CN220603976U - Computer auxiliary radiator - Google Patents
Computer auxiliary radiator Download PDFInfo
- Publication number
- CN220603976U CN220603976U CN202322384641.9U CN202322384641U CN220603976U CN 220603976 U CN220603976 U CN 220603976U CN 202322384641 U CN202322384641 U CN 202322384641U CN 220603976 U CN220603976 U CN 220603976U
- Authority
- CN
- China
- Prior art keywords
- computer
- heat
- heat dissipation
- box
- cooling box
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 99
- 238000001816 cooling Methods 0.000 claims abstract description 77
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 238000005192 partition Methods 0.000 claims abstract description 8
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 230000005855 radiation Effects 0.000 description 8
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer auxiliary radiator, comprising: a side heat dissipation mechanism and a top heat dissipation mechanism; the side heat dissipation mechanism comprises a cooling box arranged on the side face of the computer, the outside of the cooling box is provided with a heat dissipation box, one side of a side plate of the computer is provided with a heat conduction copper block, the top of the cooling box is provided with a circulating pump, and the inside of the heat dissipation box is provided with a plurality of partition boards. The auxiliary radiator for the computer provided by the utility model has the advantages that the side radiating mechanism and the top radiating mechanism are arranged, the heat conduction copper block is used for absorbing the heat in the computer and transmitting the heat to the side plate of the computer, and the cooling box is used for absorbing the heat of the side plate, so that the heat in the computer is led out of the computer, and the cooling box is cooled by the cooling fan, so that the auxiliary radiating of the computer is realized, the temperature of the internal elements of the computer is reduced, and the efficiency of the computer is improved.
Description
Technical Field
The utility model relates to the technical field of computer heat dissipation, in particular to a computer auxiliary radiator.
Background
Integrated circuits are used in large numbers in computer components, and the internal operation of a computer or an integrated circuit causes high temperature heat of the computer, and the high temperature not only causes unstable operation of the system, but also shortens the service life and possibly burns out some components.
The existing computer mainly relies on fans to dissipate heat, the heat dissipation objects are mainly parts with larger heating values such as a CPU (Central processing Unit), a display card and the like, when the computer runs under the condition of long-term expiration load, the heat dissipation requirements of all components are difficult to meet by only relying on the heat dissipation fans inside the case, hot air in the case of the computer is difficult to remove in time, the temperature of the components is further increased, and the working efficiency of the computer is further reduced.
Therefore, there is a need to provide a computer-aided heat sink that solves the above-mentioned technical problems.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects in the prior art, the utility model provides the auxiliary radiator for the computer, which can realize auxiliary heat dissipation of the computer, reduce the internal temperature of the computer and improve the efficiency of the computer.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
a computer-assisted heat sink comprising: a side heat dissipation mechanism and a top heat dissipation mechanism; the side cooling mechanism comprises a cooling box arranged on the side face of the computer, cooling liquid is contained in the cooling box, a cooling box is arranged on the outer side of the cooling box, a heat conduction copper block is arranged on the inner side of a side plate of the computer, a circulating pump is arranged at the top of the cooling box, two ends of the circulating pump are communicated with the inside of the cooling box through pipelines, the tail of the cooling box is open, a plurality of partition plates are arranged in the cooling box, the inside of the cooling box is divided into a plurality of cooling channels by the plurality of partition plates, a plurality of cooling fans are arranged at the front end of the cooling box, each cooling air corresponds to one cooling channel, and the front end and the tail end of the cooling channel where the cooling fan is located are large, so that the flow speed of air is improved.
Preferably, the side face of the cooling box is hinged with a plurality of fixing plates, and one side of each fixing plate is provided with a magnetic block.
Preferably, a plurality of first heat dissipation fins are arranged on one side, close to the heat dissipation box, of the cooling box, and the plurality of first heat dissipation fins are distributed in a plurality of heat dissipation channels in the heat dissipation box.
