CN220326092U - Hardware heat radiation structure - Google Patents
Hardware heat radiation structure Download PDFInfo
- Publication number
- CN220326092U CN220326092U CN202321409784.4U CN202321409784U CN220326092U CN 220326092 U CN220326092 U CN 220326092U CN 202321409784 U CN202321409784 U CN 202321409784U CN 220326092 U CN220326092 U CN 220326092U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- power device
- heat dissipation
- radiator
- patch power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000005855 radiation Effects 0.000 title claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model aims to provide a hardware heat radiation structure which is simple to assemble, low in heat radiation cost, free from additional fans and capable of realizing high-efficiency heat radiation under the condition of not increasing the area of the existing circuit board. The utility model comprises a radiating copper sheet, a circuit board, a patch power device and a radiator, wherein the patch power device is welded on the upper surface of the circuit board, the radiator is arranged on the upper surface of the circuit board and covers the patch power device, one end of the radiating copper sheet is arranged at the bottom of the patch power device, and the other end of the radiating copper sheet is in contact fit with the radiator. The utility model is applied to the technical field of PCB heat dissipation.
Description
Technical Field
The utility model is applied to the technical field of PCB heat dissipation, and particularly relates to a hardware heat dissipation structure.
Background
Along with the technological change, electronic products such as smart phones, bluetooth headsets, smart watches and the like are continuously developed in the direction of miniaturization and portability. The size of the power device is continuously reduced, and the power density is increased. Therefore, the temperature becomes an important factor influencing the performance of the power device, and the power device can work in a stable state by the good heat dissipation design, so that the whole product achieves the target performance of the expected design; however, in products with poor heat dissipation performance, the accuracy and stability of the whole circuit can be affected by the overhigh temperature of the power device, and even the use experience of the products is seriously affected.
The existing heat dissipation means generally increases the contact area between the circuit board and the external environment, such as adding a heat dissipation fin, but is limited by the main flow chip structure, and in some cases, the efficiency of heat generated by the chip is very low because the heat generated by the chip is conducted to the heat dissipation fin after being packaged by the plastic on the top layer, so that the heat generated by components on the board, especially the power components, during working cannot be timely conducted out, heat aggregation is caused, and the temperature of the chip is increased, thereby generating a series of adverse effects. As disclosed in chinese patent CN211267551U, a heat dissipation device for a PCB board and a power electronic device is disclosed, which can conduct heat of the power electronic device to a heat dissipation fin through the design of heat conducting silica gel and heat dissipation fins, thereby avoiding overheat of the power electronic device, and accelerating heat dissipation of the heat dissipation fins through a fan, so as to improve heat dissipation efficiency.
Disclosure of Invention
The utility model aims to solve the technical problems of overcoming the defects of the prior art and providing the hardware radiating structure which is simple to assemble, low in radiating cost and capable of realizing high-efficiency radiating under the condition of not increasing the area of the existing circuit board without adding a fan.
The technical scheme adopted by the utility model is as follows: the utility model comprises a radiating copper sheet, a circuit board, a patch power device and a radiator, wherein the patch power device is welded on the upper surface of the circuit board, the radiator is arranged on the upper surface of the circuit board and covers the patch power device, one end of the radiating copper sheet is arranged at the bottom of the patch power device, and the other end of the radiating copper sheet is in contact fit with the radiator.
According to the scheme, the heat of the patch power device is directly conducted from the circuit board to the radiator by the aid of the radiating copper sheet under the condition that the area of the whole circuit board is not increased, so that the heat generated by the operation of the patch power device is more quickly and efficiently conducted to the external environment, the heat radiating area of the whole circuit board is indirectly increased, the temperature of the patch power device during operation is reduced on the whole, the stability of a circuit is improved, the output drift of the chip due to the temperature is improved, the working accuracy of the circuit is improved, and the working state of a product is more stable, safe and efficient.
The heat dissipation copper sheet comprises a contact end, a bending end and a heat dissipation end which are sequentially connected, wherein the contact end is arranged between the patch power device and the circuit board, the bending end and the heat dissipation end are both positioned on one side of the patch power device, and the bending end is of an arc-shaped structure.
In a preferred embodiment, the surface of the contact end is coated with a thermally conductive silicone.
The hardware heat dissipation structure comprises an adapter plate with a U-shaped structure, wherein the adapter plate is arranged on the upper surface of the circuit board, through hole bonding pads are arranged on two sides of the adapter plate, the bottom of the patch power device is embedded in a groove of the adapter plate, pins on two sides of the patch power device are welded on the through hole bonding pads, and the contact end is arranged in the groove of the adapter plate.
