CN113594109B - Hot-press formed heat conducting film - Google Patents
Hot-press formed heat conducting film Download PDFInfo
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- CN113594109B CN113594109B CN202110804828.2A CN202110804828A CN113594109B CN 113594109 B CN113594109 B CN 113594109B CN 202110804828 A CN202110804828 A CN 202110804828A CN 113594109 B CN113594109 B CN 113594109B
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- 239000010410 layer Substances 0.000 claims abstract description 153
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 58
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000000741 silica gel Substances 0.000 claims abstract description 48
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 48
- 238000007731 hot pressing Methods 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims description 36
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 30
- 239000000919 ceramic Substances 0.000 claims description 29
- 230000017525 heat dissipation Effects 0.000 claims description 22
- 229920002379 silicone rubber Polymers 0.000 claims description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 15
- BKGYVGAGCKBQTL-UHFFFAOYSA-N phenoxybenzene;silicon Chemical compound [Si].C=1C=CC=CC=1OC1=CC=CC=C1 BKGYVGAGCKBQTL-UHFFFAOYSA-N 0.000 claims description 13
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 12
- 235000011187 glycerol Nutrition 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- -1 graphite alkene Chemical class 0.000 claims description 7
- 239000012528 membrane Substances 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 6
- 229920002472 Starch Polymers 0.000 claims description 6
- 239000002390 adhesive tape Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000000395 magnesium oxide Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000004005 microsphere Substances 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 235000019698 starch Nutrition 0.000 claims description 6
- 239000008107 starch Substances 0.000 claims description 6
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 3
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000001027 hydrothermal synthesis Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 11
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a heat conducting film formed by hot pressing, which relates to the field of heat conducting films, and comprises a release film, wherein an adhesive layer is arranged at the top of the release film, an insulating heat conducting layer is arranged at the top of the adhesive layer, heat conducting silica gel is arranged at the top of the insulating heat conducting layer, a graphene layer is arranged at the top of the heat conducting silica gel, and a miniature copper pipe is arranged in the graphene layer.
Description
Technical Field
The invention relates to the field of heat conducting films, in particular to a heat conducting film formed by hot pressing.
Background
With the rapid development of modern technology, electronic devices are miniaturized, the main frequency of chips is continuously increased, functions are increasingly enhanced, and the power consumption of a single chip is gradually increased, which leads to the rapid increase of the heat flux density. Studies have shown that over 55% of the failure modes of electronic devices are caused by excessive temperatures, and therefore the heat dissipation problem of electronic devices plays a significant role in the development of electronic devices.
The traditional graphite heat conducting film has a single structure, is used for high-density, high-power and light-thin electronic equipment, has low strength, meets the requirements of heat conductivity, has poor practicality, and has low service life, and if vibration or collision occurs, the heat conducting film is damaged.
Disclosure of Invention
Based on the above, the invention aims to provide a heat conducting film formed by hot pressing, so as to solve the technical problems of poor heat conducting effect and low service life.
In order to achieve the above purpose, the present invention provides the following technical solutions: the heat conducting film formed by hot pressing comprises the following components in parts by weight: 30-40 parts of graphene, 10-15 parts of alumina powder, 10-12 parts of silicon dioxide, 8-10 parts of magnesia powder, 10-15 parts of heat conduction silica gel, 8-9 parts of anhydrous glycerol, 5-7 parts of ethylene glycol and 20-26 parts of ceramic powder; 1 part of heat conduction double faced adhesive tape, 80-130 parts of miniature copper pipe, 1 part of phenyl ether silicon rubber, 5-8 parts of adhesive, 12-15 parts of starch, 1 part of PP insulating sheet, 1 part of PET film, 1 part of PTFE film, 60-70 parts of flaky hexagonal boron nitride, 65-70 parts of dimethyl silicon rubber and 16-20 parts of nano boron nitride powder.
The utility model provides a hot briquetting's heat conduction membrane, includes from the type membrane, the top from the type membrane is provided with the bond line, the top of bond line is provided with insulating heat conduction layer, the top of insulating heat conduction layer is provided with heat conduction silica gel, the top of heat conduction silica gel is provided with the graphite alkene layer, the inside of graphite alkene layer is provided with miniature copper pipe, the top of graphite alkene layer is provided with the ceramic layer, the inside of ceramic layer is provided with phenyl ether and props the silastic-layer, the top of ceramic layer is provided with the heat conduction layer, the top of heat conduction layer is provided with the heat dissipation layer, the top of heat dissipation layer is provided with recess and silica gel buffer block respectively, heat dissipation fin has been run through to the inside below of recess, the top of recess is provided with waterproof ventilative layer.