Preferably, the top heat dissipation mechanism comprises a heat absorption plate arranged at the top of the computer shell, the top of the heat absorption plate is provided with a handle, the heat absorption plate is made of copper, the side surface of the heat absorption plate is hinged with a heat dissipation support plate, and the heat dissipation support plate can be turned upwards.
Preferably, the number of the heat dissipation support plates is two, the heat dissipation support plates are attached to the side plate of the computer, and the heat dissipation support plates are opposite to the air outlet of the heat dissipation box.
Preferably, a plurality of second radiating fins are arranged on the radiating support plate, the contact area between the radiating support plate and air is increased by the second radiating fins, and the radiating speed of the radiating support plate is improved.
Compared with the prior art, the utility model has the following beneficial effects:
(1) According to the utility model, the side heat dissipation mechanism and the top heat dissipation mechanism are arranged, the heat conduction copper block is used for absorbing the heat in the computer and transmitting the heat to the side plate of the computer, and the cooling box is used for absorbing the heat of the side plate, so that the heat in the computer is led out of the computer, and the cooling box is cooled by the heat dissipation fan, so that the auxiliary heat dissipation of the computer is realized, the temperature of the internal elements of the computer is reduced, and the efficiency of the computer is improved;
(2) According to the utility model, the cooling box and the computer can be conveniently connected and fixed by arranging the fixing plate and the magnetic block;
(3) According to the utility model, the plurality of first radiating fins are arranged on one side, close to the radiating box, of the cooling box, so that the radiating speed of the cooling box can be improved, and the auxiliary radiating effect on a computer is further improved;
(4) The top heat dissipation mechanism comprising the heat absorption plate and the two heat dissipation support plates is arranged, so that auxiliary heat dissipation can be carried out on the top of the computer, and the internal temperature of the computer is reduced;
(5) According to the utility model, the heat dissipation support plate is provided with the plurality of second heat dissipation fins, so that the heat dissipation speed of the top of the computer can be further improved.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a computer-assisted heat sink according to the present utility model;
FIG. 2 is a schematic diagram of one embodiment of the computer-assisted heat sink shown in FIG. 1;
FIG. 3 is a schematic diagram of a side heat dissipation mechanism in the computer-assisted heat sink shown in FIG. 1;
FIG. 4 is a schematic view of a heat dissipating box in the computer-assisted heat sink shown in FIG. 1;
FIG. 5 is a schematic view of a cooling box in the computer-assisted heat sink shown in FIG. 1;
fig. 6 is a schematic structural diagram of a top heat dissipation mechanism in the computer-assisted heat sink shown in fig. 1.
Wherein, the names corresponding to the reference numerals are: the cooling device comprises a cooling box 1, a heat dissipation box 2, a heat absorption plate 3, a circulating pump 11, a fixing plate 12, a magnetic block 13, a first heat dissipation fin 14, a partition plate 21, a heat dissipation fan 22, a second heat dissipation fin 31 and a heat dissipation support plate 32.
Detailed Description
The utility model will be further illustrated by the following description and examples, which include but are not limited to the following examples.
Example 1:
as shown in fig. 1 to 6, a computer auxiliary radiator provided by the present utility model includes: a side heat dissipation mechanism and a top heat dissipation mechanism; the side heat radiation mechanism comprises a cooling box 1 arranged on the side of a computer, cooling liquid is contained in the cooling box 1, a heat radiation box 2 is arranged on the outer side of the cooling box 1, a heat conduction copper block is arranged on the inner side of a side plate of the computer, the heat conduction copper block adopts the design scheme disclosed in CN218547451U, which is not repeated here, a circulating pump 11 is arranged at the top of the cooling box 1, two ends of the circulating pump 11 are communicated with the inside of the cooling box 1 through pipelines, the tail part of the heat radiation box 2 is open, a plurality of partition boards 21 are arranged in the heat radiation box 2, the inside of the heat radiation box 2 is divided into a plurality of heat radiation channels by the partition boards 21, a plurality of heat radiation fans 22 are arranged at the front end of the heat radiation box 2, each heat dissipation air-cooling channel corresponds to one heat dissipation channel, the front end of the heat dissipation channel where the heat dissipation fan 22 is located is big, the tail end is small, the flow rate of air is improved, when the computer cooling device is used, the heat conduction copper block absorbs heat in the computer through the air and then transfers the heat to the side plate of the computer, the heat of the side plate of the computer is transferred to the cooling box 1, the temperature of the cooling box 1 is increased, the heat dissipation fan 22 is started, air flows through the side face of the cooling box 1, the air flow rate near the surface of the cooling box 1 is accelerated, the cooling box 1 is cooled, the auxiliary heat dissipation of the computer is finally realized, and meanwhile, the circulating pump 11 is started, so that cooling liquid in the cooling box 1 circulates, and the temperatures of all parts of the cooling box 1 are consistent.
