CN213182635U - Water-cooled computer heat abstractor - Google Patents
Water-cooled computer heat abstractor Download PDFInfo
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- CN213182635U CN213182635U CN202022291702.3U CN202022291702U CN213182635U CN 213182635 U CN213182635 U CN 213182635U CN 202022291702 U CN202022291702 U CN 202022291702U CN 213182635 U CN213182635 U CN 213182635U
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- water
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- mounting plate
- air inlet
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Abstract
The utility model relates to the technical field of heat dissipation devices, in particular to a water-cooled computer heat dissipation device, which comprises a case, an air draft device, an air inlet duct and a heat dissipation assembly; the middle part of the case forms a cavity for installing computer hardware; the left side and the right side of the case are both provided with air inlet ducts; the inner wall of the case is provided with a mounting plate, and the mounting plate is hollow; a partition plate is arranged inside the mounting plate; the partition plate divides the interior of the mounting plate into a water storage cavity and an isolation cavity; the heat dissipation assembly is arranged at the bottom of the case, and a plurality of spiral heat dissipation pipes are arranged inside the heat dissipation assembly; a radiating fan is arranged in the radiating assembly and blows air towards the radiating pipe; the top of the case is provided with an air draft device; the utility model utilizes the water cooling device to reduce the temperature of the whole case, the air draft device is opened to draw air and dissipate heat, thereby achieving the purpose of rapid heat dissipation; set up baffle and isolation chamber simultaneously, reduce the risk that the leakage brought.
Description
Technical Field
The utility model relates to a heat abstractor technical field especially relates to a water-cooled computer heat abstractor.
Background
The computer is commonly called computer, and is a modern electronic computing machine for high-speed computation, which can perform numerical computation, logic computation and memory function. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed. The computer can generate a large amount of heat in the working process, and a heat dissipation device is required to be arranged for heat dissipation; common heat dissipation devices are air-cooled and water-cooled, but water-cooled radiators are prone to water leakage after being used for a long time, and once water leakage occurs, computer hardware can be damaged, and loss which is difficult to estimate is caused.
In order to solve the above problems, the present application provides a water-cooled computer heat dissipation device.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
In order to solve the technical problems existing in the background technology, the utility model provides a water-cooled computer heat dissipation device, which utilizes a water cooling device to reduce the temperature of the whole case, and an air draft device is opened to draw air and dissipate heat, thereby achieving the purpose of rapid heat dissipation; simultaneously, the baffle and the isolation cavity are arranged, so that the risk caused by water leakage is reduced.
(II) technical scheme
In order to solve the technical problem, the utility model provides a water-cooled computer heat dissipation device, which comprises a case, an air draft device, an air inlet duct and a heat dissipation assembly;
the middle part of the case forms a cavity for installing computer hardware; the left side and the right side of the case are both provided with air inlet ducts; a plurality of air inlet cavities are arranged on the air inlet duct at equal intervals; the air inlet cavity is horn-shaped, and the inner diameter of the air inlet cavity is gradually increased from the air inlet end to the air outlet end;
the inner wall of the case is provided with a mounting plate, and the mounting plate is hollow; a partition plate is arranged inside the mounting plate; the partition plate divides the interior of the mounting plate into a water storage cavity and an isolation cavity, and a conduit which is in conduction connection with the heat dissipation assembly is arranged at the bottom of the water storage cavity; one side of the mounting plate facing the interior of the case is provided with an elastic silica gel pad;
the heat dissipation assembly is arranged at the bottom of the case, a plurality of spiral heat dissipation pipes are arranged inside the heat dissipation assembly, a water inlet pipe and a water outlet pipe are respectively arranged at two ends of the heat dissipation assembly, and the water inlet pipe and the water outlet pipe are in conduction connection with the water storage cavity on the mounting plate; a radiating fan is arranged in the radiating assembly and blows air towards the radiating pipe;
the top of the case is provided with an air draft device, the air draft device is provided with a fan, and the fan sucks the gas in the case outwards; a plurality of heat dissipation holes are formed in the shell of the air draft device.
Preferably, the air inlet end and the air outlet end of the air inlet cavity are both provided with filter screens.
Preferably, the mounting plate is provided with a plurality of protruding positioning pins.
Preferably, the inside of keeping apart the chamber is provided with level sensor, and level sensor and host computer signal connection.
Preferably, the inside of the water storage cavity is provided with a circulating pump.
Preferably, the heat dissipation assembly is covered with a dust screen.
Preferably, the casing of the chassis is a heat-conducting metal piece.
The above technical scheme of the utility model has following profitable technological effect:
1. the mounting plate is provided with a plurality of protruding positioning bolts. The positioning bolt is used for being installed with a mainboard of a computer; the raised positioning bolt ensures that the main board is not in direct contact with the mounting plate so as to avoid the phenomenon of conductive short circuit. The mounting panel is provided with elastic silica gel pad towards the one side of quick-witted incasement portion, and the silica gel pad is soft, and silica gel pad heat conduction effect is good, and the silica gel pad is the insulator, and the mainboard is direct to be in contact with the silica gel pad, is convenient for carry out the heat exchange, avoids appearing electrically conductive short circuit phenomenon simultaneously.
