CN216980505U

CN216980505U - Wet stripping guide mechanism and wet stripping device

Info

Publication number: CN216980505U
Application number: CN202123456413.5U
Authority: CN
Inventors: 袁晓峰
Original assignee: Dynax Semiconductor Inc
Current assignee: Dynax Semiconductor Inc
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-07-15
Anticipated expiration: 2031-12-31

Abstract

The utility model provides a wet stripping guide mechanism and a wet stripping device, and relates to the technical field of semiconductors. When the wafer is actually stripped by the wet method, the wafer is placed in the liquid tank, the guide disc is arranged on one side of the wafer, the solution around the wafer flows towards the guide disc in an accelerating mode, the mixing and dissolving speed of the solution and the photoresist is accelerated, the wet stripping process is accelerated, and meanwhile, due to the fact that the flowing of the solution is directional, the metal film can approach the guide disc after being stripped, the metal film cannot be reversely adhered to the surface of the wafer, and the defect of metal residue is avoided.

Description

Wet stripping guide mechanism and wet stripping device

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a wet stripping guide mechanism and a wet stripping device.

Background

The wet lift-off process (lift-off) is a commonly used method for forming metal images on wafers in the semiconductor industry, and generally requires coating a layer of glass paste on a wafer substrate, then coating a photoresist, exposing/developing the photoresist, then evaporating the required metal, and finally standing the wafer in an organic solution capable of dissolving the lift-off paste and the photoresist to realize the lift-off.

The inventor researches and discovers that in a common groove type stripping process, metal is evaporated on a wafer with photoresist, the wafer is placed in an organic solution, the organic solution dissolves the photoresist through standing, and therefore the unnecessary metal on the wafer is stripped, the process generally takes longer, and after a metal film is stripped, the metal film is stripped and falls off only under the action of gravity, and is easily adhered to the wafer reversely, so that the metal residue defect is formed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wet stripping guide mechanism and a wet stripping device, which can be used for wet stripping.

The embodiment of the utility model is realized by the following steps:

in a first aspect, the utility model provides a wet stripping guide mechanism, which includes a guide disc and a guide pipeline, wherein the guide disc is arranged in a liquid tank filled with a dissolving liquid and is located on one side of a wafer, the guide disc is provided with a plurality of guide holes, and the guide pipeline is connected with the plurality of guide holes and is used for partially extending out of the liquid tank, so that the dissolving liquid between the wafer and the guide disc is discharged through the guide pipeline.

In an optional embodiment, a circulation pump is arranged on the diversion pipeline, one end of the diversion pipeline, which is far away from the diversion disc, is used for extending into the opening of the liquid tank, and the circulation pump is used for pumping the solution in the diversion pipeline to the opening of the liquid tank.

In an optional embodiment, the diversion pipeline includes a plurality of capillaries and a manifold, the plurality of capillaries are connected with the plurality of diversion holes in a one-to-one correspondence manner, the manifold is connected with the plurality of capillaries, and the circulation pump is disposed on the manifold.

In an alternative embodiment, a filter is provided on each of the capillaries for filtering the solution entering the capillary.

In an alternative embodiment, a throttle valve is provided on each capillary tube for regulating the flow rate of the corresponding capillary tube.

In an alternative embodiment, the plurality of guide holes are distributed on the guide disc in a honeycomb shape.

In an alternative embodiment, the plurality of guide holes are annularly distributed on the guide disc.

In a second aspect, the present invention provides a wet stripping apparatus, including a liquid tank filled with a solution, a clamp and the flow guide plate of any one of the foregoing embodiments, the clamp and the flow guide plate being disposed in the liquid tank at an interval, the clamp being configured to clamp a wafer such that the flow guide plate is located on one side of the wafer, and the flow guide pipe partially extending out of the liquid tank for discharging the solution between the wafer and the flow guide plate.

In an optional embodiment, the clamp is provided with a clamping position arranged along a vertical direction, so that the wafer is vertically clamped on the clamping position, the diversion disc is arranged on one side of the clamp and is used for being parallel to the wafer, and the diversion pipeline penetrates through the side wall of the liquid tank.

In an optional embodiment, the clamp is provided with a clamping position arranged along a horizontal direction, so that the wafer is horizontally clamped on the clamping position, the diversion disc is arranged at the bottom side of the clamp and is used for being parallel to the wafer, and the diversion pipeline penetrates through the bottom wall of the liquid tank.