Through setting up side cooling mechanism and top cooling mechanism, utilize the heat conduction copper billet to absorb the inside heat of computer to give the computer curb plate with heat transfer, use cooling tank 1 to absorb the curb plate heat, thereby export the inside heat of computer outside the computer, use radiator fan 22 to cool down cooling tank 1, and then realize the auxiliary heat dissipation to the computer, be favorable to reducing the temperature of the inside component of computer, improve the efficiency of computer.
Example 2:
as shown in fig. 2-3, the side surface of the cooling box 1 is hinged with a plurality of fixing plates 12, the rotation angle of the fixing plates 12 is 0-90 degrees, the magnetic block 13 is installed on one side of the fixing plates 12, when in use, the handle at the top of the lifting cooling box 2 lifts the side surface cooling mechanism to the side cover of the computer, the fixing plates 12 are turned over, the magnetic block 13 is attracted with the side plate, and then the cooling box 1 is connected with the side plate.
By arranging the fixing plate 12 and the magnetic block 13, the cooling box 1 can be conveniently connected and fixed with a computer.
Example 3:
as shown in fig. 5, a plurality of first heat dissipation fins 14 are installed on a side of the cooling box 1 near the heat dissipation box 2, and the plurality of first heat dissipation fins 14 are distributed in a plurality of heat dissipation channels in the heat dissipation box 2, when in use, the first heat dissipation fins 14 increase the contact area between the cooling box 1 and air, so that the heat exchange speed between the cooling box 1 and air is increased, and secondly, when the air flows through gaps between the first heat dissipation fins 14, the air is further compressed, the flow speed is further increased, and the heat dissipation speed of the cooling box 1 is further increased.
By arranging the cooling box 1 and installing the plurality of first radiating fins 14 on one side close to the radiating box 2, the radiating speed of the cooling box 1 can be improved, and the auxiliary radiating effect of a computer can be improved.
Example 4:
as shown in fig. 2 and 6, the top heat dissipation mechanism comprises a heat absorption plate 3 installed at the top of a computer casing, a handle is installed at the top of the heat absorption plate 3, the heat absorption plate 3 is made of copper, two heat dissipation support plates 32 are hinged to the side surfaces of the heat absorption plate 3, the heat dissipation support plates 32 can be turned upwards, the heat dissipation support plates 32 are attached to the side plates of the computer and are opposite to the air outlet of the heat dissipation box 2, when the heat absorption plate 3 absorbs heat at the top of the computer and transfers the heat to the heat dissipation support plates 32, when high-speed air flow at the air outlet of the heat dissipation box 2 passes through the heat dissipation support plates 32, the air flow rate near the surface of the heat dissipation support plates 32 is improved, the heat dissipation speed of the heat dissipation support plates 32 is improved, and then the top of the computer is cooled.
By arranging the top heat dissipation mechanism comprising the heat absorption plate 3 and the two heat dissipation support plates 32, auxiliary heat dissipation can be carried out on the top of the computer, and the reduction of the internal temperature of the computer is facilitated.
