CN217062128U - Die bonding platform and multifunctional die bonding equipment - Google Patents
Die bonding platform and multifunctional die bonding equipment Download PDFInfo
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- CN217062128U CN217062128U CN202123392725.4U CN202123392725U CN217062128U CN 217062128 U CN217062128 U CN 217062128U CN 202123392725 U CN202123392725 U CN 202123392725U CN 217062128 U CN217062128 U CN 217062128U
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Abstract
The application provides a solid brilliant platform and multi-functional solid brilliant equipment, wherein solid brilliant platform includes: the adsorption fixing device is provided with an adsorption fixing surface and a plurality of adsorption fixing holes which are arranged on the adsorption fixing surface and can generate suction force, and the distance between any two adjacent adsorption fixing holes is smaller than the minimum width of the bracket; the pre-fixing device is provided with a pre-fixing surface for arranging and placing a plurality of brackets; the crystal fixing device is provided with a crystal fixing face, and the crystal fixing face is used for fixing a plurality of wafers; the plurality of supports arranged on the pre-fixing surface can be transferred to the adsorption fixing surface, and the plurality of wafers on the crystal fixing surface can be correspondingly placed in the cup cavities of the supports on the adsorption fixing surface one by one; through adopting above-mentioned technical scheme, to the restriction of putting the angle of support when having reduced the fixed bolster, further improved the suitability of adsorbing fixing device, adjust the consuming time of position when having saved the fixed bolster, promoted the efficiency of fixed bolster.
Description
Technical Field
The application relates to the technical field of wafer fixing equipment of LED light-emitting modules, in particular to a die bonding platform and multifunctional die bonding equipment.
Background
At present, the demand for the LED light-emitting module is increasing day by day and can be seen in different use scenes, so that the requirement on the production and manufacturing capacity of an LED manufacturer is higher and higher, namely the requirement on the packaging speed of the LED light-emitting module is higher and higher;
in the existing LED light-emitting module packaging technology, light-emitting wafers are required to be placed on supports one by one, when an LED light-emitting module with a large packaging scale faces, a plurality of supports are fixed on a fixing template by a die fixing platform, then the wafers are placed in cup cavities of the supports through cover plates matched with the fixing template, in the process, the fixing template is required to be matched with the supports to fix the supports at accurate positions, meanwhile, cover plates matched with the supports are required to be manufactured to accurately place the wafers in the supports, and for supports and wafers of different models, the supports and the wafers can be accurately aligned and correctly installed only through the fixing templates and the cover plates with different sizes, so that the existing die fixing platform is poor in applicability.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide a die bonding platform and a multifunctional die bonding device, so as to solve the technical problem that the die bonding platform in the prior art is poor in applicability.
In order to achieve the above object, the present application adopts a technical solution that is a die bonding platform, including:
the adsorption fixing device is provided with an adsorption fixing surface and a plurality of adsorption fixing holes which are arranged on the adsorption fixing surface and can generate suction force, and the distance between any two adjacent adsorption fixing holes is smaller than the minimum width of the bracket;
the pre-fixing device is provided with a pre-fixing surface for arranging and placing a plurality of brackets;
the crystal fixing device is provided with a crystal fixing face, and the crystal fixing face is used for fixing a plurality of wafers;
the plurality of supports arranged on the pre-fixing surface can be transferred to the adsorption fixing surface, and the plurality of wafers on the crystal fixing surface can be placed in the cup cavities of the supports on the adsorption fixing surface in a one-to-one correspondence manner.
Through adopting above-mentioned technical scheme, to the restriction of putting the angle of support when having reduced the fixed bolster, further improved the suitability of adsorbing fixing device, adjust the consuming time of position when having saved the fixed bolster, promoted the efficiency of fixed bolster.
In one embodiment, the die bonding platform further includes an image positioning device electrically connected to the die bonding device, the image positioning device is located above the adsorption fixing device, and the image positioning device is configured to obtain a position of the support on the adsorption fixing surface and send control information to the die bonding device, so that the wafer on the die bonding surface is adjusted to a position relative to the support on the adsorption fixing surface.