The embodiment of the utility model has the beneficial effects that:

according to the wet stripping guide mechanism provided by the embodiment of the utility model, the guide disc with the guide holes is provided, and the guide pipeline is utilized to discharge the solution between the wafer and the guide disc. When actually carrying out wet stripping, the wafer is placed in the cistern, the guiding disc sets up the one side at the wafer simultaneously, dissolve liquid between with wafer and the guiding disc is discharged through a plurality of water conservancy diversion holes and water conservancy diversion pipeline, thereby make the solution around the wafer flow with higher speed towards the direction of guiding disc, make the mixed solution speed of dissolving liquid and photoresist accelerate, accelerate the wet stripping process, simultaneously because the flow of solution has the directionality, metal film can be close to on the guiding disc after being peeled off, can not reverse glue to the wafer surface, avoid causing the metal to remain the defect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic view of a wet stripping guiding mechanism according to a first embodiment of the present invention;

fig. 2 is a schematic structural view of the diversion disk in fig. 1;

FIG. 3 is an assembly view of a wet stripping deflector according to a first embodiment of the present invention;

fig. 4 is a schematic structural view of a diaphragm according to a second embodiment of the present invention;

fig. 5 is a schematic structural diagram of a wet stripping apparatus according to a fourth embodiment of the utility model.

Icon:

100-wet stripping guide mechanism; 110-a flow guide disc; 111-flow guide holes; 130-a diversion conduit; 131-a circulating pump; 133-a capillary; 135-a collector tube; 137-a filter; 139-a throttle valve; 200-a liquid bath; 300-clamp.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As disclosed in the background, the wet stripping process of the prior art generally employs the following procedures:

firstly, coating a layer of stripping glue (such as LOR series of Microchem company) on a wafer substrate, then coating a layer of photoresist, exposing the photoresist to form a pattern, removing an exposure area of the photoresist after development, and simultaneously forming an inverted T-shaped structure on the exposure area due to isotropic corrosion of a developing solution to the stripping glue.

The desired metal is then evaporated onto the wafer and the metal in the exposed areas is evaporated directly onto the wafer substrate, which is the metal to be formed for process purposes and needs to remain on the substrate. The metal in the unexposed areas evaporates on the photoresist and this part of the metal is not the metal to be formed for process purposes and needs to be removed.

And finally, standing the wafer in an organic solution capable of dissolving the stripping glue and the photoresist, such as NMP, wherein after the stripping glue and the photoresist are dissolved by the organic solvent, the metal film on the wafer can fall off from the wafer substrate due to the action of gravity and is removed. Eventually only the metal required for the process remains on the substrate, forming a patterned metal on the substrate.

In a common groove type stripping process, metal is evaporated on a wafer with photoresist, the wafer is placed in an organic solution, the organic solution dissolves the photoresist through standing, and therefore the metal which is not needed on the wafer is stripped.

In order to solve the above problems, the present invention provides a wet stripping guide mechanism and a wet stripping apparatus, and it should be noted that, in a non-conflicting manner, features in embodiments of the present invention may be combined with each other.

First embodiment

Referring to fig. 1 to 3, the present invention provides a wet stripping guiding mechanism 100, which can accelerate the wet stripping process, and meanwhile, since the flow of the dissolving solution is directional, the metal film will not be reversely adhered to the surface of the wafer after being stripped, thereby avoiding the metal residue defect.

The wet stripping diversion mechanism 100 provided by this embodiment includes a diversion disc 110 and a diversion pipeline 130, the diversion disc 110 is configured to be disposed in a liquid tank 200 filled with a dissolution liquid and located at one side of a wafer, and the diversion disc 110 is provided with a plurality of diversion holes 111, the diversion pipeline 130 is connected with the plurality of diversion holes 111 and is configured to partially extend out of the liquid tank 200, so that the dissolution liquid between the wafer and the diversion disc 110 is discharged through the diversion pipeline 130.

It should be noted that the flow guide mechanism 100 for wet stripping in this embodiment is suitable for a wet stripping apparatus, in which the flow guide disc 110 and the clamp 300 are arranged in the liquid tank 200 at intervals, the clamp 300 is used for clamping a wafer, and the flow guide disc 110 is located on one side of the wafer. The wafer is a wafer after metal evaporation, and preferably, the side of the wafer having the metal layer faces the baffle 110, so that the solution can flow from the metal layer to the baffle 110.

