CN217279471U - Computer mainframe capable of circularly radiating - Google Patents

Computer mainframe capable of circularly radiating Download PDF

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Publication number
CN217279471U
CN217279471U CN202220415387.7U CN202220415387U CN217279471U CN 217279471 U CN217279471 U CN 217279471U CN 202220415387 U CN202220415387 U CN 202220415387U CN 217279471 U CN217279471 U CN 217279471U
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China
Prior art keywords
heat dissipation
heat
water
case
frame
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Expired - Fee Related
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CN202220415387.7U
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Chinese (zh)
Inventor
何凯
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Guizhou Economic And Trade Vocational And Technical College
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Individual
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The utility model discloses a computer mainframe box capable of circularly radiating, relating to the technical field of computers, comprising a case, wherein an auxiliary radiating mechanism is arranged at the back surface of a mounting plate, the auxiliary radiating mechanism comprises a water cooling mechanism and a heat exchange mechanism, the water cooling mechanism is fixedly arranged at the upper side of the back surface of the mounting plate and faces the inside of the case, and the heat exchange mechanism is arranged below the water cooling mechanism and is connected with a hose; the water cooling mechanism comprises a heat dissipation plate, the heat dissipation plate is fixedly arranged on the back surface of the mounting plate, and a heat dissipation coil is arranged in the middle of the heat dissipation plate; the utility model provides a, through supplementary heat dissipation mechanism, computer mainboard installs on water-cooling mechanism, and water-cooling mechanism and heat transfer mechanism mutually support, with the heat dissipation of coolant liquid circulation flow to the cooling of coolant liquid, the cooling efficiency of improvement device that can be very big can provide the circulation heat dissipation that lasts for the device, and radiating fin on a plurality of rectangle distributive pipes is to quick-witted case protrusion and outside air abundant contact, accelerates heat transfer efficiency.