Example 5:
as shown in fig. 6, the heat dissipation support plate 32 is provided with a plurality of second heat dissipation fins 31, the second heat dissipation fins 31 increase the contact area between the heat dissipation support plate 32 and the air, so that the heat dissipation speed of the heat dissipation support plate 32 is increased, and when in use, the tail air flow of the heat dissipation box 2 blows to the second heat dissipation fins 31, so that the heat dissipation speed of the heat dissipation support plate 32 is accelerated, and the heat dissipation speed of the top of the computer is further increased.
By arranging the heat dissipation support plate 32 with the plurality of second heat dissipation fins 31, the heat dissipation speed of the top of the computer can be further improved.
In use, the heat conduction copper block, the cooling box 2, the heat absorption plate 3, the heat dissipation support plate 32 and the computer shell can be provided with heat conduction silica gel sheets, the contact surface is more compact, the heat exchange efficiency is improved, and the cooling box 2 and the heat absorbing plate 3 are arranged at the original air inlet and outlet positions of the computer case;
the heat conduction copper block absorbs heat in the computer through air and then is transferred to the side plate of the computer, the heat of the side plate of the computer is transferred to the cooling box 1, the temperature of the cooling box 1 is increased, the cooling fan 22 is started, air flow blows through the side surface of the cooling box 1, the air flow speed near the surface of the cooling box 1 is accelerated, the cooling box 1 is cooled, the auxiliary heat dissipation of the computer is finally realized, the circulating pump 11 is started at the same time, the cooling liquid in the cooling box 1 circularly flows, and the temperatures of all parts of the cooling box 1 are consistent;
the heat absorbing plate 3 absorbs heat at the top of the computer and transfers the heat to the heat dissipating support plate 32, and high-speed air flow at the air outlet of the heat dissipating box 2 blows to the second heat dissipating fins 31 on the heat dissipating support plate 31, so that the heat dissipating speed of the heat dissipating support plate 32 is accelerated, and the top of the computer is cooled.
The above embodiment is only one of the preferred embodiments of the present utility model, and should not be used to limit the scope of the present utility model, but all the insubstantial modifications or color changes made in the main design concept and spirit of the present utility model are still consistent with the present utility model, and all the technical problems to be solved are included in the scope of the present utility model.
Claims (6)
1. A computer-aided heat sink, comprising:
a side heat dissipation mechanism and a top heat dissipation mechanism;
the side heat dissipation mechanism comprises a cooling box arranged on the side face of the computer, a heat dissipation box is arranged on the outer side of the cooling box, a heat conduction copper block is arranged on one side of a side plate of the computer, a circulating pump is arranged at the top of the cooling box, a plurality of partition boards are arranged in the heat dissipation box, the inside of the heat dissipation box is divided into a plurality of heat dissipation channels by the partition boards, and a plurality of heat dissipation fans are arranged at the front end of the heat dissipation box.
2. The computer-aided radiator of claim 1, wherein a plurality of fixing plates are hinged to two sides of the cooling box, and a magnet is mounted to one side of the fixing plate.
3. The computer-assisted heat sink of claim 1 wherein a side of the cooling box adjacent the heat sink box is provided with a plurality of first heat fins.
4. The computer-aided radiator of claim 1, wherein the top heat dissipation mechanism comprises a heat absorption plate arranged at the top of the computer, and a heat dissipation support plate is hinged to the side surface of the heat absorption plate.
5. The computer-aided heat sink of claim 4 wherein the number of heat dissipating support plates is two.
6. The computer-assisted heat sink of claim 4 wherein said heat sink support is mounted with a plurality of second heat fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322384641.9U CN220603976U (en) | 2023-09-04 | 2023-09-04 | Computer auxiliary radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322384641.9U CN220603976U (en) | 2023-09-04 | 2023-09-04 | Computer auxiliary radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220603976U true CN220603976U (en) | 2024-03-15 |
Family
ID=90164076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322384641.9U Active CN220603976U (en) | 2023-09-04 | 2023-09-04 | Computer auxiliary radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220603976U (en) |
-
2023
- 2023-09-04 CN CN202322384641.9U patent/CN220603976U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |