CN217157237U - Intelligent logistics big data processing platform - Google Patents

Abstract

The utility model discloses an intelligent logistics big data processing platform, belonging to the technical field of big data processing servers, comprising a server box body, the bottom end in the server box body is provided with a heat radiating unit through a bolt, two sides of the upper end of the inner wall of the server box body are provided with radiators through bolts, the rear end of the server box body is provided with a hard disk storage box through a bolt, and the server box also comprises fixing devices arranged at two sides of the lower end of the inner wall of the server box body, a placing device which is detachably arranged in the fixing device, and a main board which is detachably arranged at the upper end of the placing device, and demountable installation is at the heat absorbing device in the middle of the inner wall of the server box body, the utility model discloses reach and to increase heat dispersion, increase the life of server, prevent the effect that the server burns out, and reach the effect that the convenience was installed and was dismantled the inside device of server box body.

Description

Intelligent logistics big data processing platform

Technical Field

The utility model relates to a big data processing server technical field especially relates to an intelligent commodity circulation big data processing platform.

Background

Intelligent logistics utilizes integrated intelligent technology, makes logistics system can imitate people's intelligence, has thinking, perception, study, the ability of reasoning judgement and some problems in the commodity circulation of solving by oneself, and four characteristics will be reflected in the future development of intelligent commodity circulation: intelligentization, integration, layering, flexibility and socialization, and intelligentization of a large number of operations and decisions in the logistics operation process; the logistics management is used as a core, the integration of links such as transportation, storage, packaging, loading and unloading in the logistics process and the layering of an intelligent logistics system are realized, and four intelligent mechanisms of the intelligent logistics system, namely an intelligent information acquisition technology, an intelligent transmission technology, an intelligent processing technology and an intelligent application technology are adopted.

The big data processing platform is suitable for computers and corollary equipment thereof in the technical field of computer science.

The server is a computer, which runs faster, has higher load and is more expensive than a common computer, provides computing or application service for other clients in the network, and has high-speed CPU computing capability, long-time reliable running, strong I/O external data throughput capability and better expansibility.

The existing big data processing server can generate larger power consumption due to the need of processing larger data, and the CPU load is enabled to operate, so that the CPU and other devices connected on a mainboard generate larger heat, the heat generated by the existing blowing heat dissipation and non-effective processing can be generated, the service life of the server is prolonged, the server is easily burnt out, and the existing server is inconvenient to install internal devices due to more devices.

Therefore, based on the above technical problems, it is necessary for those skilled in the art to develop an intelligent logistics big data processing platform.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an intelligent commodity circulation big data processing platform.

In order to achieve the above object, the present invention provides the following technical solutions:

the utility model discloses an intelligent commodity circulation big data processing platform, include: the server box body is characterized by comprising a server box body, fixing devices, a placing device, a main board, a heat absorbing device and a CPU heat radiating device, wherein the bottom end inside the server box body is provided with the heat radiating unit through a bolt, two sides of the upper end of the inner wall of the server box body are provided with the heat radiators through bolts, and the rear end of the server box body is provided with a hard disk storage box through bolts;

the heat absorbing device comprises a limiting frame, the limiting frame is installed on two sides of the middle of the inner wall of the server box body through bolts, a heat conducting silica gel plate is detachably installed inside the limiting frame, heat conducting holes are formed in the periphery of the surface of the heat conducting silica gel plate, heat radiating fins are stored at the left end of the bottom of the heat conducting silica gel plate, a clamping plate is arranged in the middle of the bottom of the heat conducting silica gel plate, power supply box radiating fins are arranged at the right end of the bottom of the heat conducting silica gel plate, heat radiating water cooling pipes are installed at two ends of the surface of the heat conducting silica gel plate, and the heat radiating water cooling pipes are connected with a radiator at the left end of the inner wall of the server box body.

Furthermore, the upper end of the outer wall of the server box body is detachably provided with a cover plate, and heat dissipation holes are formed in the periphery of the outer wall of the server box body.