Further, a plurality of groups of radiating fins are arranged, the bottoms of the plurality of groups of radiating fins are in contact with the heat conducting layer, and the plurality of groups of radiating fins are in a zigzag shape.
By adopting the technical scheme, the zigzag radiating fins enlarge the contact area of air and improve the radiating effect.
Further, the thickness of the graphene layer is 50-80 μm, and the top and the bottom of the graphene layer are wavy.
Through adopting above-mentioned technical scheme, wavy graphene layer has increased area of contact, makes heat can transfer fast.
Further, the silica gel buffer blocks are provided with a plurality of groups, and the silica gel buffer blocks are arranged in an equidistant manner.
Through adopting above-mentioned technical scheme, the silica gel buffer block plays anti vibration and cushioning's effect, avoids the heat conduction membrane to damage when vibration and striking.
Further, the grooves are arranged in a plurality, and the sectional views of the grooves are arc-shaped.
By adopting the technical scheme, the contact area between the heat dissipation layer and the air is increased, and the heat dissipation effect is improved.
Further, the thickness of the adhesive layer is 10-20 μm.
By adopting the technical scheme, the heat conduction is good, and the buffer and shock absorption functions are excellent.
Further, the miniature copper pipe is provided with the multiunit, and multiunit miniature copper pipe equidistance inlays in the inside of graphite alkene layer.
Through adopting above-mentioned technical scheme, accelerated unnecessary heat and given off, be favorable to heat conduction silica gel heat absorption vaporization, realize quick heat conduction, effect duration is long, effectual.
The heat conducting film formed by hot pressing has the following production steps:
step 1: stirring and dissolving starch and water, adding graphene, performing ultrasonic dispersion uniformly, performing hydrothermal reaction at 180-200 ℃, discharging, washing, drying to obtain starch-graphene microspheres, and stirring and mixing the starch-graphene microspheres with ethylene glycol and 2 parts of glycerol to obtain graphene membrane liquid;
step 2: casting the graphene film, putting the graphene film into a die, hot-pressing the graphene film into a wave shape to obtain a graphene layer, embedding a miniature copper pipe, and drying;
Step 3: bonding the heat-conducting silica gel with the graphene layer in the step 2, setting the hot-pressing temperature to be 150-250 ℃ and the hot-pressing pressure to be more than 20MPa to obtain a heat-conducting silica gel layer;
step 4: coating the top of the miniature copper tube in the step 2 with residual anhydrous glycerin so that the anhydrous glycerin is poured into the miniature copper tube;
Step 5: mixing ceramic powder with nano boron nitride powder, and adding one third of binder for stirring to obtain a mixture of the ceramic powder and the nano boron nitride powder;
Step 6: coating one half of the mixture in the step 5 on the graphene layer, paving a layer of phenyl ether silicon rubber, and coating the rest of the two halves of the mixture on the phenyl ether silicon rubber to obtain a ceramic layer and a phenyl ether silicon rubber reinforcing layer;
step 7: mixing alumina powder and magnesia powder, adding one third of adhesive, stirring to obtain a metal powder mixture, and coating the metal powder mixture on a ceramic layer to obtain a heat conducting layer;
step 8: mixing and stirring silicon dioxide and the rest one third of the adhesive, coating the stirred and mixed silicon dioxide on the heat-conducting layer to obtain a heat-radiating layer, and hot-pressing the top of the heat-radiating layer by using a hot press to ensure that the heat-conducting layer is tightly attached to the heat-radiating layer, and forming a groove by hot-pressing;
Step 9: the interior of the groove is spliced with flaky hexagonal boron nitride to obtain radiating fins, and a PTFE film on one side is attached to the top of the groove to obtain a waterproof breathable layer;
Step 10: attaching a PP insulating sheet to the bottom of the heat-conducting silica gel layer to obtain an insulating heat-conducting layer;
Step 11: bonding dimethyl silicon rubber on the top of the heat dissipation layer to obtain a silica gel buffer block, hot-pressing the silica gel buffer block by using a hot press again, and transferring to an oven for further curing after the hot pressing is finished;
Step 12: and (3) attaching the heat-conducting double-sided adhesive tape to the bottom of the insulating heat-conducting layer to obtain an adhesive layer, attaching the PET film to the bottom of the adhesive layer to obtain a release film, and finally preparing the heat-conducting film.
