CN218241812U

CN218241812U - Dual in-line ceramic shell

Info

Publication number: CN218241812U
Application number: CN202222196543.8U
Authority: CN
Inventors: 戴玮明; 李广坤; 王忠军; 张景龙; 贺亮
Original assignee: Zhuzhou Aisenda New Material Technology Co ltd
Current assignee: Zhuzhou Aisenda New Material Technology Co ltd
Priority date: 2022-08-19
Filing date: 2022-08-19
Publication date: 2023-01-06
Anticipated expiration: 2032-08-19

Abstract

The utility model provides a biserial in-line ceramic package, including the casing, logical groove has been seted up at the top of casing, is equipped with auxiliary assembly on the inner wall that leads to the groove, is equipped with the mounting panel on the inner wall of casing, and the mounting groove has been seted up to one side of mounting panel, is equipped with adjusting part on the inner wall of mounting groove, and the equal fixed mounting in both sides at casing both ends has two sets of pins. The utility model discloses: through pressing into logical inslot with the apron, apron cooperation a plurality of push pedal drives a plurality of slider and removes in a plurality of through-hole, a plurality of slider extrudees a plurality of spring, then rotates the limiting plate on two sets of dead levers to with the rigidity of apron, otherwise then be convenient for dismantle it, then take off two stoppers from two draw-in grooves, remove two collars, cooperate two archs to drive the mounting panel and remove in two spouts, thereby be convenient for maintain interior component.

Description

Dual in-line ceramic shell

Technical Field

The utility model belongs to the technical field of ceramic package, concretely relates to biserial in-line ceramic package.

Background

Among them, "a dual in-line integrated circuit package casing" disclosed in application number "CN202021090806.1" is also an increasingly mature technology, which "it includes a casing and several pins, the pins are set on both sides of the casing, and is characterized in that, among the pins located on the same side of the casing, at least two pins are connected together by a connecting piece to form a combined pin, when the number of pins forming the combined pin is less than the total number of pins on that side and the difference is not less than 2, there can be multiple combined pins set at intervals in the same side of the casing, the pins include a wider portion and a narrower portion", but the casing also has the following defects:

this shell has promoted integrated circuit's heat dispersion when using, and the spatial structure of this shell is simple simultaneously, and space utilization is not enough, and the inside cavity that only has of shell can't satisfy the encapsulation requirement of multicore piece and irregular chip, is not convenient for repair it when the internals damages moreover, has improved the degree of difficulty of maintenance, so need design a biserial in-line ceramic package that the practicality is strong.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dual in-line ceramic package, aim at solving current dual in-line ceramic package space structure simple among the prior art, space utilization is not enough, and the inside cavity that only has of shell can't satisfy the encapsulation requirement of multicore piece and irregular chip, is not convenient for repair it when the internal element damages moreover, has improved the problem of the degree of difficulty of maintenance.

In order to achieve the above object, the utility model provides a following technical scheme: a dual in-line ceramic shell comprises a shell, wherein a through groove is formed in the top of the shell, an auxiliary assembly is arranged on the inner wall of the through groove, an installation plate is arranged on the inner wall of the shell, an installation groove is formed in one side of the installation plate, an adjusting assembly is arranged on the inner wall of the installation groove, and two groups of pins are fixedly installed on two sides of two ends of the shell;

the auxiliary assembly is including installing a plurality of baffle on the mounting groove inner wall, a plurality of form a plurality of cavity, a plurality of between baffle and the mounting groove equal fixed mounting has the boss of different quantity on the inner wall of cavity, the boss is used for supporting the chip, and forms different polygon region with the cavity inner wall.

In order to make it to be convenient for maintain the internal element, as the utility model relates to a preferred, adjusting part is including seting up a plurality of through-hole on leading to the inslot wall, a plurality of equal fixed mounting has the spring on the inner wall of through-hole, the one end fixedly connected with slider of spring, the top contact of slider is connected with the push pedal, the top fixed mounting of push pedal has the apron.

In order to be convenient for fix the mounting panel, as the utility model relates to an it is preferred, the spout has all been seted up to shells inner wall's both sides, the inner wall of spout and the protruding sliding connection at mounting panel both ends, the draw-in groove has been seted up on the inner wall of spout, two all be equipped with the stopper between the draw-in groove.

In order to make it be convenient for take out the mounting panel, as the utility model relates to an it is preferred, threaded hole is all seted up to the both sides at mounting panel top, threaded connection has the collar on the inner wall of screw hole.

In order to make the boss of being convenient for carry out electric connection, as the utility model relates to an it is preferable, a plurality of all be equipped with the bonding point on the boss.

In order to make the heat that the internal component of being convenient for discharge produced, as the utility model discloses a preferred, the radiating groove has all been seted up to the both sides at apron top, fixed mounting has the radiator-grid on the inner wall of radiating groove.

In order to be convenient for carry on spacingly to the apron, as the utility model relates to an it is preferred, the top fixed mounting of casing has two sets of dead levers, and is two sets of the surface of dead lever is all rotated and is connected with the limiting plate, the bottom of limiting plate is connected with the top contact of apron.

In order to facilitate further heat dissipation from the inside of the case, it is preferable that the pin is composed of a connector and a combined pin, and the pin is composed of a connector and a single pin.

Compared with the prior art, the beneficial effects of the utility model are that:

1) The plurality of cavities are formed by the plurality of partition plates and the mounting grooves, and different polygonal areas are formed by matching with different numbers of bosses arranged in the plurality of cavities, so that chips with different shapes can be conveniently mounted, and the packaging requirements of multiple chips and irregular chips are met;

2) Through pressing into logical inslot with the apron, apron cooperation a plurality of push pedal drives the removal of a plurality of slider in a plurality of through-hole, a plurality of slider extrudees a plurality of spring, then rotate the limiting plate on two sets of dead levers, thereby with the rigidity of apron, otherwise then be convenient for dismantle it, then take off two stoppers from two draw-in grooves, remove two collars, cooperate two archs to drive the mounting panel and remove in two spouts, thereby be convenient for maintain interior component.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;

fig. 2 is one of the schematic structural diagrams of embodiment 1 of the present invention;

fig. 3 is a schematic structural view of a housing according to embodiment 1 of the present invention;

fig. 4 is a schematic structural view of an auxiliary assembly according to embodiment 1 of the present invention;

fig. 5 is a schematic structural view of an adjusting assembly in embodiment 1 of the present invention;

fig. 6 is a schematic structural diagram of embodiment 2 of the present invention.

In the figure: 1. a housing; 11. a through groove; 12. mounting a plate; 121. mounting grooves; 122. a protrusion; 123. a threaded hole; 124. a mounting ring; 13. a pin; 14. a chute; 141. a card slot; 142. a limiting block; 15. a fixing rod; 151. a limiting plate; 2. an auxiliary component; 21. a partition plate; 22. a cavity; 23. a boss; 3. an adjustment assembly; 31. a through hole; 32. a spring; 33. a slider; 34. pushing the plate; 35. a cover plate; 351. a heat sink; 352. a heat-dissipating mesh; 4. a connecting member; 41. a combined pin; 42. a single pin.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-5, the present invention provides the following technical solutions: a dual in-line ceramic shell comprises a shell body 1, wherein the top of the shell body 1 is provided with a through groove 11, the inner wall of the through groove 11 is provided with an auxiliary assembly 2, the inner wall of the shell body 1 is provided with an installation plate 12, one side of the installation plate 12 is provided with an installation groove 121, the inner wall of the installation groove 121 is provided with an adjusting assembly 3, and two groups of pins 13 are fixedly installed on two sides of two ends of the shell body 1;

the auxiliary assembly 2 comprises a plurality of partition plates 21 installed on the inner wall of the installation groove 121, a plurality of cavities 22 are formed between the plurality of partition plates 21 and the installation groove 121, bosses 23 of different numbers are fixedly installed on the inner wall of the plurality of cavities 22, and the bosses 23 are used for supporting chips and form different polygonal areas with the inner wall of the cavities 22.

When the packaging structure is used specifically, the plurality of cavities 22 formed by the plurality of partition plates 21 and the mounting groove 121 are matched with the bosses 23 in different numbers of the internal installation of the plurality of cavities 22 to form different polygonal areas, so that chips in different shapes can be conveniently installed, and the packaging requirements of multiple chips and irregular chips are met.

In this embodiment, the adjusting assembly 3 includes a plurality of through holes 31 formed in the inner wall of the through slot 11, a spring 32 is fixedly mounted on the inner wall of each through hole 31, a sliding block 33 is fixedly connected to one end of the spring 32, a push plate 34 is connected to the top of the sliding block 33 in a contact manner, and a cover plate 35 is fixedly mounted on the top of the push plate 34.

During specific use, press into logical groove 11 with apron 35 in, apron 35 cooperates a plurality of push pedal 34 to drive a plurality of slider 33 and remove in a plurality of through-hole 31, and a plurality of slider 33 extrudees a plurality of spring 32, then rotates limiting plate 151 on two sets of dead levers 15 to with the rigidity of apron 35.

In this embodiment, the sliding grooves 14 have been all seted up to the both sides of casing 1 inner wall, and the inner wall of sliding groove 14 and the protruding 122 sliding connection at mounting panel 12 both ends have seted up draw-in groove 141 on the inner wall of sliding groove 14, are equipped with stopper 142 between two draw-in grooves 141.

When the device is used specifically, the two limit blocks 142 are taken down from the two clamping grooves 141, the two mounting rings 124 are moved, and the two protrusions 122 are matched to drive the mounting plate 12 to move in the two sliding grooves 14, so that maintenance of internal elements is facilitated.

In this embodiment, threaded holes 123 are formed in both sides of the top of the mounting plate 12, and a mounting ring 124 is connected to the inner wall of each threaded hole 123 through threads.

When the mounting plate is used specifically, the threaded hole 123 is in threaded connection with the mounting ring 124, so that the mounting plate 12 is driven to move.

In this embodiment, the plurality of bosses 23 are provided with bonding points.

When the bonding device is used specifically, the bonding points on the plurality of bosses 23 are utilized, so that the bosses 23 can be electrically connected conveniently.

In this embodiment, the heat dissipation grooves 351 are formed on both sides of the top of the cover plate 35, and the heat dissipation net 352 is fixedly mounted on the inner wall of the heat dissipation grooves 351.

In particular use, the heat-dissipating net 352 is installed in the heat-dissipating groove 351, thereby facilitating the discharge of heat generated from the internal components.

In this embodiment, the top fixed mounting of casing 1 has two sets of dead levers 15, and the surface of two sets of dead levers 15 all rotates and is connected with limiting plate 151, and the bottom of limiting plate 151 is connected with the top contact of apron 35.

When the fixing device is used specifically, the limiting plates 151 on the two groups of fixing rods 15 are rotated, so that the position of the cover plate 35 is fixed

In this embodiment, one of the pins 13 is composed of the connector 4 and the combined pin 41, and the other pin 13 is composed of the connector 4 and the single pin 42.

In particular, the connector 4 and the combined pins 41, and the connector 4 and the single pins 42 can form different pin 13 structures, thereby facilitating the improvement of the heat dissipation performance of the device.

The working principle is as follows: when using this equipment, at first install inside a plurality of baffle 21 and a plurality of cavity 22 that mounting groove 121 formed, the different quantity boss 23 of a plurality of cavity 22 internally mounted forms different polygon region, thereby be convenient for install the chip of different shapes, satisfy the encapsulation requirement of multicore piece and irregular chip, when needing to maintain the internal component, rotate limiting plate 151 on two sets of dead levers 15, apron 35 is unrestricted thereupon, a plurality of spring 32 cooperates a plurality of slider 33 to drive a plurality of push pedal 34 and slides on the inner wall of a plurality of through-hole 31 this moment, a plurality of push pedal 34 drives apron 35 rebound, contact connection when push pedal 34 and slider 33, so can take off apron 35, then take off two stopper 142 from two draw-in grooves 141, remove two collar 124, cooperate two protruding 122 to drive mounting panel 12 and remove in two spouts 14, thereby be convenient for maintain the internal component.

Example 2

Referring to fig. 6, in order to further improve the heat dissipation performance of the device, the difference between the present embodiment and the foregoing embodiment is: in this embodiment, one of the pins 13 is composed of the connector 4 and the combined pin 41, and the other pin 13 is composed of the connector 4 and the single pin 42.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A dual in-line ceramic housing comprising a shell (1), characterized in that: the top of the shell (1) is provided with a through groove (11), the inner wall of the through groove (11) is provided with an auxiliary assembly (2), the inner wall of the shell (1) is provided with a mounting plate (12), one side of the mounting plate (12) is provided with a mounting groove (121), the inner wall of the mounting groove (121) is provided with an adjusting assembly (3), and two sides of two ends of the shell (1) are fixedly provided with two groups of pins (13);

auxiliary assembly (2) are including installing a plurality of baffle (21), a plurality of on mounting groove (121) inner wall form a plurality of cavity (22), a plurality of between baffle (21) and mounting groove (121) equal fixed mounting has boss (23) of different quantity on the inner wall of cavity (22), boss (23) are used for supporting the chip, and form different polygon regions with cavity (22) inner wall.

2. A dual in-line ceramic housing according to claim 1, wherein: adjusting part (3) are including seting up a plurality of through-hole (31), a plurality of on logical groove (11) inner wall equal fixed mounting has spring (32) on the inner wall of through-hole (31), the one end fixedly connected with slider (33) of spring (32), the top contact of slider (33) is connected with push pedal (34), the top fixed mounting of push pedal (34) has apron (35).

3. A dual in-line ceramic housing according to claim 1, wherein: both sides of casing (1) inner wall have all seted up spout (14), the inner wall of spout (14) and arch (122) sliding connection at mounting panel (12) both ends, draw-in groove (141) have been seted up on the inner wall of spout (14), two be equipped with stopper (142) between draw-in groove (141).

4. A dual in-line ceramic housing according to claim 1, wherein: threaded holes (123) are formed in the two sides of the top of the mounting plate (12), and mounting rings (124) are connected to the inner wall of each threaded hole (123) in a threaded mode.

5. A dual in-line ceramic housing according to claim 1, wherein: bonding points are arranged on the bosses (23).

6. A dual in-line ceramic package according to claim 2, wherein: radiating grooves (351) are formed in the two sides of the top of the cover plate (35), and radiating nets (352) are fixedly mounted on the inner walls of the radiating grooves (351).

7. A dual in-line ceramic housing according to claim 1, wherein: the top fixed mounting of casing (1) has two sets of dead lever (15), and is two sets of the surface of dead lever (15) all rotates and is connected with limiting plate (151), the bottom of limiting plate (151) is connected with the top contact of apron (35).

8. A dual in-line ceramic housing according to claim 1, wherein: one group of the pins (13) consists of a connector (4) and a combined pin (41), and the other group of the pins (13) consists of a connector (4) and a single pin (42).