CN217546632U - Chip mounting automation equipment - Google Patents
Chip mounting automation equipment Download PDFInfo
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- CN217546632U CN217546632U CN202221208473.7U CN202221208473U CN217546632U CN 217546632 U CN217546632 U CN 217546632U CN 202221208473 U CN202221208473 U CN 202221208473U CN 217546632 U CN217546632 U CN 217546632U
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Abstract
The utility model discloses a chip mounting automation device, which comprises a frame, be equipped with point gum machine in the frame and construct and nation head swing arm mechanism, still be equipped with expand membrane mechanism and wafer magazine mechanism in the frame, still be equipped with the membrane change manipulator that is connected with expand membrane mechanism and wafer magazine mechanism in the frame, expand membrane mechanism and nation head swing arm mechanism cooperate, nation head swing arm mechanism is used for absorbing the chip on expanding membrane mechanism, be equipped with the straight line feeding mechanism who is used for tie point gum machine and nation head swing arm mechanism in the frame; the linear feeding mechanism is provided with a feeding mechanism at one end of the dispensing mechanism, and the rack is provided with a transferring manipulator for connecting the dispensing electric sliding table and the paster electric sliding table. The utility model discloses autoloading can be accomplished and the material is connect, the artifical mechanical energy material loading is not needed to production efficiency has effectively been improved.
Description
Technical Field
The utility model relates to a chip pastes dress technical field specifically is a chip pastes dress automation equipment.
Background
A Printed Circuit Board (PCB), which is called a Printed Circuit Board (PCB) for short, is one of important parts in the electronic industry. Almost every kind of electronic equipment, small electronic watches, calculators, large computers, communication electronics, military weaponry systems, as long as there are electronic components such as integrated circuits, etc., use printed boards for electrical interconnection between them. SMT is a process in which a leadless or short lead surface-mounted component is mounted on the surface of a Printed Circuit Board (PCB) and the assembly process is completed by dispensing; the existing printed circuit board is manually loaded and unloaded in the process of mounting, and the working efficiency is low. Therefore, the chip mounting automation equipment is improved.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model relates to a chip pastes dress automation equipment, which comprises a frame, be equipped with point gum machine structure and nation head swing arm mechanism in the frame, still be equipped with expand membrane mechanism and wafer magazine mechanism in the frame, still be equipped with the membrane change manipulator that is connected with expand membrane mechanism and wafer magazine mechanism in the frame, expand membrane mechanism and nation head swing arm mechanism cooperate, nation head swing arm mechanism is used for absorbing the chip on expanding membrane mechanism, be equipped with the straight line feeding mechanism who is used for tie point gum machine structure and nation head swing arm mechanism in the frame, straight line feeding mechanism includes the linear slide rail that sets up in the frame, be equipped with the point gum machine that slides along the linear slide rail and paste electronic slip table, point gum machine top is equipped with first removal slip table, the slip direction of first removal slip table is perpendicular on the space with the slip direction of point gum machine structure, the top of paster electronic slip table is equipped with the second removal slip table, the slip direction of second removal slip table is perpendicular on the space with the slip direction of paster electronic slip table; the straight line feeding mechanism is equipped with feeding mechanism in the one end that is located the point and glues the mechanism, just be equipped with the transportation manipulator of connecting point and gluing electronic slip table and paster electronic slip table in the frame.
As a preferred technical solution of the present invention, the feeding mechanism includes a material plate box disposed on a frame, pcb material plates stacked up and down are placed in the material plate box, one side of the frame located on the material plate box is provided with a pcb material plate conveying mechanism matched with the glue dispensing electric sliding table, the pcb conveying mechanism includes a positioning frame disposed on the frame, the positioning frame is provided with parallel conveying belts, and two sides of the positioning frame are provided with limiting plates, a limiting channel for a single pcb material plate to pass through is formed between the limiting plates; still be equipped with the pay-off manipulator in the frame, the pay-off manipulator is used for adsorbing the pcb flitch of placing the flitch box and transports on the conveyer belt.
As an optimal technical scheme of the utility model, be equipped with in the frame and be used for some glue to detect vision camera in the rear end that lies in the point gum machine structure.
