CN217280747U

CN217280747U - Fixing part for chip packaging

Info

Publication number: CN217280747U
Application number: CN202221076048.7U
Authority: CN
Inventors: 陈海军; 卞正刚
Original assignee: Jiangsu Shengluan Electronic Technology Co ltd
Current assignee: Jiangsu Shengluan Electronic Technology Co ltd
Priority date: 2022-05-07
Filing date: 2022-05-07
Publication date: 2022-08-23
Anticipated expiration: 2032-05-07

Abstract

The utility model discloses a fixing piece for chip packaging, which comprises a shell and an upper cover plate, wherein the shell is hollow and has an opening at the upper part, screw holes are arranged at the four corners of the upper part of the shell, fixing holes are arranged at the four corners of the upper cover plate corresponding to the screw holes, a heat-conducting silica gel sheet is arranged at the bottom surface of the shell and at the lower end surface of the upper cover plate, a plurality of strip-shaped heat dissipation holes are arranged at the bottom surface of the shell and at the upper surface of the upper cover plate, a net-shaped baffle is arranged at one end of each strip-shaped heat dissipation hole close to the heat-conducting silica gel sheet, a plurality of fixing rods are arranged at the two side surfaces of the shell, and one end of each fixing rod extending into the shell is connected with a chip through a wire, the upper cover plate is connected with the shell through fastening screws, so that the maintenance personnel can directly disassemble and maintain the shell.

Description

Fixing part for chip packaging

Technical Field

The utility model relates to a chip packaging hardware technical field specifically indicates a mounting is used in chip packaging.

Background

The chip package shell not only plays the roles of installation, fixation, sealing, chip protection and the like, but also is connected with other devices through the wires connected to the printed circuit board by the contacts on the chip by the wires, thereby realizing the connection of the internal chip and an external circuit. The packaged chip is also more convenient to install and transport. The fixed shell structure that current chip package used is comparatively fixed, overhauls inconveniently, and radiating effect and damping performance are not good simultaneously, have shortened the life of chip.

SUMMERY OF THE UTILITY MODEL

The utility model provides a fixing part for chip packaging, which solves the problems mentioned above.

In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a mounting for chip package, includes casing and upper cover plate, inside cavity of casing and top opening, casing top four corners department all is equipped with the screw, upper cover plate four corners department all corresponds the screw and is equipped with the fixed orifices, terminal surface all is equipped with heat conduction silica gel piece under inside bottom surface of casing and the upper cover plate, all be equipped with a plurality of bar louvres above casing bottom surface and the upper cover plate, the bar louvre is close to and is equipped with netted baffle in the one end of heat conduction silica gel piece, casing both sides face all is equipped with a plurality of dead levers, the dead lever stretches into the inside one end of casing and passes through the wire and be connected with the chip.

As an improvement, the shell and the upper cover plate are fixedly connected through fastening screws, and the fastening screws penetrate through the fixing holes to be in threaded fit with the screw holes.

As an improvement, a dustproof net is arranged in one end, away from the heat-conducting silica gel sheet, of the strip-shaped heat dissipation hole.

As an improvement, one end of the fixed rod, which extends out of the shell, is connected with a pin.

As an improvement, the strip-shaped heat dissipation holes are arranged in parallel, and the heat conduction silica gel sheet covers all the strip-shaped heat dissipation holes.

Compared with the prior art, the utility model the advantage lies in: the utility model discloses be provided with heat conduction silica gel piece, clip the chip from upper and lower both sides, play the radiating effect of heat conduction on the one hand, on the other hand effectively filters the vibrations that the outside produced, protects the chip, is provided with the bar louvre, and the heat gives off with higher speed, is equipped with the dust screen, prevents in the dust entering casing that the upper cover plate passes through fastening screw and is connected with the casing, and the direct dismantlement of easy access person is overhauld.

Drawings

Fig. 1 is a schematic view of a front view structure of a mounting member for chip packaging according to the present invention.

Fig. 2 is a schematic top view of a chip package mounting according to the present invention.

Fig. 3 is a schematic structural diagram of a region a of the mounting for chip packaging according to the present invention.

As shown in the figure: 1. a housing; 2. an upper cover plate; 3. a screw hole; 4. a fixing hole; 5. a heat-conducting silica gel sheet; 6. strip-shaped heat dissipation holes; 7. a mesh baffle; 8. fixing the rod; 9. fastening screws; 10. a dust screen; 11. and (7) a pin.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Combine 1-3 of the accompanying drawings, a mounting for chip package, including casing 1 and upper cover plate 2, 1 inside cavity of casing and top opening, 1 top four corners department of casing all is equipped with

screw

3, 2 four corners departments of upper cover plate all correspond screw 3 and are equipped with fixed orifices 4, terminal surface all is equipped with heat conduction silica gel piece 5 under 1 inside bottom surface of casing and the upper cover plate 2, all be equipped with a plurality of bar louvres 6 above 1 bottom surface of casing and the upper cover plate 2, bar louvre 6 is close to and is equipped with netted baffle 7 in the one end of heat conduction silica gel piece 5, 1 both sides face of casing all is equipped with a plurality of dead levers 8, dead lever 8 stretches into 1 inside one end of casing and passes through the wire and is connected with the chip.

Casing 1 and upper cover plate 2 are through fastening screw 9 looks fixed connection, fastening screw 9 passes fixed orifices 4 and 3 screw-thread fit of screw, be equipped with dust screen 10 in the one end that heat conduction silica gel piece 5 was kept away from to bar louvre 6, the one end connection that the dead lever 8 stretches out casing 1 is equipped with pin 11, bar louvre 6 mutual parallel arrangement just heat conduction silica gel piece 5 covers all bar louvre 6 full coveredly.

The utility model discloses a concrete implementation mode: the utility model discloses before using, prevent putting the chip inside casing 1, be connected chip and dead lever 8 with the wire, then cover upper cover plate 2, make two heat conduction silica gel pieces 5 compress tightly the chip, then use fastening screw 9 to fix upper cover plate 2 on casing 1, the encapsulation is accomplished, the heat that sends when the chip operation is in 5 transmissions to bar louvres 6 of heat conduction silica gel pieces, then discharge, netted baffle 7 prevents 5 extrusion deformation of heat conduction silica gel pieces.

The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.

Claims

1. The utility model provides a chip packaging is with mounting, includes casing (1) and upper cover plate (2), its characterized in that: the utility model discloses a heat-insulating and heat-insulating integrated circuit, including casing (1), upper cover plate (2), bottom surface and upper cover plate (2), casing (1) inside cavity and top opening, casing (1) top four corners department all is equipped with screw (3), upper cover plate (2) four corners department all corresponds screw (3) and is equipped with fixed orifices (4), terminal surface all is equipped with heat conduction silica gel piece (5) under casing (1) inside bottom surface and upper cover plate (2), all be equipped with a plurality of bar louvres (6) above casing (1) bottom surface and upper cover plate (2), be equipped with netted baffle (7) in bar louvre (6) one end near heat conduction silica gel piece (5), casing (1) both sides face all is equipped with a plurality of dead levers (8), dead lever (8) stretch into casing (1) inside one end and pass through the wire and are connected with the chip.

2. The die attach clip according to claim 1, wherein: the shell (1) and the upper cover plate (2) are fixedly connected through fastening screws (9), and the fastening screws (9) penetrate through the fixing holes (4) to be in threaded fit with the screw holes (3).

3. The die attach fixture of claim 1, wherein: and a dustproof net (10) is arranged in one end, away from the heat-conducting silica gel sheet (5), of the strip-shaped heat dissipation hole (6).

4. The die attach clip according to claim 1, wherein: and one end of the fixed rod (8) extending out of the shell (1) is connected with a pin (11).

5. The die attach clip according to claim 1, wherein: the strip-shaped heat dissipation holes (6) are arranged in parallel, and the heat conduction silica gel sheet (5) covers all the strip-shaped heat dissipation holes (6).