CN215117437U - Radiator and heat pipe radiating structure thereof - Google Patents

Abstract

The utility model discloses a radiator and heat pipe heat radiation structure thereof, wherein, heat pipe heat radiation structure includes: the heat pipe comprises a first radiating fin unit, a second radiating fin unit, a soaking plate and a plurality of heat pipes; the first radiator fin unit comprises a first connecting groove; the second cooling fin unit comprises a second connecting groove; one end of the heat pipe and the soaking plate are integrally formed and arranged in the first connecting groove, and the other end of the heat pipe is inserted in the second connecting groove. The heat pipe radiating structure has uniform heat dissipation and reduces welding contact thermal resistance.

Description

Radiator and heat pipe radiating structure thereof

Technical Field

The utility model relates to the radiator field especially involves a radiator and heat pipe heat radiation structure thereof.

Background

With the development of the times, computers have become indispensable electronic devices in people's lives, the living standard is improved, so that the performance requirements of the computers are higher and higher, a plurality of main heat sources, namely a Central Processing Unit (CPU), a south bridge chip set, a north bridge chip set and a Graphics Processing Unit (GPU), are arranged on a mainboard of the computer, and in order to ensure that the key devices can work stably, a radiator is arranged to radiate heat and cool the heating components so as to keep the overall working efficiency of the computer.

The existing heat pipe is not uniform in heat dissipation, and the heat source is at risk of burning out due to the fact that local high temperature of the heat source cannot be effectively dissipated.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heat dissipation is even, reduces the radiator of welding thermal contact resistance and heat pipe heat radiation structure thereof.

In a first aspect, the utility model discloses a technical scheme that heat pipe heat radiation structure adopted does: a heat pipe heat dissipation structure, comprising: the heat pipe comprises a first radiating fin unit, a second radiating fin unit, a soaking plate and a plurality of heat pipes;

the first radiator fin unit comprises a first connecting groove;

the second cooling fin unit comprises a second connecting groove;

one end of the heat pipe and the soaking plate are integrally formed and arranged in the first connecting groove, and the other end of the heat pipe is inserted in the second connecting groove.

Furthermore, heat conduction paste is arranged in the first connecting groove, and heat conduction paste is arranged in the second connecting groove.

Further, the soaking plate is screwed with the first radiator fin unit.

Furthermore, the top surface of the soaking plate is provided with a positioning bulge for positioning the attaching position of the heat source.

Furthermore, the heat pipe comprises a groove pipe section and a composite pipe section, wherein the groove pipe section is arranged in a hollow mode, and copper powder is filled in the composite pipe section.

In a second aspect, the present invention also provides a heat sink, which is equipped with the heat pipe heat dissipation structure.

The beneficial effects of the utility model reside in that: the heat transmission path of the soaking plate is two-dimensional, heat can be conducted towards a plurality of horizontal directions, heat dissipation is uniform, efficiency is higher, heat is transmitted to the radiating fin units through the heat pipes integrally formed with the soaking plate to achieve heat dissipation, welding thermal resistance is reduced due to the fact that the soaking plate and the heat pipes are integrally formed, and heat dissipation performance is further improved.

Drawings

Fig. 1 is a schematic view of the overall structure of the heat sink of the present invention.

Fig. 2 is an overall structure split view of the heat sink of the present invention.

In the figure, a first finlet unit 100, a first connecting slot 110; a second finstock unit 200, a second connecting slot 210; a soaking plate 300, a positioning projection 310; a plurality of heat pipes 400.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the following description, with reference to the accompanying drawings and embodiments, will explain in further detail a heat sink and a heat pipe heat dissipation structure thereof. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "central," "longitudinal," "lateral," "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience and simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application will be understood by those of ordinary skill in the art from the specific context.