In one preferred embodiment, a surface of the heat sink contacting the circuit board is a flush end, and a surface of the heat sink far from the circuit board is a heat dissipation fin structure arranged in an aligned manner.
One preferable scheme is, the circuit board includes the conducting layer that a plurality of layers are piled up, the circuit board has seted up a plurality of through-holes along vertical decurrent, the through-hole includes grommet and pore wall, the top layer of grommet with the top layer of pore wall all pastes and is equipped with copper metal structure, a plurality of groups the through-hole all communicates in a plurality of layers the conducting layer.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is an exploded perspective view of the present utility model;
FIG. 3 is a schematic perspective view of the radiator;
FIG. 4 is a schematic perspective view of the heat dissipating copper sheet;
fig. 5 is a schematic perspective view of the adapter plate;
fig. 6 is a schematic diagram of a laminated structure of the circuit board.
Detailed Description
As shown in fig. 1 to 4, in this embodiment, the present utility model includes a heat dissipation copper sheet 1, a circuit board 2, a patch power device 3, and a radiator 4, where the patch power device 3 is welded on the upper surface of the circuit board 2, the radiator 4 is disposed on the upper surface of the circuit board 2, the radiator 4 covers the patch power device 3, one end of the heat dissipation copper sheet 1 is disposed at the bottom of the patch power device 3, and the other end of the heat dissipation copper sheet 1 is in contact fit with the radiator 4. The heat radiating copper sheet 1 can conduct the heat emitted by the patch power device 3 to the top of the patch power device 3 through the bottom bonding pad of the patch package, and is directly contacted with the radiator 4, so that the thermal resistance on the heat conduction path can be reduced, the heat radiating efficiency is improved, the high-efficiency heat radiation is realized, the working temperature of the patch power device 3 is reduced under the condition that the whole area of a circuit board is not increased, and the problem that the performance is influenced due to temperature drift caused by the heating of the patch power device 3 is solved.
As shown in fig. 4, in this embodiment, the heat dissipation copper sheet 1 includes a contact end 5, a bending end 6 and a heat dissipation end 7 that are sequentially connected, the contact end 5 is disposed between the chip power device 3 and the circuit board 2, the bending end 6 and the heat dissipation end 7 are both located at one side of the chip power device 3, and the bending end 6 is in an arc structure. The contact terminal 5 is used as a contact part between the heat dissipation copper sheet 1 and the bottom of the chip power device 3, the contact terminal 5 is installed between the chip power device 3 and the circuit board 2, and functions of electrical property connection and heat absorption of the chip power device 3 and the circuit board 2, and the thickness of the contact terminal 5 is usually designed to be very thin, in this embodiment, 0.5 mm. The bending end 6 plays a role in conducting heat of the patch power device 3 from the contact end 5 to the heat dissipation end 7, and meanwhile interference with other components of the circuit board 2 is avoided. The heat dissipation tip 7 functions to conduct heat absorbed by the contact tip 5 to the surface of the heat dissipation tip 7.
In this embodiment, the surface of the contact end 5 is coated with a thermally conductive silicone. The heat-conducting silica gel is used for filling gaps between contact surfaces, so that the heat resistance of the contact surfaces is reduced, and the heat conduction efficiency is improved.
As shown in fig. 1, 2 and 5, in this embodiment, the hardware heat dissipation structure includes an adapter plate 8 with a U-shaped structure, the adapter plate 8 is disposed on the upper surface of the circuit board 2, through hole pads 9 are disposed on two sides of the adapter plate 8, the bottom of the patch power device 3 is embedded in a groove of the adapter plate 8, pins on two sides of the patch power device 3 are welded on the through hole pads 9, and the contact end 5 is disposed in the groove of the adapter plate 8.
As shown in fig. 1 and 3, in this embodiment, a surface of the heat sink 4 contacting the circuit board 2 is a flush end 10, and a surface of the heat sink 4 away from the circuit board 2 is a heat dissipation fin structure 11 arranged in an aligned manner. The circuit function is to realize the high-precision output of power supply voltage and current, and because the energy conversion efficiency is not 100%, energy loss can be generated, and part of electric energy is converted into useless heat energy to be timely dispersed, so that the radiator 4 is required to be additionally arranged on the circuit board to increase the contact area with air, and the heat dissipation efficiency is improved. The bottom surface of the heat sink 4 is flat, and is used for contacting with the top surface of the patch power device 3 and the heat dissipation copper sheet 1, and absorbing heat of the heat dissipation copper sheet into the heat sink 4. The top surface of the radiator 4 is provided with a radiating fin structure 11, which is used for increasing the contact area with air, transferring the heat absorbed by the bottom surface of the radiator 4 to the air more quickly, improving the radiating efficiency, reducing the working temperature of the patch power device 3 and enabling the circuit board 2 to work in a stable state.
