CN216624286U

CN216624286U - Display device

Info

Publication number: CN216624286U
Application number: CN202123295037.6U
Authority: CN
Inventors: 李志�
Original assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-05-27
Anticipated expiration: 2031-12-24

Abstract

The application provides a display device, which comprises an OLED display panel, a cover body, an electronic element, a heat conducting pad and a heat conducting mechanism, wherein the heat conducting pad is arranged in the accommodating space and is positioned at one side of the electronic element far away from the OLED display panel, the heat conducting mechanism is arranged in the accommodating space and is positioned at one side of the heat conducting pad far away from the electronic element, wherein the heat conducting pad is made of flexible material, so that one side of the heat conducting pad is attached to the electronic element, the other side of the heat conducting pad is attached to the heat conducting mechanism, namely, no gap exists between one side of the heat conducting pad and the electronic element, no gap exists between the other side of the heat conducting pad and the heat conducting mechanism, make whole heat of electronic component can pass through heat conduction pad transmission to heat conduction mechanism, should not lead to the heat conduction inefficiency for there is the clearance between electronic component and the heat conduction mechanism, can effectively solve the electronic component at OLED display panel back during operation and continuously generate heat in order to lead to the not good and problem that reduces OLED device life of OLED device display effect.

Description

Display device

Technical Field

The application relates to the technical field of display, in particular to a display device.

Background

Organic electroluminescent Display (OLED) is a new type of light emitting Display technology, and has the features of wide color gamut, low power consumption, thin size, and fast response speed. Because the internal structure of the OLED has poor heat dissipation, and the OLED emits light for a long time, an electronic element on the back of the OLED continuously emits heat, so that heat accumulation is easily caused, and the light-emitting display effect of the OLED and the service life of an OLED device are further influenced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a display device to solve the problem that when an existing OLED display panel works, an electronic element on the back of the OLED display panel continuously generates heat to influence the OLED light-emitting display effect and reduce the service life of an OLED device.

In a first aspect, an embodiment of the present application provides a display device, including:

an OLED display panel having a display back;

the cover body is covered on one side of the display back surface of the OLED display panel, and an accommodating space is formed between the cover body and the OLED display panel;

the electronic element is arranged in the accommodating space and is positioned on one side of the display back of the OLED display panel;

the heat conducting pad is arranged in the accommodating space and is positioned on one side, far away from the OLED display panel, of the electronic element;

the heat conduction mechanism is arranged in the accommodating space and is positioned on one side, far away from the electronic element, of the heat conduction pad;

the heat conducting pad is made of a flexible material, one side of the heat conducting pad is attached to the electronic element, and the other side of the heat conducting pad is attached to the heat conducting mechanism.

Optionally, the heat conducting mechanism includes:

the heat conduction component is attached to the heat conduction pad on one side, facing the OLED display panel, of the heat conduction component;

the fins are arranged on one side, far away from the heat conducting pad, of the heat conducting member and are arranged at intervals with the heat conducting member;

and the phase-change heat pipe set is arranged on one side of the heat conduction component, which is far away from the heat conduction pad, and is adjacent to the heat conduction component, and the phase-change heat pipe set is arranged on the fin in a penetrating way.

Optionally, the fin is annular or elliptical in shape.

Optionally, one side of the heat conducting member, which faces the OLED display panel, is provided with a plurality of protruding portions arranged at intervals, and one side of the heat conducting pad, which faces away from the OLED display panel, is provided with a recessed portion matched with the plurality of protruding portions.

Optionally, the protrusion is cylindrical, or semi-elliptical, or hemispherical.

Optionally, a surface area of the thermal pad facing the electronic component is larger than a surface area of the electronic component facing the thermal pad.

Optionally, the phase-change heat pipe assembly includes:

an evaporation end adjacent to the heat conducting member, the evaporation end being provided with a first accommodating channel;

the condensation end is adjacent to the cover body and is provided with a second accommodating channel;

the phase-change heat pipes are arranged between the evaporation end and the condensation end at intervals, one end, facing the evaporation end, of each phase-change heat pipe is communicated with the first accommodating channel, and one end, facing the condensation end, of each phase-change heat pipe is communicated with the second accommodating channel.