Referring to fig. 1-2, in the embodiment of the present invention, the tube heat dissipation structure mainly includes a first heat dissipation fin unit 100, a second heat dissipation fin unit 200, a vapor chamber 300, and a plurality of heat tubes 400; specifically, be equipped with first connecting groove 110 on the first radiator fin unit 100, be equipped with second connecting groove 210 on the second radiator fin unit 200, the one end of heat pipe 400 and soaking board 300 integrated into one piece set up and locate in first connecting groove 110, the other end of heat pipe 400 is pegged graft in second connecting groove 210, soaking board 300's heat transmission route is two-dimentional, the heat can be to a plurality of horizontal direction conduction, the heat dissipation is not only even, and efficiency is also higher, the heat transmits through the heat pipe with soaking board 300 integrated into one piece and accomplishes the heat dissipation on the radiator fin unit, soaking board 300 has reduced welding thermal resistance with heat pipe integrated into one piece's setting, further promoted heat dispersion.

The operation principle of the vapor chamber 300 is as follows: the heat generated when the heat source operates is conducted to the evaporation end of the soaking plate, the cooling liquid in the soaking plate can quickly absorb the heat and generate gasification to be changed into steam, at the moment, the steam quickly expands due to the heat absorption and moves from a high-pressure area to a low-pressure area in the soaking plate, and in the process that the steam moves to the low-pressure area, the steam can quickly generate condensation phenomenon when contacting with the inner wall with lower temperature, releases the heat, is further liquefied into liquid and flows back to the evaporation end under the capillary action of the inner wall of the cavity; therefore, the cooling liquid in the soaking plate is continuously switched between liquid and gas to form a circulating heat dissipation system.

In an embodiment, a layer of thermal conductive paste is coated in each of the first connecting groove 110 and the second connecting groove 210, the main component of the thermal conductive paste is silicone grease, which is non-toxic, odorless, corrosion-resistant, and has good thermal conductivity, electrical insulation, shock absorption and impact resistance, and the heat dissipation capability of the heat sink is further improved by coating the thermal conductive paste.

In one embodiment, to prevent the heat spreader 300 from loosening, the heat spreader 300 may be fixedly connected, preferably screwed, to the first finunit 100, which is low in cost and secure.

Referring to fig. 2, in an embodiment, the top surface of the soaking plate 300 is provided with a positioning protrusion 310 for positioning the heat source attachment position, and the positioning protrusion 310 is preferably disposed at the center of the top surface of the soaking plate 300, but other positions are also possible, so that the soaking plate can be quickly aligned with the heat source during installation, and the efficiency is improved.

In an embodiment, the heat pipe 400 includes a groove pipe section and a composite pipe section, the groove pipe section is hollow, the composite pipe section is filled with copper powder, the position sequence of the groove pipe section and the composite pipe section is replaceable, for example, the groove pipe section is disposed in the first connecting groove 110, the composite pipe section is inserted in the second connecting groove 210, the positions of the groove pipe section and the composite pipe section can be changed, the reflux speed of cooling water in the heat pipe can be effectively increased through the layered arrangement of the groove pipe section and the composite pipe section, the cross-sectional area of water circulation is also increased, and the heat conduction efficiency of the heat pipe is effectively improved.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description in any form, and although the present invention has been disclosed with reference to the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make modifications or changes equivalent to the equivalent embodiment of the above embodiments without departing from the scope of the present invention.

Claims (6)

1. A heat pipe heat dissipation structure, comprising: a first radiator fin unit (100), a second radiator fin unit (200), a vapor chamber (300), and a plurality of heat pipes (400);

the first radiator fin unit (100) includes a first connection groove (110);

the second finstock unit (200) includes a second connection slot (210);

one end of the heat pipe (400) and the soaking plate (300) are integrally formed and arranged in the first connecting groove (110), and the other end of the heat pipe (400) is inserted into the second connecting groove (210).

2. A heat pipe heat dissipation structure as claimed in claim 1, wherein a thermal paste is disposed in the first connection groove (110), and a thermal paste is disposed in the second connection groove (210).

3. A heat pipe heat dissipation structure as defined in claim 1, wherein the soaking plate (300) is screw-coupled with the first radiator fin unit (100).

4. A heat pipe heat dissipation structure as defined in claim 1, wherein the top surface of the soaking plate (300) is provided with a positioning protrusion (310) for positioning the heat source attaching position.

5. A heat pipe heat dissipation structure as defined in claim 1, wherein the heat pipe (400) comprises a grooved pipe section and a composite pipe section, the grooved pipe section is hollow, and the composite pipe section is filled with copper powder.

6. A heat sink comprising the heat pipe heat dissipating structure of any one of claims 1 to 5.

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