TWI686130B - Cooling module - Google Patents

Cooling module Download PDF

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Publication number
TWI686130B
TWI686130B TW108114921A TW108114921A TWI686130B TW I686130 B TWI686130 B TW I686130B TW 108114921 A TW108114921 A TW 108114921A TW 108114921 A TW108114921 A TW 108114921A TW I686130 B TWI686130 B TW I686130B
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Taiwan
Prior art keywords
heat
bent portion
heat dissipation
heat pipe
conducting plate
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TW108114921A
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Chinese (zh)
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TW202041132A (en
Inventor
洪銀樹
廖津均
古惟仁
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大陸商昆山廣興電子有限公司
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Application filed by 大陸商昆山廣興電子有限公司 filed Critical 大陸商昆山廣興電子有限公司
Priority to TW108114921A priority Critical patent/TWI686130B/en
Priority to CN201910383727.5A priority patent/CN111863747A/en
Priority to CN201920662302.3U priority patent/CN210516704U/en
Application granted granted Critical
Publication of TWI686130B publication Critical patent/TWI686130B/en
Publication of TW202041132A publication Critical patent/TW202041132A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A cooling module is provided to overcome the low cooling efficiency of the conventional cooling efficiency resulting from exposing a bend to the air. The cooling module includes at least one heat pipe having a bend located between a vaporization portion and a condensed portion, at least one heat transferring board connected to the bend of the at least one heat pipe, and a cooling fin unit located on the condensed portion of the at least one heat pipe.

Description

散熱模組Cooling module

本發明係關於一種散熱模組，尤其是一種經由熱管之熱傳遞進行散熱的散熱模組。 The invention relates to a heat dissipation module, in particular to a heat dissipation module which dissipates heat through heat transfer of a heat pipe.

現有的中央處理器等電子元件在運作時會產生大量的熱能，導致自身的溫度升高，故會於該電子元件上加裝一散熱模組，而習知的散熱模組係藉由一吸熱端用以吸收該電子元件所產生的熱，並通過一熱管將所吸收的熱導入一散熱鰭片組以將熱散出，藉此使該散熱模組可以對該電子元件進行散熱。 Existing central processing units and other electronic components generate a lot of heat energy during operation, which causes their own temperature to rise. Therefore, a heat dissipation module is added to the electronic component. The conventional heat dissipation module uses a heat sink The end is used to absorb the heat generated by the electronic component, and the absorbed heat is introduced into a heat dissipation fin group through a heat pipe to dissipate the heat, thereby allowing the heat dissipation module to dissipate the electronic component.

惟，習知的散熱模組之熱管係藉由穿伸通過該散熱鰭片組來傳遞熱，當該熱管為了配合安裝或設計上的需求而具有彎折結構時，該彎折結構將因無法穿伸通過該散熱鰭片組，而必須呈裸露狀，導致該散熱模組在該彎折結構處的散熱效率不佳。 However, the heat pipe of the conventional heat dissipation module transfers heat through the heat dissipation fin set. When the heat pipe has a bent structure to meet the requirements of installation or design, the bent structure will not be able to It must pass through the heat dissipation fin set and must be exposed, resulting in poor heat dissipation efficiency of the heat dissipation module at the bending structure.

有鑑於此，習知的散熱模組確實仍有加以改善之必要。 In view of this, the conventional heat dissipation modules still need to be improved.

為解決上述問題，本發明的目的是提供一種散熱模組，係能夠提升熱管之彎折部散熱效率，以進一步增加整體散熱效率者。 In order to solve the above problems, an object of the present invention is to provide a heat dissipation module capable of improving the heat dissipation efficiency of the bent portion of the heat pipe, so as to further increase the overall heat dissipation efficiency.

本發明之次一目的是提供一種散熱模組，係能夠增加熱管之熱 量傳遞範圍者。 The second object of the present invention is to provide a heat dissipation module capable of increasing the heat of the heat pipe The scope of delivery.

本發明全文所述方向性或其近似用語，例如「前」、「後」、「左」、「右」、「上(頂)」、「下(底)」、「內」、「外」、「側面」等，主要係參考附加圖式的方向，各方向性或其近似用語僅用以輔助說明及理解本發明的各實施例，非用以限制本發明。 The directivity or its approximate terms in the entire text of the present invention, such as "front", "back", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer" , "Side", etc., mainly refer to the directions of the attached drawings, and each directivity or its approximate terms are only used to help explain and understand the embodiments of the present invention, not to limit the present invention.

本發明全文所記載的元件及構件使用「一」或「一個」之量詞，僅是為了方便使用且提供本發明範圍的通常意義；於本發明中應被解讀為包括一個或至少一個，且單一的概念也包括複數的情況，除非其明顯意指其他意思。 The use of the quantifier "a" or "one" in the elements and components described throughout the present invention is for convenience and provides the usual meaning of the scope of the present invention; in the present invention, it should be interpreted as including one or at least one, and single The concept of also includes the plural case unless it clearly means something else.

本發明全文所述「結合」、「組合」或「組裝」等近似用語，主要包含連接後仍可不破壞構件地分離，或是連接後使構件不可分離等型態，係本領域中具有通常知識者可以依據欲相連之構件材質或組裝需求予以選擇者。 The approximate terms "combination", "combination", or "assembly" described throughout the present invention mainly include the types that can be separated without damaging the components after connection, or the components cannot be detached after connection, which is common knowledge in the art. It can be selected according to the material or assembly requirements of the components to be connected.