Optionally, a liquid phase change condensation material is arranged in the phase change heat pipe group.

Optionally, the cover body is provided with a plurality of heat dissipation holes with hollow-out designs.

Optionally, the cover body is attached to the condensation end, and the heat dissipation hole is opposite to the condensation end.

The display device that this application embodiment provided, the heat conduction pad sets up in accommodation space and is located electronic component and keeps away from OLED display panel one side, heat conduction mechanism sets up in accommodation space and is located the heat conduction pad and keeps away from electronic component one side, wherein, the material of heat conduction pad is flexible material, thereby make heat conduction pad one side laminating electronic component, opposite side laminating heat conduction mechanism, do not have the clearance between heat conduction pad one side and the electronic component promptly, also do not have the clearance between heat conduction pad opposite side and the heat conduction mechanism, make whole heat of electronic component can transmit to heat conduction mechanism through the heat conduction pad, should not lead to heat conduction inefficiency for there is the clearance between electronic component and the heat conduction mechanism, can effectively solve the electronic component at OLED display panel back and continuously generate heat in order to lead to the not good and reduce OLED device life's problem of OLED device display panel display effect during operation.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.

Fig. 1 is a schematic structural diagram of an OLED display device in the prior art.

Fig. 2 is a schematic view of a first structure of a display device according to an embodiment of the present disclosure.

Fig. 3 is a schematic structural diagram of a phase-change heat pipe set of the display device shown in fig. 2.

Fig. 4 is a schematic structural diagram of the working state of the heat pipe of the display device shown in fig. 2.

Fig. 5 is a schematic view of a second structure of a display device according to an embodiment of the present disclosure.

Fig. 6 is a schematic view of a first structure of a cover according to an embodiment of the present disclosure.

Fig. 7 is a second structural schematic diagram of the cover provided in the embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Organic electroluminescent Display (OLED) is a new type of light emitting Display technology, and has the features of wide color gamut, low power consumption, thin size, and fast response speed. Referring to fig. 1, fig. 1 is a schematic structural diagram of an OLED display device in the prior art, as shown in fig. 1, an OLED display panel 11 and a cover 12 are packaged by a connecting device 13 to form an accommodating space, an electronic component 14 is disposed at the back of the OLED display panel 11, the electronic component 14 is disposed in the accommodating space, and the electronic component 14 generally includes a glass substrate, a TFT array substrate, an organic light emitting layer, a polarizer, and other components that are prone to generate heat during operation. Due to poor heat dissipation of the internal structure of the OLED, and the long-time light emission of the OLED, the electronic element 14 on the back of the OLED continuously generates heat, which is very easy to cause heat accumulation, and further affects the light emitting and displaying effect of the OLED and the service life of the OLED device. Therefore, a good heat dissipation condition is provided, which helps to improve the display effect of the OLED and prolong the service life of the device.

Based on this, the embodiment of the application provides a display device to solve the problem that when the existing OLED display panel works, the electronic element on the back of the existing OLED display panel continuously generates heat to affect the OLED light emitting display effect and reduce the service life of the OLED device. The following description will be made with reference to the accompanying drawings.

The display device provided by the present application can be applied to the field of display technology, for example, please refer to fig. 2, and fig. 2 is a first structural schematic diagram of the display device provided by the embodiment of the present application. In an embodiment of the present application, a display device includes: the OLED display device comprises an OLED display panel 11, a cover body 12, an electronic element 14, a heat conducting pad 15 and a heat conducting mechanism 10; the OLED display panel 11 has a display back 112, the cover 12 covers the display back 112 side of the OLED display panel 11, and an accommodation space is provided between the cover and the OLED display panel 11, the electronic component 14 is disposed in the accommodation space and located on the display back 112 side of the OLED display panel 11, the heat conduction pad 15 is disposed in the accommodation space and located on one side of the electronic component 14 away from the OLED display panel 11, the heat conduction mechanism 10 is disposed in the accommodation space and located on one side of the heat conduction pad 15 away from the electronic component 14, wherein the material of the heat conduction pad 15 is a flexible material, the electronic component 14 is attached to one side of the heat conduction pad 15, and the heat conduction mechanism 10 is attached to the other side of the heat conduction pad 15.