2. The inside in isolation chamber is provided with level sensor, and level sensor and host computer signal connection. If the water storage cavity is damaged by the partition plate and water leaks, water enters the isolation cavity, the liquid level sensor detects a liquid level signal and is immediately in signal connection with the upper computer through a signal line to give an alarm; meanwhile, the upper computer controls the power-off of the mainboard and timely informs workers of processing, the isolation cavity plays a role in secondary protection, and water leakage is reduced to cause greater loss.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of the air inlet duct of the present invention;
fig. 3 is a schematic view of the internal structure of the middle chassis of the present invention;
fig. 4 is a schematic structural view of the middle heat dissipation assembly of the present invention.
Reference numerals: 1. an air draft device; 2. heat dissipation holes; 3. a fan; 4. an air inlet duct; 41. an air inlet cavity; 42. Filtering with a screen; 5. a chassis; 51. mounting a plate; 52. positioning bolts; 53. a silica gel pad; 54. a water storage cavity; 55. a partition plate; 56. a liquid level sensor; 6. a heat dissipating component; 61. a heat radiation fan; 62. a radiating pipe; 63. a dust screen.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-4, the present invention provides a water-cooled computer heat dissipation device, which comprises a chassis 5, an air draft device 1, an air inlet duct 4 and a heat dissipation assembly 6;
a cavity for installing computer hardware is formed in the middle of the case 5; the left side and the right side of the case 5 are both provided with air inlet ducts 4; a plurality of air inlet cavities 41 are arranged on the air inlet duct 4 at equal intervals; the air inlet cavity 41 is trumpet-shaped, and the inner diameter of the air inlet cavity 41 is gradually increased from the air inlet end to the air outlet end;
the inner wall of the case 5 is provided with a mounting plate 51, and the mounting plate 51 is hollow; a partition plate 55 is arranged inside the mounting plate 51; the partition plate 55 divides the interior of the mounting plate 51 into a water storage cavity 54 and an isolation cavity, and the bottom of the water storage cavity 54 is provided with a conduit which is in conduction connection with the heat dissipation assembly 6; an elastic silica gel pad 53 is arranged on one side of the mounting plate 51 facing the interior of the case 5;
the heat dissipation assembly 6 is arranged at the bottom of the case 5, a plurality of spiral heat dissipation pipes 62 are arranged inside the heat dissipation assembly 6, a water inlet pipe and a water outlet pipe are respectively arranged at two ends of the heat dissipation assembly 6, and the water inlet pipe and the water outlet pipe are in conduction connection with the water storage cavity 54 on the mounting plate 51; a heat dissipation fan 61 is arranged inside the heat dissipation assembly 6, and the heat dissipation fan 61 blows air towards the heat dissipation pipe 62;
the top of the case 5 is provided with an air draft device, the air draft device is provided with a fan 3, and the fan 3 draws the gas in the case 5 outwards; a plurality of heat dissipation holes 2 are arranged on the shell of the air draft device.
In this embodiment, the air inlet end and the air outlet end of the air inlet chamber 41 are both provided with a filter screen 42.
It should be noted that the filter screen 42 can prevent dust from entering the air inlet chamber 41 from the air inlet end and the air outlet end, so as to prevent the dust from accumulating and affecting the air inlet effect.
In the present embodiment, the mounting plate 51 is provided with a plurality of projecting positioning pins 52.
It should be noted that the positioning bolt 52 is used for mounting with a motherboard of a computer; the raised pegs 52 ensure that the motherboard does not make direct contact with the mounting plate 51, so as to avoid a conductive short circuit. The mounting panel 51 is provided with elastic silica gel pad 53 towards the inside one side of quick-witted case 5, and silica gel pad 53 is soft, and silica gel pad 53 heat conduction effect is good, and silica gel pad 53 is the insulator, and the mainboard is direct to be contacted with silica gel pad 53, is convenient for carry out the heat exchange, avoids appearing electrically conductive short circuit phenomenon simultaneously.
In the embodiment, a liquid level sensor 56 is arranged inside the isolation cavity, and the liquid level sensor 56 is in signal connection with an upper computer.
It should be noted that if the water storage cavity 54 is damaged by the partition plate 55 and water leaks, the water body enters the isolation cavity, and the liquid level sensor 56 detects a liquid level signal and is immediately in signal connection with the upper computer through a signal line to give an alarm; meanwhile, the upper computer controls the power-off of the mainboard and timely informs workers of processing, the isolation cavity plays a role in secondary protection, and water leakage is reduced to cause greater loss.
In this embodiment, the inside of the reservoir chamber 54 is provided with a circulation pump.
In the present embodiment, the heat dissipating member 6 is covered with a dust screen 63.
It should be noted that the dust screen 63 prevents dust from accumulating on the heat pipe 62, so as to prevent heat accumulation from affecting the heat dissipation effect.
In this embodiment, the housing of the chassis 5 is a heat-conducting metal member.
The utility model discloses a theory of operation and use flow: the mainboard is arranged on a positioning bolt 52, and the positioning bolt 52 is used for being arranged with the mainboard of the computer; the raised pegs 52 ensure that the motherboard does not make direct contact with the mounting plate 51, so as to avoid a conductive short circuit. One side of the mounting plate 51 facing the inside of the case 5 is provided with an elastic silica gel pad 53, the silica gel pad 53 is soft, the heat conduction effect of the silica gel pad 53 is good, the silica gel pad 53 is an insulator, and the mainboard is directly contacted with the silica gel pad 53, so that heat exchange is facilitated, and meanwhile, the phenomenon of electric conduction short circuit is avoided; in actual use, the circulation pump circulates the water in the radiating pipe 62 and the water in the water storage cavity 54; after the water absorbs the heat generated by the main board, the temperature is raised; after the water body enters the radiating pipe 62, the radiating fan 61 is started to continuously cool and radiate; ensure that the temperature of the water entering the reservoir chamber 54 is low; meanwhile, the fan 3 of the air draft device 1 at the top is continuously opened to keep the air draft state, so that hot air in the case 5 is quickly dissipated; a liquid level sensor 56 is arranged in the isolation cavity, and the liquid level sensor 56 is in signal connection with an upper computer. If the water storage cavity 54 is damaged by the partition plate 55 and water leaks, water enters the isolation cavity, the liquid level sensor 56 detects a liquid level signal and is immediately in signal connection with an upper computer through a signal line to give an alarm; meanwhile, the upper computer controls the power off of the main board and timely informs workers of processing, the isolation cavity plays a role in secondary protection, and larger loss caused by water leakage is reduced; the utility model utilizes the water cooling device to reduce the temperature of the whole case 5, the air draft device 1 is opened to perform air draft and heat dissipation, and the purpose of rapid heat dissipation is achieved; and meanwhile, the partition plate 55 and the isolation cavity are arranged, so that the risk caused by water leakage is reduced.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (7)
1. A water-cooled computer heat abstractor is characterized by comprising a case (5), an air draft device (1), an air inlet duct (4) and a heat dissipation assembly (6);
the middle part of the case (5) forms a cavity for installing computer hardware; the left side and the right side of the case (5) are both provided with air inlet ducts (4); a plurality of air inlet cavities (41) are arranged on the air inlet duct (4) at equal intervals; the air inlet cavity (41) is horn-shaped, and the inner diameter of the air inlet cavity (41) is gradually increased from the air inlet end to the air outlet end;
the inner wall of the case (5) is provided with a mounting plate (51), and the mounting plate (51) is hollow; a partition plate (55) is arranged inside the mounting plate (51); the partition plate (55) divides the interior of the mounting plate (51) into a water storage cavity (54) and an isolation cavity, and a conduit which is in conduction connection with the heat dissipation assembly (6) is arranged at the bottom of the water storage cavity (54); one side of the mounting plate (51) facing the interior of the case (5) is provided with an elastic silica gel pad (53);
the heat dissipation assembly (6) is arranged at the bottom of the case (5), a plurality of spiral heat dissipation pipes (62) are arranged inside the heat dissipation assembly (6), a water inlet pipe and a water outlet pipe are respectively arranged at two ends of the heat dissipation assembly (6), and the water inlet pipe and the water outlet pipe are in conduction connection with the water storage cavity (54) on the mounting plate (51); a radiating fan (61) is arranged in the radiating assembly (6), and the radiating fan (61) blows air towards the radiating pipe (62);
the top of the case (5) is provided with an air draft device, a fan (3) is arranged on the air draft device, and the fan (3) pumps the gas in the case (5) outwards; a plurality of heat dissipation holes (2) are formed in the shell of the air draft device.
2. The water-cooled computer heat sink according to claim 1, wherein the air inlet end and the air outlet end of the air inlet chamber (41) are provided with a filter screen (42).
3. The water-cooled computer heat sink according to claim 1, wherein a plurality of protruding positioning pins (52) are provided on the mounting plate (51).
4. The water-cooled computer heat sink according to claim 1, wherein a liquid level sensor (56) is disposed inside the isolation chamber, and the liquid level sensor (56) is in signal connection with an upper computer.
5. The water-cooled computer heat sink according to claim 1, wherein a circulation pump is provided inside the water storage chamber (54).
6. The water-cooled computer heat sink according to claim 1, wherein the heat sink assembly (6) is covered with a dust screen (63).
7. The water-cooled computer heat sink according to claim 1, wherein the housing of the chassis (5) is a thermally conductive metal piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022291702.3U CN213182635U (en) | 2020-10-14 | 2020-10-14 | Water-cooled computer heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022291702.3U CN213182635U (en) | 2020-10-14 | 2020-10-14 | Water-cooled computer heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213182635U true CN213182635U (en) | 2021-05-11 |
Family
ID=75778867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022291702.3U Expired - Fee Related CN213182635U (en) | 2020-10-14 | 2020-10-14 | Water-cooled computer heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213182635U (en) |
-
2020
- 2020-10-14 CN CN202022291702.3U patent/CN213182635U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210511 Termination date: 20211014 |