Further, fixing device includes the mount, the mount passes through the bolt and installs the lower extreme both sides at server box inner wall, the mount is run through by the inserted sheet, the nest of plates is run through to the bottom of inserted sheet, nest of plates demountable installation is in the bottom of mount, the front end both sides of mount are rotated and are connected fixedly and collude.

Further, the placing device comprises a placing plate, fixing columns are arranged at two ends of the inside of the placing plate, and the inside of each fixing column is fixedly hooked.

Furthermore, through holes are formed in the periphery of the surface of the placing plate, air guide sheets are mounted in the middles of two ends of the surface of the placing plate through bolts, the other ends of the air guide sheets are mounted on the inner wall of the server box body through bolts, and mounting blocks are mounted at two ends of the surface of the placing plate through bolts.

Further, mainboard demountable installation is between the installation piece, mainboard surface left end demountable installation DRAM, demountable installation CPU in the middle of the surface of mainboard, the surperficial right-hand member demountable installation power pack of mainboard.

Furthermore, the memory bank is inserted into the memory bank radiating fin, the surface of the CPU is contacted with the CPU radiating device, and the power supply box is inserted into the power supply box radiating fin.

Furthermore, the hot water cold pipes are arranged into two groups, the left end of the hot water cold pipe at the front end is provided with a water inlet, the left end of the hot water cold pipe at the rear end is provided with a water outlet, and the water inlet and the water outlet are both connected with the radiator at the left end of the inner wall of the server box body.

Furthermore, the CPU heat dissipation device comprises a heat conduction graphite sheet, a CPU water cooling pipe is arranged on the surface of the heat conduction graphite sheet, the CPU water cooling pipe is circular, a water cooling inlet pipe is arranged at the left end of the CPU water cooling pipe, a water cooling outlet pipe is arranged in the middle of the CPU water cooling pipe, and a limiting cover is detachably mounted on the surface of the heat conduction graphite sheet.

Furthermore, the water-cooling inlet pipe and the water-cooling outlet pipe are both connected with the radiator at the right end of the inner wall of the server box body, and the inner wall of the limiting cover is in contact with the outer wall of the CPU water-cooling pipe.

In the technical scheme, the utility model provides a pair of big data processing platform of intelligent commodity circulation has following beneficial effect:

the utility model discloses a fixing device can conveniently dismantle the installation to the placer to conveniently carry out the effect of operation;

the inside of the fixing column is hooked by the fixing hook, so that the placing plate is fixed inside the fixing frame, and the placing plate is convenient to detach and mount;

the heat sink of the memory bank is in contact with the memory bank at the left end of the main plate, so that heat is absorbed around the memory bank, and the heat is led into the heat-conducting silica gel plate through the heat sink of the memory bank, so that the heat of the memory bank is conducted, and the heat accumulation of the memory bank is prevented;

the radiating fins of the power supply box are in contact with the power supply box at the right end of the mainboard, so that the radiating fins of the power supply box can absorb heat around the power supply box, and the heat of the radiating fins of the power supply box is absorbed by the heat-conducting silica gel plate, so that the heat is conducted on the power supply box, and the heat discharged from the power supply box is prevented from being accumulated;

the heat is absorbed and taken away through the heat-dissipating water-cooling pipe on the surface of the heat-conducting silica gel plate, and the heat-dissipating liquid with heat flows to the heat sink at the left end of the inner wall of the server box body, so that the heat-dissipating liquid with heat is dissipated through the heat sink at the left end of the inner wall of the server box body, and then the heat-dissipating liquid after heat dissipation is continuously led into the heat-dissipating water-cooling pipe, so that the water-cooling heat dissipation is realized, the heat in the heat-conducting silica gel plate is led out, the heat is dissipated to the heat-conducting silica gel plate, the heat of a memory bar, a power supply box and other devices on the surface of the mainboard is greatly reduced, and the device burnout is prevented;

the heat of the CPU is absorbed by the heat-conducting graphite sheet through the contact of the heat-conducting graphite sheet and the CPU water-cooling pipe, so that the heat is taken away, and the effect of water-cooling heat dissipation is achieved on the CPU;

set up to circular through the CPU water-cooling tube, the CPU water-cooling tube covers the heat conduction graphite flake to increase the area of contact with the heat conduction graphite flake, and then can increase the thermal diffusivity to the heat conduction graphite flake.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.

