 12 is electroplated at steel plate layer 11 double-sided surface, both in conjunction with tight; The thickness of heat dissipating layer 12 is the 0.2-0.4 micron, and consumptive material is few, and the overall thermal conductivity of heat conduction sheet material 10 can reach 400 k(W/(MK)), heat transfer efficiency is high, can greatly improve the heat-sinking capability of radiator.
The thickness of steel plate layer 11 is 0.2 ~ 0.4mm, and more fin 1 can be set in identical space, improves fin 1 number that is arranged at same heat dissipation base 2, increases the cooling surface area of radiator, improves rate of heat dissipation; Can guarantee simultaneously the structural strength of fin 1.In the present embodiment, particularly, the thickness of steel plate layer 11 is 0.3mm.Certainly the thickness of steel plate layer 11 is not limited to this.
The above is preferred embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection domain of the present utility model.
Claims (9)
1. a heat conduction sheet material, is characterized in that, comprises steel plate layer and plating at the heat dissipating layer of described steel plate layer double-sided surface, and the thickness of described heat dissipating layer is the 0.2-0.4 micron.
2. heat conduction sheet material according to claim 1, is characterized in that, the thickness of described steel plate layer is 0.2 ~ 0.4mm.
3. heat conduction sheet material according to claim 2, is characterized in that, the thickness of described steel plate layer is 0.3mm.
4. heat conduction sheet material according to claim 1, is characterized in that, described heat dissipating layer is copper plate or silver coating.
5. heat conduction sheet material according to claim 1, is characterized in that, the thickness of described heat dissipating layer is 0.3 micron.
6. a fin, is characterized in that, described fin is made by the described heat conduction plate stamping of claim 1 to 5 any one.
7. a radiator, is characterized in that, comprises a plurality of fin claimed in claim 6 and heat dissipation base, and a plurality of described fin are arranged on heat dissipation base.
8. radiator according to claim 7, is characterized in that, is arranged in parallel between a plurality of described fin.
9. radiator according to claim 7, is characterized in that, a plurality of described fin are radial and are arranged on described heat dissipation base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220501590 CN202923050U (en) | 2012-09-28 | 2012-09-28 | Heat-conducting board, heat radiator and radiation fins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220501590 CN202923050U (en) | 2012-09-28 | 2012-09-28 | Heat-conducting board, heat radiator and radiation fins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202923050U true CN202923050U (en) | 2013-05-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220501590 Expired - Fee Related CN202923050U (en) | 2012-09-28 | 2012-09-28 | Heat-conducting board, heat radiator and radiation fins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202923050U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105605958A (en) * | 2015-12-21 | 2016-05-25 | 江苏格林威尔金属材料科技有限公司 | Silver-plated aluminum alloy circular pipe for radiator |
| CN108565253A (en) * | 2018-01-23 | 2018-09-21 | 维沃移动通信有限公司 | A kind of conductive structure and preparation method thereof, mobile terminal |
-
2012
- 2012-09-28 CN CN 201220501590 patent/CN202923050U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105605958A (en) * | 2015-12-21 | 2016-05-25 | 江苏格林威尔金属材料科技有限公司 | Silver-plated aluminum alloy circular pipe for radiator |
| CN108565253A (en) * | 2018-01-23 | 2018-09-21 | 维沃移动通信有限公司 | A kind of conductive structure and preparation method thereof, mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130508 Termination date: 20150928 |
|
| EXPY | Termination of patent right or utility model |