CN217406790U - Circuit board with heat dissipation effect - Google Patents
Circuit board with heat dissipation effect Download PDFInfo
- Publication number
- CN217406790U CN217406790U CN202220332251.XU CN202220332251U CN217406790U CN 217406790 U CN217406790 U CN 217406790U CN 202220332251 U CN202220332251 U CN 202220332251U CN 217406790 U CN217406790 U CN 217406790U
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- heat dissipation
- circuit board
- dissipation base
- base
- heat
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Abstract
The utility model provides a circuit board with radiating effect. The circuit board with the heat dissipation effect comprises a circuit board body, a graphene cushion layer and a heat dissipation base, wherein the graphene cushion layer is arranged on the lower surface of the circuit board body, and the heat dissipation base is arranged below the graphene cushion layer. The utility model discloses, through being provided with radiating fin, graphite alkene and heat dissipation base, radiating fin derives the produced heat of circuit board, and the heat dissipation through-hole has accelerateed thermal giving off, the heat conduction that graphite alkene bed course produced when with the circuit board operation to heat dissipation base, the heat dissipation through-hole that the heat dissipation base side surface was seted up and the heat dissipation channel of seting up bottom the heat dissipation base have accelerated thermal discharge, effectual weight and the volume of having reduced, the effectual radiating efficiency that has improved, the effectual possibility of avoiding the high temperature to cause the damage to the circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board with radiating effect.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board makes circuit miniaturation, visualizationly, plays important effect to fixed circuit's batch production and optimal use electrical apparatus overall arrangement, and the most radiating effect of current circuit board is not good, need adopt auxiliary mode heat dissipation such as fan, and this makes the volume and the weight gain of circuit board for the circuit board is too heavy portable not.
Therefore, it is necessary to provide a new circuit board with heat dissipation effect to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a circuit board with radiating effect.
The utility model provides a circuit board with radiating effect includes circuit board body, graphite alkene bed course and heat dissipation base, circuit board body lower surface is provided with graphite alkene bed course, and graphite alkene bed course below is provided with the heat dissipation base, circuit board body upper surface is provided with the fixing base, threaded hole has been seted up to the fixing base upper surface, and the guide slot has been seted up to the fixing base upper surface, and every group guide slot is inside to be provided with a set of radiating fin.
Preferably, the lower surface of the heat dissipation base is provided with a heat conduction channel, and the side surface of the heat dissipation base is provided with a heat dissipation through hole.
Preferably, the side surface of the radiating fin is provided with a radiating through hole.
Compared with the prior art, the utility model provides a circuit board with radiating effect has following beneficial effect:
through being provided with radiating fin, graphite alkene and heat dissipation base, radiating fin exports the produced heat of circuit board, and radiating through hole has accelerateed thermal giving off, the heat conduction that graphite alkene bed course produced when with the circuit board operation to heat dissipation base, radiating through hole that radiating base side surface was seted up and the radiating channel that radiating base bottom was seted up have accelerateed thermal discharge, effectual weight and the volume of having reduced, the effectual radiating efficiency that has improved, the effectual possibility of avoiding high temperature to cause the damage to the circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board with a heat dissipation effect according to a preferred embodiment of the present invention;
fig. 2 is a schematic structural view of the heat dissipation base of the present invention;
fig. 3 is a schematic structural view of the fixing base and the heat dissipating fins of the present invention.
Reference numbers in the figures: 1. a circuit board body; 2. a graphene pad layer; 3. a heat dissipation base; 4. a fixed seat; 5. A heat conducting channel; 6. a heat dissipating through hole; 7. a heat dissipating fin; 8. a threaded bore.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
Please refer to fig. 1, fig. 2 and fig. 3, wherein fig. 1 is a schematic structural diagram of a circuit board with heat dissipation effect according to a preferred embodiment of the present invention; fig. 2 is a schematic structural view of the heat dissipation base of the present invention; fig. 3 is a schematic structural view of the fixing base and the heat dissipating fins of the present invention. Including circuit board body 1, graphite alkene bed course 2 and heat dissipation base 3, 1 lower surfaces of circuit board body are provided with graphite alkene bed course 2, and graphite alkene bed course 2 below is provided with heat dissipation base 3.
In the specific implementation process, as shown in fig. 1, fig. 2 and fig. 3, wherein the fixing seat 4 is arranged on the upper surface of the circuit board body 1, the threaded hole 8 is formed in the upper surface of the fixing seat 4, the threaded hole 8 formed in the upper surface of the fixing seat 4 facilitates the fixing of the fixing seat 4 on the upper surface of the circuit board body by a screw, the guide groove is formed in the upper surface of the fixing seat, a group of heat dissipation fins 7 are arranged in each group of guide grooves, the heat generated by the circuit board is led out by the heat dissipation fins 7, the side surfaces of the heat dissipation fins 7 are provided with heat dissipation through holes 6, and the heat dissipation through holes 6 accelerate the dissipation of the heat.
Wherein, the lower surface of the heat dissipation base 3 is provided with a heat conduction channel 5, and the side surface of the heat dissipation base 3 is provided with a heat dissipation through hole 6, so that a heat dissipation channel is formed with the mounting platform, and the heat emission is accelerated.
The utility model provides a theory of operation as follows: the heat generated on the upper surface of the circuit board is absorbed by the heat dissipation fins 7, the graphene cushion layer 2 conducts the heat generated during the operation of the circuit board to the heat dissipation base 3, and the heat dissipation through holes 6 formed in the side surface of the heat dissipation base 3 and the heat dissipation channel formed in the bottom of the heat dissipation base 3 accelerate the heat dissipation.
The utility model discloses circuit and control that relate to are prior art, do not carry out too much repetition here.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (3)
1. The utility model provides a circuit board with radiating effect, its characterized in that, includes circuit board body (1), graphite alkene bed course (2) and heat dissipation base (3), circuit board body (1) lower surface is provided with graphite alkene bed course (2), and graphite alkene bed course (2) below is provided with heat dissipation base (3), and circuit board body (1) upper surface is provided with fixing base (4), threaded hole (8) have been seted up to fixing base (4) upper surface, and the guide slot has been seted up to the fixing base upper surface, and every inside a set of radiating fin (7) that is provided with of group guide slot.
2. The circuit board with heat dissipation effect according to claim 1, wherein the heat conduction channel (5) is formed on the lower surface of the heat dissipation base (3), and the heat dissipation through hole (6) is formed on the side surface of the heat dissipation base (3).
3. The circuit board with heat dissipation effect according to claim 1, wherein the side surface of the heat dissipation fin (7) is provided with a heat dissipation through hole (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220332251.XU CN217406790U (en) | 2022-02-14 | 2022-02-14 | Circuit board with heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220332251.XU CN217406790U (en) | 2022-02-14 | 2022-02-14 | Circuit board with heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217406790U true CN217406790U (en) | 2022-09-09 |
Family
ID=83135999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220332251.XU Active CN217406790U (en) | 2022-02-14 | 2022-02-14 | Circuit board with heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217406790U (en) |
-
2022
- 2022-02-14 CN CN202220332251.XU patent/CN217406790U/en active Active
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