Fig. 1 is a schematic view of an overall front view cross-sectional structure provided in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a server box provided in an embodiment of the present invention;

fig. 3 is an enlarged view of the area a in fig. 1 according to an embodiment of the present invention;

fig. 4 is a schematic top view of a placement device according to an embodiment of the present invention;

fig. 5 is a schematic structural view of an air guiding plate according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a mounting block according to an embodiment of the present invention;

fig. 7 is a schematic structural view of a CPU heat dissipation device according to an embodiment of the present invention;

fig. 8 is a schematic top view of a heat conductive graphite sheet according to an embodiment of the present invention;

fig. 9 is an enlarged view of region B of fig. 1 according to an embodiment of the present invention;

fig. 10 is a schematic bottom view of a heat absorber device according to an embodiment of the present invention;

fig. 11 is a schematic top view of a heat sink according to an embodiment of the present invention.

Description of reference numerals: the server box body 1, a cover plate 11, a heat dissipation hole 12, a heat dissipation unit 2, a fixing device 3, a fixing frame 31, an insertion sheet 32, a sleeve sheet 33, a fixing hook 34, a placing device 4, a placing plate 41, a fixing column 42, a through hole 43, an air guide sheet 44, a mounting block 45, a main board 5, a memory bank 51, a CPU52, a power box 53, a heat absorption device 6, a limiting frame 61, a heat conduction silica gel plate 62, a heat conduction hole 63, a memory bank radiating fin 64, a clamping plate 65, a power box radiating fin 66, a heat dissipation water cooling pipe 67, a water inlet 68, a water outlet 69, a CPU heat dissipation device 7, a heat conduction graphite sheet 71, a CPU water cooling pipe 72, a water cooling inlet pipe 73, a water cooling outlet pipe 74, a limiting cover 75, a heat radiator 8 and a hard disk storage box 9.

Detailed Description

In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 11;

the utility model discloses an intelligent commodity circulation big data processing platform, include: the system comprises a server box body 1, a heat dissipation unit 2, a fixing device 3, a placing device 4, a mainboard 5, a heat absorption device 6, a CPU heat dissipation device 7, a radiator 8 and a hard disk storage box 9.

Preferably, the hard disk storage box 9 is detachably mounted at the rear end inside the server box body 1, the internal components of the server can be mounted through the server box body 1, the server box body 1 comprises a cover plate 11 and heat dissipation holes 12, the cover plate 11 is detachably mounted at the upper end of the outer wall of the server box body 1, the server box body 1 can be sealed by the cover plate 11 to prevent the internal devices from falling out, the periphery of the outer wall of the server box body 1 is provided with heat dissipation holes 12, the heat dissipation holes 12 can transfer the heat inside, the heat dissipation unit 2 is installed at the bottom end inside the server box 1 through bolts, the cooling air outside the server box body 1 is blown into the interior through the heat radiating unit 2 to perform the effect of air cooling and heat radiation, through the inside rear end demountable installation hard disk storage box 9 of server box 1, can install hard disk storage box 9, conveniently save data.

Preferably, the placing device 4 is detachably mounted inside the fixing device 3, the placing device 4 can be conveniently detached and mounted through the fixing device 3, so that the operation is convenient, the fixing device 3 comprises a fixing frame 31, inserting pieces 32, a sleeve piece 33 and a fixing hook 34, the fixing frame 31 is mounted on two sides of the lower end of the inner wall of the server box body 1 through bolts, the fixing effect is achieved, the fixing frame 31 is prevented from falling off, the fixing frame 31 is penetrated through by the inserting pieces 32, the blocking and limiting effects are achieved, the placing plate 41 is convenient to clamp, the sleeve piece 33 penetrates through the bottom of the inserting piece 32, the limiting effect is achieved, the inserting piece 32 can be fixed, the inserting piece 32 is prevented from falling off, the sleeve piece 33 is detachably mounted at the bottom of the fixing frame 31, the fixing effect is achieved, the sleeve piece 33 is fixed, the stability of the inserting piece 32 is improved, two sides of the front end of the fixing frame 31 are rotatably connected with the fixing hook 34, play spacing effect, collude the fixed column 42 outer wall that places board 41 both ends through fixed colluding 34 to placing board 41 spacing, prevent to place board 41 and remove and the skew, and the convenient effect to the dismantlement and the installation of placing board 41.