It should be noted that the positioning direction of the diversion disc 110 in this embodiment may be determined according to the holding direction of the wafer, when the wafer is vertically positioned, the diversion sheet is also vertically positioned and disposed on the left side or the right side of the wafer, and when the wafer is horizontally positioned, the diversion sheet is also horizontally positioned and disposed on the bottom side of the wafer.

It should be noted that, in this embodiment, the dissolving solution may be an organic solution capable of realizing wet stripping, such as a high-temperature NMP solution, which can dissolve the photoresist and the stripping resist, so that the metal thin film is separated from the wafer substrate. The diversion disk 110 is made of stainless steel, and the diversion pipe can be made of stainless steel pipe or hose which can not react with the solution.

In this embodiment, the diversion pipeline 130 is provided with a circulation pump 131, one end of the diversion pipeline 130 away from the diversion disk 110 is used for extending into the opening of the liquid tank 200, and the circulation pump 131 is used for pumping the solution in the diversion pipeline 130 to the opening of the liquid tank 200. Specifically, after passing out of the liquid tank 200, the diversion pipeline 130 extends into the opening of the liquid tank 200 again, so that the discharged solution can flow into the liquid tank 200 again, and the circular flow is realized. Since the diversion pipeline 130 needs to be lifted and extended into the liquid tank 200 again, a circulating pump 131 is arranged to provide pumping power, so that the dissolving liquid can circularly flow, and liquid supplement is not needed in the stripping process.

In other preferred embodiments of the present invention, a circulation flow path may not be adopted, that is, the diversion pipe 130 is directly discharged to the outside, and at this time, the end of the diversion pipe 130 may be placed downward, so that the solution is discharged by gravity.

In this embodiment, the diversion pipeline 130 includes a plurality of capillaries 133 and a manifold 135, the plurality of capillaries 133 are connected to the plurality of diversion holes 111 in a one-to-one correspondence, the manifold 135 is connected to the plurality of capillaries 133, and the circulation pump 131 is disposed on the manifold 135. Specifically, the capillary 133 has a size that is adapted to a size of the corresponding guide hole 111, so that an end of the capillary 133 can be engaged with one end of the guide hole 111, so that the solution can flow into the capillary 133 through the guide hole 111. Meanwhile, the side wall or the bottom wall of the liquid tank 200 is also provided with a yielding hole for the capillary 133 to extend out, the capillary 133 is in sealing fit with the yielding hole and penetrates out of the yielding hole, and the collecting pipe 135 is connected with the plurality of capillaries 133 at the same time, so that the collecting is realized. The circulating pump 131 is disposed on the collecting pipe 135, and can pump the collected solution to the opening of the liquid tank 200.

In the present embodiment, each capillary tube 133 is provided with a filter 137 for filtering the solution entering the capillary tube 133. Specifically, the dissolving solution is used for dissolving the photoresist and the stripper, and meanwhile, the dropped metal layer residue enters the capillary 133 through the diversion hole 111, and the residual photoresist and the metal residue can be effectively filtered by arranging the filter 137, so that the influence on the downstream circulating pump 131 is avoided.

In the present embodiment, a throttle 139 is provided on each capillary 133, and the throttle 139 is used to adjust the flow rate of the corresponding capillary 133. Specifically, the throttle valve 139 may be an electromagnetic throttle valve 139, which is controlled by a central control machine, and the multiple throttle valves 139 may control the flow rates of the multiple capillaries 133 independently, so as to individually control the flow rate of the solution near each diversion hole 111, and specifically accelerate the peeling speed of a certain area of the wafer, thereby achieving precise control.

In the present embodiment, the plurality of baffle holes 111 are distributed on the baffle 110 in a honeycomb shape. Specifically, a plurality of flow guide holes 111 are uniformly distributed on the flow guide disc 110, each flow guide hole 111 is connected with a capillary 133, and the solution on the front surface of the wafer can uniformly flow through the flow guide holes 111 distributed in a honeycomb shape, so that the flow speeds of the solution around the wafer are consistent, and the wet stripping process is uniformly accelerated.

In summary, in the wet stripping guiding mechanism 100 provided in this embodiment, the guiding plate 110 is vertically disposed in the liquid tank 200, and the front surface of the guiding plate is opposite to the wafer to be stripped, wherein the distance between the wafer and the guiding plate 110 can be adjusted by moving the clamp 300 by the robot. When the circulating pump 131 is started, the dissolving liquid near the diversion hole 111 on the diversion disc 110 can flow into the capillary 133 path at an accelerated speed, the filter 137 arranged on each capillary 133 can prevent metal debris from blocking the throttle valve 139 and the circulating pump 131, the throttle valve 139 can independently control the flow of each capillary 133, the dissolving liquid enters the pipe circulating pump 131 and returns to the liquid tank 200, and liquid supplement is not needed in the stripping process. When the solution near the diversion hole 111 starts to flow like the above process, the solution near the wafer opposite to the diversion hole 111 also starts to flow, the photoresist under the metal film of the solution is clamped, the process of dissolving the photoresist by the solution is accelerated, and the metal film also falls off at an accelerated speed. Because of the influence of the flowing of the dissolving solution, the metal film does not fall off under the action of gravity, but falls off under the influence of the flowing of the dissolving solution, particularly falls off under the thrust of the flowing of the dissolving solution and in the direction of the diversion disc 110, and the defect that the metal film is adhered to the surface of the wafer again in time to cause metal residue is avoided.

Second embodiment

Referring to fig. 4, the basic structure and principle of the wet stripping guiding mechanism 100 and the technical effects thereof provided by the present embodiment are the same as those of the first embodiment, and for the sake of brief description, corresponding contents in the first embodiment may be referred to for parts not mentioned in the present embodiment.

This embodiment differs from the first embodiment in the diaphragm 110.

In this embodiment, the wet stripping guiding mechanism 100 includes a guiding disc 110 and a guiding pipeline 130, the guiding disc 110 is configured to be disposed in a liquid tank 200 filled with a dissolving liquid and located at one side of the wafer, and the guiding disc 110 is provided with a plurality of guiding holes 111, the guiding pipeline 130 is connected to the plurality of guiding holes 111 and is configured to partially extend out of the liquid tank 200, so that the dissolving liquid between the wafer and the guiding disc 110 is discharged through the guiding pipeline 130.

In this embodiment, the plurality of guiding holes 111 are annularly distributed on the guiding plate 110. Specifically, the plurality of guiding holes 111 may form a plurality of ring structures with different diameters, and the plurality of ring structures are concentrically disposed. Through the plurality of annularly distributed guide holes 111, the solution can be layered when entering the guide holes 111, so that the occurrence of a turbulent flow phenomenon is slowed down, and the flow of the solution around the wafer is more stable.

Third embodiment

Referring to fig. 3 in combination, the present embodiment provides a wet stripping apparatus, which includes a wet stripping guiding mechanism 100, wherein the basic structure and principle of the wet stripping guiding mechanism 100 and the generated technical effects are the same as those of the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents in the first embodiment for parts not mentioned in the present embodiment.

The wet stripping device provided by the embodiment comprises a liquid tank 200, a clamp 300 and a wet stripping guide mechanism 100, wherein a solution is filled in the liquid tank 200, the wet stripping guide mechanism 100 comprises a guide disc 110 and a guide pipeline 130, the clamp 300 and the guide disc 110 are arranged in the liquid tank 200 at intervals, the clamp 300 is used for clamping a wafer, the guide disc 110 is positioned on one side of the wafer, the guide disc 110 is provided with a plurality of guide holes 111, the guide pipeline 130 is connected with the guide holes 111 and partially extends out of the liquid tank 200, so that the solution between the wafer and the guide disc 110 is discharged through the guide pipeline 130.

In this embodiment, the wafer is a wafer after metal evaporation, and preferably, the side of the wafer having the metal layer faces the baffle 110, so that the solution can flow from the metal layer to the baffle 110. In this embodiment, the placement position of the diversion disc 110 may be determined according to the clamping position of the wafer, when the wafer is placed vertically, the diversion sheet is also placed vertically and is disposed on the left side or the right side of the wafer, and when the wafer is placed horizontally, the diversion sheet is also placed horizontally and is disposed on the bottom side of the wafer.

In this embodiment, the fixture 300 is provided with a clamping position arranged along a vertical direction, so that the wafer is vertically clamped on the clamping position, the diversion disc 110 is arranged on one side of the fixture 300 and is parallel to the wafer, and the diversion pipeline 130 penetrates through the side wall of the liquid tank 200. Specifically, offer the hole of stepping down on the lateral wall of cistern 200, capillary 133 with step down hole seal fit to wear out the hole of stepping down, collecting pipe 135 is connected with a plurality of capillaries 133 simultaneously, thereby realizes converging.