本發明的散熱模組，包含：至少一熱管，具有一彎折部位於一蒸發部與一冷凝部之間；至少一導熱板，連接該熱管的彎折部，該導熱板具有相對的一第一表面及一第二表面，該第一表面凹設有一槽道，該彎折部的外周面與該槽道的壁面可熱傳導地連接，其中，該導熱板的數量為二個，該二導熱板的槽道共同包覆該彎折部的外周面；及一散熱鰭片組，位於該熱管的冷凝部。 The heat dissipation module of the present invention includes: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conducting plate connected to the bent portion of the heat pipe, the heat conducting plate having a first A surface and a second surface, the first surface is concavely provided with a channel, the outer peripheral surface of the bending portion is thermally conductively connected to the wall surface of the channel, wherein the number of the heat conducting plates is two, the two heat conduction The grooves of the plate jointly cover the outer peripheral surface of the bent portion; and a heat dissipation fin set located at the condensation portion of the heat pipe.

本發明的散熱模組，包含：一種散熱模組，包含：至少一熱管，具有一彎折部位於一蒸發部與一冷凝部之間；至少一導熱板，連接該熱管的彎折部，該導熱板具有相對的一第一表面及一第二表面，該第一表面凹設有一槽道，該彎折部的外周面與該槽道的壁面可熱傳導地連接；及一散熱鰭片組，位於該熱管的冷凝部，該散熱鰭片組連接該導熱板的第二表面。 The heat dissipation module of the present invention includes: a heat dissipation module including: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conduction plate connected to the bent portion of the heat pipe, the The heat conducting plate has a first surface and a second surface opposite to each other, the first surface is concavely provided with a channel, the outer peripheral surface of the bent portion is thermally conductively connected to the wall surface of the channel; and a heat dissipation fin set, Located in the condensation part of the heat pipe, the heat dissipation fin group is connected to the second surface of the heat conduction plate.

本發明的散熱模組，包含：一種散熱模組，包含：至少一熱管，具有一彎折部位於一蒸發部與一冷凝部之間；至少一導熱板，連接該熱管的彎折部，該導熱板具有相對的一第一表面及一第二表面，該第一表面凹設有一槽道，該彎折部的外周面與該槽道的壁面可熱傳導地連接，其中，該導熱板的第二表面具有數個凸肋；及一散熱鰭片組，位於該熱管的冷凝部。 The heat dissipation module of the present invention includes: a heat dissipation module including: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conduction plate connected to the bent portion of the heat pipe, the The heat-conducting plate has a first surface and a second surface opposite to each other, the first surface is concavely provided with a channel, and the outer peripheral surface of the bending portion is thermally conductively connected to the wall surface of the channel. The two surfaces have several convex ribs; and a radiating fin set is located in the condensation part of the heat pipe.

據此，本發明的散熱模組，能夠經由該導熱板吸收該熱管之彎折部的熱量，使該彎折部未呈裸露狀而可以充分進行熱傳遞，確保該彎折部內工作液體的熱量能夠傳遞至該導熱板的作用，係可以提升該熱管之熱傳遞範圍，且在不增加該散熱模組之整體縱向高度的前提下，可以增進該散熱模組的散熱效率；又，該導熱板吸收該熱管之彎折部的熱量後，可藉由該第二表面將熱量傳遞至該散熱鰭片組來散出，係具有進一步提升該彎折部散熱效率的作用。本發明的散熱模組，確可擴大散熱模組的散熱面積並增進其散熱效率，以達到提升散熱模組的散熱效果之功效。 According to this, the heat dissipation module of the present invention can absorb the heat of the bent portion of the heat pipe through the heat conduction plate, so that the bent portion is not exposed and can fully perform heat transfer, ensuring the heat of the working liquid in the bent portion The function of being able to be transferred to the heat conduction plate can increase the heat transfer range of the heat pipe, and can increase the heat radiation efficiency of the heat radiation module without increasing the overall longitudinal height of the heat radiation module; in addition, the heat conduction plate After absorbing the heat of the bent portion of the heat pipe, the heat can be dissipated by transferring the heat to the heat dissipation fin group through the second surface, which has the effect of further improving the heat dissipation efficiency of the bent portion. The heat dissipation module of the present invention can indeed expand the heat dissipation area of the heat dissipation module and improve its heat dissipation efficiency, so as to achieve the effect of improving the heat dissipation effect of the heat dissipation module.

其中，該彎折部的外周面可以具有25%以上的面積皆位於該槽道中。如此，係具有確保該彎折部內工作液體的熱量能夠傳遞至該導熱板的作用。 Wherein, the outer peripheral surface of the bent portion may have more than 25% of the area located in the channel. In this way, it has the function of ensuring that the heat of the working liquid in the bent portion can be transferred to the heat conducting plate.

其中，該二導熱板的槽道可以完全包覆該彎折部的外周面，該二導熱板的第一表面相連接。如此，該彎折部的外周面可以完全被該二導熱板所包覆，係具有進一步提升散熱效率的作用。 Wherein, the grooves of the two heat conduction plates can completely cover the outer peripheral surface of the bending portion, and the first surfaces of the two heat conduction plates are connected. In this way, the outer peripheral surface of the bent portion can be completely covered by the two heat conductive plates, which has the effect of further improving the heat dissipation efficiency.