Preferably, the placement device 4 is detachably mounted inside the fixing frame 31, the motherboard 5 can be detached and mounted by the placement device 4, and the heat dissipation unit 2 can blow cold air through the bottom of the motherboard 5 and conduct heat out of the inside of the server box 1, the placement device 4 includes a placement plate 41, fixing posts 42, through holes 43, air deflectors 44 and mounting blocks 45, the fixing posts 42 are disposed at two ends of the inside of the placement plate 41, the fixing posts 42 are hooked by the fixing hooks 34, so that the placement plate 41 is fixed inside the fixing frame 31, the placement plate 41 is convenient to detach and mount, the through holes 43 are disposed around the surface of the placement plate 41, the cold air can be blown through the through holes 43 by the heat dissipation unit 2, so that the cold air is blown to the bottom of the motherboard 5 to dissipate heat from the bottom of the motherboard 5, the air deflectors 44 are mounted by bolts in the middle of two ends of the surface of the placement plate 41, the other end of guide vane 44 passes through the bolt and installs the inner wall at server box 1, rethread guide vane 44 sets up to the inclined plane, thereby make the cold wind that blows to mainboard 5 when the backward flow, can be derived server box 1 through guide vane 44, thereby increase the thermal diffusivity, prevent that server box 1 from being burnt out the effect when handling big data, place board 41's surperficial both ends and install installation piece 45 through the bolt, through the inside at installation piece 45 with mainboard 5 card, and through the bolt fastening, can be convenient dismantle and install mainboard 5, the effect of conveniently operating mainboard 5.

Preferably, the heat absorbing device 6 is arranged in the middle of the inside of the server box 1, the heat absorbing device 6 can absorb heat to the memory strip 51 and the power box 53 on the surface of the mainboard 5 and other devices, and the heat is led out through the hot water cooling pipe 67, the heat absorbing device 6 comprises a limiting frame 61, a heat conducting silica gel plate 62, a heat conducting hole 63, a memory strip radiating fin 64, a clamping plate 65, a power box radiating fin 66, a radiating water cooling pipe 67, a water inlet 68 and a water outlet 69, the limiting frame 61 is arranged on two sides of the middle of the inner wall of the server box 1 through bolts to play a fixing role, the heat conducting silica gel plate 62 is detachably arranged through the inside of the limiting frame 61, so that the heat conducting silica gel plate 62 is conveniently detached and installed, the heat conducting silica gel plate 62 is prevented from dropping and moving, the heat conducting holes 63 are arranged on the periphery of the surface of the heat conducting silica gel plate 62, the heat can be led out through the heat conducting holes, the heat accumulation is prevented, the memory bank heat sink 64 at the left end of the bottom of the heat-conducting silica gel plate 62 is in contact with the memory bank 51 at the left end of the mainboard 5 through the memory bank heat sink 64 so as to absorb heat around the memory bank 51 and lead the heat into the heat-conducting silica gel plate 62 through the memory bank heat sink 64 so as to conduct heat to the memory bank 51 and prevent the heat accumulation of the memory bank 51, the clamping plate 65 is arranged in the middle of the bottom of the heat-conducting silica gel plate 62 and can clamp the CPU heat dissipation device 7 through the clamping plate 65 so as to prevent the CPU heat dissipation device 7 from falling off and facilitate the CPU heat dissipation device 7 to be in contact with the CPU52, the power box heat sink 66 is arranged at the right end of the bottom of the heat-conducting silica gel plate 62 and is in contact with the power box 53 at the right end of the mainboard 5 through the power box heat sink 66 so that the heat around the power box heat sink 66 can absorb the heat around the power box heat, and the heat of the power box heat sink 66 is absorbed by the heat-conducting silica gel plate 62, thereby conducting heat to the power box 53, preventing heat from accumulating from the power box 53, installing heat-dissipating water-cooling pipes 67 at two ends of the surface of the heat-conducting silica gel plate 62, enabling the heat-dissipating liquid to absorb and flow the heat in the heat-conducting silica gel plate 62 through the heat-dissipating water-cooling pipes 67, thereby reducing the heat in the heat-conducting silica gel plate 62, further achieving the heat-dissipating effect, setting two groups of heat-dissipating water-cooling pipes 67 through the heat-conducting water-cooling pipes 67, arranging a water inlet 68 at the left end of the front-end hot water-cooling pipe 67, arranging a water outlet 69 at the left end of the rear-end hot water-cooling pipe 67, connecting the heat sink 8 at the left end of the inner wall of the server box 1 through the water inlet 68 and the water outlet 69, enabling the heat-dissipating water-cooling pipes 67 on the surface of the heat-conducting silica gel plate 62 to absorb and take away the heat, enabling the heat-dissipating liquid with heat to flow to the heat sink 8 at the left end of the inner wall of the server box 1, thereby dissipating liquid with heat is dissipated through the heat sink 8 at the left end of the inner wall of the server box 1, the inside of the leading-in heat dissipation water-cooling pipe 67 of radiating liquid after will dispel the heat again, thereby reach the water-cooling heat dissipation, and derive the inside heat of heat conduction silica gel board 62, dispel the heat to heat conduction silica gel board 62, and then reduce the heat of DRAM 51 and power pack 53 and other devices on mainboard 5 surface by a wide margin, prevent the effect that the device burns out, wherein heat conduction silica gel board 62 can effectively promote heat transfer efficiency, still play simultaneously insulating, the shock attenuation, effect such as sealed, can adsorb the heat of DRAM fin 64 and power pack fin 66.