It should be noted that, the basic structure of the fixture 300 may refer to the existing wafer fixture 300, and in this embodiment, the wafer is held vertically, so that the solution near the wafer can flow horizontally when the circulating pump 131 is started, and the metal film can move horizontally and fall downward under the influence of gravity, so that most of the metal film falls to the bottom of the liquid bath 200, and the filtering pressure of the filter 137 is reduced. Moreover, the wafer vertically clamped is adopted, the requirement on the horizontal size of the liquid tank 200 is lower, and the liquid tank 200 with smaller size can be used for completing the wet stripping process.

Fourth embodiment

Referring to fig. 5 in combination, the present embodiment provides a wet stripping apparatus, which includes a wet stripping guiding mechanism 100, wherein the basic structure and principle of the wet stripping guiding mechanism 100 and the generated technical effects are the same as those of the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents in the first embodiment for parts not mentioned in the present embodiment.

In this embodiment, the fixture 300 is provided with a clamping position arranged along the horizontal direction, so that the wafer is horizontally clamped on the clamping position, the diversion disc 110 is arranged at the bottom side of the fixture 300 and is parallel to the wafer, and the diversion pipeline 130 penetrates through the bottom wall of the liquid tank 200. Specifically, the clamping position is disposed at the bottom of the clamp 300, the basic structure of the clamp can refer to the existing wafer clamp 300, meanwhile, the diversion disc 110 is disposed on the bottom wall of the liquid tank 200, the abdicating hole is opened on the bottom wall of the liquid tank 200, and the capillary 133 penetrates out of the abdicating hole.

The wet stripping device provided by the embodiment can enable the flowing direction of the flow guide hole 111 to be consistent with the gravity direction, so that the dissolving liquid and the metal film further flow downwards, the metal film is further prevented from being reversely adhered to the surface of the wafer, and the defect of metal residue is avoided.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The wet stripping guide mechanism is characterized by comprising a guide disc and a guide pipeline, wherein the guide disc is arranged in a liquid tank filled with a dissolving liquid and is positioned on one side of a wafer, a plurality of guide holes are formed in the guide disc, and the guide pipeline is connected with the plurality of guide holes and partially extends out of the liquid tank so that the dissolving liquid between the wafer and the guide disc is discharged through the guide pipeline.

2. The wet stripping guide mechanism according to claim 1, wherein a circulation pump is disposed on the guide pipeline, one end of the guide pipeline away from the guide disc is used for extending into the opening of the liquid tank, and the circulation pump is used for pumping the solution in the guide pipeline to the opening of the liquid tank.

3. The wet stripping guide mechanism according to claim 2, wherein the guide pipeline comprises a plurality of capillaries and a manifold, the capillaries are connected with the guide holes in a one-to-one correspondence manner, the manifold is connected with the capillaries, and the circulating pump is arranged on the manifold.

4. The wet stripping guide mechanism according to claim 3, wherein each capillary is provided with a filter for filtering the solution entering the capillary.

5. The wet stripping guide mechanism according to claim 3, wherein a throttle valve is disposed on each capillary for adjusting the flow rate of the corresponding capillary.

6. The wet stripping deflector mechanism as recited in claim 1, wherein the plurality of deflector holes are distributed in a honeycomb shape on the deflector disc.

7. The wet stripping deflector of claim 1, wherein the plurality of deflector holes are annularly distributed on the deflector disc.

8. A wet stripping apparatus comprising a liquid tank filled with a solution, a clamp and the flow guide plate of any one of claims 1 to 7, wherein the clamp and the flow guide plate are arranged in the liquid tank at a distance, the clamp is used for clamping a wafer so that the flow guide plate is positioned on one side of the wafer, and the flow guide pipeline partially extends out of the liquid tank and is used for discharging the solution between the wafer and the flow guide plate.

9. The wet stripping device as claimed in claim 8, wherein the fixture is provided with a clamping position arranged along a vertical direction, so that the wafer is vertically clamped on the clamping position, the diversion disc is provided at one side of the fixture and is parallel to the wafer, and the diversion pipeline penetrates through a side wall of the fluid bath.

10. The wet stripping device as claimed in claim 8, wherein the fixture is provided with a clamping position arranged along a horizontal direction, so that the wafer is horizontally clamped on the clamping position, the diversion disc is arranged at the bottom side of the fixture and is parallel to the wafer, and the diversion pipeline penetrates through the bottom wall of the liquid tank.