其中，該熱管的彎折部至冷凝部末端可以均與該導熱板連接。如此，該熱管之彎折部延伸至該冷凝部的外周面，皆可以藉由該導熱板進行熱傳遞，係可以藉由該導熱板涵蓋該熱管之彎折部以及該冷凝部，以產生更完善的散熱作用。 Wherein, the bent part of the heat pipe to the end of the condensation part may be connected to the heat conducting plate. In this way, the bent portion of the heat pipe extends to the outer peripheral surface of the condensing portion, and the heat transfer can be performed by the heat conducting plate. The heat conducting plate can cover the bent portion of the heat pipe and the condensing portion to produce more Perfect heat dissipation.

其中，該熱管的彎折部與蒸發部之間具有一直線區段，該導熱 板可以連接該彎折部及該直線區段。如此，係具有增加該熱管之熱量傳遞範圍的作用。 There is a straight section between the bent part and the evaporation part of the heat pipe, the heat conduction The plate can connect the bent portion and the straight section. In this way, it has the effect of increasing the heat transfer range of the heat pipe.

其中，該熱管的彎折部的截面可以呈圓形，或縱向高度與橫向寬度的比值為≧0.75的形狀。如此，係具有方便成形來簡化製作步驟，且可以維持該熱管內璧之毛細結構的完整性，避免影響該工作液體對流循環的作用。 Wherein, the cross section of the bent portion of the heat pipe may have a circular shape or a shape with a ratio of longitudinal height to lateral width ≧0.75. In this way, it is convenient to shape to simplify the manufacturing steps, and can maintain the integrity of the capillary structure of the inner wall of the heat pipe, and avoid affecting the convection circulation of the working liquid.

其中，該熱管的彎折部的截面可以呈縱向高度與橫向寬度的比值為≦0.5的扁管形狀。如此，可以增加與該導熱板連接的面積，係具有提升導熱效率的作用。 Wherein, the cross section of the bent portion of the heat pipe may be in the shape of a flat tube with a ratio of longitudinal height to lateral width ≦0.5. In this way, the area connected to the heat conduction plate can be increased, which has the effect of improving the heat conduction efficiency.

其中，該熱管的彎折部可以具有相對的二平面，該導熱板具有一第一表面貼接其中一前述的平面。如此，可以增加與該導熱板連接的面積，係具有提升導熱效率的作用。 Wherein, the bent portion of the heat pipe may have two opposite planes, and the heat conducting plate has a first surface attached to one of the aforementioned planes. In this way, the area connected to the heat conduction plate can be increased, which has the effect of improving the heat conduction efficiency.

1‧‧‧熱管 1‧‧‧heat pipe

11‧‧‧蒸發部 11‧‧‧Evaporation Department

12‧‧‧冷凝部 12‧‧‧Condensation

13‧‧‧彎折部 13‧‧‧Bending Department

131‧‧‧平面 131‧‧‧plane

14‧‧‧直線區段 14‧‧‧Linear section

2‧‧‧導熱板 2‧‧‧Heat conduction board

21‧‧‧第一表面 21‧‧‧First surface

22‧‧‧第二表面 22‧‧‧Second surface

23‧‧‧槽道 23‧‧‧Slot

24‧‧‧凸肋 24‧‧‧rib

3‧‧‧散熱鰭片組 3‧‧‧Cooling Fin Set

31‧‧‧散熱鰭片 31‧‧‧ Fin

32‧‧‧固定孔 32‧‧‧Fixed hole

〔第1圖〕 本發明第一實施例的分解立體圖。 [Figure 1] An exploded perspective view of the first embodiment of the present invention.

〔第2圖〕 本發明第一實施例的組合俯視圖。 [Figure 2] A combined plan view of the first embodiment of the present invention.

〔第3圖〕 本發明第一實施例的導熱板部份包覆熱管剖面圖。 [Figure 3] A cross-sectional view of a heat pipe partially covered with a heat pipe according to the first embodiment of the present invention.

〔第4圖〕 本發明第一實施例的導熱板完全包覆熱管剖面圖。 [Figure 4] A cross-sectional view of the heat pipe completely covering the heat pipe according to the first embodiment of the present invention.

〔第5圖〕 本發明第一實施例的導熱板貼接該熱管外周面剖面圖。 [Figure 5] A cross-sectional view of the heat pipe of the first embodiment of the present invention attached to the outer peripheral surface of the heat pipe.

〔第6圖〕 本發明第一實施例的導熱板涵蓋直線區段俯視圖。 [Figure 6] A top view of the heat conducting plate of the first embodiment of the present invention covering a straight section.

〔第7圖〕 本發明第二實施例的分解立體圖。 [Figure 7] An exploded perspective view of a second embodiment of the present invention.

〔第8圖〕 本發明第二實施例的散熱鰭片組連接導熱板剖面圖。 [Figure 8] A cross-sectional view of a heat dissipation fin assembly connected to a thermally conductive plate according to a second embodiment of the present invention.

〔第9圖〕 本發明第二實施例的散熱鰭片組部份連接導熱板剖面圖。 [Figure 9] A cross-sectional view of a part of the heat dissipation fin assembly connected to the heat conducting plate of the second embodiment of the present invention.

〔第10圖〕 該散熱鰭片組部份連接導熱板之第二型態剖面圖。 [Figure 10] The second type of cross-sectional view of the heat dissipation fin assembly partially connected to the heat conducting plate.

〔第11圖〕 本發明第三實施例的局部分解立體圖。 [Figure 11] A partially exploded perspective view of a third embodiment of the present invention.

〔第12圖〕 本發明第三實施例的組合圖。 [Figure 12] A combination diagram of a third embodiment of the present invention.