Specifically, in the embodiment of the present application, the OLED display panel 11 has a display front surface 111 and a display back surface 112, the display front surface 111 is used for displaying a picture, the display back surface 112 is used for storing each component so as to provide the picture to the display front surface 111 through the matching of the component, a cover 12 capable of covering the display back surface 112 is disposed on one side of the display back surface 112 of the OLED display panel 11, and the cover 12 and the OLED display panel 11 are connected by a connecting device 13 to form an accommodating space capable of accommodating each component.

It should be noted that, in the embodiment of the present application, the connection manner of the connection device 13 with the OLED display panel 11 and the cover 12 is not limited, and it is only necessary to fixedly connect the cover 12 and the OLED display panel 11 to form an accommodating space, for example: threaded connection, bolt connection or welding and the like; the material of the connecting device 13 is also not limited in the embodiment of the present application, and it is only necessary that the heat resistance is so good as not to be affected by the heat generation of the electronic element 14, for example: silver-copper alloy, aluminum alloy and the like.

Specifically, an electronic component 14 is disposed in an accommodating space formed by the OLED display panel 11, the cover 12 and the connecting device 13, and the electronic component 14 is disposed in the accommodating space and located on one side of the display back 112 of the OLED display panel 11, wherein the heat conducting mechanism 10 is further disposed on one side of the heat conducting pad 15 away from the electronic component 14 in the accommodating space, and the heat conducting mechanism 10 is used for improving heat conduction efficiency. In the accommodating space, a heat conducting pad 15 made of a flexible material is further arranged on one side of the electronic element 14, which is far away from the OLED display panel 11, one side of the heat conducting pad 15, which is close to the electronic element 14, is closely attached to the electronic element 14, and the other side is attached to the heat conducting mechanism 10, so that the electronic element 14 and the heat conducting mechanism 10 are connected through the heat conducting mechanism 10, the thermal resistance of the electronic element 14 and the heat conducting mechanism 10 is reduced, and the heat conducting efficiency is improved.

In the embodiment of the present invention, the material of the thermal pad 15 is not limited, and for example, the thermal pad 15 made of graphene or thermally conductive and insulating elastic rubber may be used, and the thermal pad 15 made of graphene may fill the gap between the thermal pad and the electronic component 14 to complete the heat transfer between the heat generating portion and the heat dissipating portion, and may have a thick substrate to perform the functions of shock absorption, insulation, sealing, and the like.

The heat dissipation process of the display device provided by the embodiment of the application is as follows: when the display device is operated, the electronic components 14 behind the display back surface 112 of the OLED display panel 11 start to operate and generate heat, and the heat emitted by the electronic components 14 is transferred to the heat conducting mechanism 10 through the flexible heat conducting pad 15 having the function of reducing the heat resistance.

Illustratively, as shown in fig. 2, in the embodiment of the present application, the surface area of the side of the thermal pad 15 facing the electronic component 14 is larger than the surface area of the side of the electronic component 14 facing the thermal pad 15. When the side of the thermal pad 15 facing the electronic component 14 can cover the side of the electronic component 14 facing the thermal pad 15, the heat emitted from the electronic component 14 is absorbed completely, so that the heat can be transferred to the thermal conducting mechanism 10 more completely and quickly.

For example, please refer to fig. 3, fig. 4 and fig. 5 in combination with fig. 2, fig. 3 is a schematic structural diagram of a phase-change heat pipe set of the display device shown in fig. 2, fig. 4 is a schematic structural diagram of a heat pipe operation state of the display device shown in fig. 2, and fig. 5 is a second schematic structural diagram of the display device according to the embodiment of the present disclosure. The heat conducting mechanism 10 in the embodiment of the present application includes: a heat conductive member 16, fins 21, and a phase-change heat pipe group 20.