In summary, the invention has the following advantages:
1. The micro copper pipe, the heat conducting silica gel layer, the ceramic layer, the heat radiating layer, the groove and the heat radiating fin are arranged for matching use, the ceramic layer and the graphene layer have the characteristics of light weight, high heat conductivity, adjustable thermal expansion coefficient and the like, the thermal conductive silica gel heat radiating device is stable in physical and chemical properties and good in weather resistance, can meet the heat radiating scheme of a tip electronic product and a high-power semiconductor wafer, the micro copper pipe is arranged in the graphene layer, is favorable for heat absorption and vaporization of heat conducting silica gel, realizes quick heat conduction, is long in action duration, good in effect, safe and convenient, can increase the contact area between the heat radiating layer and air through the arrangement of the groove, further improves the heat radiating effect, and the heat radiating fin can further conduct out the heat of the heat conducting layer, so that the bottom and the top of the graphene layer are wavy, the contact area of the graphene is increased, the heat can be quickly transferred, the most critical heat diffusion effect is achieved on the whole heat conducting film, and the heat conducting efficiency is accelerated;
2. According to the invention, the silica gel buffer block is arranged, and is made of dimethyl silicone rubber, so that the silica gel buffer block has good elasticity and ageing resistance, has excellent electrical insulation performance, dampproof, shockproof, physiological inertia and other characteristics, can buffer when being subjected to vibration or impact, avoids damaging the heat conducting film, improves the protection performance, and can ensure that the ceramic layer has stronger stability, improves the tensile property of the heat conducting film and further prolongs the service life of the heat conducting film.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
fig. 2 is a schematic diagram of a graphene layer structure according to the present invention;
FIG. 3 is a schematic diagram of a heat dissipation layer according to the present invention;
fig. 4 is an enlarged schematic view of the structure of fig. 1a according to the present invention.
In the figure: 1. a release film; 2. an adhesive layer; 3. an insulating heat conducting layer; 4. thermally conductive silica gel; 5. a graphene layer; 6. a miniature copper tube; 7. a ceramic layer; 8. a phenyl ether silicon rubber reinforcing layer; 9. a heat conducting layer; 10. a heat dissipation layer; 11. a silica gel buffer block; 12. a waterproof breathable layer; 13. a groove; 14. and the heat dissipation fins.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Hereinafter, an embodiment of the present invention will be described in accordance with its entire structure.
The heat conducting film formed by hot pressing comprises the following components in parts by weight: 30-40 parts of graphene, 10-15 parts of alumina powder, 10-12 parts of silicon dioxide, 8-10 parts of magnesia powder, 10-15 parts of heat conduction silica gel, 8-9 parts of anhydrous glycerol, 5-7 parts of ethylene glycol and 20-26 parts of ceramic powder; 1 part of heat conduction double faced adhesive tape, 80-130 parts of miniature copper pipe, 1 part of phenyl ether silicon rubber, 5-8 parts of adhesive, 12-15 parts of starch, 1 part of PP insulating sheet, 1 part of PET film, 1 part of PTFE film, 60-70 parts of flaky hexagonal boron nitride, 65-70 parts of dimethyl silicon rubber and 16-20 parts of nano boron nitride powder.
The heat conducting film formed by hot pressing comprises a release film 1, an adhesive layer 2 is arranged at the top of the release film 1, an insulating heat conducting layer 3 is arranged at the top of the adhesive layer 2, a heat conducting silica gel layer 4 is arranged at the top of the insulating heat conducting layer 3, a graphene layer 5 is arranged at the top of the heat conducting silica gel layer 4, a miniature copper pipe 6 is arranged in the graphene layer 5, a ceramic layer 7 is arranged at the top of the graphene layer 5, a phenyl ether supporting silicon rubber reinforcing layer 8 is arranged in the ceramic layer 7, a heat conducting layer 9 is arranged at the top of the ceramic layer 7, a heat radiating layer 10 is arranged at the top of the heat conducting layer 9, grooves 13 and a silica gel buffer block 11 are respectively arranged at the top of the heat radiating layer 10, heat radiating fins 14 penetrate through the inner lower part of the grooves 13, a plurality of grooves 13 are arranged, the sectional views of the plurality of groups of grooves 13 are arc-shaped, the contact area between the heat radiating fins 10 and air is increased, the heat radiating effect is improved, the bottoms of the plurality of groups of fins 14 are contacted with the heat conducting layer 9, the plurality of groups of fins 14 are in contact with the heat conducting layer 9, the sawtooth-shaped heat radiating fins 14 are increased, the heat radiating effect of the sawtooth-shaped heat radiating fins are increased, and the heat radiating fins 12 are contacted with the heat radiating fins are arranged at the top of the heat conducting layer.