As a preferred technical scheme of the utility model, all be equipped with electronic transportation area on first removal slip table and the second removal slip table, first removal slip table and second remove the slip table both sides and all are equipped with spacing curb plate, and form the spacing passageway that supplies single pcb flitch to pass through between two spacing curb plates.
As a preferred technical scheme of the utility model, first removal slip table is equipped with the spacing board of supporting of pcb flitch on the electric transfer area not with the one end of pcb flitch conveying mechanism butt joint.
As a preferred technical scheme of the utility model, sharp feeding mechanism's the other end is equipped with the finished product receiving mechanism with the butt joint of paster electronic slip table, finished product receiving mechanism is including setting up the material receiving platform in the frame, just it places the chamber and the chamber is placed to the finished product box that the butt joint magazine was placed to the material receiving bench, just finished product box places the chamber and the chamber is placed to the empty box and is set up from top to bottom, just still be equipped with the sharp slip table that is used for vertical setting on the material receiving platform, be equipped with on the sharp slip table and connect the finished product box to place the saddle in chamber and empty box, just be equipped with the socket that the side direction that is used for on the saddle inserts material receiving box, just the bottom that the chamber was placed to the empty box is equipped with and is used for carrying the material receiving box conveying the intraoral pay-off area of socket of saddle, and material receiving box is the iron and steel material, just the inboard that is equipped with on the saddle and is used for butt joint magazine to carry out the electro-magnet fixed, just still be equipped with on the saddle and be used for ejecting cylinder that is used for pushing up the material receiving box and places the finished product box intracavity.
As an optimized technical proposal of the utility model, the material receiving box is internally provided with a positioning slot which is arranged up and down and is inserted by a single PCB material plate.
As an optimal technical scheme of the utility model, still be equipped with in the frame and be used for carrying out the paster detection camera that the paster detected to the pcb flitch behind the paster.
The utility model has the advantages that:
the automatic chip mounting equipment comprises a feeding mechanical arm, a conveying belt, an electric glue dispensing sliding table, a glue dispensing electric sliding table, a bonding head swing arm mechanism, a film spreading mechanism and a conveying mechanical arm, wherein the conveying mechanical arm is used for adsorbing and conveying a pcb plate placed in a material box to the conveying belt, then the conveying belt is used for conveying the material plate to a butted glue dispensing electric sliding table, the electric conveying belt on a first moving sliding table is used for conveying the pcb plate to a specified position, then the glue dispensing electric sliding table moves along a linear guide rail, the glue dispensing electric sliding table is conveyed into the glue dispensing mechanism for glue dispensing, the glue dispensing electric sliding table is used for detecting under the detection action of a glue dispensing detection vision camera after the glue dispensing is finished, the glued pcb plate on the glue dispensing electric sliding table is conveyed to the bonding head swing arm mechanism after the glue dispensing electric sliding table is detected to be qualified, the bonding head swing arm mechanism is used for attaching the chip adsorbed and conveyed from the film spreading mechanism to the corresponding position of the pcb plate, after the surface mounting is finished, a surface mounting detection camera detects the surface mounted pcb flitch, and after the surface mounting is required for composite production, the qualified pcb flitch is sent into a product material box in a finished product receiving mechanism under the conveying effect of a surface mounting electric sliding table, the linear sliding table drives the material box to move up and down, the qualified pcb flitch is inserted into a positioning slot in the material box layer by layer, when the material box is full, the linear sliding table drives the material box to move into a finished product placing cavity, the electromagnet removes the fixing effect on the material box, then the ejection cylinder pushes the material box into the finished product placing cavity, then the linear sliding table drives the material box to move into an empty box placing cavity, a conveying belt in the empty box placing cavity conveys the empty material box into a supporting table and is fixed through the electromagnet, and the linear sliding table drives the material box to move to receive materials; automatic feeding and material receiving can be completed, and manual mechanical energy feeding is not needed, so that the production efficiency is effectively improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is a schematic structural view of a beam panel of an automation device for chip mounting according to embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a feeding mechanism of an automatic chip mounting apparatus according to embodiment 1 of the present invention;
fig. 3 is a schematic structural view of an electric dispensing sliding table of an automatic chip mounting device according to embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of a chip mounting electric slide table of the chip mounting automation device in embodiment 1 of the present invention;
fig. 5 is a schematic structural view of a finished product receiving mechanism of an automatic chip mounting apparatus according to embodiment 1 of the present invention;
fig. 6 is a schematic structural diagram of an ejection cylinder of the chip mounting automation equipment in embodiment 1 of the present invention;
fig. 7 is a schematic structural diagram of a material box of an automatic chip mounting apparatus according to embodiment 1 of the present invention;
fig. 8 is a schematic top view structure diagram of an automated chip mounting apparatus according to embodiment 1 of the present invention;
fig. 9 is a schematic structural diagram of a feeding mechanism of an automatic chip mounting device in embodiment 2 of the present invention.