By adopting the technical scheme, the image positioning device can assist in adjusting the relative positions of the wafer and the support, so that the supports of various sizes and types can be placed on the adsorption fixing surface, and the limitation of the angles of the supports on the adsorption fixing surface is reduced.
In one embodiment, the suction fixing surface of the suction fixing device is further provided with a plurality of image positioning structures, and the image positioning device is configured to acquire the plurality of image positioning structures to output control information.
By adopting the technical scheme, the accuracy of the image positioning device for acquiring the position of the bracket is further improved.
In one embodiment, the pre-fixing device includes a plurality of pre-fixing plates and a lifting platform, each pre-fixing plate is provided with the pre-fixing surface, the pre-fixing plates are stacked up and down on the lifting platform, and the lifting platform sequentially lifts the pre-fixing surfaces of the pre-fixing plates to positions with the same height as the adsorption fixing surfaces.
Through adopting above-mentioned technical scheme for a plurality of supports can all be fixed to each pre-fixing plate's pre-fixing surface, and the support is fixed on different pre-fixing surfaces in groups promptly, and wherein the type of the support of different pre-fixing surfaces can be the same, also can be inequality, and a plurality of pre-fixing plates lift in proper order to with adsorb the equal height position of fixed surface, and the subdividing shifts to on the absorption fixed surface in batches.
In one embodiment, the lifting platform further includes a lifting device and an in-place positioning structure electrically connected to the lifting device, the lifting device is configured to lift the pre-fixing plate, and the in-place positioning structure is configured to detect a relative height between the pre-fixing surface and the adsorption fixing surface, and send control information to the lifting device, so that the pre-fixing surface stays at a position as high as the adsorption fixing surface.
Through adopting above-mentioned technical scheme, improved lift platform's degree of automation.
In one embodiment, the lifting device is provided with a plurality of mounting holes along the lifting direction, the mounting holes synchronously move upwards under the action of the lifting device, and the pre-fixing plate is provided with mounting posts which can be plugged into the mounting holes.
By adopting the technical scheme, the pre-fixing plates can be mounted and dismounted conveniently, and the replacement efficiency of the pre-fixing plates is improved.
In one embodiment, the die bonding platform further comprises an adsorption transfer device, the adsorption transfer device is provided with an adsorption transfer surface, a plurality of transfer holes capable of generating suction are formed in the adsorption transfer surface, and the adsorption transfer surface can generate suction to transfer the plurality of supports on the pre-fixing surface to the adsorption fixing surface;
or the adsorption fixing device can move to the position where the adsorption fixing surface is opposite to the pre-fixing surface, so that the adsorption fixing surface adsorbs the plurality of supports on the pre-fixing surface.
By adopting the technical scheme, the plurality of supports on the pre-fixing surface are transferred to the adsorption fixing surface in a plurality of ways, the first way is that the supports are integrated on the manipulator through the adsorption transfer device, and the supports are fixed on the transfer holes and then transferred to the adsorption fixing surface through the adsorption transfer surface;
the second is that the adsorption fixing surface moves to the position opposite to the pre-fixing surface, a plurality of supports are directly fixed by the suction force generated by the adsorption fixing holes, and then the adsorption fixing surface is transferred to the position to be fixed with crystals.
In one embodiment, the plurality of adsorption fixing holes on the adsorption fixing surface are arranged in an array, and the distance between two adjacent adsorption fixing holes is smaller than the minimum width of the bracket.
By adopting the technical scheme, the plurality of adsorption fixing holes arranged in an array are arranged in order, so that the generated suction force is uniform, and the support is favorably fixed.
In one embodiment, a plurality of pre-fixing grooves are formed on the pre-fixing surface of the pre-fixing plate, and the pre-fixing grooves correspond to the brackets one to one.
By adopting the technical scheme, the bracket can be fixed on the preset position in advance on the pre-fixing plate, and the time consumed for fixing is reduced.
The embodiment also provides multifunctional die bonding equipment which comprises a transmission device and the die bonding platform, wherein the die bonding platform is butted with the transmission device, and the transmission device transmits the support and the wafer to the die bonding platform.