為讓本發明之上述及其他目的、特徵及優點能更明顯易懂，下文特舉本發明之較佳實施例，並配合所附圖式，作詳細說明如下：請參照第1、2圖所示，其係本發明散熱模組的第一實施例，係包含至少一熱管1，該熱管1的兩端之間係連接至少一導熱板2，且該熱管1之兩端之其中一端係具有一散熱鰭片組3，使該熱管1所吸收之熱可以傳遞至該導熱板2及該散熱鰭片組3以進行散熱。 In order to make the above and other objects, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, which are described in detail as follows: This is the first embodiment of the heat dissipation module of the present invention, which includes at least one heat pipe 1, at least one heat conducting plate 2 is connected between the two ends of the heat pipe 1, and one of the two ends of the heat pipe 1 has A heat dissipation fin group 3 enables the heat absorbed by the heat pipe 1 to be transferred to the heat conducting plate 2 and the heat dissipation fin group 3 for heat dissipation.

該熱管1可以例如為銅或鋁等高導熱性能之材質，該熱管1內可以灌注一工作液體，該工作液體可以為水、酒精或其他低沸點之液體，藉此使該工作液體可以從液態吸收熱量而蒸發成氣態。該熱管1之內璧係可以具有如金屬絲篩網、微型溝槽等毛細結構，以幫助該工作液體進行回流，係為本領域人員可以瞭解，本發明在此不作贅述。詳言之，該熱管1的一端可以具有一蒸發部11，該蒸發部11係用以吸收一熱源的熱能，該熱源可以例如為中央處理器，或者電路板上因運作而產生熱之晶片等電子元件，使該熱管1內的工作液體可以於該蒸發部11吸收熱量而由液態蒸發成氣態，該熱管1遠離該蒸發部11的一端可以具有一冷凝部12，藉此該工作液體會帶著熱量往溫度相對較低的冷凝部12移動以將熱量釋放而回復液態，以便回流至該蒸發部11吸收熱量而形成對流循環。本實施例中，該熱管1係可以為數個，以同時藉由數個該熱管1對該電子元件進行熱傳遞；各該熱管1之蒸發部11及該冷凝部12之間係可以具有至少一彎折部13，使該數個該熱管1可以分別 通過該彎折部13朝不同方向延伸以配合設計上的需求，並使各該冷凝部12具有足夠的散熱空間藉此提升對該電子元件的散熱效率。 The heat pipe 1 may be made of a material with high thermal conductivity, such as copper or aluminum. The heat pipe 1 may be filled with a working liquid. The working liquid may be water, alcohol, or other low-boiling liquids, so that the working liquid can be changed from the liquid state. Absorb heat and evaporate into gas. The inner wall of the heat pipe 1 may have a capillary structure such as a wire mesh, a micro-groove, etc., to help the working liquid to return, as those skilled in the art can understand, and the present invention will not repeat them here. In detail, one end of the heat pipe 1 may have an evaporation portion 11 for absorbing the heat energy of a heat source, such as a central processing unit, or a chip on a circuit board that generates heat due to operation, etc. Electronic components, so that the working liquid in the heat pipe 1 can absorb heat in the evaporation part 11 and evaporate from the liquid state into a gas state. The end of the heat pipe 1 away from the evaporation part 11 may have a condensing part 12, whereby the working liquid will carry The heat moves toward the relatively low-temperature condensing part 12 to release the heat and return to the liquid state, so as to return to the evaporation part 11 to absorb the heat and form a convection cycle. In this embodiment, the number of the heat pipes 1 can be several, so that the heat elements 1 can simultaneously transfer heat to the electronic component; each of the heat pipes 1 can have at least one between the evaporation portion 11 and the condensation portion 12 The bent portion 13 allows the heat pipes 1 to be respectively The bent portion 13 extends in different directions to meet the design requirements, and each of the condensing portions 12 has sufficient heat dissipation space to improve the heat dissipation efficiency of the electronic component.

請參照第3、4、5圖所示，該熱管1之彎折部13的截面係可以為任何幾何形狀，本發明在此不限。本實施例中，該彎折部13係可以具有通過該截面中心的一縱向高度與一橫向寬度(以圖面方向)，該縱向高度與該橫向寬度的比值係≧0.75，使該彎折部13之截面可以略呈圓形狀(如第3、4圖所示)，該截面較佳可以為正圓形以方便成形來簡化製作步驟，且可以維持該熱管內璧之毛細結構的完整性，避免影響該工作液體對流循環；或者該縱向高度與該橫向寬度的比值係≦0.5，使該彎折部13之截面可以呈扁管形狀(如第5圖所示)，使該彎折部13可以具有相對的二平面131，即，於圖面方向上該彎折部13之外周面縱向相對的兩處具有該二平面131，該二平面131係可以增加與該導熱板2連接的面積，藉此具有提升導熱效率的作用。 Please refer to FIGS. 3, 4, and 5, the cross-section of the bent portion 13 of the heat pipe 1 may have any geometric shape, and the present invention is not limited thereto. In this embodiment, the bent portion 13 may have a longitudinal height and a transverse width (in the direction of the drawing) passing through the center of the cross section, and the ratio of the longitudinal height to the transverse width is ≧0.75, so that the bent portion The cross-section of 13 may be slightly rounded (as shown in Figures 3 and 4). The cross-section may preferably be a perfect circle to facilitate forming to simplify the manufacturing process and maintain the integrity of the capillary structure of the inner wall of the heat pipe. Avoid affecting the convection circulation of the working liquid; or the ratio of the longitudinal height to the lateral width is ≦0.5, so that the cross section of the bent portion 13 can be in the shape of a flat tube (as shown in FIG. 5), so that the bent portion 13 There may be two opposite planes 131, that is, the two planes 131 are longitudinally opposed to the outer peripheral surface of the bent portion 13 in the direction of the drawing, and the two planes 131 can increase the area connected to the heat conducting plate 2, This has the effect of improving the thermal conductivity.

