CN216288380U - Semiconductor chip package with dustproof heat dissipation function - Google Patents
Semiconductor chip package with dustproof heat dissipation function Download PDFInfo
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- CN216288380U CN216288380U CN202121653343.XU CN202121653343U CN216288380U CN 216288380 U CN216288380 U CN 216288380U CN 202121653343 U CN202121653343 U CN 202121653343U CN 216288380 U CN216288380 U CN 216288380U
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Abstract
The utility model discloses a semiconductor chip package with dustproof and heat dissipation functions, which comprises a chip body, wherein a stabilizing mechanism is fixedly arranged at the lower end of the chip body, a wire mechanism is fixedly arranged at the outer end of the chip body, a packaging mechanism is fixedly arranged at the outer side of the chip body, the dustproof and heat dissipation mechanism comprises a heat dissipation top plate, a heat dissipation through hole and a dustproof and heat dissipation fiber layer, the upper end of the packaging mechanism is fixedly provided with the heat dissipation top plate, the upper end of the heat dissipation top plate is fixedly provided with the heat dissipation through hole, and the upper end of the packaging mechanism is fixedly provided with the dustproof and heat dissipation mechanism. This semiconductor chip package with dustproof heat dissipation function, the heat dissipation roof adopts the higher material of thermal conductivity to make, has improved the radiating effect of chip body, and the heat dissipation through-hole has increased gaseous circulation, more is favorable to the heat dissipation of chip body, and dustproof heat dissipation fibrous layer can dispel the heat to the chip body, can play the effect of blockking again to the dust, prevents that the dust from in the heat dissipation through-hole access device.
Description
Technical Field
The utility model relates to the technical field of semiconductor chips, in particular to a semiconductor chip package with a dustproof heat dissipation function.
Background
A semiconductor chip: the semiconductor device which can realize a certain function is made by etching and wiring on a semiconductor wafer, not only a silicon wafer, but also a common semiconductor material such as gallium arsenide (gallium arsenide is toxic, so that some inferior circuit boards do not decompose the gallium arsenide) and germanium.
The existing semiconductor chip packaging has poor dustproof and heat-radiating functions and insufficient stability, and the existing semiconductor chip packaging is not convenient to disassemble and assemble.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a semiconductor chip package with dustproof and heat dissipation functions to solve the above problems.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a semiconductor chip encapsulates with dustproof heat dissipation function, includes the chip body, the fixed firm mechanism that is provided with of lower extreme of chip body, the fixed wire mechanism that is provided with in outer end of chip body, the fixed packaging mechanism that is provided with in outside of chip body, the fixed dustproof heat dissipation mechanism that is provided with in upper end of packaging mechanism, dustproof heat dissipation mechanism is including heat dissipation roof, heat dissipation through-hole, dustproof heat dissipation fibrous layer, the upper end fixed mounting of packaging mechanism has the heat dissipation roof, the fixed heat dissipation through-hole that is provided with in upper end of heat dissipation roof.
Preferably, the heat dissipation through-hole equidistance is arranged in the upper end of heat dissipation roof, the inside fixed mounting of heat dissipation through-hole has dustproof heat dissipation fibrous layer, through installing the heat dissipation roof, this heat dissipation roof adopts the material that the thermal conductivity is higher to make, like copper sheet or heat conduction silicone grease etc., the radiating effect of chip body has been improved, through setting up the heat dissipation through-hole, the heat dissipation through-hole has increased gaseous circulation, more be favorable to the heat dissipation of chip body, through installing dustproof heat dissipation fibrous layer, this dustproof heat dissipation fibrous layer has the fibre hole, can dispel the heat to the chip body, can play the effect of blockking to the dust simultaneously again, prevent that the dust from getting into the device inside from the heat dissipation through-hole.
Preferably, firm mechanism includes mounting plate, connecting cylinder, stopper, spring and spliced pole, the lower extreme fixed mounting of chip body has mounting plate, mounting plate's outer end fixed mounting has the connecting cylinder, the lower extreme of connecting cylinder is located the inside fixed mounting of mounting plate and has the stopper, through installing the stopper, can play fixed and spacing effect to the connecting cylinder, increases the compactness between connecting cylinder and the mounting plate.
Preferably, the inside fixed mounting of connecting cylinder has the spring, the inner fixed mounting of spring has the spliced pole, the spliced pole extends to the inside of connecting cylinder, the connecting cylinder symmetric distribution is in the left and right sides of mounting plate, and through the installation spring, this spring can play the cushioning effect to mounting plate and packaging mechanism, increases the stability of device.