Description

Computer mainframe capable of circularly radiating
Technical Field
The utility model relates to a computer technology field especially relates to a radiating computer mainframe circulates.
Background
The computer is commonly called as computer, is a modern electronic computing machine for high-speed computation, can perform numerical computation and logic computation, and also has the function of storage and memory. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed. The chassis is used as a part of computer accessories and has the main function of placing and fixing the computer accessories, thereby having a supporting and protecting function.
The existing case generally adopts air-cooled heat dissipation or water-cooled heat dissipation, the water-cooled heat dissipation conveys cooling liquid into the case for heat exchange through a water pump and a connecting pipe, and then the cooling liquid is blown by an internal fan for cooling.
SUMMERY OF THE UTILITY MODEL
The utility model provides a radiating computer mainframe circulates has solved the above-mentioned technical problem who proposes.
In order to solve the technical problem, the utility model provides a computer mainframe box capable of circularly radiating, which comprises a case, wherein two foot pads are symmetrically arranged at the bottom of the case, a mounting plate is arranged on the front end face of the case, an air inlet communicated with the inside of the case is formed in the middle of the mounting plate, an upper radiating frame is arranged at the top of the case, an auxiliary radiating mechanism is arranged at the back of the mounting plate, the auxiliary radiating mechanism comprises a water cooling mechanism and a heat exchange mechanism, the water cooling mechanism is fixedly arranged at the upper side of the back of the mounting plate and faces the inside of the case, and the heat exchange mechanism is arranged below the water cooling mechanism and connected with a hose; the water cooling mechanism comprises a heat dissipation plate, the heat dissipation plate is fixedly installed on the back face of the installation plate, a heat dissipation coil is installed in the middle of the heat dissipation plate, and a water inlet connector and a water outlet connector are connected to two ends of the heat dissipation coil in a through mode; the heat exchange mechanism comprises a heat exchange frame, wherein the two opposite side ends of the heat exchange frame are in through connection with a water inlet pipe and a water outlet pipe, a water pump is arranged at a position close to the water inlet pipe, a fan frame is fixedly arranged on the back of the heat exchange frame, a ventilation opening penetrates through the middle of the heat exchange frame, a plurality of rectangular distributive pipes are uniformly connected to the ventilation opening, and radiating fins are fixedly connected to the upper ends of the rectangular distributive pipes.
Preferably, the heat dissipation coil is made of aluminum alloy, is hollow and is in a snake-shaped bent shape.
Preferably, the water inlet joint is connected with the water outlet pipe orifice through a hose, and the water outlet joint hose is connected with the water inlet pipe orifice.
Preferably, the heat exchange frame is hollow and is in through connection with the plurality of rectangular water distribution pipes.
Preferably, the radiating fins are wavy and made of aluminum alloy.
Preferably, the heat dissipation plate is provided with a computer mainboard, and the fan frame is internally provided with a fan.
Preferably, the lower side of the mounting plate is provided with a heat dissipation opening in a penetrating manner, and the plurality of rectangular water distribution pipes of the heat exchange frame and the connected heat dissipation fins protrude out of the case from the heat dissipation opening.
Preferably, the fan is fixedly installed inside the upper heat dissipation frame, and filter screens are fixedly installed on two sides of the upper heat dissipation frame.
Compared with the prior art, the utility model provides a pair of radiating computer mainframe circulates has following beneficial effect:
the utility model provides a, through supplementary heat dissipation mechanism, the computer mainboard is installed on water cooling mechanism, and water cooling mechanism and heat transfer mechanism mutually support, with the heat dissipation of coolant liquid circulation flow to the coolant liquid cooling, the cooling efficiency of improvement device that can be very big can provide the circulation heat dissipation that lasts for the device, and radiating fin on a plurality of rectangle distributive pipes is to quick-witted outer protrusion and outside air abundant contact, accelerates heat transfer efficiency.
The utility model provides a, through the effect of last heat dissipation frame internal fan, take the gas of quick-witted incasement portion out, send into the inside of quick-witted case with the external gas by the air intake again, through steam to the principle that rises, can be quick take the heat out, make the effect that the internal gas formed the circulation and removed.
Drawings
FIG. 1 is an overall view of the present invention;
FIG. 2 is a schematic diagram of the overall explosion of the present invention;
FIG. 3 is a view showing the water cooling mechanism of the present invention;
fig. 4 is a schematic view of the heat exchange mechanism of the present invention.
Reference numbers in the figures: 1. a chassis; 2. a foot pad; 3. an auxiliary heat dissipation mechanism; 4. an air inlet; 5. mounting a plate; 6. an upper heat dissipation frame; 31. a water cooling mechanism; 311. a heat-dissipating coil; 312. a heat dissipation plate; 313. a water inlet joint; 314. a water outlet joint; 32. a heat exchange mechanism; 321. a fan frame; 322. a water pump; 323. a water inlet pipe orifice; 324. a heat exchange rack; 3241. a heat dissipating fin; 3242. a rectangular shunt pipe; 325. a water outlet pipe orifice.
Detailed Description