請續參照第1圖所示，該導熱板2係可以熱傳導地連接該熱管1之彎折部13，藉此以對該彎折部13進行散熱。詳言之，各該導熱板2可以具有相對的一第一表面21及一第二表面22，該第一表面21係用以貼接於該彎折部13的外周面，以直接吸收該彎折部13內工作液體的熱量，並藉由該第二表面22將熱量散出。本實施例中，該第一表面21可以具有對應該彎折部13的至少一槽道23，該槽道23係可以由該第一表面21凹設形成，使該第一表面21可以藉由該槽道23的璧面對應連接於該彎折部13的外周面。 Please continue to refer to FIG. 1, the heat-conducting plate 2 can connect the bent portion 13 of the heat pipe 1 with heat conduction, so as to dissipate heat from the bent portion 13. In detail, each of the heat conductive plates 2 may have a first surface 21 and a second surface 22 opposite to each other. The first surface 21 is used to be attached to the outer peripheral surface of the bending portion 13 to directly absorb the bending The heat of the working liquid in the folded portion 13 dissipates the heat through the second surface 22. In this embodiment, the first surface 21 may have at least one channel 23 corresponding to the bent portion 13, and the channel 23 may be formed by recessing the first surface 21 so that the first surface 21 can be formed by The wall surface of the channel 23 is correspondingly connected to the outer peripheral surface of the bent portion 13.

請續參照第3、4圖所示，舉例而言，該彎折部13之截面略呈圓形狀時，該槽道23的璧面截面係可以形成一弧面，該弧面係對應於該彎折部13外周面之部份，當該導熱板2為一個時，可以使該彎折部13的外周面具有25%以上的面積位於該槽道23中，藉此具有確保該彎折部13內工作液體的熱量能夠傳遞至該導熱板2的作用。 Please refer to FIG. 3 and FIG. 4 again. For example, when the cross-section of the bending portion 13 is slightly round, the cross-section of the wall surface of the channel 23 can form an arc surface, and the arc surface corresponds to the For the portion of the outer peripheral surface of the bent portion 13, when there is only one thermally conductive plate 2, the outer peripheral surface of the bent portion 13 can have an area of more than 25% located in the channel 23, thereby ensuring the bent portion The heat of the working liquid in 13 can be transferred to the function of the heat conducting plate 2.

值得注意的是，該導熱板2的數量可以為二個，以由該二導熱板2共同夾合該熱管1之彎折部13；亦即，該二導熱板2之第一表面21可以分別具有該槽道23，係能夠以該二導熱板2之槽道23夾持該彎折部13，使該二導熱板2的槽道23共同部份包覆該彎折部13的外周面，藉此，即可使該彎折部13的外周面具有50%以上的面積位於該二導熱板2相對的槽道23中(如第3圖所示)，而較佳使該二槽道23可以完全包覆該彎折部13的外周面(如第4圖所示)，以使該二導熱板2的第一表面21相連接，藉此，該彎折部13的外周面可以完全被該二導熱板2所包覆，從而進一步地提升散熱效率。另，該導熱板2之第一表面21及該彎折部13係可以藉由塗抹錫膏來焊接，藉此，該彎折部13的外周面與該導熱板2的第一表面21不須特別互相匹配，或者該第一表面21可以不具有該槽道23，亦可藉由該錫膏的高包覆性及可塑形性來填補該第一表面21及該彎折部13之間的間隙，以增加該第一表面21及該彎折部13的熱傳遞面積，來達到良好的熱傳遞效果。 It is worth noting that the number of the heat conducting plates 2 can be two, so that the bending portions 13 of the heat pipe 1 are sandwiched by the two heat conducting plates 2; that is, the first surfaces 21 of the two heat conducting plates 2 can be respectively With the groove 23, the bending portion 13 can be sandwiched between the grooves 23 of the two heat-conducting plates 2, so that the grooves 23 of the two heat-conducting plates 2 collectively cover the outer peripheral surface of the bending portion 13, In this way, the outer peripheral surface of the bending portion 13 can have an area of more than 50% in the groove 23 (as shown in FIG. 3) opposite to the two heat-conducting plates 2, and preferably the two grooves 23 The outer peripheral surface of the bent portion 13 (as shown in FIG. 4) can be completely covered to connect the first surfaces 21 of the two heat-conducting plates 2, whereby the outer peripheral surface of the bent portion 13 can be completely The two heat-conducting plates 2 are coated to further improve the heat dissipation efficiency. In addition, the first surface 21 of the heat conducting plate 2 and the bent portion 13 can be soldered by applying solder paste, whereby the outer peripheral surface of the bent portion 13 and the first surface 21 of the heat conducting plate 2 need not be Especially matched to each other, or the first surface 21 may not have the channel 23, or the gap between the first surface 21 and the bent portion 13 may be filled by the high coverage and moldability of the solder paste The gap increases the heat transfer area of the first surface 21 and the bent portion 13 to achieve a good heat transfer effect.

另外，請參照第6圖所示，該熱管1的彎折部13與蒸發部11之間可以具有一直線區段14，該導熱板2亦可以從該彎折部13延伸連接至該直線區段14，藉此以增加該導熱板2對該熱管1之熱量吸收範圍，於該直線區段14上該導熱板2較佳與該蒸發部11相距一段距離，以避免該導熱板2過於靠近該蒸發部11，而對該熱管1內工作液體的相變化產生影響，降低整體散熱效率。 In addition, referring to FIG. 6, a straight section 14 may be provided between the bent portion 13 and the evaporation portion 11 of the heat pipe 1, and the heat conducting plate 2 may also extend from the bent portion 13 to be connected to the straight section 14, so as to increase the heat absorption range of the heat pipe 1 by the heat conduction plate 2, the heat conduction plate 2 is preferably separated from the evaporation portion 11 on the linear section 14 to avoid the heat conduction plate 2 being too close to the The evaporation part 11 affects the phase change of the working liquid in the heat pipe 1 and reduces the overall heat dissipation efficiency.

請續參照第1、2圖所示，該散熱鰭片組3係位於該熱管1之冷凝部12，以使該工作液體之氣態可以於該冷凝部12將熱量散出以回復為液態；該散熱鰭片組3之設置形態不限，係可以接收該熱管1之工作液體所帶之熱量並散出即可，另亦可以藉由一散熱風扇進行氣流的吹送，以提升該熱量的散出。本實施例中，該數個該熱管1之冷凝部12係可以通過各該彎折 部13朝相對的兩個方向延伸，以具有相對的散熱鰭片組3。詳言之，該散熱鰭片組3可以具有數個散熱鰭片31，該數個散熱鰭片31係可以互相堆疊以使彼此之間具有間隙或者呈間隔設置等型態，本發明在此不限，且該數個散熱鰭片31可以平行排列，各該散熱鰭片31可以分別具有一固定孔32，以供該熱管1之冷凝部12通過，另，該熱管1之冷凝部12亦可以利用錫膏焊接固定於該固定孔32中。 Please continue to refer to Figures 1 and 2, the heat dissipation fin group 3 is located in the condensation part 12 of the heat pipe 1, so that the gaseous state of the working liquid can dissipate heat in the condensation part 12 to return to a liquid state; The arrangement form of the heat sink fin group 3 is not limited, it can receive the heat carried by the working fluid of the heat pipe 1 and dissipate it, or it can be blown by a cooling fan to improve the heat dissipation . In this embodiment, the condensation sections 12 of the heat pipes 1 can be bent by each The portion 13 extends in two opposite directions to have opposite heat dissipation fin groups 3. In detail, the heat dissipation fin group 3 may have a plurality of heat dissipation fins 31, and the heat dissipation fins 31 may be stacked on top of each other so as to have a gap or are arranged at intervals, etc. The heat dissipation fins 31 can be arranged in parallel, and each of the heat dissipation fins 31 can have a fixing hole 32 for the condensation part 12 of the heat pipe 1 to pass through. In addition, the condensation part 12 of the heat pipe 1 can also be Solder paste is fixed in the fixing hole 32.

請參照第7~10圖所示，其係本發明散熱模組的第二實施例，該散熱鰭片組3可以延伸連接於該導熱板2之第二表面22，藉此，該導熱板2吸收該熱管1之彎折部13的熱量後，可藉由該第二表面22將熱量傳遞至該散熱鰭片組3來進行散出，具有進一步提升該彎折部13散熱效率的作用，又，當該導熱板2的數量為兩個並夾持於該彎折部13時，該散熱鰭片組3係可以選擇分別連接至該二導熱板2之第二表面22(如第8圖所示)，藉此來達到進一步提升散熱效率的作用，或者僅連接至其中一導熱板2之第二表面22(如第9圖所示)，以降低該散熱模組之整體縱向高度，達到微型化的作用。另，該導熱板2之第二表面22係可以選擇不連接該散熱鰭片組3，而具有數個凸肋24，該數個凸肋24係可以增加該第二表面22的表面積，以提升該導熱板2的散熱效率(如第10圖所示)。舉例而言，該數個凸肋24可以為互相平行排列的直條肋或波浪條肋，並由該第二表面22的一邊緣延伸至另一邊緣，或者該數個凸肋24可以相交錯以互相連接，該數個凸肋24亦可以為截斷狀依序排列的短肋，又或者呈近圓柱狀之針肋，本發明在此不限，據此，係具有可以在不增加該散熱模組之整體縱向高度的前提下，進一步提升散熱效率的作用。 Please refer to FIGS. 7 to 10, which is the second embodiment of the heat dissipation module of the present invention. The heat dissipation fin group 3 can be extended to be connected to the second surface 22 of the heat conducting plate 2, whereby the heat conducting plate 2 After absorbing the heat of the bent portion 13 of the heat pipe 1, the second surface 22 can transfer the heat to the heat dissipation fin group 3 for dissipation, which has the effect of further improving the heat dissipation efficiency of the bent portion 13, and When the number of the thermally conductive plates 2 is two and is clamped to the bent portion 13, the heat dissipation fin group 3 can be selectively connected to the second surfaces 22 of the two thermally conductive plates 2 (as shown in FIG. 8) In order to achieve the effect of further improving the heat dissipation efficiency, or only connected to the second surface 22 of one of the heat conducting plates 2 (as shown in FIG. 9), so as to reduce the overall longitudinal height of the heat dissipation module to achieve miniaturization Role. In addition, the second surface 22 of the thermally conductive plate 2 can choose not to connect to the heat dissipation fin group 3, but has a plurality of ribs 24, which can increase the surface area of the second surface 22 to increase The heat dissipation efficiency of the heat conducting plate 2 (as shown in Fig. 10). For example, the ribs 24 may be straight ribs or wavy ribs arranged parallel to each other, and extend from one edge to the other edge of the second surface 22, or the ribs 24 may be staggered. In order to connect with each other, the plurality of convex ribs 24 may also be short ribs arranged in sequence in a truncated shape, or needle ribs in a near-cylindrical shape, the invention is not limited herein, and according to this, the heat dissipation Under the premise of the overall longitudinal height of the module, it further improves the efficiency of heat dissipation.