In the figure: 1. a frame; 2. a glue dispensing mechanism; 3. a head-side swing arm mechanism; 4. a film expanding mechanism; 5. a wafer magazine mechanism; 7. a film changing manipulator; 8. a linear feeding mechanism; 9. a linear slide rail; 10. dispensing electric sliding tables; 11. a patch electric sliding table; 12. a first movable sliding table; 13. a second movable sliding table; 14. a feeding mechanism; 15. a transferring manipulator; 16. a panel box; 17. a positioning frame; 18. a conveyor belt; 19. a limiting plate; 20. an electric transfer belt; 21. a limiting side plate; 23. a finished product receiving mechanism; 24. a receiving platform; 25. a material receiving box; 26. a finished product box placing cavity; 27. an empty box placing cavity; 28. a linear sliding table; 29. a saddle; 30. a socket; 31. a feed belt; 32. an electromagnet; 33. ejecting out the cylinder; 34. positioning the slot; 35. a patch detection camera; 36. a feeding manipulator; 37. a dispensing detection vision camera; 38. an electric push rod; 39. a lifting plate; 40. positioning a groove; 41. pushing out the cylinder; 42. and (7) pushing the block.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
The embodiment is as follows: as shown in fig. 1-8, the utility model relates to a chip pastes dress automation equipment, which comprises a frame 1, be equipped with point gum machine on the frame 1 and construct 2 and nation head swing arm mechanism 3, still be equipped with membrane expanding mechanism 4 and wafer magazine mechanism 5 in the frame 1, still be equipped with the membrane manipulator 7 that trades that is connected with membrane expanding mechanism 4 and wafer magazine mechanism 5 in the frame 1, membrane expanding mechanism 4 cooperatees with nation head swing arm mechanism 3, nation head swing arm mechanism 3 is used for absorbing its characterized in that to the chip on membrane expanding mechanism 4: the automatic gluing machine is characterized in that a linear feeding mechanism 8 used for connecting a gluing mechanism 2 and a bonding head swing arm mechanism 3 is arranged on the rack 1, the linear feeding mechanism 8 comprises a linear slide rail 9 arranged on the rack 1, a glue dispensing electric sliding table 10 and a patch electric sliding table 11 which slide along the linear slide rail 9 are arranged on the linear slide rail 9, a first moving sliding table 12 is arranged at the top of the glue dispensing electric sliding table 10, the sliding direction of the first moving sliding table 12 is perpendicular to the sliding direction of the glue dispensing electric sliding table 10 in space, a second moving sliding table 13 is arranged at the top of the patch electric sliding table 11, and the sliding direction of the second moving sliding table 13 is perpendicular to the sliding direction of the patch electric sliding table 11 in space; the linear feeding mechanism 8 is provided with a feeding mechanism 14 at one end of the dispensing mechanism 2, and the frame 1 is provided with a transferring manipulator 15 connected with the dispensing electric sliding table 10 and the paster electric sliding table 11. The electronic slip table 10 of point glue of butt joint is sent into with it on to the pcb flitch is sent into through feeding mechanism 14, and the electronic transportation area 20 on first removal slip table 12 sends the pcb flitch into appointed position, then point glue electronic slip table 10 moves along linear guide, then send into point glue electronic slip table 10 of point glue and carry out the point glue in the mechanism 2 of gluing, point glue detect the detection effect of vision camera 37 and detect under the point glue after accomplishing, transport the pcb flitch after the point glue on electronic slip table 10 of point glue after the manipulator 15 will be glued in the transportation manipulator, transport on paster electronic slip table 11, then paster electronic slip table 11 sends the pcb flitch after the point glue into bonding head swing arm mechanism 3 in, then bonding head swing arm mechanism 3 will follow the chip that film expanding mechanism 4 adsorbs the transfer to attach the corresponding position of pcb flitch and carry out the paster, send out after the paster is accomplished.