Wherein, the side of the heat conduction member 16 facing the OLED display panel 11 is attached to the heat conduction pad 15, the fins 21 are disposed on the side of the heat conduction member 16 away from the heat conduction pad 15 and spaced from the heat conduction member 16, the phase-change heat pipe set 20 is disposed on the side of the heat conduction member 16 away from the heat conduction pad 15 and is adjacent to the heat conduction member 16, and the phase-change heat pipe set 20 is disposed between the fins 21.

Specifically, in the embodiment of the present application, one side of the heat conducting member 16 facing the OLED display panel 11 is attached to the heat conducting pad 15, wherein, for example, as shown in fig. 2, one side of the heat conducting member 16 facing the OLED display panel 11 has a plurality of semi-elliptical protruding portions arranged at intervals, one side of the heat conducting pad 15 facing away from the OLED display panel 11 has semi-elliptical recessed portions corresponding to the protruding portions, and the heat conducting member 16 and the heat conducting pad 15 are provided with a plurality of recessed portions and protruding portions which are matched with each other, so that the heat conducting area on the surface of the heat conducting member 16 is increased, and thus the heat conducting efficiency can be effectively improved to rapidly disperse the heat accumulation on the electronic component 14.

It should be noted that, in the embodiment of the present application, the material of the heat conducting member 16 is not limited, for example, the material may be silver, copper, gold, aluminum, or the like, and only the material has good heat conducting performance and can conduct heat quickly; in the embodiment of the present application, the shapes of the convex portions and the concave portions of the heat conducting member 16 and the heat conducting pad 15, which are engaged with each other, are not limited, and for example, the convex portions and the concave portions may be cylindrical as shown in fig. 5, or may be formed in a hemispherical shape, a wavy shape, or an irregular pattern, as long as the contact area between the heat conducting member 16 and the heat conducting pad 15 can be increased.

Specifically, as shown in fig. 3, in the embodiment of the present application, the phase-change heat pipe group 20 is disposed on a side of the heat conducting member 16 away from the heat conducting pad 15 and is adjacent to the heat conducting member 16, and the phase-change heat pipe group 20 exemplarily includes an evaporation end 17, a condensation end 18, and a plurality of phase-change heat pipes 19.

Wherein, the evaporation end 17 is adjacent to the heat conducting member 16, and a first accommodating channel is arranged in the evaporation end 17; the condensation end 18 is adjacent to the cover 12, a second accommodating channel is arranged in the condensation end 18, a plurality of phase-change heat pipes 19 are arranged between the evaporation end 17 and the condensation end 18 at intervals, one end of each phase-change heat pipe 19 facing the evaporation end 17 is communicated with the first accommodating channel, and one end of each phase-change heat pipe 19 facing the condensation end 18 is communicated with the second accommodating channel. The evaporation end 17 and the condensation end 18 respectively contain a first containing channel and a second containing channel, and the surfaces of the evaporation end 17 and the condensation end 18 are provided with holes, so that a plurality of phase change heat pipes 19 can be communicated with the first containing channel inside the evaporation end 17 and the second containing channel inside the condensation end 18.

It should be noted that, in the embodiment of the present application, the connection relationship between the plurality of phase-change heat pipes 19 and the evaporation end 17 and the condensation end 18 is not limited, and for example, the connection relationship may be one of a heat-conducting adhesive connection, a soldering tin welding connection, a screw connection, a key-groove connection, and the like, and the heat-conducting adhesive can better conduct heat and better fix the phase-change heat pipes 19 on the other hand.