請參照第11、12圖所示，其係本發明散熱模組的第三實施例，該熱管1的彎折部13至該冷凝部12末端均與該導熱板2連接，即，該導熱 板2係從該彎折部13延伸至該冷凝部12，藉此，從該熱管1之彎折部13的外周面一直延伸至該冷凝部12的外周面，皆可以藉由該導熱板2進行熱傳遞，此時，該散熱鰭片組3係可以連接於該導熱板2的第二表面22以將熱量散出，以產生更完善的散熱作用，該散熱鰭片組3之各散熱鰭片31亦不需分別開設供該冷凝部12通過的固定孔32，具有提升製造便利性的效果。 Please refer to Figs. 11 and 12, which is the third embodiment of the heat dissipation module of the present invention. The bent portion 13 of the heat pipe 1 to the end of the condensing portion 12 are connected to the heat conducting plate 2, that is, the heat conduction The plate 2 extends from the bent portion 13 to the condensing portion 12, whereby the outer surface of the bent portion 13 of the heat pipe 1 extends all the way to the outer peripheral surface of the condensing portion 12 For heat transfer, at this time, the heat dissipation fin group 3 can be connected to the second surface 22 of the heat conducting plate 2 to dissipate heat to produce a more perfect heat dissipation effect. The heat dissipation fins of the heat dissipation fin group 3 The sheet 31 does not need to provide fixing holes 32 for the condensing part 12 to pass through, which has the effect of improving manufacturing convenience.

綜上所述，本發明之散熱模組能夠經由該導熱板吸收該熱管之彎折部的熱量，使該彎折部未呈裸露狀而可以充分進行熱傳遞。此外，亦可以藉由該導熱板涵蓋該熱管之彎折部、冷凝部以及該彎折部與該蒸發部之間的直線區段，係可以提升該熱管之熱傳遞範圍，以增進該散熱模組的散熱效率。另經由實驗結果可知，以習知散熱模組對該電子元件散熱後，可測的該電子元件之溫度為74.2~77℃，而本發明之散熱模組藉由該導熱板吸收該熱管之彎折部的熱量以散出，再測得該電子元件之溫度約為67.3℃，相較於習知散熱模組溫度下降了6.9~9.7℃，是以本發明的散熱模組，確可擴大散熱模組的散熱面積並增進其散熱效率，以達到提升散熱模組的散熱效果之功效。 In summary, the heat dissipation module of the present invention can absorb the heat of the bent portion of the heat pipe through the heat conduction plate, so that the bent portion is not exposed and can fully perform heat transfer. In addition, the heat transfer plate can also cover the bent portion, the condensation portion, and the linear section between the bent portion and the evaporation portion of the heat pipe to increase the heat transfer range of the heat pipe to improve the heat dissipation mold Group cooling efficiency. It is also known from the experimental results that after the conventional heat dissipation module dissipates the electronic component, the measurable temperature of the electronic component is 74.2~77°C, and the heat dissipation module of the present invention absorbs the bending of the heat pipe through the heat conduction plate The heat of the folded part is dissipated, and the temperature of the electronic component is measured to be about 67.3°C, which is 6.9~9.7°C lower than that of the conventional heat dissipation module. The heat dissipation module of the present invention can indeed expand the heat dissipation The heat dissipation area of the module and increase its heat dissipation efficiency to achieve the effect of improving the heat dissipation effect of the heat dissipation module.

雖然本發明已利用上述較佳實施例揭示，然其並非用以限定本發明，任何熟習此技藝者在不脫離本發明之精神和範圍之內，相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with this art without departing from the spirit and scope of the present invention still makes various changes and modifications to the above-mentioned embodiments. The technical scope of the invention is protected, so the scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

1‧‧‧熱管 1‧‧‧heat pipe

13‧‧‧彎折部 13‧‧‧Bending Department

14‧‧‧直線區段 14‧‧‧Linear section

2‧‧‧導熱板 2‧‧‧Heat conduction board

21‧‧‧第一表面 21‧‧‧First surface

22‧‧‧第二表面 22‧‧‧Second surface

23‧‧‧槽道 23‧‧‧Slot

3‧‧‧散熱鰭片組 3‧‧‧Cooling Fin Set

31‧‧‧散熱鰭片 31‧‧‧ Fin

32‧‧‧固定孔 32‧‧‧Fixed hole

Claims (10)