The feeding mechanism 14 comprises a material plate box 16 arranged on the rack 1, pcb material plates stacked up and down are placed in the material plate box 16, a pcb material plate conveying mechanism matched with the glue dispensing electric sliding table 10 is arranged on one side, located on the material plate box 16, of the rack 1, the pcb conveying mechanism comprises a positioning frame 17 arranged on the rack 1, a conveying belt 18 arranged in parallel is arranged on the positioning frame 17, limiting plates 19 are arranged on two sides of the positioning frame 17, and a limiting channel for a single pcb material plate to pass through is formed between the limiting plates 19; still be equipped with feeding manipulator 36 on the frame 1, feeding manipulator 36 is used for adsorbing and transporting the pcb flitch that the flitch box 16 was placed to the conveyer belt 18 on, wherein the feeding manipulator adsorbs and transports the pcb flitch of placing in the flitch box to the conveyer belt 18 on, then the conveyer belt sends it into with it the point of butt joint on the electronic slip table of gluing to realize pay-off work.
A visual dispensing detection camera 37 is arranged at the rear end of the dispensing mechanism 2 on the frame 1.
All be equipped with electronic transportation area 20 on first removal slip table 12 and the second removal slip table 13, first removal slip table 12 and second remove slip table 13 both sides and all are equipped with spacing curb plate 21, and form the spacing passageway that supplies single pcb flitch to pass through between two spacing curb plates 21, and electronic transportation area 20 on the first removal slip table 12 is convenient for adjust the position of pcb flitch, and the electronic transportation area 20 on the second removal slip table 13 conveniently carries out the ejection of compact.
First removal slip table 12 is equipped with the spacing board of supporting of pcb flitch on taking 20 to electronic transportation in the one end that does not dock with pcb flitch conveying mechanism, has played spacing effect to the pcb flitch for the pcb flitch can arrive appointed position and be convenient for carry out the point and glue.
The other end of sharp feeding mechanism 8 is equipped with finished product receiving mechanism 23 with the electronic slip table 11 butt joint of paster, finished product receiving mechanism 23 is including setting up the material receiving platform 24 on frame 1, just the finished product box that is equipped with on the material receiving platform 24 and places chamber 26 and empty box and place chamber 27, just finished product box places chamber 26 and empty box and places chamber 27 and be setting up from top to bottom, just still be equipped with the sharp slip table 28 that is used for vertical setting on the material receiving platform 24, be equipped with on the sharp slip table 28 and connect the finished product box to place chamber 26 and empty box and place the saddle 29 of chamber 27, just be equipped with the socket 30 that the side direction that is used for on the saddle 29 inserted material receiving box 25, just the bottom that empty box placed chamber 27 is equipped with the ejecting belt 31 that is used for carrying material receiving box 25 in the socket 30 of saddle 29, and material receiving box 25 is steel material, just the inboard that is equipped with on the saddle 29 and is used for is equipped with the electro-magnet 32 that is used for fixing material receiving box 25, just still be equipped with on the saddle 29 and be used for ejecting finished product box 25 to the finished product box and place ejecting cylinder 33 in the chamber 26. Qualified pcb flitches are fed into a product material box in the finished product receiving mechanism 23 under the conveying action of the patch electric sliding table 11, the material box is driven to move up and down through the linear sliding table 28, the qualified pcb flitches are inserted into the positioning slots 34 in the material box layer by layer, when the material box is full, the linear sliding table 28 drives the material box to move into a finished product placing cavity, the fixing action on the material box is relieved by the electromagnet 32, the material box is pushed into the finished product placing cavity by the ejection cylinder 33, then the material box is driven to move into the empty box placing cavity 27 by the linear sliding table 28, the empty material box is conveyed into the support table 29 by the feeding belt 31 in the empty box placing cavity 27 and is fixed through the electromagnet 32, and the material box is driven to move through the linear sliding table 28 to carry out receiving work; automatic feeding and material receiving can be completed, and manual mechanical energy feeding is not needed, so that the production efficiency is effectively improved.