Preferably, the bottom of the CPU heat sink 7 contacts the surface of the CPU52, the CPU52 can be conducted heat by the CPU heat sink 7, and can transmit and dissipate heat, thereby reducing the heat of the CPU52, and preventing the CPU52 from being burned out when processing big data, the CPU heat sink 7 includes a heat conductive graphite sheet 71, a CPU water cooling tube 72, a water cooling inlet tube 73, a water cooling outlet tube 74, and a limit cover 75, the surface of the heat conductive graphite sheet 71 is provided with the CPU water cooling tube 72, the heat of the CPU52 is absorbed by the heat conductive graphite sheet 71 by contacting the CPU52 through the heat conductive graphite sheet 71, and then the heat is taken away through the CPU water cooling tube 72, thereby performing the water cooling effect on the CPU52, the CPU water cooling tube 72 is set to be circular, the CPU water cooling tube 72 covers the heat conductive graphite sheet 71, thereby increasing the contact area with the heat conductive graphite sheet 71, and further increasing the heat dissipation performance of the heat conductive graphite sheet 71, the limit cover 75 can be detachably mounted on the surface of the heat conductive graphite sheet 71, thereby conveniently dismantling and installing the limit cover 75, and then contacting the outer wall of the CPU water-cooling tube 72 through the inner wall of the limit cover 75, thereby enabling the limit cover 75 to limit the CPU water-cooling tube 72, and preventing the CPU water-cooling tube 72 from falling and being damaged, the left end of the CPU water-cooling tube 72 is provided with the water-cooling inlet tube 73, the middle of the CPU water-cooling tube 72 is provided with the water-cooling outlet tube 74, the water-cooling inlet tube 73 and the water-cooling outlet tube 74 penetrate through the heat conduction hole 63 and are both connected with the radiator 8 at the right end of the inner wall of the server box 1, thereby guiding the heat dissipation liquid into the CPU water-cooling tube 72 through the water-cooling inlet tube 73, performing water-cooling heat dissipation on the heat conduction graphite sheet 71, and guiding out through the water-cooling outlet tube 74, so that the heat dissipation liquid absorbing heat enters the radiator 8 connected with the right end of the inner wall of the server box 1, performing heat dissipation on the heat dissipation liquid with heat, thereby achieving the purpose of dissipating the heat conduction graphite sheet 71, further, the CPU52 is radiated to prevent the CPU52 from burning out.