In the first embodiment, as shown in fig. 1-4, the utility model discloses a case 1, two pads 2 are symmetrically installed at the bottom of case 1, a mounting plate 5 is installed on the positive end surface of case 1, and an air inlet 4 is opened in the middle of mounting plate 5 to communicate with the inside of case 1, an upper heat dissipation frame 6 is installed at the top of case 1, an auxiliary heat dissipation mechanism 3 is installed on the back surface of mounting plate 5, auxiliary heat dissipation mechanism 3 includes a water cooling mechanism 31 and a heat exchange mechanism 32, water cooling mechanism 31 is fixedly installed on the upper side of the back surface of mounting plate 5 and faces the inside of case 1, and heat exchange mechanism 32 is installed below water cooling mechanism 31 and connected with a hose; the water cooling mechanism 31 comprises a heat dissipation plate 312, the heat dissipation plate 312 is fixedly installed on the back surface of the installation plate 5, a heat dissipation coil 311 is installed in the middle of the heat dissipation plate 312, and two ends of the heat dissipation coil 311 are connected with a water inlet joint 313 and a water outlet joint 314 in a penetrating manner; the heat exchange mechanism 32 comprises a heat exchange frame 324, wherein two opposite side ends of the heat exchange frame 324 are in through connection with a water inlet pipe 323 and a water outlet pipe 325, a water pump 322 is arranged at a position close to the water inlet pipe 323, a fan frame 321 is fixedly arranged on the back surface of the heat exchange frame 324, a ventilation opening penetrates through the middle of the heat exchange frame 324, a plurality of rectangular water distribution pipes 3242 are uniformly connected at the ventilation opening, and the upper ends of the rectangular water distribution pipes 3242 are fixedly connected with radiating fins 3241; the heat dissipation coil 311 is made of aluminum alloy, and is hollow and bent in a serpentine shape; the water inlet joint 313 is connected with the water outlet pipe orifice 325 through a hose, and the water outlet joint 314 hose is connected with the water inlet pipe orifice 323; the heat exchange frame 324 is hollow and is connected with the plurality of rectangular water distribution pipes 3242 in a penetrating way; the radiating fins 3241 are wavy and made of aluminum alloy; the heat dissipation plate 312 is provided with a computer motherboard, and the fan rack 321 is provided with a fan; a heat dissipation port is formed through the lower side of the mounting plate 5, and the plurality of rectangular water distribution pipes 3242 and the connected heat dissipation fins 3241 of the heat exchange frame 324 protrude from the heat dissipation port to the outside of the enclosure 1.
The computer mainboard is fixed on the outer surface of the heat dissipation plate 312, after heat is generated, the cooling liquid is driven by the water pump 322 to circularly flow, the cooling liquid flows into the inside of the heat dissipation coil 311, after the heat on the heat dissipation plate 312 is absorbed, the heated cooling liquid is conveyed into the heat exchange frame 324 and enters the plurality of rectangular distributive pipes 3242, the plurality of rectangular distributive pipes 3242 are blown by a fan inside the fan frame 321, the plurality of rectangular distributive pipes 3242 are provided with the heat dissipation fins 3241 in the shape of waves and fully contact with air, the heat dissipated by the plurality of rectangular distributive pipes 3242 is fully blown out for heat exchange, and the cooled cooling liquid is re-input into the heat dissipation coil 311 for circular heat absorption.
In the second embodiment, on the basis of the first embodiment, the fan is fixedly installed inside the upper heat dissipation frame 6, and the filter screens are fixedly installed on both sides of the upper heat dissipation frame 6;
wherein, go up the inside square groove of heat dissipation frame 6 card income roof, through the effect of the inside fan of last heat dissipation frame 6, take out the inside gas of quick-witted case 1, send into the inside of quick-witted case 1 with outside gas by air intake 4 again, through the principle that steam rises to the top, can be quick take the heat out, make inside gas form the effect of circulating movement.
The working principle is as follows:
when the cooling device is installed, the upper heat dissipation frame 6 is clamped in a square groove in the top plate, air in the case 1 is extracted under the action of a fan in the upper heat dissipation frame 6, external air is sent into the case 1 through the air inlet 4, heat can be rapidly brought out through the principle that hot air rises upwards, so that the internal air forms the circulating movement effect, the computer mainboard is fixed on the outer surface of the heat dissipation plate 312, after heat is generated, cooling liquid is driven to flow circularly through the water pump 322 to flow into the heat dissipation coil 311, after the heat on the heat dissipation plate 312 is absorbed, the heated cooling liquid is conveyed into the heat exchange frame 324 and enters the rectangular water diversion pipes 3242, the rectangular water diversion pipes 3242 are blown by the fan in the fan frame 321, the rectangular water diversion pipes 3242 are provided with the wave-shaped heat dissipation fins 3241 which are fully contacted with the air, the heat that gives off a plurality of rectangle distributive pipes 3242 fully blows out the heat transfer, and the refrigerated coolant liquid inputs the heat absorption of circulation in the heat dissipation coil 311 again, through heat transfer frame 324 and heating panel 312 with fan rack 321's cooperation, the cooling efficiency of improvement device that can be very big can provide the circulation heat dissipation that lasts for the device to radiating fin 3241 on a plurality of rectangle distributive pipes 3242 is to the outer protrusion of quick-witted case 1 fully contact with the outside air for heat exchange efficiency.

Claims (8)

1. The utility model provides a radiating computer mainframe can circulates, includes quick-witted case (1), two pad foot (2) are installed to quick-witted case (1) bottom symmetry, mounting panel (5) are installed to quick-witted case (1) positive terminal surface, and the middle part of mounting panel (5) has seted up air intake (4) and has link up its characterized in that with quick-witted case (1) inside: an upper heat dissipation frame (6) is installed at the top of the case (1), an auxiliary heat dissipation mechanism (3) is installed on the back surface of the installation plate (5), the auxiliary heat dissipation mechanism (3) comprises a water cooling mechanism (31) and a heat exchange mechanism (32), the water cooling mechanism (31) is fixedly installed on the upper side of the back surface of the installation plate (5) and faces the inside of the case (1), and the heat exchange mechanism (32) is installed below the water cooling mechanism (31) and connected with a hose; the water cooling mechanism (31) comprises a heat dissipation plate (312), the heat dissipation plate (312) is fixedly installed on the back face of the installation plate (5), a heat dissipation coil (311) is installed in the middle of the heat dissipation plate (312), and a water inlet connector (313) and a water outlet connector (314) are connected to two ends of the heat dissipation coil (311) in a penetrating mode; heat transfer mechanism (32) are including heat transfer frame (324), heat transfer frame (324) opposite both sides end through connection has water inlet pipe mouth (323) and water outlet pipe mouth (325), and is close to water inlet pipe mouth (323) position department and installs water pump (322), heat transfer frame (324) back fixed mounting has fan frame (321), and has run through the vent in heat transfer frame (324) middle part, vent department evenly is connected with a plurality of rectangle distributive pipes (3242), and a plurality of rectangle distributive pipes (3242) upper end fixedly connected with radiating fin (3241).
2. The computer mainframe box according to claim 1, wherein the heat dissipation coil (311) is made of aluminum alloy, and is hollow and has a serpentine shape.
3. A computer main cabinet capable of dissipating heat circularly as claimed in claim 1, wherein the water inlet connector (313) is connected to the water outlet nozzle (325) through a hose, and the water outlet connector (314) is connected to the water inlet nozzle (323).
4. The computer mainframe box capable of dissipating heat circularly as claimed in claim 1, wherein the heat exchanging rack (324) is hollow inside and connected with a plurality of rectangular water diversion pipes (3242) in a penetrating manner.
5. The computer mainframe box with circulation heat dissipation function as claimed in claim 1, wherein said heat dissipation fins (3241) are corrugated and made of aluminum alloy.
6. The computer main case with heat dissipation circulation of claim 1, wherein the heat dissipation plate (312) is installed with a computer motherboard, and the fan housing (321) is installed with a fan.
7. The computer mainframe box capable of circularly dissipating heat according to claim 1, wherein a heat dissipating port is formed through the lower side of the mounting plate (5), and a plurality of rectangular water distribution pipes (3242) and connected heat dissipating fins (3241) of the heat exchanging rack (324) protrude from the heat dissipating port to the outside of the computer case (1).
8. The computer mainframe box capable of circularly dissipating heat according to claim 1, wherein a fan is fixedly installed inside the upper heat dissipation frame (6), and a filter screen is fixedly installed on both sides of the upper heat dissipation frame (6).
CN202220415387.7U 2022-02-28 2022-02-28 Computer mainframe capable of circularly radiating Expired - Fee Related CN217279471U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220415387.7U CN217279471U (en) 2022-02-28 2022-02-28 Computer mainframe capable of circularly radiating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220415387.7U CN217279471U (en) 2022-02-28 2022-02-28 Computer mainframe capable of circularly radiating

Publications (1)

Publication Number Publication Date
CN217279471U true CN217279471U (en) 2022-08-23

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Application Number Title Priority Date Filing Date
CN202220415387.7U Expired - Fee Related CN217279471U (en) 2022-02-28 2022-02-28 Computer mainframe capable of circularly radiating

Country Status (1)

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CN (1) CN217279471U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117535139A (en) * 2023-11-17 2024-02-09 渥宝科技(上海)有限公司 Cell counter with circulating water cooling structure and circulating water cooling method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117535139A (en) * 2023-11-17 2024-02-09 渥宝科技(上海)有限公司 Cell counter with circulating water cooling structure and circulating water cooling method
CN117535139B (en) * 2023-11-17 2024-06-11 渥宝科技(上海)有限公司 Cell counter with circulating water cooling structure and circulating water cooling method

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20221009

Address after: 558000 room 61, floor 12, unit 2, huaxinwan phase II, Duyun Development Zone, Qiannan Buyei and Miao Autonomous Prefecture, Guizhou Province

Patentee after: Guizhou Economic and Trade Vocational and Technical College

Address before: 558000 room 61, floor 12, unit 2, huaxinwan phase II, Duyun Development Zone, Qiannan Buyei and Miao Autonomous Prefecture, Guizhou Province

Patentee before: He Kai

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20220823