The receiving box 25 is internally provided with a positioning slot 34 which is vertically arranged and is used for a single PCB flitch to be inserted, so that PCB flitch pieces in the butt joint material box 25 can be stacked without contacting with each other, and the gluing phenomenon is not easy to occur.
Still be equipped with the paster detection camera 35 that is used for carrying out the paster to the pcb flitch behind the paster and detects on frame 1. And the rack 1 is also provided with a visual positioning camera for positioning the chip in the film expanding mechanism (4).
The working principle is as follows: the pcb material plate placed in the magazine is first sucked and transferred to the conveyor belt 18 by the feeding robot 36, the conveyer belt 18 then feeds it onto the docking electric dispensing slide 10, and the electric transfer belt 20 on the first moving slide 12 feeds the pcb boards to the designated position, then the glue dispensing electric sliding table 10 moves along the linear guide rail, the glue dispensing electric sliding table 10 is sent into the glue dispensing mechanism 2 for glue dispensing, after the glue dispensing is finished, the glue dispensing is detected under the detection action of the glue dispensing detection vision camera 37, after the detection is qualified, the glued pcb material plate on the glue dispensing electric sliding table 10 is transferred to the paster electric sliding table 11 by the transfer manipulator 15, the electric paster sliding table 11 feeds the glued pcb material plate into the bonding head swing arm mechanism 3, the bonding head swing arm mechanism 3 attaches the chip adsorbed and transported from the film expanding mechanism 4 to the corresponding position of the pcb material plate, after the pasting is finished, the pasting detection camera 35 detects the pasted pcb material plate, after the paster composite production is required, the qualified pcb material plate is sent into a product material box in the finished product receiving mechanism 23 under the conveying action of the paster electric sliding table 11, the linear sliding table 28 drives the material box to move up and down, the qualified pcb material plates are inserted into the positioning slots 34 in the material box layer by layer, when the material box is full, the linear sliding table 28 drives the material box to move into the finished product placing cavity, the electromagnet 32 releases the fixing effect on the material box, then the ejection cylinder 33 pushes the material box into the finished product placing cavity, then the linear sliding table 28 drives the material box to move to the empty box placing cavity 27, the material feeding belt 31 in the empty box placing cavity 27 conveys the empty material box to the support table 29, the material receiving device is fixed by an electromagnet 32, and the material receiving work is carried out by driving the material box to move through a linear sliding table 28; automatic feeding and material receiving can be completed, and manual mechanical energy feeding is not needed, so that the production efficiency is effectively improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a chip pastes dress automation equipment, includes frame (1), be equipped with dispensing machine on frame (1) and construct (2) and nation's first swing arm mechanism (3), still be equipped with on frame (1) and expand membrane mechanism (4) and wafer magazine mechanism (5), still be equipped with membrane changing manipulator (7) that are connected with and expand membrane mechanism (4) and wafer magazine mechanism (5) on frame (1), expand membrane mechanism (4) and cooperate with nation's first swing arm mechanism (3), nation's first swing arm mechanism (3) are used for absorbing the chip on expanding membrane mechanism (4), its characterized in that: the automatic glue dispensing machine is characterized in that a linear feeding mechanism (8) used for connecting a glue dispensing mechanism (2) and a head bonding swing arm mechanism (3) is arranged on the rack (1), the linear feeding mechanism (8) comprises a linear slide rail (9) arranged on the rack (1), a glue dispensing electric sliding table (10) and a patch electric sliding table (11) which slide along the linear slide rail (9) are arranged on the linear slide rail (9), a first moving sliding table (12) is arranged at the top of the glue dispensing electric sliding table (10), the sliding direction of the first moving sliding table (12) is spatially perpendicular to the sliding direction of the glue dispensing electric sliding table (10), a second moving sliding table (13) is arranged at the top of the patch electric sliding table (11), and the sliding direction of the second moving sliding table (13) is spatially perpendicular to the sliding direction of the patch electric sliding table (11); the linear feeding mechanism (8) is provided with a feeding mechanism (14) at one end of the glue dispensing mechanism (2), and the rack (1) is provided with a transferring manipulator (15) connected with the glue dispensing electric sliding table (10) and the paster electric sliding table (11).