The utility model installs the fixing frame 31 at the two sides of the lower end of the inner wall of the server box body 1 by bolts, then the inserting piece 32 penetrates through the fixing frame 31, the sleeve piece 33 is inserted into the bottom of the fixing frame to fix the inserting piece 32, then the placing plate 41 is placed between the fixing frames 31, the placing plate 41 is placed, then the fixing hook 34 is rotated to make the fixing hook 34 hook into the outer wall of the fixing column 42 to fix the placing plate 41, the wind deflector 44 is installed at the center of the two ends of the placing plate 41 by bolts, then the other end of the wind deflector 44 is installed at the inner wall of the server box body 1, the installing blocks 45 are installed at the two ends of the placing plate 41 by bolts, then the mainboard 5 is placed between the installing blocks 45 and is fixed by bolts, thereby the mainboard is installed, by installing the limiting frame 61 at the two ends of the inner wall of the server box body 1, then the heat-conducting silica gel plate 62 is placed between the limiting frames 61, the position limitation is carried out through the limiting frame 61, at the moment, the memory bank radiating fins 64 are made to contact with the outer wall of the memory bank 51, the power supply box radiating fins 66 are made to contact with the outer wall of the power supply box 53, the heat conducting graphite sheets 71 inside the clamping plates 65 are made to contact with the CPU52, so that the installation of the heat conducting silica gel plates 62 is completed, through connecting one group of radiators 8 with the water outlet 69, connecting the water inlet 68 with the water pump, connecting the other group of radiators 8 with the water cooling outlet pipe 74, connecting the water cooling inlet pipe 73 with the water pump, then installing the radiators 8 on two sides of the upper end of the inner wall of the server box 1, installing the water pump at the rear ends of the two sides of the upper end of the inner wall of the server box 1, then installing the cover plate 11 at the upper end of the outer wall of the server box 1 through the detachable bolt, so that the installation of the server box 1 is completed, and the effects of convenient disassembly and installation of the server box 1 are achieved, and the operation is simple, the heat dissipation unit 2 is started, so that the heat dissipation unit 2 blows air outside the server box body 1 to the bottom of the mainboard 5, and cold air blowing to the mainboard 5 can be guided out of the server box body 1 through the air guide sheet 44 when the cold air flows back, the heat dissipation performance is improved, the heat is absorbed and taken away by the heat dissipation water cooling tube 67 on the surface of the heat conduction silica gel plate 62 by starting the water pump, heat dissipation liquid with heat flows to the radiator 8 at the left end of the inner wall of the server box body 1, so that the heat dissipation liquid with heat is dissipated through the radiator 8 at the left end of the inner wall of the server box body 1, the heat dissipation liquid after heat dissipation is continuously guided into the heat dissipation water cooling tube 67, so that water cooling heat dissipation is achieved, the heat of the CPU52 is absorbed by the heat conduction graphite sheet 71 by contacting the CPU52 through the heat conduction graphite sheet 71, the heat is taken away through the CPU water cooling tube 72, so that the effect of water cooling heat dissipation is achieved for the CPU52, the CPU water cooling tube 72 is set to be circular, the CPU water cooling tube 72 covers the heat conductive graphite sheet 71, so as to increase the contact area with the heat conductive graphite sheet 71, and further increase the heat dissipation performance of the heat conductive graphite sheet 71, and further achieve the effects of increasing the heat dissipation performance, increasing the service life of the server, and preventing the server from being burned out.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.

Claims (10)

1. An intelligent logistics big data processing platform, comprising: the server box body (1), the bottom end inside the server box body (1) is provided with a heat dissipation unit (2) through bolts, the two sides of the upper end of the inner wall of the server box body (1) are provided with radiators (8) through bolts, and the rear end of the server box body (1) is provided with a hard disk storage box (9) through bolts, and the server box body is characterized by further comprising fixing devices (3) arranged on the two sides of the lower end of the inner wall of the server box body (1), a placing device (4) detachably arranged inside the fixing devices (3), a main board (5) detachably arranged on the upper end of the placing device (4), a heat absorption device (6) detachably arranged in the middle of the inner wall of the server box body (1), and a CPU heat dissipation device (7) detachably arranged in the middle of the heat absorption device (6);