Through adopting above-mentioned technical scheme, to the restriction of putting the angle of support when having reduced the fixed bolster, further improved the suitability of adsorbing fixing device, adjust the consuming time of position when having saved the fixed bolster, promoted the efficiency of fixed bolster.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a front view of a die bonding platform provided in an embodiment of the present application;
FIG. 2 is a top view of a suction fixture provided in accordance with an embodiment of the present application;
FIG. 3 is a front view of a pre-fixing device provided in an embodiment of the present application;
fig. 4 is a front view of a die bonding apparatus provided in an embodiment of the present application.
The various reference numbers in the figures are:
100-die bonding platform;
1-an adsorption fixture; 2-pre-fixing means; 3-a die bonding device; 4-vacuum equipment; 5-a support; 6-image positioning device;
11-adsorption fixing surface; 12-adsorption fixing holes; 13-image positioning structure; 21-a pre-fixing surface; 26-pre-fixing plate; 22-pre-fixing groove; 23-a lifting platform; 24-a position location structure; 25-mounting holes; 31-solidifying the crystal face; 32-wafer.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used herein to refer to an orientation or positional relationship as shown in the drawings, which is used for convenience in describing the present application, and is not intended to indicate that a device or component must have a particular orientation, be constructed and operated in a particular orientation, and is not to be construed as limiting the present application.
Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as indicating a number of technical features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. Specific implementations of the present application are described in more detail below with reference to specific embodiments:
as shown in fig. 1, a die bonding platform 100 provided in the embodiment of the present application includes: an adsorption fixing device 1, a pre-fixing device 2 and a die bonding device 3;
referring to fig. 2, the adsorption fixing device 1 is provided with an adsorption fixing surface 11 and a plurality of adsorption fixing holes 12, the adsorption fixing holes 12 are communicated with the vacuum equipment 4, the adsorption fixing holes 12 are formed in the adsorption fixing surface 11, the adsorption fixing holes 12 can generate suction under the driving of the vacuum equipment 4, the bracket 5 placed on the adsorption fixing surface 11 is adsorbed and fixed, the distance between any two adjacent adsorption fixing holes 12 is smaller than the minimum width of the bracket 5, so that the bracket 5 can be placed between any two adjacent adsorption fixing holes 12 and can be covered on one adsorption fixing hole 12, and further fixed by the suction of the adsorption fixing hole 12;
referring to fig. 3, the pre-fixing device 2 is provided with a pre-fixing surface 21, the pre-fixing surface 21 is used for arranging a plurality of supports 5, the plurality of supports 5 are pre-placed on the pre-fixing surface 21 before die bonding, and then the plurality of supports 5 on the pre-fixing surface 21 are transferred to the adsorption fixing surface 11;
the die bonding device 3 is provided with a die bonding surface 31, and the die bonding surface 31 is used for fixing a plurality of wafers 32;
the plurality of holders 5 arranged on the pre-fixing surface 21 can be transferred onto the adsorption fixing surface 11, and the plurality of wafers 32 on the fixing surface 31 can be placed in the cup cavities of the holders 5 on the adsorption fixing surface 11 in one-to-one correspondence.
The working principle of the die bonding platform 100 provided by the embodiment is as follows:
the pre-fixing device 2, the adsorption fixing device 1 and the die bonder 3 are sequentially arranged, firstly, the plurality of supports 5 are arranged on the pre-fixing surface 21, the plurality of supports 5 are arranged in order, and specifically, the plurality of supports 5 can be correspondingly arranged in the pre-fixing groove 22 one by one to realize pre-fixing, namely, the plurality of supports 5 are roughly arranged in order on the pre-fixing surface 21, so that large deviation is avoided; secondly, transferring the plurality of supports 5 on the pre-fixing surface 21 onto the adsorption fixing surface 11, wherein the specific steps include but are not limited to grabbing by a manipulator, the manipulator can grab the plurality of supports 5 simultaneously and place the supports on the adsorption fixing surface 11, the supports are covered on the adsorption fixing holes 12, and the supports 5 are fixed by the suction force generated by the adsorption fixing holes 12; the die bonder 3 is provided with a die bonding surface 31 for fixing a plurality of wafers 32, the wafers 32 can be transferred and placed in the cup cavities of the support 5 one by one, and the wafer bonding operation is completed by the mechanical hand which can grasp and place the plurality of wafers 32 at the same time.
By adopting the technical scheme:
firstly, the adsorption fixing device 1 is provided with an adsorption fixing surface 11, the adsorption fixing surface 11 is provided with a plurality of adsorption fixing holes 12, the distance between any two adjacent adsorption fixing holes 12 is less than the minimum width of the bracket 5, therefore, it can be understood that the bracket 5 is placed on the adsorption fixing surface 11 and is covered on at least one adsorption fixing hole 12, namely, the bracket can be fixed by the suction force generated by the adsorption fixing hole 12, and at the same time, the adsorption fixing device 1 of the embodiment is suitable for fixing brackets 5 with various sizes as long as the minimum width of the bracket 5 is greater than the distance between two adjacent adsorption fixing holes 12, and can be fixed by the adsorption fixing hole 12, and meanwhile, the bracket 5 can also be placed on the adsorption fixing surface 11 at various angles and can be covered on the adsorption fixing hole 12, thereby reducing the limitation on the placing angle of the bracket 5 when the bracket 5 is fixed, the applicability of the adsorption fixing device 1 is further improved, the time consumed for adjusting the position of the fixing support 5 is saved, and the efficiency of the fixing support 5 is improved;
secondly, the pre-fixing device 2 is provided with a pre-fixing surface 21, and the plurality of supports 5 are placed on the pre-fixing surface 21 in advance before die bonding, so that the pre-arrangement of the plurality of supports 5 is realized, and the uniformity and stability of the plurality of supports 5 during fixing are improved;
finally, the die bonding device 3 is provided with a die bonding face 31, the die bonding face 31 is used for fixing a plurality of wafers 32, the wafers 32 correspond to the supports 5 one by one, and the wafer fixing efficiency is improved;
referring to fig. 1 and fig. 2 again, in an embodiment, the die bonding platform 100 further includes an image positioning device 6, the image positioning device 6 is electrically connected to the die bonding device 3, the image positioning device 6 is located above the adsorption fixing device 1, and the image positioning device 6 is configured to obtain a position of the support 5 on the adsorption fixing surface 11 and send control information to the die bonding device 3, so that the wafer 32 on the die bonding surface 31 is adjusted to a position corresponding to the support 5 on the adsorption fixing surface 11.
Specifically, the image positioning device 6 can take images of a plurality of supports 5 on the suction fixing surface 11, obtain the positions of the supports 5 by analyzing the images, and output control information to the die bonder 3 so that the wafer 32 can be placed in alignment with the supports 5.
By adopting the above technical scheme, image positioner 6 can assist the relative position of adjustment wafer 32 and support 5 for the support 5 of multiple size type all can be placed on adsorbing stationary plane 11, has also reduced the restriction of the angle that support 5 placed on adsorbing stationary plane 11 simultaneously, because image positioner 6 can be according to the position of the support 5 who obtains and then adjust the position of placing of wafer 32, has consequently further improved solid brilliant platform 100's suitability.
In one embodiment, the suction fixing surface 11 of the suction fixing device 1 is further provided with a plurality of image positioning structures 13, and the image positioning device 6 is configured to acquire the plurality of image positioning structures 13 to output control information.
Specifically, the image positioning structure 13 is a "mark" point, so that the image positioning device 6 establishes a coordinate system for identifying the position of the support 5, and generally the image positioning structure 13 is a fixed point, such as a fixed column, on the suction fixing surface 11.
By adopting the technical scheme, the accuracy of the image positioning device 6 for acquiring the position of the bracket 5 is further improved.
Referring to fig. 3 again, in an embodiment, the pre-fixing device 2 includes a plurality of pre-fixing plates 26 and a lifting platform 23, each pre-fixing plate 26 has a pre-fixing surface 21, the pre-fixing plates 26 are stacked up and down on the lifting platform 23, and the lifting platform 23 sequentially lifts the pre-fixing surfaces 21 of the pre-fixing plates 26 to a position having the same height as the adsorption fixing surface 11.
By adopting the technical scheme, the pre-fixing surfaces 21 of each pre-fixing plate 26 can fix a plurality of supports 5, namely the supports 5 are fixed on different pre-fixing surfaces 21 in groups, wherein the types of the supports 5 of different pre-fixing surfaces 21 can be the same or different, and the pre-fixing plates 26 are sequentially lifted to the positions with the same height as the adsorption fixing surface 11 and then transferred to the adsorption fixing surface 11 in batches.
In one embodiment, the lifting platform 23 further includes a lifting device and an in-place positioning structure 24 electrically connected to the lifting device, the lifting device is configured to lift the pre-fixing plate 26, the in-place positioning structure 24 is configured to detect the relative heights of the pre-fixing surface 21 and the adsorption fixing surface 11, and send control information to the lifting device, so that the pre-fixing surface 21 stays at a position with the same height as the adsorption fixing surface 11; specifically, the in-place positioning structure 24 may be a micro switch, and when the pre-fixing plate 26 touches the micro switch, the lifting device stops moving the pre-fixing plate 26.
Through adopting above-mentioned technical scheme, improved lift platform 23's degree of automation.
In one embodiment, the lifting device is provided with a plurality of mounting holes 25 along the lifting direction, the plurality of mounting holes 25 move upwards synchronously under the action of the lifting device, and the pre-fixing plate 26 is provided with mounting posts which can be plugged into the mounting holes 25.
Through adopting above-mentioned technical scheme, do benefit to the installation and the dismantlement of a plurality of pre-fixing plates 26, improved the efficiency that pre-fixing plate 26 was changed.
In one embodiment, the die bonding platform 100 further includes an adsorption transfer device, the adsorption transfer device is provided with an adsorption transfer surface, the adsorption transfer surface is provided with a plurality of transfer holes capable of generating a suction force, and the adsorption transfer surface is capable of generating a suction force to transfer the plurality of racks 5 on the pre-fixing surface 21 to the adsorption fixing surface 11;
alternatively, the suction fixing device 1 can be moved to a position where the suction fixing surface 11 faces the pre-fixing surface 21, and the suction fixing surface 11 can suck the plurality of racks 5 on the pre-fixing surface 21.
By adopting the technical scheme, the plurality of supports 5 on the pre-fixing surface 21 are transferred to the adsorption fixing surface 11 in a plurality of ways, the first way is that the supports 5 are fixed on transfer holes and then transferred to the adsorption fixing surface 11 through an adsorption transfer device which is integrated on a manipulator by arranging the adsorption transfer surface;
the second is that the adsorption fixing surface 11 moves to a position opposite to the pre-fixing surface 21, the plurality of supports 5 are directly fixed by the suction force generated by the adsorption fixing holes 12, and then the adsorption fixing surface 11 is transferred to a position to be crystal-fixed.
In one embodiment, the plurality of adsorption fixing holes 12 on the adsorption fixing surface 11 are arranged in an array, and a distance between two adjacent adsorption fixing holes 12 is smaller than the minimum width of the bracket 5.
By adopting the technical scheme, the plurality of adsorption fixing holes 12 arranged in an array are orderly arranged, so that the generated suction force is uniform, and the support 5 is favorably fixed.
In one embodiment, the pre-fixing surface 21 of the pre-fixing plate 26 is provided with a plurality of pre-fixing grooves 22, and the pre-fixing grooves 22 correspond to the brackets 5 one by one.
Specifically, the plurality of pre-fixing grooves 22 have a size slightly larger than that of the supporter 5 so that the supporter 5 can be clearance-fitted to the pre-fixing grooves 22.
By adopting the technical scheme, the bracket 5 can be fixed on the preset position on the pre-fixing plate 26 in advance, and the time consumption for fixing is reduced.
The present embodiment further provides a multifunctional die bonding apparatus, which includes a transmission device and the die bonding platform 100, wherein the die bonding platform 100 is connected to the multifunctional die bonding transmission device, and the transmission device transmits the support 5 and the wafer 32 to the die bonding platform 100.