Referring to fig. 1 and 3, the thickness of the graphene layer 5 is 50-80 μm, and the top and bottom of the graphene layer 5 are all wavy, the contact area of the wavy graphene layer 5 is enlarged, so that heat can be rapidly transferred, the silica gel buffer blocks 11 are provided with a plurality of groups, the silica gel buffer blocks 11 are equidistantly arranged, the silica gel buffer blocks 11 play a role in vibration resistance and buffering, and the heat conducting film is prevented from being damaged during vibration and impact.
Referring to fig. 1, the adhesive layer 2 has a thickness of 10-20 μm, and has good heat conduction and excellent buffering and damping functions.
Referring to fig. 1-2, the miniature copper tubes 6 are provided with a plurality of groups, and the miniature copper tubes 6 are equidistantly inlaid in the graphene layer 5, so that the dissipation of redundant heat in the interior is quickened, the heat conduction silica gel 4 is facilitated to absorb heat and vaporize, the quick heat conduction is realized, the action duration is long, and the effect is good.
The heat conducting film formed by hot pressing has the following production steps:
step 1: stirring and dissolving starch and water, adding graphene, performing ultrasonic dispersion uniformly, performing hydrothermal reaction at 180-200 ℃, discharging, washing, drying to obtain starch-graphene microspheres, and stirring and mixing the starch-graphene microspheres with ethylene glycol and 2 parts of glycerol to obtain graphene membrane liquid;
Step 2: casting the graphene film, putting the graphene film into a die, hot-pressing the graphene film into a wave shape to obtain a graphene layer 5, embedding a miniature copper pipe 6, and drying;
Step 3: bonding the heat-conducting silica gel with the graphene layer in the step 2, setting the hot-pressing temperature to be 150-250 ℃ and the hot-pressing pressure to be more than 20MPa to obtain a heat-conducting silica gel layer 4;
Step 4: coating the top of the miniature copper tube 6 in the step 2 with residual anhydrous glycerin so that the anhydrous glycerin is poured into the miniature copper tube 6;
Step 5: mixing ceramic powder with nano boron nitride powder, and adding one third of binder for stirring to obtain a mixture of the ceramic powder and the nano boron nitride powder;
step 6: coating one half of the mixture in the step 5 on the graphene layer 5, then paving a layer of phenyl ether silicon rubber, and then coating the rest of the two-half mixture on the phenyl ether silicon rubber to obtain a ceramic layer 7 and a phenyl ether silicon rubber reinforcing layer 8;
Step 7: mixing alumina powder and magnesia powder, adding one third of adhesive, stirring to obtain a metal powder mixture, and coating the metal powder mixture on the ceramic layer 7 to obtain a heat conducting layer 9;
step 8: mixing and stirring silicon dioxide and the rest one third of the adhesive, coating the stirred and mixed silicon dioxide on the heat-conducting layer 9 to obtain a heat-radiating layer 10, hot-pressing the top of the heat-radiating layer 10 by using a hot press to tightly adhere the heat-conducting layer 9 and the heat-radiating layer 10, and forming a groove 13 by hot pressing;
Step 9: the inside of the groove 13 is inserted with flaky hexagonal boron nitride to obtain radiating fins 14, and a PTFE film on one side is attached to the top of the groove 13 to obtain a waterproof breathable layer 12;
Step 10: attaching a PP insulating sheet to the bottom of the heat-conducting silica gel layer 4 to obtain an insulating heat-conducting layer 3;
step 11: bonding dimethyl silicon rubber on the top of the heat dissipation layer 10 to obtain a silica gel buffer block 11, hot-pressing the silica gel buffer block 11 by a hot press again, and transferring to an oven for further curing after the hot pressing is finished;
Step 12: and (3) attaching the heat-conducting double-sided adhesive tape to the bottom of the insulating heat-conducting layer 3 to obtain an adhesive layer 2, attaching the PET film to the bottom of the adhesive layer 2 to obtain a release film 1, and finally preparing the heat-conducting film.