heat sink (6) are including spacing (61), both sides in the middle of the inner wall at server box (1) are installed through the bolt in spacing (61), inside demountable installation heat conduction silica gel board (62) of spacing (61), the surface of heat conduction silica gel board (62) is equipped with heat conduction hole (63) all around, bottom left end memory strip fin (64) of heat conduction silica gel board (62), be equipped with splint (65) in the middle of the bottom of heat conduction silica gel board (62), the bottom right-hand member of heat conduction silica gel board (62) is equipped with power pack fin (66), heat dissipation water-cooling tube (67) are installed at the surperficial both ends of heat conduction silica gel board (62), heat dissipation water-cooling tube (67) are connected radiator (8) of server box (1) inner wall left end.

2. The intelligent logistics big data processing platform of claim 1, wherein a cover plate (11) is detachably mounted at the upper end of the outer wall of the server box body (1), and heat dissipation holes (12) are formed in the periphery of the outer wall of the server box body (1).

3. The intelligent logistics big data processing platform of claim 1, wherein the fixing device (3) comprises a fixing frame (31), the fixing frame (31) is installed on two sides of the lower end of the inner wall of the server box body (1) through bolts, the fixing frame (31) is penetrated through by an insertion sheet (32), the bottom of the insertion sheet (32) penetrates through a sleeve sheet (33), the sleeve sheet (33) is detachably installed on the bottom of the fixing frame (31), and two sides of the front end of the fixing frame (31) are rotatably connected with a fixing hook (34).

4. The intelligent logistics big data processing platform according to claim 1, wherein the placing device (4) comprises a placing plate (41), fixing columns (42) are arranged at two ends of the inside of the placing plate (41), and the inside of the fixing columns (42) is hooked by fixing hooks (34).

5. The intelligent logistics big data processing platform according to claim 4, wherein through holes (43) are formed in the periphery of the surface of the placing plate (41), an air guide sheet (44) is installed in the middle of two ends of the surface of the placing plate (41) through bolts, the other end of the air guide sheet (44) is installed on the inner wall of the server box body (1) through bolts, and installation blocks (45) are installed at two ends of the surface of the placing plate (41) through bolts.

6. The intelligent logistics big data processing platform of claim 1, wherein the main board (5) is detachably installed between the installation blocks (45), the memory bank (51) is detachably installed at the left end of the surface of the main board (5), the CPU (52) is detachably installed in the middle of the surface of the main board (5), and the power supply box (53) is detachably installed at the right end of the surface of the main board (5).

7. The intelligent logistics big data processing platform of claim 5, wherein the memory bank (51) is inserted into the memory bank heat sink (64), the CPU (52) surface contacts the CPU heat sink (7), and the power box (53) is inserted into the power box heat sink (66).

8. The intelligent logistics big data processing platform of claim 1, wherein the hot and cold water pipes (67) are arranged in two groups, the left end of the front hot and cold water pipe (67) is provided with a water inlet (68), the left end of the rear hot and cold water pipe (67) is provided with a water outlet (69), and the water inlet (68) and the water outlet (69) are both connected with the radiator (8) at the left end of the inner wall of the server box body (1).

9. The intelligent logistics big data processing platform of claim 1, wherein the CPU heat dissipation device (7) comprises a heat conductive graphite sheet (71), a CPU water cooling pipe (72) is arranged on the surface of the heat conductive graphite sheet (71), the CPU water cooling pipe (72) is arranged in a circular shape, a water cooling inlet pipe (73) is arranged at the left end of the CPU water cooling pipe (72), a water cooling outlet pipe (74) is arranged in the middle of the CPU water cooling pipe (72), and a limit cover (75) is detachably mounted on the surface of the heat conductive graphite sheet (71).

10. The intelligent logistics big data processing platform of claim 9, wherein the water-cooled inlet pipe (73) and the water-cooled outlet pipe (74) are both connected with the radiator (8) at the right end of the inner wall of the server box body (1), and the inner wall of the limit cover (75) is in contact with the outer wall of the CPU water-cooled pipe (72).

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