Through adopting above-mentioned technical scheme, to the restriction of putting the angle of support 5 when having reduced fixed bolster 5, further improved the suitability of adsorbing fixing device 1, adjust the consuming time of position when having saved fixed bolster 5, promoted fixed bolster 5's efficiency.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A die bonding platform, comprising:
the adsorption fixing device is provided with an adsorption fixing surface and a plurality of adsorption fixing holes which are arranged on the adsorption fixing surface and can generate suction force, and the distance between any two adjacent adsorption fixing holes is smaller than the minimum width of the bracket;
the pre-fixing device is provided with a pre-fixing surface for arranging and placing a plurality of brackets;
the crystal fixing device is provided with a crystal fixing face, and the crystal fixing face is used for fixing a plurality of wafers;
the plurality of supports arranged on the pre-fixing surface can be transferred to the adsorption fixing surface, and the plurality of wafers on the crystal fixing surface can be placed in the cup cavities of the supports on the adsorption fixing surface in a one-to-one correspondence manner.
2. The die bonding platform of claim 1, further comprising an image positioning device electrically connected to the die bonding device, wherein the image positioning device is located above the adsorption fixing device, and is configured to obtain a position of the support on the adsorption fixing surface and send control information to the die bonding device, so that the wafer on the die bonding surface is adjusted to a position opposite to the support on the adsorption fixing surface.
3. The die bonding platform of claim 2, wherein the suction fixing surface of the suction fixing device further comprises a plurality of image positioning structures, and the image positioning device is configured to obtain the plurality of image positioning structures to output control information.
4. The die bonding platform of claim 1, wherein the pre-fixing device comprises a plurality of pre-fixing plates and a lifting platform, each pre-fixing plate is provided with the pre-fixing surface, the pre-fixing plates are stacked up and down on the lifting platform, and the lifting platform sequentially lifts the pre-fixing surfaces of the pre-fixing plates to positions with the same height as the adsorption fixing surfaces.
5. The die bonding platform of claim 4, wherein the lifting platform further comprises a lifting device and an in-place positioning structure electrically connected with the lifting device, the lifting device is used for lifting the pre-fixing plate, and the in-place positioning structure is used for detecting the relative heights of the pre-fixing surface and the adsorption fixing surface and sending control information to the lifting device so that the pre-fixing surface stays at the same height as the adsorption fixing surface.
6. The die bonding platform according to claim 5, wherein the lifting device is provided with a plurality of mounting holes along a lifting direction, the plurality of mounting holes synchronously move upwards under the action of the lifting device, and the pre-fixing plate is provided with mounting posts which can be plugged into the mounting holes.
7. The die bonding platform according to any one of claims 1 to 6, further comprising an adsorption transfer device, wherein the adsorption transfer device is provided with an adsorption transfer surface, the adsorption transfer surface is provided with a plurality of transfer holes capable of generating suction, and the adsorption transfer surface can generate suction to transfer the plurality of supports on the pre-fixing surface to the adsorption fixing surface;
or the adsorption fixing device can move to the position where the adsorption fixing surface is opposite to the pre-fixing surface, so that the adsorption fixing surface adsorbs the plurality of supports on the pre-fixing surface.
8. The die bonding platform according to any one of claims 1 to 6, wherein the plurality of the adsorption fixing holes on the adsorption fixing surface are arranged in an array, and a distance between two adjacent adsorption fixing holes is smaller than a minimum width of the support.
9. The die bonding platform according to any one of claims 4 to 6, wherein a plurality of pre-fixing grooves are formed on the pre-fixing surface of the pre-fixing plate, and the pre-fixing grooves correspond to the supports one to one.
10. A multifunctional die bonding apparatus, comprising a transmission device and the die bonding platform of any one of claims 1 to 9, wherein the die bonding platform is butted with the transmission device, and the transmission device transmits the support and the wafer onto the die bonding platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123392725.4U CN217062128U (en) | 2021-12-29 | 2021-12-29 | Die bonding platform and multifunctional die bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123392725.4U CN217062128U (en) | 2021-12-29 | 2021-12-29 | Die bonding platform and multifunctional die bonding equipment |
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| Publication Number | Publication Date |
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| CN217062128U true CN217062128U (en) | 2022-07-26 |
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| CN202123392725.4U Active CN217062128U (en) | 2021-12-29 | 2021-12-29 | Die bonding platform and multifunctional die bonding equipment |
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| CN (1) | CN217062128U (en) |
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- 2021-12-29 CN CN202123392725.4U patent/CN217062128U/en active Active
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