一種散熱模組，包含：至少一熱管，具有一彎折部位於一蒸發部與一冷凝部之間；至少一導熱板，連接該熱管的彎折部，該導熱板具有相對的一第一表面及一第二表面，該第一表面凹設有一槽道，該彎折部的外周面與該槽道的壁面可熱傳導地連接，其中，該導熱板的數量為二個，該二導熱板的槽道共同包覆該彎折部的外周面；及一散熱鰭片組，位於該熱管的冷凝部。 A heat dissipation module includes: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conducting plate connected to the bent portion of the heat pipe, the heat conducting plate having an opposite first surface And a second surface, the first surface is concavely provided with a channel, the outer peripheral surface of the bending portion is thermally conductively connected to the wall surface of the channel, wherein the number of the heat conducting plates is two, and the number of the two heat conducting plates The grooves collectively cover the outer peripheral surface of the bent portion; and a heat dissipation fin set is located in the condensation portion of the heat pipe. 如申請專利範圍第1項所述之散熱模組，其中，該彎折部的外周面具有25%以上的面積皆位於該槽道中。 The heat dissipation module as described in item 1 of the patent application scope, wherein the outer peripheral surface of the bent portion has more than 25% of the area located in the channel. 如申請專利範圍第1項所述之散熱模組，其中，該二導熱板的槽道完全包覆該彎折部的外周面，該二導熱板的第一表面相連接。 The heat dissipation module as described in item 1 of the patent application scope, wherein the grooves of the two heat conducting plates completely cover the outer peripheral surface of the bent portion, and the first surfaces of the two heat conducting plates are connected. 一種散熱模組，包含：至少一熱管，具有一彎折部位於一蒸發部與一冷凝部之間；至少一導熱板，連接該熱管的彎折部，該導熱板具有相對的一第一表面及一第二表面，該第一表面凹設有一槽道，該彎折部的外周面與該槽道的壁面可熱傳導地連接；及一散熱鰭片組，位於該熱管的冷凝部，該散熱鰭片組連接該導熱板的第二表面。 A heat dissipation module includes: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conducting plate connected to the bent portion of the heat pipe, the heat conducting plate having an opposite first surface And a second surface, the first surface is concavely provided with a channel, the outer peripheral surface of the bent portion is thermally conductively connected to the wall surface of the channel; and a heat dissipation fin set is located in the condensation portion of the heat pipe, the heat dissipation The fin set is connected to the second surface of the heat conducting plate. 一種散熱模組，包含：至少一熱管，具有一彎折部位於一蒸發部與一冷凝部之間；至少一導熱板，連接該熱管的彎折部，該導熱板具有相對的一第一表面及一第二表面，該第一表面凹設有一槽道，該彎折部的外周面與該槽道的壁面可熱傳導地連接，其中，該導熱板的第二表面具有數個凸肋；及 一散熱鰭片組，位於該熱管的冷凝部。 A heat dissipation module includes: at least one heat pipe with a bent portion between an evaporation portion and a condensed portion; at least one heat conducting plate connected to the bent portion of the heat pipe, the heat conducting plate having an opposite first surface And a second surface, the first surface is concavely provided with a channel, and the outer peripheral surface of the bent portion is thermally conductively connected to the wall surface of the channel, wherein the second surface of the thermally conductive plate has a plurality of ribs; and A heat dissipation fin set is located in the condensation part of the heat pipe. 如申請專利範圍第1至5項中任一項所述之散熱模組，其中，該熱管的彎折部至冷凝部末端均與該導熱板連接。 The heat dissipation module as described in any one of the items 1 to 5 of the patent application range, wherein the bending part of the heat pipe to the end of the condensation part are connected to the heat conducting plate. 如申請專利範圍第1至5項中任一項所述之散熱模組，其中，該熱管的彎折部與蒸發部之間具有一直線區段，該導熱板連接該彎折部及該直線區段。 The heat dissipation module as described in any one of claims 1 to 5, wherein the heat pipe has a straight section between the bent portion and the evaporation portion, and the heat conducting plate connects the bent portion and the linear area segment. 如申請專利範圍第1至5項中任一項所述之散熱模組，其中，該熱管的彎折部的截面呈圓形，或縱向高度與橫向寬度的比值為≧0.75的形狀。 The heat dissipation module according to any one of claims 1 to 5, wherein the cross section of the bent portion of the heat pipe has a circular shape, or a shape with a ratio of longitudinal height to lateral width ≧0.75. 如申請專利範圍第1項所述之散熱模組，其中，該熱管的彎折部的截面呈縱向高度與橫向寬度的比值為≦0.5的扁管形狀。 The heat dissipation module as described in item 1 of the patent application scope, wherein the cross section of the bent portion of the heat pipe is in the shape of a flat tube with a ratio of longitudinal height to lateral width ≦0.5. 如申請專利範圍第9項所述之散熱模組，其中，該熱管的彎折部具有相對的二平面，該導熱板具有一第一表面貼接其中一前述的平面。 The heat dissipation module as described in item 9 of the patent application range, wherein the bent portion of the heat pipe has two opposite planes, and the heat conducting plate has a first surface attached to one of the aforementioned planes.
TW108114921A 2019-04-29 2019-04-29 Cooling module TWI686130B (en)

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CN201920662302.3U CN210516704U (en) 2019-04-29 2019-05-09 Heat radiation module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795198B (en) * 2022-01-28 2023-03-01 營邦企業股份有限公司 Rapid heat dissipation device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101616565A (en) * 2008-06-27 2009-12-30 富准精密工业(深圳)有限公司 Heat abstractor
TWI612272B (en) * 2016-05-04 2018-01-21 技嘉科技股份有限公司 Heat dissipating module and assemblimg method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101616565A (en) * 2008-06-27 2009-12-30 富准精密工业(深圳)有限公司 Heat abstractor
TWI612272B (en) * 2016-05-04 2018-01-21 技嘉科技股份有限公司 Heat dissipating module and assemblimg method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI795198B (en) * 2022-01-28 2023-03-01 營邦企業股份有限公司 Rapid heat dissipation device

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