The phase-change heat pipe 19 is a device for rapidly transferring heat by using a phase-change process of evaporating a medium in a first accommodating channel of the evaporation end 17 and then condensing the medium in a second accommodating channel of the condensation end 18, and the inside of the phase-change heat pipe 19 is pumped into a negative pressure state and is flushed with a proper liquid. When one end of the phase-change heat pipe 19 is heated, the liquid in the pipe is rapidly vaporized, the vapor flows to the other end under the power of heat diffusion, the vapor is condensed in the second accommodating channel of the condensing end 18 and releases heat, the liquid flows back to the evaporating end 17 along the capillary action, and the circulation is carried out, so that the heat is rapidly conducted from the heated end to the other end until the temperatures of the two ends of the phase-change heat pipe 19 are equal. In the embodiment of the present application, heat dissipated by the electronic component 14 is transferred to the heat conducting member 16 having a semi-elliptical or cylindrical protrusion with an increased heat conducting area through the flexible heat conducting pad 15 with a function of reducing thermal resistance, as shown in fig. 4, after the heat generated by the electronic component 14 is transferred to the heat conducting member 16, the liquid phase change condensation material in the first accommodating channel of the evaporation end 17 absorbs the heat and is vaporized into steam, and since the steam pressure of the evaporation end 17 is higher than that of the condensation end 18, a pressure difference is formed between the two ends, and the steam is driven to flow from the evaporation end 17 to the second condensation channel in the condensation end 18 through the phase change heat pipe 19. The vapor condenses at the condensation end 18 and releases heat, and the liquid phase change condensation material flows back to the evaporation end 17 by capillary action, and the circulation is carried out until the heat accumulation of the electronic component 14 is gradually dispersed.

It should be noted that, in the embodiment of the present application, the material of the liquid phase change condensation material is not limited, for example, the material of the liquid phase change condensation material may be: ethanol, water, or other condensing material; the shape of the phase-change heat pipe 19 is not limited in the embodiment, for example, the shape of the phase-change heat pipe 19 may be a long strip, an oval, or other shapes.

The operation principle of the fins 21 is that when heat is conducted to the plurality of fins 21 arranged at intervals, the air gap between two adjacent fins 21 arranged at intervals is utilized, and the contact area between the heat and the air is increased to improve the heat dissipation efficiency. In the embodiment of the present application, the fin 21 is disposed on the side of the heat conducting member 16 away from the heat conducting pad 15 and spaced from the heat conducting member 16. Specifically, in this application embodiment, fin 21 sets up between evaporating end 17 and the condensation end 18 in phase change heat pipe group 20, and alternate with phase change heat pipe 19 and be connected the setting, fin 21's theory of operation lies in utilizing the interval to set up the air gap of two fins 21 that set up, consequently, when each fin 21 is in non-laminating state and interval setting, just can maximize fin 21 heat-sinking capability, so fin 21 need set up with heat conduction component 16 interval in this application embodiment, fin 21 sets up between evaporating end 17 and the condensation end 18 in phase change heat pipe group 20, and alternate with phase change heat pipe 19 and be connected the setting, can increase the air gap between fin 21, with the heat absorption radiating efficiency of effective improvement heat pipe.

Wherein, a plurality of through holes for the heat supply pipe to pass through are arranged in each fin 21, a plurality of phase change heat pipes 19 arranged between the evaporation end 17 and the condensation end 18 pass through the through holes in each fin 21, and a plurality of fins 21 are connected and fixed in a threaded connection way, as shown in figure 4, when the heat generated by the electronic component 14 is transferred to the heat conducting member 16, the liquid phase change condensation material in the first accommodating channel of the evaporation end 17 absorbs the heat and then is vaporized into steam, since the vapor pressure at the evaporation end 17 is higher than that at the condensation end 18, a pressure difference is formed between the two ends, and the vapor is driven to flow from the evaporation end 17 to the second condensation channel in the condensation end 18 through the phase change heat pipe 19, and at this time, the two fins 21 arranged at intervals increase the contact area of the steam and the air in the phase-change heat pipe 19 by utilizing the gap between the two fins, so that the heat absorption and heat dissipation capacity of the heat pipe is increased, and the heat dissipation speed is increased.

The fins 21 in the embodiments of the present application are illustratively in the shape of rings, ovals, or other sheet structures that increase the rate of air circulation. In the embodiment of the present invention, the connection method of the heat pipe and the fin 21 is not limited, and for example, the connection method may be one of a heat conductive adhesive connection method, a solder welding method, and the like, and the heat conductive adhesive can conduct heat more effectively. In the embodiment of the present application, the number of the heat pipes and the fins 21 is not limited, and only the purpose of heat dissipation can be achieved.

