CN217398806U - High-heat-conductivity, insulating and tough double-sided adhesive tape - Google Patents
High-heat-conductivity, insulating and tough double-sided adhesive tape Download PDFInfo
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- CN217398806U CN217398806U CN202220396507.3U CN202220396507U CN217398806U CN 217398806 U CN217398806 U CN 217398806U CN 202220396507 U CN202220396507 U CN 202220396507U CN 217398806 U CN217398806 U CN 217398806U
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- sensitive adhesive
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables
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Abstract
The utility model discloses a high heat conduction insulating toughness double-sided tape, including glass fiber cloth, locate the high heat conduction pressure-sensitive adhesive layer of glass fiber cloth both sides, locate a plurality of silica gel insulated wires of arranging along glass fiber cloth length direction interval on each high heat conduction pressure-sensitive adhesive layer, locate on each high heat conduction pressure-sensitive adhesive layer and the mica paper layer of hot pressing silica gel insulated wire, the release layer of adhesion on each mica paper layer. The utility model discloses an improve heat conductivility, insulating properties and the protection toughness of glass fiber sticky tape.
Description
Technical Field
The utility model belongs to the technical field of the sticky tape, especially, relate to a high heat conduction insulating toughness double-sided tape.
Background
The glass fiber cloth heat-conducting double-sided adhesive is prepared by coating high-heat-conducting ceramic particles filled with high-viscosity high-performance oily acrylate pressure-sensitive adhesive on two sides of glass fiber cloth or without a base material. The glass fiber cloth heat-conducting double-sided adhesive tape provides an efficient heat-conducting channel between an electronic device and a radiating fin, has good viscosity, and can fix a heating body and a radiating body together, so that the electronic device and the radiating body are not required to be mechanically fixed and liquid adhesive is not required to be solidified and fixed. The glass fiber cloth heat-conducting double-sided adhesive tape can work for 5 years at the lowest temperature of 80-120 ℃ and has a heat-conducting coefficient of 0.8W/mk.
The existing patent No. CN201611264823.0 is a water-based acrylic acid heat-conducting double-sided tape, which comprises a glass fiber fabric layer, wherein both sides of the glass fiber fabric layer are respectively coated with a pressure-sensitive adhesive layer and a lower pressure-sensitive adhesive layer, the upper and lower pressure-sensitive adhesive layers are water-based acrylic acid heat-conducting pressure-sensitive adhesive layers, and the water-based acrylic acid heat-conducting pressure-sensitive adhesive layers further comprise the following components: a mixture of sodium bicarbonate particles and carbon powder. The glass fiber cloth heat-conducting double faced adhesive tape on the market is used for electronic equipment such as computers, LED backlight sources TV, LED high-power lighting lamps and the like, has limited heat-conducting performance and poor insulativity, and is easy to fracture and damage due to insufficient toughness when used as an adhesive tape for replacing a connecting piece.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the technical problem and providing high heat conduction insulating toughness double-sided tape to realize improving heat conductivility, insulating properties and the protection toughness of glass fiber adhesive tape. In order to achieve the above purpose, the utility model discloses technical scheme as follows:
the high-heat-conductivity, insulating and tough double-sided tape comprises glass fiber cloth, high-viscosity heat-conductivity and pressure-sensitive adhesive layers arranged on two sides of the glass fiber cloth, a plurality of silica gel insulating wires arranged at intervals along the length direction of the glass fiber cloth on each high-viscosity heat-conductivity and pressure-sensitive adhesive layer, mica paper layers arranged on each high-viscosity heat-conductivity and pressure-sensitive adhesive layer and thermally pressed with the silica gel insulating wires, and release layers adhered to the mica paper layers.
Specifically, the mica paper layer is connected with the release layer through an adhesive layer.
Specifically, heat conducting particles are mixed in the silica gel insulating wire and the high-viscosity heat-conducting pressing adhesive layer.
Specifically, the heat conducting particles are one of silicon carbide, aluminum oxide and aluminum nitride.
Specifically, the glass fiber cloth, the high-viscosity heat-conduction pressure-sensitive adhesive layer, the mica paper layer and the adhesive layer are all internally provided with a plurality of air holes.
Specifically, the thickness of the glass fiber cloth is 25-30 μm.
Specifically, the thickness of the high-viscosity heat-conducting pressure-sensitive adhesive layer is 60-65 μm.
Specifically, the thickness of the release layer is 115-120 μm.
Compared with the prior art, the utility model discloses high heat conduction insulating toughness double-sided tape's beneficial effect mainly embodies:
the high-viscosity heat-conducting pressure-sensitive adhesive layers are arranged on the two sides of the glass fiber cloth and mixed with heat-conducting particles, so that the heat conducting performance of the adhesive tape is improved; the silica gel insulated wire is arranged on the high-viscosity heat-conducting pressure-sensitive adhesive layer, so that the heat conducting property of the adhesive tape is improved, and the toughness of the adhesive tape is improved, so that the adhesive tape has good connecting strength and is not easy to break; the mica paper layer is arranged on the high-viscosity heat-conducting pressure-sensitive adhesive layer, so that the overall insulating property of the adhesive tape is improved; the release layer on each mica paper layer plays a role in protecting the double-sided adhesive tape; the glass fiber cloth, the high-viscosity heat-conducting pressure-sensitive adhesive layer, the mica paper layer and the adhesive layer are all internally provided with a large number of air holes, so that the air permeability of the adhesive tape is improved, and the heat dissipation performance is further improved.
Drawings
Fig. 1 is a schematic sectional structure diagram of an embodiment of the present invention;
FIG. 2 is a schematic top view of the high-viscosity thermal-conductive pressure-sensitive adhesive layer of the present embodiment;
the figures in the drawings represent:
1 glass fiber cloth, 11 air holes, 2 high-viscosity heat-conduction pressure-sensitive adhesive layers, 3 silica gel insulating wires, 4 mica paper layers, 41 adhesive layers and 5 release layers.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments.
Example (b):
referring to fig. 1-2, the present embodiment is a high thermal conductivity, insulation and toughness double-sided tape, which includes a glass fiber cloth 1, high thermal conductivity and pressure sensitive adhesive layers 2 disposed on two sides of the glass fiber cloth 1, a plurality of silica gel insulation wires 3 disposed on each high thermal conductivity and pressure sensitive adhesive layer 2 and arranged at intervals along the length direction of the glass fiber cloth 1, mica paper layers 4 disposed on each high thermal conductivity and pressure sensitive adhesive layer 2 and thermally bonded to the silica gel insulation wires 3, and release layers 5 adhered to the mica paper layers 4.
The mica paper layer 4 is connected with the release layer 5 through an adhesive layer 41, and the adhesive layer 41 is made of polyurethane or acrylic ester.
The silica gel insulated wire 3 and the high-viscosity heat-conducting pressure-sensitive adhesive layer 2 are mixed with heat-conducting particles, and the heat-conducting particles are uniformly stirred and defoamed with the silica gel insulated wire 3 or the high-viscosity heat-conducting pressure-sensitive adhesive layer 2 respectively. The heat conducting particles are one of silicon carbide, aluminum oxide and aluminum nitride. The heat conducting particles can improve the heat conducting performance of the silica gel insulating wire 3 and the high-viscosity heat conducting pressure-sensitive adhesive layer 2. The silica gel insulated wires 3 are arranged at intervals along the length direction of the glass fiber cloth 1, so that the toughness of the glass fiber cloth 1 is improved, and the fracture risk is reduced.
The glass fiber cloth 1, the high-viscosity heat-conduction pressure-sensitive adhesive layer 2, the mica paper layer 4 and the adhesive layer 41 are all internally provided with a plurality of air holes 11. The whole ventilation and heat dissipation performance of the adhesive tape is improved.
The thickness of the glass fiber cloth 1 is 25-30 μm. The thickness of the high-viscosity heat-conducting pressure-sensitive adhesive layer 2 is 60-65 mu m. The thickness of the release layer 5 is 115-120 μm.
When the embodiment is applied, the high-heat-conductivity, insulating and tough double-sided adhesive tape is applied to bonding of a chip, a flexible circuit board, a high-power transistor and a radiating fin or other cooling devices, including bonding of a high-power LED lighting aluminum substrate and a radiator, and mounting of a CPU radiator; the heater is suitable for heating bodies such as hard disks, memory chips, south bridges or video memory chips, MOS tubes and the like; the temperature display film is suitable for an LED backlight source module TV and is provided with the temperature display film; the method is suitable for installing the thermoelectric cooling die and comprises the steps of bonding a radiator and a microprocessor and bonding a flexible circuit and the radiator; the adhesive is suitable for bonding the power transistor and the printed circuit board.
The preparation method of the high-thermal-conductivity, insulating and tough double-sided adhesive tape comprises the following steps: mixing the heat-conducting particles with the silica gel insulating material and the high-viscosity heat-conducting pressure-sensitive adhesive material respectively, and mechanically stirring the mixture uniformly for separate use; coating high-viscosity heat-conducting pressure-sensitive adhesive materials with heat-conducting particles on two sides of the glass fiber cloth 1 to form a high-viscosity heat-conducting pressure-sensitive adhesive layer 2; extruding silica gel insulating materials along the length direction of the glass fiber cloth 1 on the high-viscosity heat-conduction pressure-sensitive adhesive layer 2 to form silica gel insulating wires 3 which are arranged at intervals; placing the glass fiber cloth 1 in an oven for standby; the mica paper layer 4 is hot-pressed on the high-viscosity heat-conduction pressure-sensitive adhesive layer 2 and covered with the silica gel insulating wire 3; the release layer 5 is connected with the adhesive layer 41 and transferred onto the mica paper layer 4, and the mica paper layer is subjected to hot pressing by a multi-section temperature-adjusting high-temperature oven to form the double-sided tape.
In the embodiment, the high-viscosity heat-conducting pressure-sensitive adhesive layers 2 are arranged on the two sides of the glass fiber cloth 1, and the high-viscosity heat-conducting pressure-sensitive adhesive layers 2 are mixed with heat-conducting particles, so that the heat conducting performance of the adhesive tape is improved; the silica gel insulating wires 3 are arranged on the high-viscosity heat-conducting pressure-sensitive adhesive layer 2, so that the heat conducting property of the adhesive tape is improved, and the toughness of the adhesive tape is improved, so that the adhesive tape has good connecting strength and is not easy to break; the mica paper layer 4 is arranged on the high-viscosity heat-conducting pressure-sensitive adhesive layer 2, so that the overall insulation performance of the adhesive tape is improved; the release layer 5 on each mica paper layer 4 plays a role in protection; the glass fiber cloth 1, the high-viscosity heat-conduction pressure-sensitive adhesive layer 2, the mica paper layer 4 and the adhesive layer 41 are all internally provided with a plurality of air holes 11, so that the air permeability of the adhesive tape is improved, and the heat dissipation performance is further improved.
What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.
Claims (6)
1. High heat conduction insulating toughness double-sided tape, its characterized in that: the mica paper comprises glass fiber cloth, high-viscosity heat-conduction pressure-sensitive adhesive layers arranged on two sides of the glass fiber cloth, a plurality of silica gel insulating wires arranged at intervals along the length direction of the glass fiber cloth and arranged on each high-viscosity heat-conduction pressure-sensitive adhesive layer, mica paper layers arranged on each high-viscosity heat-conduction pressure-sensitive adhesive layer and thermally pressed with the silica gel insulating wires, and release layers adhered to the mica paper layers.
2. The double-sided adhesive tape with high thermal conductivity, electric insulation and toughness as claimed in claim 1, wherein: the mica paper layer is connected with the release layer through an adhesive layer.
3. The double-sided adhesive tape with high thermal conductivity, electric insulation and toughness as claimed in claim 1, wherein: the glass fiber cloth, the high-viscosity heat-conducting pressure-sensitive adhesive layer, the mica paper layer and the adhesive layer are all internally provided with a large number of air holes.
4. The double-sided adhesive tape with high thermal conductivity, electric insulation and toughness as claimed in claim 1, wherein: the thickness of the glass fiber cloth is 25-30 μm.
5. The double-sided adhesive tape with high thermal conductivity, electric insulation and toughness as claimed in claim 1, wherein: the thickness of the high-viscosity heat-conducting pressure-sensitive adhesive layer is 60-65 mu m.
6. The double-sided adhesive tape with high thermal conductivity, electric insulation and toughness as claimed in claim 1, wherein: the thickness of the release layer is 115-120 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220396507.3U CN217398806U (en) | 2022-02-25 | 2022-02-25 | High-heat-conductivity, insulating and tough double-sided adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220396507.3U CN217398806U (en) | 2022-02-25 | 2022-02-25 | High-heat-conductivity, insulating and tough double-sided adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217398806U true CN217398806U (en) | 2022-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220396507.3U Active CN217398806U (en) | 2022-02-25 | 2022-02-25 | High-heat-conductivity, insulating and tough double-sided adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217398806U (en) |
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2022
- 2022-02-25 CN CN202220396507.3U patent/CN217398806U/en active Active
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