Preferably, the wire mechanism includes first wire and second wire, both ends fixed mounting has first wire about the chip body, both ends fixed mounting has the second wire around the chip body, first wire and second wire are the same kind of structure, and through installation wire mechanism, it is electric conductivity to increase the chip body.
Preferably, packaging mechanism includes lower encapsulation shell, goes up the wire and wears to draw the groove, lower wire wears to draw the groove, sealed pad, mounting hole and miniature bolt, mounting plate's lower extreme fixed mounting has lower encapsulation shell, lower encapsulation shell's upper end movable mounting has last encapsulation shell, the fixed wire that is provided with of lower extreme of going up encapsulation shell wears to draw the groove, the fixed wire that is provided with down of lower encapsulation shell's upper end wears to draw the groove, go up the wire and wear to draw groove, lower wire and wear to draw groove and first wire, second wire looks adaptation, through the encapsulation shell of two upper and lower separations of installation, can make things convenient for installing in dismantling of this device more, also make things convenient for the maintenance to this device more.
Preferably, the inner fixed mounting of encapsulation mechanism has sealed the pad, first wire runs through sealed the pad, the second wire runs through sealed the pad, the fixed mounting hole that is provided with in upper end of going up encapsulation shell, the inner movable mounting of mounting hole has miniature bolt, and through the sealed pad of installation, the leakproofness of this device has been increased, through setting up the mounting hole, can penetrate the mounting hole with miniature bolt in, screw up again and can accomplish the installation to last encapsulation shell and lower encapsulation shell.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the semiconductor chip package with the dustproof heat dissipation function, the heat dissipation top plate is installed and is made of materials with high heat conduction performance, such as copper sheets or heat conduction silicone grease, so that the heat dissipation effect of the chip body is improved, the circulation of gas is increased through the heat dissipation through holes, the heat dissipation of the chip body is facilitated, the dustproof heat dissipation fiber layer is provided with fiber holes, the chip body can be cooled, meanwhile, a blocking effect on dust can be achieved, and the dust is prevented from entering the device from the heat dissipation through holes;
2. according to the semiconductor chip package with the dustproof heat dissipation function, the spring is arranged, so that the spring can play a buffering role on the installation bottom plate and the packaging mechanism, and the stability of the device is improved;
3. this semiconductor chip package with dustproof heat dissipation function through two encapsulation shells of separation about the installation, can make things convenient for the installation in dismantlement of this device more, also makes things convenient for the maintenance to this device more.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a perspective view of the packaging mechanism of the present invention;
FIG. 3 is a schematic top view of the cross-sectional structure of the present invention;
FIG. 4 is a schematic cross-sectional view of the stabilizing mechanism of the present invention.
In the figure: 1. a chip body; 2. a stabilizing mechanism; 201. mounting a bottom plate; 202. a connecting cylinder; 203. a limiting block; 204. a spring; 205. connecting columns; 3. a wire guide mechanism; 301. a first conductive line; 302. a second conductive line; 4. a packaging mechanism; 401. a lower package housing; 402. an upper package housing; 403. the upper lead penetrates through the lead groove; 404. the lower lead penetrates through the guide groove; 405. a gasket; 406. mounting holes; 407. a micro bolt; 5. A dustproof heat dissipation mechanism; 501. a heat dissipation top plate; 502. a heat dissipating through hole; 503. dustproof heat dissipation fibrous layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a semiconductor chip package with dustproof heat dissipation function, including chip body 1, the fixed firm mechanism 2 that is provided with of lower extreme of chip body 1, the fixed wire mechanism 3 that is provided with in outer end of chip body 1, the fixed packaging mechanism 4 that is provided with in the outside of chip body 1, the fixed dustproof heat dissipation mechanism 5 that is provided with in upper end of packaging mechanism 4, dustproof heat dissipation mechanism 5 is including heat dissipation roof 501, heat dissipation through-hole 502, dustproof heat dissipation fibre layer 503, the upper end fixed mounting of packaging mechanism 4 has heat dissipation roof 501, the fixed heat dissipation through-hole 502 that is provided with in upper end of heat dissipation roof 501.