For example, please refer to fig. 6 and 7, in which fig. 6 is a first structural schematic diagram of the cover 12 according to the embodiment of the present application, and fig. 7 is a second structural schematic diagram of the cover 12 according to the embodiment of the present application. In the embodiment of the present application, the cover 12 has a plurality of heat dissipation holes 22 with a hollow design, specifically, the heat dissipation holes 22 of the cover 12 may be oval heat dissipation holes 22 arranged side by side on two sides of the cover 12 as shown in fig. 6, or may also be circular heat dissipation holes 22 arranged side by side on two sides of the cover 12 as shown in fig. 7, wherein the cover 12 is attached to the condensation end 18, and the heat dissipation holes 22 are opposite to the condensation end 18. When the cover 12 is attached to the condensation end 18, after the vapor in the phase change heat pipe 19 flows to the second accommodating channel of the condensation end 18, the condensation end 18 can increase the contact area with the air through the heat dissipation hole 22 on the cover 12, thereby further improving the heat dissipation efficiency of the display device.

It should be noted that, in the embodiment of the present application, the shape and the distribution manner of the heat dissipation holes 22 are not limited, for example, the shape of the heat dissipation holes 22 may also be a square, a star, a circle, or other shapes, the heat dissipation holes 22 may also be distributed at any position of the cover 12, and only the condensation end 18 needs to be attached to increase the contact area between the condensation end 18 and the air.

In the display device provided in the embodiment of the present application, the thermal pad 15 is disposed in the accommodating space and located on the side of the electronic component 14 away from the OLED display panel 11, the thermal mechanism 10 is disposed in the accommodating space and located on the side of the thermal pad 15 away from the electronic component 14, wherein, the material of the heat conducting pad 15 is flexible material, so that one side of the heat conducting pad 15 is attached to the electronic element 14, the other side is attached to the heat conducting mechanism 10, i.e., there is no gap between one side of the thermal pad 15 and the electronic component 14, there is no gap between the other side of the thermal pad 15 and the thermal mechanism 10, the whole heat of the electronic element 14 can be transmitted to the heat conducting mechanism 10 through the heat conducting pad 15, the heat conducting efficiency cannot be low due to the gap between the electronic element 14 and the heat conducting mechanism 15, and the problems that the display effect of an OLED device is poor and the service life of the OLED device is reduced due to continuous heating of the electronic element 14 on the back of the OLED display panel 11 during working can be effectively solved.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.

The display device provided by the embodiment of the present application is described in detail above, and the principle and the implementation of the present application are explained in the present application by applying specific examples, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A display device, comprising:

an OLED display panel having a display back;

2. The display device according to claim 1, wherein the heat conducting mechanism comprises:

the heat conducting component is attached to the heat conducting pad on one side, facing the OLED display panel, of the heat conducting component;

3. The display device according to claim 2, wherein the fin has a ring shape or an oval shape.

4. The display device according to claim 2, wherein the side of the heat conducting member facing the OLED display panel has a plurality of protrusions spaced apart from each other, and the side of the heat conducting pad facing away from the OLED display panel has a plurality of recesses engaged with the plurality of protrusions.

5. A display device as claimed in claim 4, characterised in that the protrusions are cylindrical or semi-elliptical or hemispherical.

6. The display device according to claim 1, wherein a surface area of the thermal pad on a side facing the electronic component is larger than a surface area of the electronic component on a side facing the thermal pad.

7. The display device of claim 2, wherein the set of phase-change heat pipes comprises:

8. The display device of claim 7, wherein a liquid phase change condensing material is disposed within the phase change heat pipe set.

9. The display device according to claim 7, wherein the cover has a plurality of heat dissipation holes with hollow design.

10. The display device according to claim 9, wherein the cover is attached to the condensation end, and the heat dissipation hole faces the condensation end.