As shown in fig. 6, in this embodiment, the circuit board 2 includes a plurality of stacked conductive layers 12, the circuit board 2 is provided with a plurality of vertically downward through holes, the through holes include an annular ring 14 and a hole wall 15, the surface layer of the annular ring 14 and the surface layer of the hole wall 15 are respectively attached with a copper metal structure, and a plurality of groups of through holes are respectively connected with a plurality of conductive layers 12.
The top pad of the circuit board 2 is designed into a windowing structure, and is treated by adopting a gold plating process, so that the weldability of the circuit board can be effectively enhanced, good connection between the bottom heat dissipation pad of the patch power device 3 and the top copper sheet is facilitated, and heat generated in the operation of the patch power device 3 is more quickly conducted onto the circuit board 2. The through hole array is that a plurality of rows of through holes are uniformly drilled on the heat dissipation bonding pad of the circuit board 2, each through hole is composed of the hole ring 14 and the hole wall 15, and the hole ring 14 and the hole wall 15 are made of copper metal. The through holes can be communicated with the conductive layers 12 on the circuit board, so that the thermal resistance between different conductive layers of the circuit board 2 is reduced, heat generated by the patch power device 3 on the surface of the circuit board 2 is conducted to the conductive layers 12 inside, and the heat dissipation area is increased, therefore, the heat generated by the patch power device 3 can be dispersed to the whole circuit board 2 more quickly and uniformly, the contact area with air is increased, and the heat of the circuit board 2 is dispersed to the air. The situation that the power device is damaged or the device is unstable due to the fact that the local temperature is too high because of the local accumulation of heat is avoided.
Claims (6)
1. A hardware heat radiation structure is characterized in that: the novel heat dissipation device comprises a heat dissipation copper sheet (1), a circuit board (2), a patch power device (3) and a radiator (4), wherein the patch power device (3) is welded on the upper surface of the circuit board (2), the radiator (4) is arranged on the upper surface of the circuit board (2), the radiator (4) covers the patch power device (3), one end of the heat dissipation copper sheet (1) is arranged at the bottom of the patch power device (3), and the other end of the heat dissipation copper sheet (1) is in contact fit with the radiator (4).
2. A hardware heat dissipation structure as defined in claim 1, wherein: the radiating copper sheet (1) comprises a contact end (5), a bending end (6) and a radiating end (7) which are sequentially connected, wherein the contact end (5) is arranged between the patch power device (3) and the circuit board (2), the bending end (6) and the radiating end (7) are both positioned on one side of the patch power device (3), and the bending end (6) is of an arc-shaped structure.
3. A hardware heat dissipation structure as defined in claim 2, wherein: the surface of the contact end (5) is coated with heat conducting silica gel.
4. A hardware heat dissipation structure as defined in claim 2, wherein: the hardware heat radiation structure comprises an adapter plate (8) with a U-shaped structure, the adapter plate (8) is arranged on the upper surface of the circuit board (2), through hole bonding pads (9) are arranged on two sides of the adapter plate (8), the bottom of the patch power device (3) is embedded in a groove of the adapter plate (8), pins on two sides of the patch power device (3) are welded on the through hole bonding pads (9), and the contact end (5) is arranged in the groove of the adapter plate (8).
5. A hardware heat dissipation structure as defined in claim 2, wherein: one surface of the radiator (4) contacting the circuit board (2) is a flat end (10), and one surface of the radiator (4) far away from the circuit board (2) is a radiating fin structure (11) which is arranged in an arrayed manner.
6. A hardware heat dissipation structure as defined in claim 1, wherein: the circuit board (2) comprises a plurality of stacked conductive layers (12), the circuit board (2) is provided with a plurality of through holes vertically downwards, each through hole comprises an annular hole (14) and a hole wall (15), the surface layer of the annular hole (14) and the surface layer of the hole wall (15) are respectively stuck with a copper metal structure, and a plurality of groups of through holes are respectively communicated with a plurality of layers of the conductive layers (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321409784.4U CN220326092U (en) | 2023-06-05 | 2023-06-05 | Hardware heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321409784.4U CN220326092U (en) | 2023-06-05 | 2023-06-05 | Hardware heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220326092U true CN220326092U (en) | 2024-01-09 |
Family
ID=89411120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321409784.4U Active CN220326092U (en) | 2023-06-05 | 2023-06-05 | Hardware heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220326092U (en) |
-
2023
- 2023-06-05 CN CN202321409784.4U patent/CN220326092U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |