CN211739015U

CN211739015U - Heat dissipation device and LED module

Info

Publication number: CN211739015U
Application number: CN201922409188.6U
Authority: CN
Inventors: 占贤武; 徐守学; 樊亮亮
Original assignee: Suzhou Hanraysun Optoelectronic Co ltd
Current assignee: Suzhou Hanraysun Optoelectronic Co ltd
Priority date: 2019-12-28
Filing date: 2019-12-28
Publication date: 2020-10-23
Anticipated expiration: 2029-12-28

Abstract

The utility model relates to a heat abstractor and LED module, including LED, first base plate, second base plate and radiator, wherein LED sets up on the first base plate, first base plate is fixed on the second base plate, the third base plate is fixed on the radiator, LED's electrode includes conductive electrode and heat transfer electrode, just conductive electrode with heat transfer electrode mutually independent, LED's conductive electrode is fixed on the first base plate, LED's heat transfer electrode is fixed on the second base plate. The utility model discloses the radiating effect is good, and whole device simple structure is with low costs moreover.

Description

Heat dissipation device and LED module

Technical Field

The utility model belongs to the technical field of the radiating technique of LED structure and specifically relates to indicate a heat abstractor and LED module.

Background

The LED structure that current car light module group step was placed is usually for pasting LED on the soft board, the reinforcement is done with the aluminum sheet to the soft board below, the below of aluminum sheet is fixed on the aluminium radiator, the heat that LED produced finally passes through the aluminium radiator dispels the heat. Therefore, the heat generated by the conventional LED during operation is transferred from the LED to the flexible board, from the flexible board to the aluminum sheet, and from the aluminum sheet to the aluminum heat sink. Because the surface of the soft board uses the polyimide film as the insulating layer, and the heat conductivity coefficient of the polyimide is 0.2W/mK, the heat conductivity is very low, in order to meet the heat dissipation requirement of the LED, the heat dissipation area can be increased only by increasing the size of the heat sink, so the design difficulty and the product cost are increased inevitably.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model aims to solve the technical problem that it is poor to overcome the radiating effect among the prior art, and the problem that product cost is high to it is good to provide a radiating effect, and heat abstractor and LED module that product cost is low.

In order to solve the technical problem, the utility model discloses a heat abstractor, including LED, first base plate, second base plate and radiator, wherein LED sets up on the first base plate, first base plate is fixed on the second base plate, the third base plate is fixed on the radiator, LED's electrode includes conductive electrode and heat transfer electrode, just conductive electrode with heat transfer electrode mutually independent, LED's conductive electrode is fixed on the first base plate, LED's heat transfer electrode is fixed on the second base plate.

In an embodiment of the present invention, the first substrate and the second substrate are fixed by a double-sided thermal adhesive tape.

In an embodiment of the present invention, the first substrate and the second substrate are fixed on the heat sink through a fixing member.

In an embodiment of the present invention, the fixing member is a blind rivet.

In one embodiment of the present invention, the first substrate is a flexible board, and the flexible board is a power line.

In one embodiment of the present invention, the second substrate is a heat-conducting plate.

In one embodiment of the present invention, the second substrate is an aluminum plate.

The utility model also provides a LED module, including above-mentioned arbitrary one heat abstractor, just heat abstractor's quantity is a plurality of.

Compared with the prior art, the technical scheme of the utility model have following advantage:

the heat dissipation device and the LED module of the utility model comprise an LED, a first substrate, a second substrate and a heat sink, wherein the LEDs are disposed on the first substrate, the first substrate is fixed on the second substrate, the third substrate is fixed on the heat sink, the electrodes of the LED include a conductive electrode and a heat transfer electrode, the conductive electrode and the heat transfer electrode are independent, the conductive electrode of the LED is fixed on the first substrate, the heat transfer electrode of the LED is fixed on the second substrate, because the heat of the LED is directly transferred to the second substrate through the heat transfer electrode of the LED and then transferred to the heat sink through the second substrate, because the polyimide with very low heat conductivity coefficient is avoided being used in the process of the heat transfer path, the heat dissipation effect is good, and the whole device has simple structure and low cost.

Drawings

In order to make the content of the invention more clearly understood, the invention will now be described in further detail with reference to specific embodiments thereof, in conjunction with the accompanying drawings, in which

Fig. 1 is a schematic view of the heat dissipation device of the present invention;

fig. 2 is a schematic diagram of the LED module of the present invention.

The specification reference numbers indicate: 11-LED, 12-first substrate, 13-second substrate, 14-heat sink, 15-mount.

Detailed Description

Example one

As shown in fig. 1, the present embodiment provides a heat dissipation device, which includes an LED11, a first substrate 12, a second substrate 13, and a heat sink 14, wherein the LED11 is disposed on the first substrate 12, the first substrate 12 is fixed on the second substrate 13, the third substrate 13 is fixed on the heat sink 14, electrodes of the LED11 include a conductive electrode and a heat transfer electrode, the conductive electrode and the heat transfer electrode are independent of each other, the conductive electrode of the LED is fixed on the first substrate 12, and the heat transfer electrode of the LED is fixed on the second substrate 13.

The heat dissipation device of this embodiment includes an LED11, a first substrate 12, a second substrate 13, and a heat sink 14, wherein the LED11 is disposed on the first substrate 12, the first substrate 12 is fixed on the second substrate 13, the third substrate 13 is fixed on the heat sink 14, the electrodes of the LED11 include a conductive electrode and a heat transfer electrode, and the conductive electrode and the heat transfer electrode are independent of each other, the conductive electrode of the LED is fixed on the first substrate 12, and the heat transfer electrode of the LED is fixed on the second substrate 13, because the heat of the LED11 is directly transferred to the second substrate 13 through the heat transfer electrode of the LED and then transferred to the heat sink 14 through the second substrate 13, because the use of polyimide with low thermal conductivity is avoided in the process of the heat transfer path, the heat dissipation effect is good, and the whole device has a simple structure, the cost is low.

The first substrate 12 and the second substrate 13 are fixed by using a double-sided thermal conductive adhesive tape, so that heat transfer is ensured and cost is reduced. The first substrate 12 and the second substrate 13 are fixed on the heat sink 14 by a fixing member 15, so that the stability of the whole device can be ensured. Specifically, the fixing piece is a blind rivet.

In this embodiment, the first substrate 12 is a flexible board, and the flexible board is a power line, so as to fix the LED11 and ensure stable transmission of the power line. The second substrate 13 is a heat conductive plate through which heat of the LEDs 11 can be well transferred to the heat sink 14. Specifically, the second substrate 13 is an aluminum plate.

Example two

As shown in fig. 2, the present embodiment provides an LED module, which includes the heat dissipation device of the first embodiment, and the number of the heat dissipation devices is multiple.

In the LED module of this embodiment, the number of the heat dissipation devices is plural, and therefore the number of the LEDs 11 is plural, and since the heat transfer electrodes of the LEDs are fixed on the second substrate 13, the heat is directly transmitted to the heat sink 14 through the second substrate 13, so that the heat dissipation amount is increased, and the heat dissipation effect is good.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. A heat dissipation device, characterized in that: the LED comprises an LED, a first substrate, a second substrate and a radiator, wherein the LED is arranged on the first substrate, the first substrate is fixed on the second substrate, the second substrate is fixed on the radiator, electrodes of the LED comprise a conductive electrode and a heat transfer electrode, the conductive electrode and the heat transfer electrode are mutually independent, the conductive electrode of the LED is fixed on the first substrate, and the heat transfer electrode of the LED is fixed on the second substrate.

2. The heat dissipating device of claim 1, wherein: the first substrate and the second substrate are fixed by a heat-conducting double-sided adhesive tape.

3. The heat dissipating device according to claim 1 or 2, wherein: the first substrate and the second substrate are fixed on the radiator through fixing pieces.

4. The heat dissipating device of claim 3, wherein: the fixing piece is a self-plugging rivet.

5. The heat dissipating device of claim 1, wherein: the first substrate is a flexible board, and the flexible board is a power line.

6. The heat dissipating device of claim 1, wherein: the second substrate is a thermally conductive plate.

7. The heat dissipating device of claim 6, wherein: the second substrate is an aluminum plate.

8. The utility model provides a LED module which characterized in that: the heat dissipating device of any of claims 1-7, comprising a plurality of said heat dissipating devices.