2. The automatic chip mounting equipment according to claim 1, wherein the feeding mechanism (14) comprises a material plate box (16) arranged on the rack (1), pcb material plates stacked up and down are placed in the material plate box (16), a pcb material plate conveying mechanism matched with the glue dispensing electric sliding table (10) is arranged on one side of the rack (1) located on the material plate box (16), the pcb conveying mechanism comprises positioning frames (17) arranged on the rack (1), conveying belts (18) arranged in parallel are arranged on the positioning frames (17), limiting plates (19) are arranged on two sides of the positioning frames (17), and a limiting channel for a single pcb material plate to pass through is formed between the limiting plates (19); the rack (1) is also provided with a feeding mechanical arm (36), and the feeding mechanical arm (36) is used for adsorbing and conveying a pcb material plate placed on the material plate box (16) to the conveying belt (18).
3. The automatic chip mounting equipment according to claim 1, wherein a visual camera (37) for dispensing inspection is arranged at the rear end of the dispensing mechanism (2) on the rack (1).
4. The automatic chip mounting equipment according to claim 1, wherein the first moving sliding table (12) and the second moving sliding table (13) are respectively provided with an electric transfer belt (20), two sides of the first moving sliding table (12) and the second moving sliding table (13) are respectively provided with a limiting side plate (21), and a limiting channel for a single pcb flitch to pass through is formed between the two limiting side plates (21).
5. The automatic chip mounting equipment according to claim 4, wherein a limiting and resisting plate for limiting the pcb material plate on the electric transfer belt (20) is arranged at one end of the first movable sliding table (12) which is not butted with the pcb material plate conveying mechanism.
6. The chip mounting automation equipment of claim 1, a chip mounting automation equipment, characterized in that, the other end of straight line feeding mechanism (8) is equipped with finished product receiving mechanism (23) with paster electronic slip table (11) butt joint, finished product receiving mechanism (23) is including setting up material receiving platform (24) on frame (1), just it places chamber (26) and empty box and places chamber (27) to be equipped with the finished product box that butt joint magazine (25) was placed on material receiving platform (24), just finished product box is placed chamber (26) and empty box and is placed chamber (27) and set up from top to bottom, just still be equipped with straight line slip table (28) that is used for vertical setting on material receiving platform (24), be equipped with on straight line slip table (28) and connect finished product box to place chamber (26) and empty box and place saddle (29) of chamber (27), just be equipped with socket (30) that the side direction that is used for on saddle (29) inserts material receiving magazine (25), just the bottom that empty box placed chamber (27) is equipped with and is equipped with socket (30) that is used for carrying material receiving magazine (29) in material receiving platform (29), and material receiving platform (25) is equipped with the material receiving cylinder (31) and is used for carrying on material receiving cylinder (29), and material receiving cylinder (25) and is equipped with material receiving cylinder (33) and carry out on material receiving platform (25) and carry on material receiving platform (29), the straight line (29).
7. The automatic chip mounting equipment according to claim 6, wherein the material receiving box (25) is provided with positioning slots (34) which are arranged up and down and are used for inserting single PCB material plates.
8. The automatic chip mounting equipment according to claim 1, wherein a patch detection camera (35) for performing patch detection on a pcb flitch after being mounted is further disposed on the rack (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221208473.7U CN217546632U (en) | 2022-05-19 | 2022-05-19 | Chip mounting automation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221208473.7U CN217546632U (en) | 2022-05-19 | 2022-05-19 | Chip mounting automation equipment |
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| Publication Number | Publication Date |
|---|---|
| CN217546632U true CN217546632U (en) | 2022-10-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221208473.7U Active CN217546632U (en) | 2022-05-19 | 2022-05-19 | Chip mounting automation equipment |
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| Country | Link |
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| CN (1) | CN217546632U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114901060A (en) * | 2022-05-19 | 2022-08-12 | 深圳市昌富祥智能科技有限公司 | Chip mounting automation equipment and use method thereof |
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2022
- 2022-05-19 CN CN202221208473.7U patent/CN217546632U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114901060A (en) * | 2022-05-19 | 2022-08-12 | 深圳市昌富祥智能科技有限公司 | Chip mounting automation equipment and use method thereof |
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