Heat dissipation through-hole 502 equidistance is arranged in the upper end of heat dissipation roof 501, the inside fixed mounting of heat dissipation through-hole 502 has dustproof heat dissipation fibrous layer 503, through installing heat dissipation roof 501, this heat dissipation roof 501 adopts the higher material of thermal conductivity to make, like copper sheet or heat conduction silicone grease etc., the radiating effect of chip body 1 has been improved, through setting up heat dissipation through-hole 502, heat dissipation through-hole 502 has increased gaseous circulation, be more favorable to chip body 1's heat dissipation, through installing dustproof heat dissipation fibrous layer 503, this dustproof heat dissipation fibrous layer 503 has the fibre hole, can dispel the heat chip body 1, can play the effect of stopping simultaneously again to the dust, prevent that the dust from getting into the device inside from heat dissipation through-hole 502.
The stabilizing mechanism 2 comprises an installation bottom plate 201, a connecting cylinder 202, a limiting block 203, a spring 204 and a connecting column 205, the lower end of the chip body 1 is fixedly provided with the installation bottom plate 201, the outer end of the installation bottom plate 201 is fixedly provided with the connecting cylinder 202, the lower end of the connecting cylinder 202 is located inside the installation bottom plate 201 and is fixedly provided with the limiting block 203, the connecting cylinder 202 can be fixed and limited through the installation limiting block 203, and the tightness between the connecting cylinder 202 and the installation bottom plate 201 is increased.
The inside fixed mounting of connecting cylinder 202 has spring 204, and the inner fixed mounting of spring 204 has spliced pole 205, and spliced pole 205 extends to the inside of connecting cylinder 202, and connecting cylinder 202 symmetric distribution is in the left and right sides of mounting plate 201, and through mounting spring 204, this spring 204 can play the cushioning effect to mounting plate 201 and packaging mechanism 4, increases the stability of device.
The wire mechanism 3 comprises a first wire 301 and a second wire 302, the first wire 301 is fixedly mounted at the left end and the right end of the chip body 1, the second wire 302 is fixedly mounted at the front end and the rear end of the chip body 1, the first wire 301 and the second wire 302 are of the same structure, and the chip body 1 can be increased to be conductive by mounting the wire mechanism 3.
The packaging mechanism 4 comprises a lower packaging shell 401, an upper packaging shell 402, an upper lead threading groove 403, a lower lead threading groove 404, a sealing gasket 405, a mounting hole 406 and a micro bolt 407, the lower end of the mounting baseplate 201 is fixedly provided with the lower packaging shell 401, the upper end of the lower packaging shell 401 is movably provided with the upper packaging shell 402, the lower end of the upper packaging shell 402 is fixedly provided with the upper lead threading groove 403, the upper end of the lower packaging shell 401 is fixedly provided with the lower lead threading groove 404, the upper lead threading groove 403, the lower lead threading groove 404 is matched with the first lead 301 and the second lead 302, and the upper packaging shell and the lower packaging shell are separated through installation, so that the device can be more conveniently installed and disassembled, and the device is more convenient to overhaul.
The inner end of the packaging mechanism 4 is fixedly provided with a sealing gasket 405, the first lead 301 penetrates through the sealing gasket 405, the second lead 302 penetrates through the sealing gasket 405, the upper end of the upper packaging shell 402 is fixedly provided with a mounting hole 406, the inner end of the mounting hole 406 is movably provided with a micro bolt 407, the sealing performance of the device is improved by mounting the sealing gasket 405, the micro bolt 407 can penetrate into the mounting hole 406 by arranging the mounting hole 406, and the upper packaging shell 402 and the lower packaging shell 401 can be mounted by screwing down.
When the device is used, the chip body 1 is fixedly arranged at the upper end of the mounting base plate 201, the connecting column 205 is connected with the lower packaging shell 401, the upper packaging shell 402 is aligned with the lower packaging shell 401, the first lead 301 and the second lead 302 respectively pass through the upper lead threading groove 403 and the lower lead threading groove 404, finally the micro bolt 407 is placed into the mounting hole 406 and screwed down, and the mounting can be completed, when the device is collided by external force during transportation, the connecting column 205 can drive the spring 204 to perform telescopic motion, so that the mounting base plate 201 and the packaging mechanism 4 are buffered, when the chip body 1 works to generate heat, the chip body 1 is made of materials with higher heat conductivity, such as a heat dissipation top plate 501 made of copper sheets or heat conduction silicone grease and the like for dissipating heat of the chip body 1, the heat dissipation through hole 502 also dissipates heat of the chip body 1, and the dustproof fiber layer 503, not only dispel the heat to chip body 1, play the effect of blockking again simultaneously to the dust, prevent that the dust from getting into inside the device from heat dissipation through-hole 502.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a semiconductor chip package with dustproof heat dissipation function, includes chip body (1), its characterized in that: the fixed firm mechanism (2) that is provided with of lower extreme of chip body (1), the fixed wire mechanism (3) that is provided with in outer end of chip body (1), the fixed packaging mechanism (4) that is provided with in outside of chip body (1), the fixed dustproof heat dissipation mechanism (5) that is provided with in upper end of packaging mechanism (4), dustproof heat dissipation mechanism (5) are including heat dissipation roof (501), heat dissipation through-hole (502), dustproof heat dissipation fibrous layer (503), the upper end fixed mounting of packaging mechanism (4) has heat dissipation roof (501), the fixed heat dissipation through-hole (502) that is provided with in upper end of heat dissipation roof (501).
2. The semiconductor chip package with dust-proof heat dissipation function of claim 1, wherein: the heat dissipation through-hole (502) equidistance is arranged in the upper end of heat dissipation roof (501), the inside fixed mounting of heat dissipation through-hole (502) has dustproof heat dissipation fibrous layer (503).
3. The semiconductor chip package with dust-proof heat dissipation function of claim 2, wherein: firm mechanism (2) are including mounting plate (201), connecting cylinder (202), stopper (203), spring (204) and spliced pole (205), the lower extreme fixed mounting of chip body (1) has mounting plate (201), the outer end fixed mounting of mounting plate (201) has connecting cylinder (202), the inside fixed mounting that the lower extreme of connecting cylinder (202) is located mounting plate (201) has stopper (203).
4. A semiconductor chip package with dust-proof heat dissipation function according to claim 3, wherein: the inside fixed mounting of connecting cylinder (202) has spring (204), the inner fixed mounting of spring (204) has spliced pole (205), spliced pole (205) extend to the inside of connecting cylinder (202), connecting cylinder (202) symmetric distribution is in the left and right sides of mounting plate (201).
5. The semiconductor chip package with dust-proof heat dissipation function of claim 4, wherein: wire mechanism (3) include first wire (301) and second wire (302), both ends fixed mounting has first wire (301) about chip body (1), both ends fixed mounting has second wire (302) around chip body (1), first wire (301) and second wire (302) are the same kind of structure.
6. The semiconductor chip package with dust-proof heat dissipation function of claim 5, wherein: packaging mechanism (4) including lower encapsulation shell (401), go up encapsulation shell (402), go up the wire and wear to draw groove (403), lead wire down and wear to draw groove (404), sealed pad (405), mounting hole (406) and miniature bolt (407), the lower extreme fixed mounting of mounting plate (201) has lower encapsulation shell (401), the upper end movable mounting of lower encapsulation shell (401) has last encapsulation shell (402), the lower extreme of going up encapsulation shell (402) is fixed to be provided with the wire and wears to draw groove (403), the upper end of lower encapsulation shell (401) is fixed to be provided with down wire and wears to draw groove (404), go up wire and wear to draw groove (403), lead wire down and wear to draw groove (404) and first wire (301), second wire (302) looks adaptation.
7. The semiconductor chip package with dust-proof heat dissipation function of claim 6, wherein: the inner fixed mounting of encapsulation mechanism (4) has sealed pad (405), first wire (301) run through sealed pad (405), second wire (302) run through sealed pad (405), the fixed mounting hole (406) that is provided with in upper end of going up encapsulation shell (402), the inner movable mounting of mounting hole (406) has miniature bolt (407).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121653343.XU CN216288380U (en) | 2021-07-20 | 2021-07-20 | Semiconductor chip package with dustproof heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121653343.XU CN216288380U (en) | 2021-07-20 | 2021-07-20 | Semiconductor chip package with dustproof heat dissipation function |
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| Publication Number | Publication Date |
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| CN216288380U true CN216288380U (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121653343.XU Active CN216288380U (en) | 2021-07-20 | 2021-07-20 | Semiconductor chip package with dustproof heat dissipation function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241140A (en) * | 2022-08-08 | 2022-10-25 | 温州欧乐彩科技有限公司 | Withstand voltage type semiconductor device with high-efficient heat radiation structure |
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2021
- 2021-07-20 CN CN202121653343.XU patent/CN216288380U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241140A (en) * | 2022-08-08 | 2022-10-25 | 温州欧乐彩科技有限公司 | Withstand voltage type semiconductor device with high-efficient heat radiation structure |
| CN115241140B (en) * | 2022-08-08 | 2023-01-31 | 温州欧乐彩科技有限公司 | Withstand voltage type semiconductor device with high-efficient heat radiation structure |
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