The implementation principle of the embodiment is as follows: firstly, the staff checks whether the heat conduction film is damaged, if the heat conduction film is damaged and replaced in time, when the heat conduction film is used, the release film 1 is damaged firstly, then the adhesive layer 2 is attached to equipment, the ceramic layer 7 and the graphene layer 5 are matched for use, the heat conduction film has the characteristics of light weight, high thermal conductivity, adjustable thermal expansion coefficient and the like, the miniature copper pipe 6 is arranged in the graphene layer 5, the heat absorption and vaporization of the heat conduction silica gel layer 4 are facilitated, the rapid heat conduction is realized, the heat dissipation layer 10 dissipates the heat of the heat conduction layer 9, the groove 13 quickens the contact area between air and the heat dissipation layer 10, the waterproof breathable layer 12 can avoid water vapor from entering the groove 13, the heat dissipation of the heat conduction layer 9 can be quickened by the heat dissipation fins 14, and the silica gel buffer block 11 can play a role in shock absorption and protection when the vibration collides, so that the damage of the heat conduction film is avoided.
Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.
Claims (7)
1. The heat conducting film formed by hot pressing comprises the following components in parts by weight: 30-40 parts of graphene, 10-15 parts of alumina powder, 10-12 parts of silicon dioxide, 8-10 parts of magnesia powder, 10-15 parts of heat conduction silica gel, 8-9 parts of anhydrous glycerol, 5-7 parts of ethylene glycol and 20-26 parts of ceramic powder; 1 part of heat conduction double faced adhesive tape, 80-130 parts of miniature copper pipe, 1 part of phenyl ether silicon rubber, 5-8 parts of adhesive, 12-15 parts of starch, 1 part of PP insulating sheet, 1 part of PET film, 1 part of PTFE film, 60-70 parts of flaky hexagonal boron nitride, 65-70 parts of dimethyl silicon rubber and 16-20 parts of nano boron nitride powder;
The heat conduction film formed by hot pressing comprises a release film (1), and is characterized in that: the top of release film (1) is provided with adhesive layer (2), the top of adhesive layer (2) is provided with insulating heat conduction layer (3), the top of insulating heat conduction layer (3) is provided with heat conduction silica gel layer (4), the top of heat conduction silica gel layer (4) is provided with graphite alkene layer (5), the inside of graphite alkene layer (5) is provided with miniature copper pipe (6), the top of graphite alkene layer (5) is provided with ceramic layer (7), the inside of ceramic layer (7) is provided with phenyl ether and props up silicone rubber enhancement layer (8), the top of ceramic layer (7) is provided with heat conduction layer (9), the top of heat conduction layer (9) is provided with heat dissipation layer (10), the top of heat dissipation layer (10) is provided with recess (13) and silica gel buffer block (11) respectively, the inside below of recess (13) is run through and is provided with heat dissipation fin (14), the top of recess (13) is provided with waterproof ventilative layer (12);
The heat conducting film formed by hot pressing has the following production steps:
step 1: stirring and dissolving starch and water, adding graphene, performing ultrasonic dispersion uniformly, performing hydrothermal reaction at 180-200 ℃, discharging, washing, drying to obtain starch-graphene microspheres, and stirring and mixing the starch-graphene microspheres with ethylene glycol and 2 parts of glycerol to obtain graphene membrane liquid;
Step 2: casting the graphene film, putting the graphene film into a die, hot-pressing the graphene film into a wave shape to obtain a graphene layer (5), embedding the graphene layer into a miniature copper pipe (6), and drying the graphene layer;
step 3: bonding the heat-conducting silica gel with the graphene layer in the step 2, setting the hot-pressing temperature to be 150-250 ℃ and the hot-pressing pressure to be more than 20MPa to obtain a heat-conducting silica gel layer (4);
Step 4: coating the top of the miniature copper tube (6) in the step 2 with residual anhydrous glycerin so that the anhydrous glycerin is poured into the miniature copper tube (6);
Step 5: mixing ceramic powder with nano boron nitride powder, and adding one third of binder for stirring to obtain a mixture of the ceramic powder and the nano boron nitride powder;
step 6: coating one half of the mixture in the step 5 on the graphene layer (5), then paving a layer of phenyl ether silicon rubber, and then coating the rest half of the mixture on the phenyl ether silicon rubber to obtain a ceramic layer (7) and a phenyl ether silicon rubber reinforcing layer (8);
step 7: mixing alumina powder and magnesia powder, adding one third of adhesive, stirring to obtain a metal powder mixture, and coating the metal powder mixture on the ceramic layer (7) to obtain a heat conducting layer (9);
step 8: mixing and stirring silicon dioxide and the rest one third of the adhesive, coating the stirred and mixed silicon dioxide on the heat-conducting layer (9) to obtain a heat-radiating layer (10), and hot-pressing the top of the heat-radiating layer (10) by using a hot press to tightly adhere the heat-conducting layer (9) and the heat-radiating layer (10), and forming a groove (13) by hot pressing;
step 9: the inside of the groove (13) is inserted with flaky hexagonal boron nitride to obtain radiating fins (14), and a PTFE film on one side is attached to the top of the groove (13) to obtain a waterproof breathable layer (12);
step 10: the PP insulating sheet is attached to the bottom of the heat-conducting silica gel layer (4) to obtain an insulating heat-conducting layer (3);
step 11: bonding dimethyl silicon rubber on the top of the heat dissipation layer (10) to obtain a silica gel buffer block (11), hot-pressing the silica gel buffer block (11) again by using a hot press, and transferring to an oven for further curing after the hot pressing is finished;
Step 12: and (3) attaching the heat-conducting double-sided adhesive tape to the bottom of the insulating heat-conducting layer (3) to obtain an adhesive layer (2), attaching the PET film to the bottom of the adhesive layer (2) to obtain a release film (1), and finally preparing the heat-conducting film.
2. The heat conductive film according to claim 1, wherein: the heat dissipation fins (14) are provided with a plurality of groups, the bottoms of the heat dissipation fins (14) are contacted with the heat conduction layer (9), and the heat dissipation fins (14) are in a zigzag shape.
3. The heat conductive film according to claim 1, wherein: the thickness of the graphene layer (5) is 50-80 mu m, and the top and the bottom of the graphene layer (5) are wavy.
4. The heat conductive film according to claim 1, wherein: the silica gel buffer blocks (11) are provided with a plurality of groups, and the silica gel buffer blocks (11) are arranged in an equidistant mode.
5. The heat conductive film according to claim 1, wherein: the grooves (13) are arranged in a plurality, and the sectional views of the grooves (13) are arc-shaped.
6. The heat conductive film according to claim 1, wherein: the thickness of the adhesive layer (2) is 10-20 mu m.
7. The heat conductive film according to claim 1, wherein: the miniature copper pipes (6) are provided with a plurality of groups, and the miniature copper pipes (6) are equidistantly inlaid in the graphene layer (5).
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| CN114801357B (en) * | 2022-04-28 | 2024-02-09 | 安徽碳华新材料科技有限公司 | Heat radiation structure for integrated chip based on film-shaped artificial graphite sheet |
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| CN202134529U (en) * | 2011-07-22 | 2012-02-01 | 长沙理工大学 | Graphite radiator device |
| CN209643204U (en) * | 2018-09-03 | 2019-11-15 | 深圳市云松科技有限公司 | A kind of graphite calendering release film |
| CN211546404U (en) * | 2019-12-20 | 2020-09-22 | 深圳市昌元兴科技有限公司 | Heat conduction silica gel sheet |
| CN212864650U (en) * | 2020-08-04 | 2021-04-02 | 苏州天煜新材料科技有限公司 | Combined type graphite alkene heat dissipation membrane |
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| CN202134529U (en) * | 2011-07-22 | 2012-02-01 | 长沙理工大学 | Graphite radiator device |
| CN209643204U (en) * | 2018-09-03 | 2019-11-15 | 深圳市云松科技有限公司 | A kind of graphite calendering release film |
| CN211546404U (en) * | 2019-12-20 | 2020-09-22 | 深圳市昌元兴科技有限公司 | Heat conduction silica gel sheet |
| CN212864650U (en) * | 2020-08-04 | 2021-04-02 | 苏州天煜新材料科技有限公司 | Combined type graphite alkene heat dissipation membrane |
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